CN103123057A - Light-emitting diode (LED) lamp and preparation method thereof - Google Patents
Light-emitting diode (LED) lamp and preparation method thereof Download PDFInfo
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- CN103123057A CN103123057A CN2012105739788A CN201210573978A CN103123057A CN 103123057 A CN103123057 A CN 103123057A CN 2012105739788 A CN2012105739788 A CN 2012105739788A CN 201210573978 A CN201210573978 A CN 201210573978A CN 103123057 A CN103123057 A CN 103123057A
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- Prior art keywords
- led lamp
- radiator
- filler
- stainless steel
- steel substrate
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Links
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- 238000000034 method Methods 0.000 claims abstract description 23
- 238000009434 installation Methods 0.000 claims abstract description 10
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Images
Abstract
The invention discloses a light-emitting diode (LED) lamp. An LED lamp bead 1 is arranged on a stainless steel substrate 4, one face, provided with an LED lamp bead 5, of the stainless steel substrate 4 is connected with a protective shade 6, the other face of the stainless steel substrate is connected with a radiator 3, and a rotary joint type lamp opening 2 is fixedly connected with a rotary joint groove formed in a lamp seat through a rotary joint device arranged on the rotary joint type lamp opening. The radiator 3 is composed of cooling fins. An arc-shaped structure is adopted in the cooling fins and the cooling fins are evenly distributed. A light transmitting material quality structure is adopted in the protective shade 6. The protective shade 6 is in a semi-spherical shape. By the adoption of the rotary joint type structure in the LED lamp, the LED lamp can resolve the problem in an existing LED lamp, a production assembling method by manual matching of automatic installation and flow line assembly can be used, and the LED lamp has the advantages of being concise in production assembling, high in production efficiency, low in production cost, attractive and firm in connection, good in lighting effect, safe in use, and long in service life.
Description
Technical field
The present invention relates to throw light on mechanical device technique field particularly relates to a kind of Novel LED light and preparation method thereof.
Background technology
the mode that present LED illuminating lamp adopts filament to connect more, it exists production stage loaded down with trivial details, produce the accessory long processing time, and the high problem of production cost, in addition, it also exists the material thermal conductivity energy relatively poor, stability is not ideal enough, and moulding, fire-retardant and the relatively poor problem of insulating properties, for this reason, need a kind of LED illuminating lamp that can address the above problem, its material can have heat conductivility and stability preferably, and can well solve moulding, the problem of fire-retardant and insulating properties, simplify simultaneously assemble method, enhance productivity, improve production cost and service life, thereby satisfy the needs of actual conditions.
Now, because electronic product more and more is tending towards miniaturization, therefore those easily integrated and miniaturization and the good complex plastic substrate of pliability are widely used, but because the multiple stratification of the highly integrated and laminate of integrated circuit certainly leads to the heat release problem, so the requirement of the heat conductivility of these materials has just been become the task of top priority.
The methods of forming such as ABS resin can be with injection moulding, extrude, vacuum, blowing and roll-in are processed as plastic cement, and also available machinery, bonding, coating, the vacuum method such as steaming is carried out secondary operations.Due to its high comprehensive performance, purposes is more extensive, mainly as engineering material, also can be used for the family life apparatus.Due to its oil resistant and acid and alkali resistance, salt and chemical reagent etc. functional, and have electrodepositable, plate the advantages such as glossy good, light specific gravity after metal level, price be low, can be used to replace some metal.Also can synthesize many kinds such as self-extinguishing type and heat resistant type, to adapt to various uses.
People with dielectric metal oxide and other compound filled polymers, have tentatively solved this problem in recent years.The filler of insulated type heat conduction plastic cement mainly comprises: metal oxide such as BeO, MgO, A1
2O
3, CaO, NIO; Metal nitride such as AlN, BN etc.; Carbide such as SiC, B
4C
3Deng.They have higher thermal conductivity factor, and what is more important compares with metal powder excellent electrical insulating property is arranged, so they can guarantee that end article has good electrical insulating property, and this is vital in electronic apparatus industry.
Research and application for the heat conduction plastic cement are a lot, can simply classify to it, can be divided into thermoplasticity heat-conducting resin and thermosetting heat-conducting resin according to the matrix material kind; Kind by particle filled composite can be divided into: metal filled type, metal oxide filled-type, metal nitride filled-type, inorganic non-metallic filled-type, fiber-filled type heat conduction plastic cement; Also can divide according to a certain character of heat conduction plastic cement, such as can be divided into insulated type heat conduction plastic cement and nonisulated type heat conduction plastic cement according to its electrical insulation capability.
Because plastic cement itself has insulating properties, the therefore electrical insulation capability of most heat conduction plastic cement is finally that the insulating properties by particle filled composite determine.The filler that is used for nonisulated type heat conduction plastic cement is usually metal powder, graphite, carbon black, carbon fiber etc., the characteristics of this class filler are to have good thermal conductivity, can easily make material obtain high heat conductivility, but also make the decreasing insulating of material even become conductive material simultaneously.Therefore in less demanding situation, can use above-mentioned filler for electrical insulating property at the working environment of material.And also necessarily require under certain conditions the heat conduction plastic cement to have low electrical insulating property to meet specific requirement, as anti-static material, electromagnetic shielding material etc.
