CN103121279A - Mold heating and cooling device - Google Patents

Mold heating and cooling device Download PDF

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Publication number
CN103121279A
CN103121279A CN2013100792970A CN201310079297A CN103121279A CN 103121279 A CN103121279 A CN 103121279A CN 2013100792970 A CN2013100792970 A CN 2013100792970A CN 201310079297 A CN201310079297 A CN 201310079297A CN 103121279 A CN103121279 A CN 103121279A
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CN
China
Prior art keywords
mold
temperature
cooling device
heating
channels
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
CN2013100792970A
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Chinese (zh)
Inventor
蔡峻峰
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Kenta Electronic Manufacturing Kunshan Co Ltd
Original Assignee
Kenta Electronic Manufacturing Kunshan Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Kenta Electronic Manufacturing Kunshan Co Ltd filed Critical Kenta Electronic Manufacturing Kunshan Co Ltd
Priority to CN2013100792970A priority Critical patent/CN103121279A/en
Publication of CN103121279A publication Critical patent/CN103121279A/en
Pending legal-status Critical Current

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Abstract

The invention discloses a mold heating and cooling device which comprises a mold core of a mold; a plurality of channels are formed on the bottom of an inner cavity of the mold core; one ends of the channels are provided with water inlets, and the other ends of the channels are provided with water outlets; and each channel is internally provided with a heating bar. According to the mold heating and cooling device, the product surface problems are improved by adopting partial high-low mold temperatures, and cycle influences caused by high mold temperature are improved through instant cooling. Compared with an ordinary mold temperature machine, for the mold heating and cooling device, the temperature can reach higher temperature being 180 DEG C, and the achieved effects are difficult to realize by the ordinary mold temperature machine; the cycle can be greatly shortened due to extremely rapid cooling of the mold; and the temperature can be more flexible and stable due to multiple temperature sensing parts, the partial temperature can be controlled independently, and the product surface appearance quality can be improved.

Description

A kind of mold heated cooling device
Technical field
The present invention relates to a kind of mould servicing unit, particularly a kind of mold heated cooling device.
Background technology
the development of society, people are increasingly to improve to the requirement of life, also higher to the specification requirement of manufacturing simultaneously, only have constantly high-new technology to stand firm in the society of development increasingly, mould temperature in the past is unalterable, can't automatically control in whole molding cycle, can't satisfy some minute surface upsurges of rising in recent years, all requirements for product appearance, minute surface, fuse trace, the stress trace, the problems such as gas line, solution should only have a kind of, increase the mould temperature, common oil temperature machine temperature can reach 140 ℃, above problem can all overcome substantially, but, high bring all bad can't overcome temperature, shrink as the surface, the tired gas of corner and having a strong impact on of cycle.
Summary of the invention
In order to overcome defects, the invention provides a kind of reaching without fusing trace, again can instantaneous cooling, in the saving cycle, saved the mold heated cooling device of cost.
The present invention for the technical scheme that solves its technical problem and adopt is: a kind of mold heated cooling device, the core rod that comprises mould, the intracavity bottom of described core rod is provided with some passages, one end of described passage is provided with water inlet, the other end of passage is provided with delivery port, is provided with a heating rod in described each passage.
As a further improvement on the present invention, the length of described heating rod is less than the length of passage.
As a further improvement on the present invention, described heating rod is provided with temperature sensor, and described temperature sensor connects the control device of heating rod.
As a further improvement on the present invention, the intracavity bottom of described core rod is provided with 3 equally distributed pipelines.
The invention has the beneficial effects as follows: the present invention has adopted local height mould temperature to improve the product surface problem, and instantaneous cooling has improved the next cycle impact in high mould temperate zone.Compare with common die heater: temperature can reach 180 ℃ of higher temperature, and the effect that reaches is that common die heater can't be realized; Very fast cooling of mould shortened the cycle greatly; The many places temperature-sensitive makes temperature sensitiveer stable, can control separately local temperature, improves the product surface presentation quality.
Description of drawings
Fig. 1 is structural representation of the present invention;
Fig. 2 is the top view of Fig. 1.
In accompanying drawing, the mark of each parts is as follows: 1, core rod; 2, passage; 3, water inlet; 4, delivery port; 5, heating rod; 6, temperature sensor.
The specific embodiment
In order to deepen the understanding of the present invention, the invention will be further described below in conjunction with embodiment and accompanying drawing, and this embodiment only is used for explaining the present invention, does not consist of the restriction to protection domain of the present invention.
Fig. 1 has shown a kind of embodiment of a kind of mold heated cooling device of the present invention, the core rod 1 that comprises mould, the intracavity bottom of described core rod 1 is provided with some passages 2, one end of described passage 2 is provided with water inlet 3, the other end of passage 2 is provided with delivery port 4, be provided with a heating rod 5 in described each passage 2, the length of described heating rod 5 is less than the length of passage 2, described heating rod 5 is provided with temperature sensor 6, described temperature sensor 6 connects the control device of heating rod 5, and the intracavity bottom of described core rod 1 is provided with 3 equally distributed pipelines 2.At first heat core rod 1 intracavity bottoms by heating rod 5 during use, after injection machine penetrates formed product, the outside water system that water inlet 3 connects is injected the water quench product, and by blowning installation, water is blown out by delivery port 4, product is taken out in die sinking this moment can obtain surface quality injecting products preferably.

