CN103104847A - Light-emitting diode (LED) light source - Google Patents
Light-emitting diode (LED) light source Download PDFInfo
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- CN103104847A CN103104847A CN2013100535492A CN201310053549A CN103104847A CN 103104847 A CN103104847 A CN 103104847A CN 2013100535492 A CN2013100535492 A CN 2013100535492A CN 201310053549 A CN201310053549 A CN 201310053549A CN 103104847 A CN103104847 A CN 103104847A
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Abstract
The invention relates to the field of lighting, and discloses a light-emitting diode (LED) light source. The LED light source comprises a base plate, a circuit line is arranged in the base plate in a spreading mode, at least one LED wafer is arranged on at least one surface of the base plate, positive and negative electrodes of the LED wafer are respectively connected with the circuit line in an electric mode, light-transmitting insulating liquid is arranged on at least one surface of the base plate in a packaging mode, and the LED wafers are respectively soaked in the insulation liquid. The LED light source has good heat dissipation performance.
Description
Technical field
The present invention relates to lighting field, particularly a kind of LED light source.
Background technology
Due to characteristics such as LED has that volume is little, luminous efficiency is high, power consumption is few, long service life, security reliability are strong, energy-conserving and environment-protective, LED just substitutes the traditional lighting light fixture as a kind of novel environment friendly illumination.
In recent years along with the development of LED technology, LED is due to its luminous efficiency higher (generally reaching 120-160lm/W), more the advantage of environmental protection and energy saving and enjoy the favor of various countries.But because the wafer surface operating temperature requirement of LED wafer is that normal working temperature is lower, if will strengthening due to the thermal resistance of LED wafer, excess Temperature further produces heat, make temperature further increase, make Current rise cause that snowslide phenomenon produces light decay immediately.Therefore the heat radiation of LED is more and more paid attention to by people now, this is that the bad junction temperature of heat radiation is just high because the light decay of LED wafer or its life-span are directly relevant with its junction temperature, and the life-span is just short.
If the junction temperature of LED wafer can be controlled at 65 ° of C, the life-span of this LED wafer light decay to 70% could be up to 100,000 hours so from the relation of the light decay of LED wafer and junction temperature as can be known! Therefore the heat radiation of LED wafer has become to affect the major control factor in the life-span of LED light fixture.
Summary of the invention
The embodiment of the present invention the first purpose is to provide a kind of LED light source, and this LED light source possesses thermal diffusivity well.
A kind of LED light source that the embodiment of the present invention provides comprises:
Substrate is equipped with circuit-line in described substrate,
On at least one surface of described substrate, at least one LED wafer is installed, the both positive and negative polarity of all described LED wafers is electrically connected to described circuit-line respectively;
Also be packaged with the iknsulating liquid of light-permeable at least one surface of described substrate, each described LED wafer is immersed in respectively in described iknsulating liquid.
Alternatively, the cover of a light-permeable is arranged at least one surface coverage of described substrate,
Described cover is connected with at least one surface of described substrate, and described iknsulating liquid fills in the cavity of described cover and the formation of described substrate.
Alternatively, also be provided with at least one fluid passage in described substrate,
Each described fluid passage is connected with described cavity, and described iknsulating liquid also fills respectively to be stated in the fluid passage.
Alternatively, also be extended with at least one described outstanding cylinder in the bottom surface of described substrate,
Also be provided with described fluid passage in described outstanding cylinder.
Alternatively, also be connected with the feed liquor mouth of pipe and the fluid mouth of pipe on described cover,
One end of the described feed liquor mouth of pipe, the fluid mouth of pipe is connected with cavity between substrate with described cover respectively.
Alternatively, also be provided with at least one fixed leg for fixing described LED light source on described substrate.
Alternatively, described iknsulating liquid is glycerine, pure water or silicone oil.
Alternatively, described substrate is metal substrate or pcb board.
Therefore, adopting the present embodiment technical scheme, the circuit-line that external dc power can pass through in substrate 101 is powered to each LED wafer 102, drive each LED wafer 102 work externally luminous, and light sees through iknsulating liquid 103 and outwards sends the realization illumination.LED wafer 102 produces heat in each LED wafer 102 courses of work, due in each LED wafer 102 is immersed in iknsulating liquid 103, be passed to rapidly in iknsulating liquid 103 therefore the heat on LED wafer 102 conducts by contact, by iknsulating liquid 103, heat be delivered to the outside.
With respect in prior art on the substrate 101 of carrying LED wafer 102 fixing traditional indirect radiating mode of cooling base or other heat abstractors.Use the present embodiment technical scheme, because the surrounding at LED wafer 102 directly covers iknsulating liquid 103, directly LED wafer 102 is dispelled the heat, its radiating mode is more directly efficient, the present embodiment technical scheme is specially adapted to high-power LED light source, is conducive to promote the high-power applications of LED light source.