Flourish information industry in the last few years, performance to macromolecular material has proposed Secretary, especially the development for the heat conduction plastic cement provides development space, the application of heat conduction plastic cement on computer fittings will improve the heat dissipation problem of computer and improve its speed of service and stability, as CPU, notebook computer shell and various surface-mounted integrated circuit, these materials all require heat conductive insulating.Macromolecular material insulate, but as Heat Conduction Material, pure macromolecular material is generally inefficient, because macromolecular material is the non-conductor of heat mostly, the macromolecular material thermal conductivity factor is about the 1/500-1/600 of metal.The thermal conductivity factor of foam plastic only has 0.02-0.046W/m.K, is about 1/1500 of metal, 1/40 of cement concrete, and 1/20 of common brick is desirable heat-insulating material. expand it in the application in heat conduction field, must carry out modification to macromolecular material.The thermal conductivity factor of macromolecular material, metal and metal oxide sees Table 1-1, table 1-2, table 1-3.
The high molecular thermal conductivity factor of table 1-1
The thermal conductivity factor of table 1-2 metal and metal oxide
Can substantially have following several as metal and the inorganic filler of heat conduction particle:
(l) metal powder filler: copper powder, aluminium powder, bronze, silver powder.
(2) metal oxide: aluminium oxide, oxidation is secret, barium monoxide, magnesia, zinc oxide.
(3) metal nitride: aluminium nitride, boron nitride.
(4) inorganic non-metallic: graphite, carborundum.
Inorganic Non-metallic Materials is during as heat filling filled high polymer material matrix, and the quality of filling effect depends primarily on following factor: (l) kind of polymeric matrix, characteristic; (2) shape of filler, particle diameter, distribution of sizes; (3) interaction of the interface binding characteristic of filler and matrix and two-phase.
The thermal conductivity factor of some packing materials of table 1-3
Due to adding of filler, the mechanical performance of material is descended.Therefore, the conductibility that not only will consider in the design of composite, and require that stability of material is good, nontoxic, satisfactory mechanical property and inexpensive.Another selection with respect to filled polymer is the polymer that use itself has the good heat conductive performance, but materials is expensive and performance on deficient in stability, become their major defect in the use.Plastic cement is the material of output maximum in macromolecular material.
The market demand of conductibility macromolecular material is all increasing every year, and wherein the market demand of heat conduction plastic cement increases faster.Therefore the research of plastic cement heat conductivility is caused various countries researcher's interest, and done good work.The research of fillibility heat conduction plastic cement at present, most of method that adopts physics to fill, heat conductivility is poor, and mechanical performance descends serious, and production cost is high.But along with the market of expanding day and going deep into of research, the heat conduction plastic cement will have a large development, especially the research and development of nano heat-conductive material, high heat conduction bulk polymer material preparation, the discussion of polymer thermal conduction mechanism should become the developing direction of heat-conducting polymer material.
Summary of the invention
Technical problem to be solved by this invention is to be, a kind of high heat conduction plastic cement and preparation method and LED lamp and preparation method have been proposed, it is by improving raw material components and formula, its heat conductivility and stability have further been improved, and moulding, fire-retardant and insulating properties have been improved largely, simultaneously, the assemble method of its product is more simplified, and the production efficiency of its product, production cost and service life all are improved largely, and it has reasonable raw material proportioning, the simple characteristics of technique.
The technical solution used in the present invention is: a kind of LED lamp is provided, has comprised: lamp socket, radiator, stainless steel substrate and LED lamp pearl.
Described LED lamp can further have the type of spinning socket;
Described lamp socket can be connected with described radiator by the type socket that spins;
Described LED lamp pearl can be arranged on described stainless steel substrate;
Described stainless steel substrate can be provided with described LED lamp pearl;
The one side of described stainless steel substrate can be connected with radiator;
The described type socket that spins can be attached thereto by the groove that spins that arranges on the rotary joint device that arranges on it and lamp socket connect fixing.
Described radiator can be comprised of fin.
Described fin can adopt arcuate structure and be evenly distributed.
The material that described radiator preferably adopts is the high heat conduction complex plastic of the described nanometer of any one in following content.
For solving the problems of the technologies described above, the present invention also provides a kind of installation method of described LED lamp, comprises the following steps: adopt the Auto-mounting mode to be arranged on stainless steel substrate LED lamp pearl; Adopt the Auto-mounting mode to be connected with described protective cover and described radiator respectively the stainless steel substrate that LED lamp pearl is housed; With lamp socket by the type socket that the spins installation that is connected with radiator by manual assembly.
For solving the problems of the technologies described above, the present invention provides again the radiator that uses in a kind of LED lamp, and the material that described radiator adopts is the high heat conduction complex plastic of the described nanometer of any one in following content.
For solving the problems of the technologies described above, the present invention provides a kind of high heat conducting nano complex plastic again, and the raw material of described high heat conducting nano complex plastic comprises matrix and filler; Described matrix is ABS; Comprise that filler comprises: MgO, Al
2O
3, Si
3N
4, BN and ZnO; The parts by weight of described raw material are: ABS55-80 part, MgO24-30 part, Al
2O
38-14 part, Si
3N
44-9 part, BN6-10 part, ZnO9-16 part.
