CN103111517A - Slicken solder loading forming molding-die and manufacturing method thereof - Google Patents
Slicken solder loading forming molding-die and manufacturing method thereof Download PDFInfo
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- CN103111517A CN103111517A CN2013100129554A CN201310012955A CN103111517A CN 103111517 A CN103111517 A CN 103111517A CN 2013100129554 A CN2013100129554 A CN 2013100129554A CN 201310012955 A CN201310012955 A CN 201310012955A CN 103111517 A CN103111517 A CN 103111517A
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- pressing mold
- slicken solder
- forming molding
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Abstract
The invention discloses a slicken solder loading forming molding and manufacturing method of the slicken solder loading forming molding-die. The slicken solder loading forming molding-die comprises a molding-die body which is made of wear-resistant high-temperature-resistant ceramic materials. The slicken solder loading forming molding-die using the ceramic materials instead of metal materials solves the problems that the forming molding-die is attached on the solder under high temperature and wearing is too fast. The ceramic materials is stronger in temperature resistance than the metal materials, not attached to the slicken solder and stronger in wear-resistant than ordinary metal materials, and therefore service life of the forming molding-die is prolonged. The ceramic forming molding-die is prone to processing in batch through special dies, and the metal forming molding-die can only conduct machinery sophisticated processing one by one and cost high. Compared with the metal forming molding-die, the ceramic forming molding-die is long is service life, low in cost and capable of improving benefits.
Description
Technical field
The present invention relates to semiconductor device packaging technique, when especially relating to a kind of high power device slicken solder load, be used for guaranteeing the flatness of load and conforming shaping pressing mold and the manufacture method thereof of tin thickness.
Background technology
At present, in the semiconductor packages process, what traditional slicken solder load shaping pressing mold generally used is metal material, has following shortcoming:
1) metal material easily wearing and tearing, deformation under hot conditions,
2) particulate metal of slicken solder material, easily the shaping pressing mold of adhesiving metal material, accelerate the wearing and tearing of shaping pressing mold and scrap;
3) metal shaping pressing mold can only one one carries out mechanical Precision Machining, and processing cost is higher.
Summary of the invention
The object of the present invention is to provide a kind of slicken solder load shaping pressing mold, it has characteristics wear-resisting, high temperature resistant, long service life.To solve the problem that in prior art, slicken solder load shaping pressing mold exists.
Another object of the present invention provides a kind of manufacture method of slicken solder load shaping pressing mold, and this manufacture method is easy to produce in batches, has reduced the processing cost of shaping pressing mold, to solve the higher problem of slicken solder load shaping pressing mold processing cost in prior art
The objective of the invention is to be achieved through the following technical solutions:
A kind of slicken solder load shaping pressing mold, it comprises the pressing mold body, wherein, described pressing mold body is made by wear-resisting, resistant to elevated temperatures ceramic material.
Especially, described pressing mold body adopt aluminium oxide ceramics, silicon nitride ceramics and glass ceramics any make.
A kind of manufacture method of slicken solder load shaping pressing mold, it comprises the following steps:
A, pressing mold: ceramic material is made blank by particular manufacturing craft;
B, sintering: above-mentioned blank is fired, and sintering temperature is 900 ℃～1300 ℃;
C, fine finishining: the product after sintering is carried out fine finishining by grinding machine.
Especially, the sintering temperature in described step b is 1100 ℃.
Beneficial effect of the present invention is that described slicken solder load shaping pressing mold and manufacture method thereof compared with prior art have following advantage:
1) ceramic material high temperature resistance characteristic is stronger than common metal, and does not adhere to slicken solder, and wearability is stronger than common metal, has improved the service life of shaping pressing mold;
2) ceramic shaping pressing mold is easy to batch machining by particular manufacturing craft, and processing cost is low;
3) the shaping pressing mold life-span of ceramic material is longer, cost is low.
Description of drawings
Fig. 1 is the structural representation of the slicken solder load shaping pressing mold that provides of the specific embodiment of the invention 1.
The specific embodiment
Further illustrate technical scheme of the present invention below in conjunction with accompanying drawing and by the specific embodiment.
See also shown in Figure 1ly, Fig. 1 is the structural representation of the slicken solder load shaping pressing mold that provides of the specific embodiment of the invention 1.
In the present embodiment, a kind of slicken solder load shaping pressing mold comprises the pressing mold body, and described pressing mold body is made by wear-resisting, resistant to elevated temperatures aluminium oxide ceramics.
A kind of manufacture method of slicken solder load shaping pressing mold, it comprises the following steps:
A, pressing mold: ceramic material is made blank by particular manufacturing craft;
B, sintering: above-mentioned blank is fired, and sintering temperature is 1100 ℃;
C, fine finishining: the product after sintering is carried out fine finishining by grinding machine.
Above-mentioned shaping pressing mold utilizes ceramic material high temperature resistance characteristic stronger than common metal, and does not adhere to slicken solder, and wearability is stronger than common metal, has improved the service life of shaping pressing mold.Pottery shaping pressing mold is easy to batch machining by particular manufacturing craft, and processing cost is low.The shaping pressing mold of ceramic material is longer than the shaping pressing mold life-span of metal material, cost is lower.