Description of drawings
Accompanying drawing described herein is used to provide a further understanding of the present invention, consists of the application's a part, does not consist of to improper restriction of the present invention, in the accompanying drawings:
The liquid cover type LED light source structural representation of the first embodiment that Fig. 1 provides for the present embodiment 1;
The liquid cover type LED light source structural representation of the second embodiment that Fig. 2 provides for the present embodiment 1;
The liquid cover type LED light source structural representation of the 3rd embodiment that Fig. 3 provides for the present embodiment 1;
The liquid cover type LED light source structural representation of the 4th embodiment that Fig. 4 provides for the present embodiment 1;
The liquid cover type LED light source structural representation of the 5th embodiment that Fig. 5 provides for the present embodiment 1;
The liquid cover type LED light source structural representation of the 6th embodiment that Fig. 6 provides for the present embodiment 1;
The LED light source structural representation of the Comparative Examples 1 that Fig. 7 provides for the present embodiment 1;
The LED light source structural representation of the Comparative Examples 2 that Fig. 8 provides for the present embodiment 1.
Reference numeral:
101: substrate; The 102:LED wafer; 103: iknsulating liquid;
104: cover; 204: fixed leg; 304: extension;
305: the fluid passage; 404: the feed liquor mouth of pipe; 405: the fluid mouth of pipe;
501: cover; 601: cover; 701: substrate;
The 702:LED wafer; 703: liquid.
The specific embodiment
Describe the present invention in detail below in conjunction with accompanying drawing and specific embodiment, be used for explaining the present invention in this illustrative examples of the present invention and explanation, but not as a limitation of the invention.
Embodiment 1:
Shown in Fig. 1-3, the present embodiment provides a kind of liquid cover type LED light source, and it mainly comprises: substrate 101, one or more LED wafer 102, iknsulating liquid 103.Its structure is as follows:
All be packaged with the iknsulating liquid 103 of light-permeable in the periphery of each LED wafer 102, make iknsulating liquid 103 cover on substrate 101, the surface of LED wafer 102 is installed and LED wafer 102 is immersed in iknsulating liquid 103.
Can select in the present embodiment glycerine (molecular formula HOCH2CH (OH) CH2OH claims again glycerine), silicone oil or pure water etc. to possess the liquid of higher thermal capacity as the iknsulating liquid 103 of the present embodiment.
The operation principle of the present embodiment LED light source is, external dc power to each LED wafer 102 power supplies, drives each LED wafer 102 work externally luminous by the circuit-line in substrate 101, and light sees through iknsulating liquid 103 and outwards sends and realize illumination.LED wafer 102 produces heat in each LED wafer 102 courses of work, due in each LED wafer 102 is immersed in iknsulating liquid 103, be passed to rapidly in iknsulating liquid 103 therefore the heat on LED wafer 102 conducts by contact, by iknsulating liquid 103, heat be delivered to the outside.
With respect in prior art on the substrate 101 of carrying LED wafer 102 fixing traditional indirect radiating mode of cooling base or other heat abstractors.Use the present embodiment technical scheme, because the surrounding at LED wafer 102 directly covers iknsulating liquid 103, directly LED wafer 102 is dispelled the heat, its radiating mode is more directly efficient, the present embodiment technical scheme is specially adapted to high-power LED light source, is conducive to promote the high-power applications of LED light source.
Figure 1 shows that the first embodiment of the present embodiment LED light source, it specifically is fixed with one or more LED wafer 102 at the end face of substrate 101, outside each LED wafer 102 or at the cover 104 of a circle of the outer covering of all LED wafers 102 (its can also but be not limited to prismatic, square, oval or other how much space patterns arbitrarily).Cover 104 is tightly connected with the end face of substrate 101, and the cavity of formation sealing between cover 104 and substrate 101 fills in cavity or half full the perfusion is sealed with iknsulating liquid 103, and all LED wafers 102 all are soaked in iknsulating liquid 103.
Figure 2 shows that the second embodiment of the present embodiment LED light source, its main distinction with respect to Fig. 1 is: the back side of the substrate 101 of the LED light source of this second implementation structure (also can according to the place of mounting design needs design at other) be provided with at least one fixed leg 204, this fixed leg 204 can but be not limited to the screw of threaded shape or other so that the user directly is arranged on the present embodiment LED light source by the fixed leg 204 of this LED light source the parts that need.