Described filler may further include: high-purity carbon dust 11-15 part.
Described ABS is acrylonitrile, butadiene and cinnamic terpolymer, and A represents acrylonitrile, and B represents butadiene, and S represents styrene; Wherein, acrylonitrile accounts for 25% ~ 30%, and butadiene accounts for 16% ~ 28%, and styrene accounts for 45% ~ 60%.
It is characterized in that, described filler AlN can for: AlN whisker or AlN particle are done filler.
Described filler may further include: AlN8-12 part.
Described filler may further include: alum 1-3 part, kaolin 1-3 part.
Described ABS can be acrylonitrile, butadiene and cinnamic terpolymer, and A represents acrylonitrile, and B represents butadiene, and S represents styrene; Wherein, acrylonitrile accounts for 25% ~ 30%, and butadiene accounts for 16% ~ 28%, and styrene accounts for 45% ~ 60%.
Described filler AlN can for: AlN whisker and/or AlN particle are done filler.
Described Si
3N
4 canBe highly heat-conductive silicon nitride.
Described BN can be the nm-class boron nitride particle, and can satisfy following index:
Described high heat conducting nano complex plastic can prepare by following steps:
The first step, synthetic rubber: by plastic modified mechanical pelleting, with described matrix, filler, and coupling agent is made plastic grains;
Second step, moulding: by the injection machine injection mo(u)lding;
The 3rd step, baking material: the plastic cement after moulding is added in injecting machine material tube baking material temperature degree 115-135 degree 2-4 hour; Be the injection moulding pressurizations when spending of 225 degree-265 in temperature again, injection moulding pressurization scope is 50-65kgf/ ㎝
2, the time is 45-50 second, carries out injection moulding.
The technique effect that the present invention has a mind to is: proposed a kind of high heat conduction plastic cement and preparation method and LED lamp and installation method, it is by improving raw material components and formula, its heat conductivility and stability have further been improved, and moulding, fire-retardant and insulating properties have been improved largely, it has reasonable raw material proportioning, the simple characteristics of technique; Its product of while, the LED lamp of namely being made by described high heat conduction plastic cement is by the employing type structure that spins, can solve the existing existing problem of LED illuminating lamp, the production and assembly mode that can adopt Auto-mounting and assembly line manually to be used in conjunction with, have production and assembly succinct, production efficiency is high, production cost is low, be connected firmly attractive in appearance, good illumination effect is used safety, the advantage that the life-span is long, the public places such as market, factory, office family can be widely used in, the needs of actual conditions can be satisfied.The present invention mixes by the filler to various difformities and size the capacity of heat transmission that uses the raising Polymers and has carried out the experiment contrast, and filler comprises MgO, Al
2O
3, Si
3N
4, BN, high-purity carbon dust, AlN, ZnO, KAl (SO
4)
212H
2O(alum) and/or Al
2O
3-2SiO
2-2H
2O(kaolin) etc.The present invention significantly improves the thermal conductivity of composite with mixed fillers.Utilization of the present invention has particle, the whisker of certain draw ratio to form continuous heat conduction network chain; Select the filler combination of different particle diameters, reach higher filling density: the interface that utilizes coupling agent to improve filler and matrix, to reduce thermal resistance at the interface; Improve thermal conductivity factor with nanomaterial-filled plastic cement.The high heat conduction complex plastic of nanometer of the present invention is that thermal conductivity is up to the thermoplastic composite resin of 22.45 ~ 33.75w/mK.The technology of the present invention is utilized unique MOLECULE DESIGN, has improved the interaction force of molecule between thermoplastic plastic and filler, and filler high efficiency contact has each other formed the heat passage, has increased substantially thermal conductivity.
Description of drawings
The invention will be further described below in conjunction with drawings and embodiments:
Fig. 1 is its assembled state structural representation of LED lamp of one embodiment of the invention;
Fig. 2 is its split status architecture schematic diagram of LED lamp of one embodiment of the invention;
Fig. 3 is its lamp socket surface structure schematic diagram of LED lamp of one embodiment of the invention;
Fig. 4 is its lamp socket front view of LED lamp of one embodiment of the invention;
Fig. 5 is its lamp base part view of LED lamp of one embodiment of the invention;
Fig. 6 is its radiator surface structure schematic diagram of LED lamp of one embodiment of the invention;
Fig. 7 is its radiator view of LED lamp of one embodiment of the invention;
Fig. 8 is its heat sink side view of LED lamp of one embodiment of the invention;
Fig. 9 is its stainless steel substrate front view of LED lamp of one embodiment of the invention;
Figure 10 is its rate stainless steel substrate side view of LED lamp of one embodiment of the invention;
Figure 11 is its LED lamp pearl structural representation of LED lamp of one embodiment of the invention;
Figure 12 is its protective cover surface structure schematic diagram of LED lamp of one embodiment of the invention;
Figure 13 is its protective cover front view of LED lamp of one embodiment of the invention;
Figure 14 is its protective cover side view of LED lamp of one embodiment of the invention.