Claims (4)

1. mold heated cooling device, the core rod (1) that comprises mould, it is characterized in that: the intracavity bottom of described core rod (1) is provided with some passages (2), one end of described passage (2) is provided with water inlet (3), the other end of passage (2) is provided with delivery port (4), is provided with a heating rod (5) in described each passage (2).
2. mold heated cooling device according to claim 1, it is characterized in that: the length of described heating rod (5) is less than the length of passage (2).
3. mold heated cooling device according to claim 1, it is characterized in that: described heating rod (5) is provided with temperature sensor (6), and described temperature sensor (6) connects the control device of heating rod (5).
4. mold heated cooling device according to claim 1, it is characterized in that: the intracavity bottom of described core rod (1) is provided with 3 equally distributed pipelines (2).
CN2013100792970A 2013-03-13 2013-03-13 Mold heating and cooling device Pending CN103121279A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN2013100792970A CN103121279A (en) 2013-03-13 2013-03-13 Mold heating and cooling device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN2013100792970A CN103121279A (en) 2013-03-13 2013-03-13 Mold heating and cooling device

Publications (1)

Publication Number Publication Date
CN103121279A true CN103121279A (en) 2013-05-29

Family

ID=48452514

Family Applications (1)

Application Number Title Priority Date Filing Date
CN2013100792970A Pending CN103121279A (en) 2013-03-13 2013-03-13 Mold heating and cooling device

Country Status (1)

Country Link
CN (1) CN103121279A (en)

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN201399884Y (en) * 2009-05-04 2010-02-10 南靖万利达科技有限公司 Heating and cooling device for instant cooling non-mark injection molding plastic mould
CN201525114U (en) * 2009-10-28 2010-07-14 杨东佐 Mold thermal shock structure
CN201979672U (en) * 2010-12-20 2011-09-21 上海天海电子有限公司 Novel mould heating rod device
CN203198199U (en) * 2013-03-13 2013-09-18 健大电业制品(昆山)有限公司 Mold heating and cooling device

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN201399884Y (en) * 2009-05-04 2010-02-10 南靖万利达科技有限公司 Heating and cooling device for instant cooling non-mark injection molding plastic mould
CN201525114U (en) * 2009-10-28 2010-07-14 杨东佐 Mold thermal shock structure
CN201979672U (en) * 2010-12-20 2011-09-21 上海天海电子有限公司 Novel mould heating rod device
CN203198199U (en) * 2013-03-13 2013-09-18 健大电业制品(昆山)有限公司 Mold heating and cooling device

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Application publication date: 20130529