Figure 3 shows that the 3rd embodiment of the present embodiment LED light source, its main distinction with respect to Fig. 1 is: also be provided with at least two fluid passages 305 in the substrate 101 of the LED light source of this 3rd implementation structure, in this 3rd implementation structure, a negative extension 304 can also be set at the back side of substrate 101, in the interior fluid passage 305 that arranges of each extension 304, to improve the quantity of fluid passage 305, improve the contact area of fluid and substrate 101.Each fluid passage 305 all is communicated with the liquid cavity at each LED wafer 102 places, thereby realize that all fluid passages 305 in substrate 101 are communicated with the liquid cavity at each LED wafer 102 places, be the iknsulating liquid 103 liquid cavity that can run through the LED place on substrate 101 surfaces, all fluid passages 305 circulations in substrate 101, the opening of at least two fluid passages 305 externally is communicated with.when using, with a fluid passage 305 that externally is communicated with wherein as the fluid perfusion entrance, another fluid passage 305 that externally is communicated with is as liquid perfusion outlet, in the LED light source course of work, by pressure toward fluid passage 305 perfusion iknsulating liquids 103, make iknsulating liquid 103 in substrate 101 and the iknsulating liquid 103 of each LED wafer 102 peripheries is in circulation status all the time, flow through substrate 101, and the iknsulating liquid 103 of LED wafer 102 conducts to heat on substrate 101 with LED wafer 102, and the heat on LED wafer 102 is taken away, export by fluid perfusion and flow to the outside, realize rapidly and efficiently heat radiation.
the 4th embodiment of LED light source embodiment illustrated in fig. 4, it with respect to Fig. 2 main distinction is: also be provided with the feed liquor mouth of pipe 404 on the cover of the LED light source of this 4th implementation structure, the fluid mouth of pipe 405, the feed liquor mouth of pipe 404 fixedly the time, the fluid mouth of pipe 405 is communicated with the cavity at LED wafer 102 places respectively, when using, the feed liquor mouth of pipe 404 at cover 104, the fluid mouth of pipe 405 places are external input duct respectively, the fluid pipeline, pour into iknsulating liquid 103 by input duct, the iknsulating liquid 103 of perfusion enters cavity under pressure, contact respectively with each LED wafer 102 heat of taking away LED wafer 102, iknsulating liquid 103 flows out from the fluid pipeline under pressure, take heat to outside, realize the mobile heat radiation of the iknsulating liquid 103 that LED wafer 102 is outer, further improve radiating efficiency.
The 5th embodiment of LED light source embodiment illustrated in fig. 5, it with respect to Fig. 3 main distinction is: cover that cover 501 on this 5th implementation structure is square and non-circular.Other structures and in like manner shown in Figure 3.
The 6th embodiment of LED light source embodiment illustrated in fig. 6, it with respect to Fig. 4 main distinction is: cover that cover 601 on this 5th implementation structure is square and non-circular.Other structures and in like manner shown in Figure 4.
Test data analyzer:
In order to further illustrate the effect of the present embodiment LED light source, below illustrate explanation by test data.
End face at the substrate of the embodiment 1-6 shown in Fig. 1-6 is fixed respectively 10 LEDs wafers, and each LED wafer is the high-power and high-luminance LED wafer, and the brightness of LED wafer is 100 lumens.
The structural representation of the Comparative Examples 1 that Fig. 7 provides for the present embodiment is fixed with specifications parameter (parameter that comprises brightness and the quantity) LED identical with the present embodiment 1-6 at the end face of the substrate 701 of Comparative Examples 1 brilliant: 702.Bottom surface at the substrate of Comparative Examples 1 is provided with negotiable liquid 703.
The structural representation of the Comparative Examples 2 that Fig. 8 provides for the present embodiment is fixed with the specifications parameter LED wafer 702 identical with the present embodiment 1-6 at the end face of the substrate 701 of Comparative Examples 2.Bottom surface at the substrate of Comparative Examples 2 is provided with negotiable liquid 703, and these liquid also flow through the fixed leg 804 that is fixed on substrate bottom surface.
Respectively under environment temperature is the environment of 24 degrees centigrade, LED light source energising to embodiment 1-6, Comparative Examples 1-2 drives each LED light source work, survey the temperature of obtaining each LED wafer surface and the temperature of substrate top surface presumptive test point at following predetermined each timing node by the mode of infrared acquisition respectively, obtain the test data shown in following table one:
Table 1: the temperature of each timing node during each LED light source work
Remarks: temperature drop ratio in Table 1 specifically: each temperature-averaging value of this enforcement 1-6 is respectively with respect to the decline percentages of the temperature-averaging value of Comparative Examples 1-2.