The specific embodiment
Describe embodiments of the present invention in detail below with reference to drawings and Examples, how the application technology means solve technical problem to the present invention whereby, and the implementation procedure of reaching technique effect can fully understand and implement according to this.
The high heat conduction complex plastic of nanometer of the present invention, its raw materials comprises matrix and filler; Described matrix is ABS.
ABS resin is little yellow solid, and certain toughness is arranged, and density is about 1.04 ~ 1.06g/cm3.It is antiacid, the corrosive power of alkali, salt is more intense, also can tolerate to a certain extent organic solvent dissolution.ABS resin can be acted normally under the environment of-25 ℃ ~ 60 ℃, and good mouldability is arranged, and the product surface that processes is bright and clean, is easy to dyeing and electroplates.Therefore it can be used to the articles for daily use such as appliance shell, toy.The high building blocks of common pleasure are exactly the ABS goods.
When the adjustment of three kinds of component ratios of blend, the physical property of ABS resin has certain variation: 1,3-butadiene provides low temperature ductility and impact resistance for ABS resin, but too much butadiene can reduce hardness, gloss and the mobility of resin; Acrylonitrile provides the character of the chemical attacks such as hardness, heat resistance, acidproof alkali salt for ABS resin; Styrene provides the mobility of hardness, processing and the fineness of product surface for ABS resin.In ABS resin, rubber grain is decentralized photo, is scattered in resin continuous phase.When being hit, crosslinked rubber grain bears and absorbs this energy, makes stress dispersion, thereby stops the breach development, improves impart tear with this.
ABS is acrylonitrile, butadiene and cinnamic terpolymer, and A represents acrylonitrile, and B represents butadiene, and S represents styrene.Wherein, acrylonitrile accounts for 15% ~ 35%, and butadiene accounts for 5% ~ 30%, and styrene accounts for 40% ~ 60%, and modal ratio is A:B:S=20:30:50, and this moment, the ABS resin fusing point was 175 ℃.
When the adjustment of three kinds of component ratios of blend, the physical property of resin has certain variation: 1,3-butadiene provides low temperature ductility and impact resistance for ABS resin, but too much butadiene can reduce hardness, gloss and the mobility of resin; Acrylonitrile provides the character of the chemical attacks such as hardness, heat resistance, acidproof alkali salt for ABS resin; Styrene provides the mobility of hardness, processing and the fineness of product surface for ABS resin.In ABS resin, rubber grain is decentralized photo, is scattered in SAN resin continuous phase.When being hit, crosslinked rubber grain bears and absorbs this energy, makes stress dispersion, thereby stops the breach development, improves impart tear with this.
ABS resin is take butadiene, styrene, acrylonitrile as raw material.Adopt emulsion polymerization to make polybutadiene latex, then carry out emulsion graft copolymerization with this latex and styrene and acrylonitrile, just make the ABS powder.Adopt suspension polymerization to make AS(SAN) emulsified material.Then with ABS powder, SAN emulsified material and the blending according to a certain ratio of various additive, through extruding pelletization, finally obtain the ABS resin product.
Embodiment 1: the ABS that the embodiment of the present invention is used is acrylonitrile, butadiene and cinnamic terpolymer, and A represents acrylonitrile, and B represents butadiene, and S represents styrene; Wherein, acrylonitrile accounts for 25% ~ 30%, and butadiene accounts for 16% ~ 28%, and styrene accounts for 45% ~ 60%.
High heat conducting nano complex plastic of the present invention, the filler that raw materials comprises are one or more in following compounds (or mixture): MgO, Al
2O
3, Si
3N
4, BN, high-purity carbon dust, AlN, ZnO, KAl (SO
4)
212H
2O(alum), Al
2O
3-2SiO
2-2H
2O(kaolin).
Embodiment 2: the MgO that the embodiment of the present invention is used is the nano-MgO particle.
The nano-powder material industrialized producing technology requires the preparation method simple, and production cost is suitable, good reproducibility, and powder granularity is even, product purity is high, the reunion degree is low.A lot of about the synthetic method of nano magnesia in prior art, but in fact can be applied to industrial less.The one, because problems such as equipment, cost, raw material, scale, investments; The 2nd, some technique still is in the laboratory research stage, realizes that suitability for industrialized production has any problem, and even some may not realize suitability for industrialized production.
The present embodiment adopts indoor temperature solid phase method to prepare the MgO particle.
Solid-phase reaction of the present invention has overcome conventional wet and has prepared the agglomeration traits that the bitter earth nano particle exists, and has reaction and need not the advantages such as solvent, productive rate is high, reaction condition is easy; And overcome that the efficient that exists in original solid-phase reaction is low, the shortcoming of the easy oxidation distortion of particle.
The concrete grammar that the present embodiment indoor temperature solid phase method prepares the MgO particle is: with MgCI solution and Na
2CO
3(raw material mass mixture ratio 1:1.2) solution, take PVA solution (poly-vinyl alcohol solution) as modifier, reaction produces precipitation MgCO
3Precipitation, then under 75 ~ 85 ℃ of constant temperature, the mode that transforms by precipitation has obtained alkali formula carbon formula magnesium presoma.50 ~ 60 ℃ of standing alkali formula carbon formula magnesium presomas precipitate 24-30 hour.Pass at the Ar air-flow at last, temperature is calcination under the condition of 600 ~ 650 ℃, has obtained the nano-MgO particle.Adopt PVA as high molecular surfactant, controlled the reunion of particle, prepared nano-MgO particle dispersion is better, is cubic structure, and is substantially spherical in shape, and its particle diameter is 25-35nm.