Above embodiment has just set forth basic principle of the present invention and characteristic; the present invention is not limited by above-mentioned example; without departing from the spirit and scope of the present invention, the present invention also has various variations and change, and these variations and change all fall in the claimed scope of the invention.The claimed scope of the present invention is defined by appending claims and equivalent thereof.
Claims (4)
1. slicken solder load shaping pressing mold, it comprises the pressing mold body, it is characterized in that: described pressing mold body is made by wear-resisting, resistant to elevated temperatures ceramic material.
2. slicken solder load shaping pressing mold according to claim 1; It is characterized in that: any of the described employing of pressing mold body aluminium oxide ceramics, silicon nitride ceramics and glass ceramics made.
3. the manufacture method of a slicken solder load shaping pressing mold, it is characterized in that: it comprises the following steps:
A, pressing mold: ceramic material is made blank by particular manufacturing craft;
B, sintering: above-mentioned blank is fired, and sintering temperature is 900 ℃～1300 ℃;
C, fine finishining: the product after sintering is carried out fine finishining by grinding machine.
4. the manufacture method of slicken solder load shaping pressing mold according to claim 3; It is characterized in that: the sintering temperature in described step b is 1100 ℃.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2013100129554A CN103111517A (en) | 2013-01-14 | 2013-01-14 | Slicken solder loading forming molding-die and manufacturing method thereof |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2013100129554A CN103111517A (en) | 2013-01-14 | 2013-01-14 | Slicken solder loading forming molding-die and manufacturing method thereof |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN103111517A true CN103111517A (en) | 2013-05-22 |
Family
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN2013100129554A Pending CN103111517A (en) | 2013-01-14 | 2013-01-14 | Slicken solder loading forming molding-die and manufacturing method thereof |
Country Status (1)
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| CN (1) | CN103111517A (en) |
Citations (9)
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| EP1170264A1 (en) * | 2000-07-04 | 2002-01-09 | Schott Glas | Translucent glass-ceramic, process for manufacturing a translucent glass-ceramic as well as its application |
| DE10238607A1 (en) * | 2002-08-16 | 2004-03-04 | Schott Glas | Process for forming glass or glass ceramic |
| CN2907950Y (en) * | 2006-06-07 | 2007-06-06 | 宁波康强电子股份有限公司 | Punching press terrace die punch pin |
| US7587919B1 (en) * | 2008-04-01 | 2009-09-15 | Ford Global Technologies Llc | Wear resistant coated sheet metal die and method to manufacture a wear resistant coated sheet metal forming die |
| CN201350481Y (en) * | 2009-02-06 | 2009-11-25 | 宁波富邦电池有限公司 | Press die |
| CN201702261U (en) * | 2010-05-07 | 2011-01-12 | 陈中红 | Ceramic pressing shield die |
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| CN102233384A (en) * | 2010-05-07 | 2011-11-09 | 陈中红 | Ceramic gland mold and manufacturing method thereof |
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2013
- 2013-01-14 CN CN2013100129554A patent/CN103111517A/en active Pending
Patent Citations (9)
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| US5057256A (en) * | 1988-08-02 | 1991-10-15 | Societe Anonyme Des Usines Chausson | Process for manufacturing a tool, particularly a tool for stamping and printing metal sheet parts |
| EP1170264A1 (en) * | 2000-07-04 | 2002-01-09 | Schott Glas | Translucent glass-ceramic, process for manufacturing a translucent glass-ceramic as well as its application |
| DE10238607A1 (en) * | 2002-08-16 | 2004-03-04 | Schott Glas | Process for forming glass or glass ceramic |
| CN2907950Y (en) * | 2006-06-07 | 2007-06-06 | 宁波康强电子股份有限公司 | Punching press terrace die punch pin |
| US7587919B1 (en) * | 2008-04-01 | 2009-09-15 | Ford Global Technologies Llc | Wear resistant coated sheet metal die and method to manufacture a wear resistant coated sheet metal forming die |
| CN201350481Y (en) * | 2009-02-06 | 2009-11-25 | 宁波富邦电池有限公司 | Press die |
| CN101992244A (en) * | 2009-08-13 | 2011-03-30 | 深圳富泰宏精密工业有限公司 | Metallic high-temperature forming die and manufacturing method thereof |
| CN201702261U (en) * | 2010-05-07 | 2011-01-12 | 陈中红 | Ceramic pressing shield die |
| CN102233384A (en) * | 2010-05-07 | 2011-11-09 | 陈中红 | Ceramic gland mold and manufacturing method thereof |
Non-Patent Citations (3)
| Title |
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| 吴浩: "黑色氧化铝陶瓷配方和工艺研究", 《中国优秀博硕士学位论文全文数据库 (硕士) 工程科技Ⅰ辑》 * |
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| 柏振海: "热压烧结温度对两种金属陶瓷组织性能的影响", 《硬质合金》 * |
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Application publication date: 20130522 |