By upper table one as seen, use the present embodiment technical scheme, in the situation that same substrate, identical LED wafer (namely except the difference that arranges of radiator liquid, in the identical situation of other conditions), the structure of application the present embodiment technical scheme promotes greatly for the radiating efficiency of LED wafer, particularly for the high strength LED light source that need work long hours.Use the present embodiment technical scheme and can greatly control the temperature of LED wafer, avoid its temperature rise in application process too high, be conducive to extend the service life of high-power LED light source, be conducive to applying of high-power LED light source.
Need to prove, this substrate can be the PCT substrate in the present embodiment, also can but be not limited to heat dispersion metal substrate well, such as aluminium sheet, copper coin etc.
The above technical scheme that the embodiment of the present invention is provided is described in detail, used specific case herein principle and the embodiment of the embodiment of the present invention are set forth, the explanation of above embodiment is only applicable to help to understand the principle of the embodiment of the present invention; Simultaneously, for one of ordinary skill in the art, according to the embodiment of the present invention, all will change on the specific embodiment and range of application, in sum, this description should not be construed as limitation of the present invention.
Claims (8)
1. a LED light source, is characterized in that, comprising:
Substrate is equipped with circuit-line in described substrate,
On at least one surface of described substrate, at least one LED wafer is installed, the both positive and negative polarity of all described LED wafers is electrically connected to described circuit-line respectively;
Also be packaged with the iknsulating liquid of light-permeable at least one surface of described substrate, each described LED wafer is immersed in respectively in described iknsulating liquid.
2. LED light source according to claim 1, is characterized in that,
The cover that one light-permeable is arranged at least one surface coverage of described substrate,
Described cover is connected with at least one surface of described substrate, and described iknsulating liquid fills in the cavity of described cover and the formation of described substrate.
3. LED light source according to claim 2, is characterized in that,
Also be provided with at least one fluid passage in described substrate,
Each described fluid passage is connected with described cavity, and described iknsulating liquid also fills respectively to be stated in the fluid passage.
4. LED light source according to claim 3, is characterized in that,
Also be extended with at least one described outstanding cylinder in the bottom surface of described substrate,
Also be provided with described fluid passage in described outstanding cylinder.
5. according to claim 2 or 3 or 4 described LED light sources, is characterized in that,
Also be connected with the feed liquor mouth of pipe and the fluid mouth of pipe on described cover,
One end of the described feed liquor mouth of pipe, the fluid mouth of pipe is connected with cavity between substrate with described cover respectively.
6. according to claim 2 or 3 or 4 described LED light sources, is characterized in that,
Also be provided with at least one fixed leg for fixing described LED light source on described substrate.
7. according to claim 1 and 2 or 3 or 4 described LED light sources, is characterized in that,
Described iknsulating liquid is glycerine, pure water or silicone oil.
8. according to claim 1 and 2 or 3 or 4 described LED light sources, is characterized in that,
Described substrate is metal substrate or pcb board.
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| Application Number | Priority Date | Filing Date | Title |
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| CN2013100535492A CN103104847A (en) | 2013-02-19 | 2013-02-19 | Light-emitting diode (LED) light source |
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| CN2013100535492A CN103104847A (en) | 2013-02-19 | 2013-02-19 | Light-emitting diode (LED) light source |
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Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101866995A (en) * | 2009-04-16 | 2010-10-20 | 财团法人工业技术研究院 | Light-emitting diode packaging structure |
| KR101014910B1 (en) * | 2006-07-17 | 2011-02-15 | 리퀴드엘이디스 라이팅 컴퍼니 리미티드 | High power led lamp with heat dissipation enhancement |
| CN102606996A (en) * | 2012-02-27 | 2012-07-25 | 中国科学院广州能源研究所 | Thermal-drive natural-circulation lamp pole cooling system for LED streetlamp |
| CN203052355U (en) * | 2013-02-19 | 2013-07-10 | 邹翔 | LED (Light Emitting Diode) light source |
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2013
- 2013-02-19 CN CN2013100535492A patent/CN103104847A/en active Pending
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR101014910B1 (en) * | 2006-07-17 | 2011-02-15 | 리퀴드엘이디스 라이팅 컴퍼니 리미티드 | High power led lamp with heat dissipation enhancement |
| CN101866995A (en) * | 2009-04-16 | 2010-10-20 | 财团法人工业技术研究院 | Light-emitting diode packaging structure |
| CN102606996A (en) * | 2012-02-27 | 2012-07-25 | 中国科学院广州能源研究所 | Thermal-drive natural-circulation lamp pole cooling system for LED streetlamp |
| CN203052355U (en) * | 2013-02-19 | 2013-07-10 | 邹翔 | LED (Light Emitting Diode) light source |
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