Embodiment 3-1: the Si that the embodiment of the present invention is used
3N
4Be the nano silicon nitride silicon grain, satisfy following index:
Embodiment 3-2: the Si that the embodiment of the present invention is used
3N
4Can also be highly heat-conductive silicon nitride.Common silicon nitride has randomly-oriented sintering structure.Highly heat-conductive silicon nitride is to add kind of crystal grain (diameter 1um, long 3-4um) at material powder (below particle diameter 1um), makes the sub-orientations of this all crystal grain, forms the fibrous silicon nitride structure that reaches 100um with orientation.Due to the formation of filamentary structure, thermal conductivity factor presents each diversity, and thermal conductivity factor is 120w/ (mK) on the orientation texture direction, is 3 times of common silicon nitride, is equivalent to the thermal conductivity factor of steel.
Embodiment 4: the BN that the embodiment of the present invention is used is the nano silicon nitride boron particles, satisfies following index:
Embodiment 5: the high-purity carbon dust that the embodiment of the present invention is used is: the 10000 high pure carbon powder of pulling together to produce in the Dongguan.Performance indications are:
| Fixed carbon: | 99.99% | Specification: | 10000 orders |
| The trade mark: | 18925457433 | Moisture: | 0.015% |
| Dilation: | 1-2 doubly | The oversize granularity: | 0.0006% |
| Ash content: | 0.85 | Volatile matter: | 0.01％ |
| The screenings granularity: | 0.0005% | ? | ? |
Embodiment 6: the AlN filler that the embodiment of the present invention is used is: AlN whisker and AlN particle are done filler.In the embodiment of the present invention, as matrix, AlN whisker and AlN particle (6um is following) are filled, and obtain the composite of the highest thermal conductivity 28.2W/ (m.K) with ABS, and AlN whisker and AlN particle ratio (mass ratio) are l:40 ~ 60.What the present invention had further studied filler mixes effect and coupling agent to the impact of composite heat conductivility.With AlN whisker and the AlN mix particles of adequate rate, give composite higher heat-conductivity and lower thermal coefficient of expansion than independent with whisker and particle.By using the coupling agent silane treatment, the thermal conductivity of the ABS composite of AlN particulate reinforcement improves 98%, and the thermal conductivity raising is that the contact resistance of filler-matrix reduces due to the interface by improvement matrix and particle.
Embodiment 7: the ZnO that the embodiment of the present invention is used is: nano granular of zinc oxide.Its performance indications are:
The nano zine oxide that the embodiment of the present invention is used, for above-mentioned: 1 class nano-ZnO, 2 class nano-ZnOs, 3 class nano-ZnOs, in a kind of.
Embodiment 8: embodiment of the present invention high heat conducting nano complex plastic prepares by following steps:
The first step, synthetic rubber: by plastic modified mechanical pelleting, with the matrix in embodiment 1-8, auxiliary material, and coupling agent is made plastic grains;
The parts by weight of described raw material are: ABS50-85 part, MgO22-28 part, Al
2O
310-16 part, Si
3N
43-8 part, BN8-12 part, ZnO8-15 part, high-purity carbon dust 12-16 part, AlN7-11 part, alum 2-4 part, kaolin 2-4 part, coupling agent: 1-3 part;
Second step, moulding: by the injection machine injection mo(u)lding;
The 3rd step, baking material: the plastic cement after moulding is added in injecting machine material tube baking material temperature degree 115-135 degree 2-4 hour; Be the injection moulding pressurizations when spending of 225 degree-265 in temperature again, injection moulding pressurization scope is 50-65kgf/ ㎝
2, the time is 45-50 second, carries out injection moulding.
Embodiment 9: performance test and sign experiment contrast.
Heat conductivility: (GB9342288) carry out with reference to national standard " plastics Determination of conductive coefficients method ", specimen finish is 100mm; The employing steady state method is measured; Tensile property test: (GB1040292) carry out with reference to national standard " plastic tensile method for testing performance ", adopt I type sample, impact property test: (GB1043293) carry out by national standard " plastics charpy impact test method ", adopt the non-notch impact specimen; Scanning electron microscope analysis: after the tensile sample stretch broken, the surperficial metal spraying of fracture surface of sample is observed on the JXA2840 SEM.
The sample preparation
The pretreatment of raw material: will add the inorganic filler of coupling agent to put into baking oven, drying condition is to dry 3～5h under 100 °, make coupling agent and filler grain further combined with.Must carry out drying to pellet before the ABS moulding, drying condition is at 120 ℃ of oven dry 4～6h.
Extruding pelletization: the resin after drying, filler are put into height and are stirred the machine batch mixing, with TE234 double screw extruder extruding pelletization.
Injection moulding: with plastic injection agent injection stretch sample, impact specimen, carry out Mechanics Performance Testing.
The preparation of heat conduction sample: with the disk mold heated to 120 of Φ 100mm ℃, then the molten mass in injection machine is expelled in the disk mould shaped by fluid pressure under the pressure of 11MPa with hydraulic press.
Formula Design: with ABS as matrix; With one or more in following raw material as filler: MgO, Al
2O
3, Si
3N
4, BN, high-purity carbon dust, AlN, ZnO, KAl (SO
4)
212H
2O(alum), Al
2O
3-2SiO
2-2H
2O(kaolin); Be total to 12 kinds of designs with VTES (A-151) as coupling agent, see the following form.The thermal conductivity factor of pure ABS matrix is 0.24W/m.K.
Various formula heat conductivilitys and mechanical property
Filler 1:ABS50 part, MgO22 part, BN8 part, 18 parts of class nano-ZnOs, 12 parts of high-purity carbon dusts, AlN7 part, 2 parts, alum, 2 parts of kaolin, 1 part of coupling agent;
Filler 2:ABS85 part, MgO28 part, Al
2O
316 parts, Si
3N
4(high-termal conductivity) 8 parts, BN12 part, 16 parts of high-purity carbon dusts, 3 parts of coupling agents;
Filler 3:ABS61 part, MgO24 part, Al
2O
313 parts, Si
3N
4(nano particle) 5 parts, 14 parts of high-purity carbon dusts, AlN9 part, 3 parts, alum, 2 parts of coupling agents;
Filler 4:ABS66 part, MgO23 part, Al
2O
315 parts, Si
3N
4(high-termal conductivity) 7 parts, BN12 part, AlN8 part, 2 parts, alum, 4 parts of kaolin, 1 part of coupling agent;
Filler 5:ABS75 part, MgO27 part, Si
3N
4(nano particle) 6 parts, BN8 part, 16 parts of high-purity carbon dusts, 2 parts of kaolin, 3 parts of coupling agents;
Filler 6:ABS77 part, Al
2O
315 parts, Si
3N
4(nano particle) 7 parts, BN11 part, 15 parts of high-purity carbon dusts, AlN7 part, 3 parts, alum, 3 parts of kaolin, 3 parts of coupling agents;
Filler 7:ABS80 part, Al
2O
312 parts, Si
3N
4(high-termal conductivity) 8 parts, BN8 part, 18 parts of class nano-ZnOs, 12 parts of high-purity carbon dusts, AlN10 part, 2 parts of kaolin, 2 parts of coupling agents;
Filler 8:ABS82 part, MgO28 part, Al
2O
313 parts, Si
3N
4(high-termal conductivity) 4 parts, 15 parts of 2 class nano-ZnOs, 16 parts of high-purity carbon dusts, AlN11 part, 1 part of coupling agent;
Filler 9:ABS58 part, MgO23 part, BN10 part, 3 10 parts of class nano-ZnOs, 14 parts of high-purity carbon dusts, AlN9 part, 3 parts of kaolin, 3 parts of coupling agents;
Filler 10:ABS84 part, Al
2O
313 parts, Si
3N
4(high-termal conductivity) 7 parts, BN8 part, 18 parts of class nano-ZnOs, 16 parts of high-purity carbon dusts, coupling agent: 1 part;
Filler 11:ABS69 part, MgO25 part, Al
2O
313 parts, BN11 part, 2 11 parts of class nano-ZnOs, 14 parts of high-purity carbon dusts, AlN9 part, 2 parts, alum, 1 part of coupling agent;
Filler 12:ABS78 part, MgO26 part, Al
2O
315 parts, Si
3N
4(high-termal conductivity) 5 parts, BN9 part, 3 11 parts of class nano-ZnOs, 14 parts of high-purity carbon dusts, 3 parts of kaolin, 2 parts of coupling agents.
High heat conducting nano complex plastic of the present invention is that thermal conductivity can be up to the thermoplastic composite resin of 21.25 ~ 34.56w/mK.The technology of the present invention is utilized unique MOLECULE DESIGN, has improved the interaction force of molecule between thermoplastic plastic and filler, and filler high efficiency contact has each other formed the heat passage, has increased substantially thermal conductivity.
Embodiment 10: as shown in Fig. 1～14, be respectively: its assembled state structural representation of the LED lamp of one embodiment of the invention; Its split status architecture schematic diagram of LED lamp; Its lamp socket surface structure schematic diagram of LED lamp; Its lamp socket front view of LED lamp; Its lamp base part view of LED lamp; Its type socket surface structure schematic diagram that spins of bulb; Its type socket front view that spins of LED lamp; Its type socket side view that spins of LED lamp; Its radiator surface structure schematic diagram of LED lamp; Its radiator view of LED lamp; Its heat sink side view of LED lamp; Its stainless steel substrate front view of LED lamp; Its rate stainless steel substrate side view of LED lamp; Its LED lamp pearl structural representation of LED lamp; Its protective cover surface structure schematic diagram of LED lamp; Its protective cover front view of LED lamp; Its protective cover side view of LED lamp.
In Fig. 1 ~ 14, each Reference numeral is respectively: 1 is lamp socket, and 2 for spinning the type socket, and 3 is radiator, and 4 is stainless steel substrate, and 5 is LED lamp pearl, and 6 is protective cover.
The LED lamp that described high heat conduction plastic cement is made comprises lamp socket 1, radiator 3, stainless steel substrate 4, LED lamp pearl 5 and protective cover 6, also comprises the type socket 2 that spins; Described lamp socket 1 is connected with radiator 3 by the type socket 2 that spins; Described LED lamp pearl 1 is arranged on stainless steel substrate 4; The one side that described stainless steel substrate 4 is provided with LED lamp pearl 5 is connected with protective cover 6, and its another side is connected with radiator 3; Described spin type socket 2 by the groove that spins that arranges on spinning of arranging on it and lamp socket be attached thereto connect fixing; Described radiator 3 is comprised of fin; Described fin adopts arcuate structure and is evenly distributed; Described protective cover 6 adopts the light-transmitting materials structure; Described protective cover 6 is made as the hemisphere face shape.
The installation method of described LED lamp comprises the following steps: adopt the Auto-mounting mode to be arranged on stainless steel substrate 4 LED lamp pearl 5; Adopt the Auto-mounting mode to be connected with protective cover 6 and radiator 3 respectively the stainless steel substrate 4 that LED lamp pearl 5 is housed; With lamp socket 1 by the type socket 2 that the spins installation that is connected with radiator 3 by manual assembly.
Embodiment 11: as shown in Fig. 1～14, be respectively: its assembled state structural representation of the LED lamp of one embodiment of the invention; Its split status architecture schematic diagram of LED lamp; Its lamp socket surface structure schematic diagram of LED lamp; Its lamp socket front view of LED lamp; Its lamp base part view of LED lamp; Its type socket surface structure schematic diagram that spins of bulb; Its type socket front view that spins of LED lamp; Its type socket side view that spins of LED lamp; Its radiator surface structure schematic diagram of LED lamp; Its radiator view of LED lamp; Its heat sink side view of LED lamp; Its stainless steel substrate front view of LED lamp; Its rate stainless steel substrate side view of LED lamp; Its LED lamp pearl structural representation of LED lamp; Its protective cover surface structure schematic diagram of LED lamp; Its protective cover front view of LED lamp; Its protective cover side view of LED lamp.
In Fig. 1～14, each Reference numeral is respectively: 1 is lamp socket, and 2 for spinning the type socket, and 3 is radiator, and 4 is stainless steel substrate, and 5 is LED lamp pearl, and 6 is protective cover.
Its LED lamp of making of the described high heat conduction plastic cement of the present embodiment comprises lamp socket 1, radiator 3, stainless steel substrate 4, LED lamp pearl 5 and protective cover 6, in addition, also comprises the type socket 2 that spins; Described lamp socket 1 is connected with radiator 3 by the type socket 2 that spins; Described LED lamp pearl 5 is arranged on stainless steel substrate 4; The one side that described stainless steel substrate 4 is provided with LED lamp pearl 5 is connected with protective cover 6, and its another side is connected with radiator 3.
The spin groove of the described type socket 2 that spins by setting on the rotary joint device that arranges on it and lamp socket 1 be attached thereto connect fixing.
Described radiator 3 is comprised of fin.
Described fin adopts arcuate structure and is evenly distributed.
Described protective cover 6 adopts the light-transmitting materials structure.
Described protective cover 6 is made as the hemisphere face shape.
Described its installation method of LED lamp comprises the following steps: adopt the Auto-mounting mode to be arranged on stainless steel substrate 4 LED lamp pearl 5; Adopt the Auto-mounting mode to be connected with protective cover 6 and radiator 3 respectively the stainless steel substrate 4 that LED lamp pearl 5 is housed; With lamp socket 1 by the type socket 2 that the spins installation that is connected with radiator 3 by manual assembly.
This intellectual property of primary enforcement that all are above-mentioned is not set restriction this new product of other forms of enforcement and/or new method.Those skilled in the art will utilize this important information, and foregoing is revised, to realize similar implementation status.But all modifications or transformation belong to the right of reservation based on new product of the present invention.
The above is only preferred embodiment of the present invention, is not to be invention to be done the restriction of other form, and any those skilled in the art may utilize the technology contents of above-mentioned announcement to be changed or be modified as the equivalent embodiment of equivalent variations.But every technical solution of the present invention content that do not break away to any simple modification, equivalent variations and remodeling that above embodiment does, still belongs to the protection domain of technical solution of the present invention according to technical spirit of the present invention.
Claims (10)
1. a LED lamp, is characterized in that, comprising: lamp socket, radiator, stainless steel substrate and LED lamp pearl.
2. LED lamp according to claim 1, is characterized in that, described LED lamp further has the type of spinning socket; Described lamp socket is connected with described radiator by the type socket that spins; Described LED lamp pearl is arranged on described stainless steel substrate; Described stainless steel substrate is provided with described LED lamp pearl, and the another side of described stainless steel substrate is connected with radiator; Described spin the type socket by the groove that spins that arranges on the rotary joint device that arranges on it and lamp socket be attached thereto connect fixing.
3. described LED lamp according to claim 1 and 2, is characterized in that, the material that described radiator adopts is the high heat conduction complex plastic of the described nanometer of any one in claim 5～10.
4. the installation method of a LED lamp as described in any one in claim 1～3, is characterized in that, comprises the following steps: adopt the Auto-mounting mode to be arranged on stainless steel substrate LED lamp pearl; Adopt the Auto-mounting mode to be connected with described radiator the stainless steel substrate that LED lamp pearl is housed; With lamp socket by the type socket that the spins installation that is connected with radiator by manual assembly.
5. the radiator that uses in a LED lamp is characterized in that, the material that described radiator adopts is the high heat conduction complex plastic of the described nanometer of any one in claim 6～10.
6. a high heat conducting nano complex plastic, is characterized in that, the raw material of described high heat conducting nano complex plastic comprises matrix and filler; Described matrix is ABS; Comprise that filler comprises: MgO, Al
2O
3, Si
3N
4, BN and ZnO; The parts by weight of described raw material are: ABS55-80 part, MgO24-30 part, Al
2O
38-14 part, Si
3N
44-9 part, BN6-10 part, ZnO9-16 part.
7. high heat conducting nano complex plastic according to claim 6, is characterized in that, described filler further comprises: high-purity carbon dust 11-15 part.
8. according to claim 6 or 7 described high heat conducting nano complex plastics, is characterized in that, described ABS is acrylonitrile, butadiene and cinnamic terpolymer, and A represents acrylonitrile, and B represents butadiene, and S represents styrene; Wherein, acrylonitrile accounts for 25%～30% butadiene and accounts for 16%～28% styrene and account for 45%～60%.
9. the described high heat conducting nano complex plastic of any one according to claim 6-8, is characterized in that, described filler AlN is: AlN whisker or AlN particle are done filler.
10. the described high heat conducting nano complex plastic of any one according to claim 6-9, is characterized in that, prepares by following steps:
The first step, synthetic rubber: by plastic modified mechanical pelleting, with described matrix, filler, and coupling agent is made plastic grains;
Second step, moulding: by the injection machine injection mo(u)lding;
The 3rd step, baking material: the plastic cement after moulding is added in injecting machine material tube baking material temperature degree 115-135 degree 2-4 hour; Be the injection moulding pressurizations when spending of 225 degree-265 in temperature again, injection moulding pressurization scope is 50-65kgf/cm
2, the time is 45-50 second, carries out injection moulding.
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105428473A (en) * | 2015-11-23 | 2016-03-23 | 海宁市新宇光能科技有限公司 | LED filament lamp electric heating clay curing method and device |
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| JPS61221262A (en) * | 1985-03-27 | 1986-10-01 | Fujikura Ltd | Method for processing thermoplastic resin |
| CN101333320A (en) * | 2007-06-25 | 2008-12-31 | 晟茂（青岛）先进材料有限公司 | Conductive heat conducting material and method for manufacturing same |
| CN201421037Y (en) * | 2009-03-12 | 2010-03-10 | 周明华 | Lamp frame with improved structure |
| CN202065740U (en) * | 2011-05-20 | 2011-12-07 | 沈李豪 | LED (light-emitting diode) bulb |
| CN102286207A (en) * | 2011-06-22 | 2011-12-21 | 四川大学 | Thermoplastic polymer based thermal conductive composite and preparation method thereof |
-
2012
- 2012-12-26 CN CN201210573978.8A patent/CN103123057B/en not_active Expired - Fee Related
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS61221262A (en) * | 1985-03-27 | 1986-10-01 | Fujikura Ltd | Method for processing thermoplastic resin |
| CN101333320A (en) * | 2007-06-25 | 2008-12-31 | 晟茂（青岛）先进材料有限公司 | Conductive heat conducting material and method for manufacturing same |
| CN201421037Y (en) * | 2009-03-12 | 2010-03-10 | 周明华 | Lamp frame with improved structure |
| CN202065740U (en) * | 2011-05-20 | 2011-12-07 | 沈李豪 | LED (light-emitting diode) bulb |
| CN102286207A (en) * | 2011-06-22 | 2011-12-21 | 四川大学 | Thermoplastic polymer based thermal conductive composite and preparation method thereof |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
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| CN105428473A (en) * | 2015-11-23 | 2016-03-23 | 海宁市新宇光能科技有限公司 | LED filament lamp electric heating clay curing method and device |
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Effective date of registration: 20150409 Address after: The city of Anshan city of Qingdao province Shandong two road 266033 No. 62 Applicant after: Zhao Yumei Address before: 266071 Shandong city of Qingdao province Hongkong City Road No. 32 Minmetals building room 1101 Applicant before: Zeng Jing |
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Inventor after: Hu Liang Inventor before: Zeng Jing Inventor before: Zeng Zhaoyong Inventor before: Shang Peng Inventor before: Qiu Xintao |
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Effective date of registration: 20170414 Address after: 528400 Guangdong City, Zhongshan Town, Cao an industrial zone, Yongkang Road, No. second, No. 3, 4, 5, 6 Patentee after: Zhongshan Oudian Lighting Co., Ltd. Address before: The city of Anshan city of Qingdao province Shandong two road 266033 No. 62 Patentee before: Zhao Yumei |
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| CF01 | Termination of patent right due to non-payment of annual fee | ||
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Granted publication date: 20150506 Termination date: 20171226 |