CN103104827B - Bulb type lamp and lighting device - Google Patents
Bulb type lamp and lighting device Download PDFInfo
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- CN103104827B CN103104827B CN201110379478.6A CN201110379478A CN103104827B CN 103104827 B CN103104827 B CN 103104827B CN 201110379478 A CN201110379478 A CN 201110379478A CN 103104827 B CN103104827 B CN 103104827B
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- bulb
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- Fastening Of Light Sources Or Lamp Holders (AREA)
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Abstract
A kind of bulb type lamp and lighting device, it can eliminate the Insulation Problems on substrate, and can make the enlarged areas of the illuminating part on substrate, maybe substrate can be made miniaturized.Bulb type lamp, at the end side configuration light emitting module of basket, arranges lamp holder in another side of basket, and is housed in basket by bright light circuit.Light emitting module has the illuminating part being provided with semiconductor light-emitting elements on substrate.By the Embedded Division of the fixed component with insulating properties being embedded into the end side of basket, thus substrate is fixed.
Description
Technical field
Embodiment of the present invention relates to and a kind ofly in light source, uses the bulb type lamp of semiconductor light-emitting elements and use the lighting device of this bulb type lamp.
Background technology
Now, use in the bulb type lamp of semiconductor light-emitting elements (such as LED element) in light source, substrate is provided with the illuminating part using LED element, and this substrate is configured in the end side of basket, and is fixed on basket by multiple screw.In addition, be provided with lamp holder in another side of basket, bright light circuit is housed in basket.In addition, by the heat produced during LED element bright light is passed to basket from substrate heat, and via the heat radiation of this basket in air, the temperature of LED element is suppressed to rise by this.
When improving the brightness of bulb type lamp, such as, can increase the quantity of used LED element, to expand the area of illuminating part.But the ratio shared on substrate due to the area of illuminating part increases, and therefore, LED element and screw can be made close on substrate, thus possibly cannot maintain the state of insulation of LED element and screw.And, in above-mentioned this bulb type lamp, although there is the specification of dielectric voltage withstand, due to the insulation distance of LED element and screw cannot be guaranteed on substrate, therefore, the specification of dielectric voltage withstand possibly cannot be met.Therefore, the brightness improving bulb type lamp is not easy.
In addition, if the state of insulation in order to maintain LED element and screw, be then not easy to make substrate miniaturized.
Summary of the invention
Technical problem to be solved by this invention is to provide a kind of Insulation Problems can eliminated on substrate, and can make the enlarged areas of the illuminating part on substrate, maybe can make the bulb type lamp of substrate miniaturization and use the lighting device of this bulb type lamp.
The bulb type lamp of embodiment, at the end side configuration light emitting module of basket, arranges lamp holder in another side of basket, and is housed in basket by bright light circuit.Light emitting module has the illuminating part being provided with semiconductor light-emitting elements on substrate.By the Embedded Division of the fixed component with insulating properties being embedded into the end side of basket, thus substrate is fixed.
According to the bulb type lamp of said structure, owing to being fixed substrate by the Embedded Division of fixed component is embedded in basket, therefore, there is no need for multiple screws substrate being fixed on basket, eliminate the Insulation Problems on substrate, and the enlarged areas of the illuminating part on substrate can be made or make substrate miniaturized.
Accompanying drawing explanation
Fig. 1 is the stereogram of the decomposing state of the bulb type lamp representing the first embodiment.
Fig. 2 is the sectional view of the assembled state of the part eliminating above-mentioned bulb type lamp.
Fig. 3 is the sectional view after a part for above-mentioned bulb type lamp being amplified.
Fig. 4 is the stereogram of above-mentioned bulb type lamp.
Fig. 5 is the stereogram of the lighting device using above-mentioned bulb type lamp.
Fig. 6 is the sectional view of a part for the bulb type lamp representing the second embodiment.
Detailed description of the invention
Below, with reference to Fig. 1 ~ Fig. 5, the first embodiment is described.
In Fig. 1 ~ Fig. 4, symbol 11 is bulb type lamp, this bulb type lamp 11 comprises cylindric basket 12, light source cell 13, bulb 14, lamp holder 15 and bright light circuit 16 etc., wherein, above-mentioned light source cell 13 is arranged on the end side (end side of the lamp axle of connection bulb and lamp holder) of this basket 12, above-mentioned bulb 14 covers light source cell 13 and is arranged on the end side of basket 12, and above-mentioned lamp holder 15 is arranged on another side of basket 12, and above-mentioned bright light circuit 16 is housed in basket 12.In addition, the shape of the bulb 14 of bulb type lamp 11 is formed as the akin bulb shape of shape with the chandelier of the flame profile in candle.
In addition, basket 12 comprises matrix 20 and inserts the lid 21 of inner side of this matrix 20.
Matrix 20 is formed by the metal such as such as aluminium of heat conductivity and thermal diffusivity excellence or pottery, and it is formed as the cylindrical shape expanding towards end side from another side.The face of matrix 20 end side is formed the annular mounting face 22 installed for light source cell 13.This installed surface 22 is formed with multiple locating hole 23.Be formed from the outstanding edge 24 of installed surface 22 at the periphery of matrix 20 end side.Outstanding engaging portion 25 is formed in the inner peripheral portion of this edge 24 end side.
Lid 21 is formed as cylindric by insulating materials such as such as PBT resin.Lid 21 is formed lid main body 26 and lamp holder installation portion 27, and wherein, above-mentioned lid main body 26 is configured in the inner side of matrix 20, and above-mentioned lamp holder installation portion 27 is given prominence to from the other end side of matrix 20.The inner surface of lid main body 26 is formed the circuit substrate installation portion 28 for installing for the circuit substrate of bright light circuit 16.
In addition, light source cell 13 comprises light emitting module 30, heat transfer plate 31, lens 32 and fixed component 33.
Light emitting module 30 comprises discoideus substrate (module substrate) 35, and this discoideus substrate 35 is formed by the metal such as such as aluminium of heat conductivity excellence or pottery.Illuminating part 36 (shown in Fig. 1) is fixed with at the middle section in the face of this substrate 35 end side.
The such as semiconductor light-emitting elements such as LED element or EL element 36a can be used in illuminating part 36.In the present embodiment, use LED element as semiconductor light-emitting elements 36a, and adopt COB (ChipOnBoard: the chip on board) mode of installing multiple LED element on substrate 35.That is, the wiring pattern of substrate 35 is installed multiple LED element, by wire-bonded, this multiple LED element is electrically connected in the mode of series connection, and be used in transparent resin the luminescent coating being mixed into fluorophor and multiple LED element covered and is sealed to integrally.Use the LED element such as sending blue light in the led element, be mixed in luminescent coating and excited by a part for the blue light from LED element and send the fluorophor of gold-tinted.In addition, form illuminating part 36 by LED element and luminescent coating etc., the surface as the luminescent coating on the surface of this illuminating part 36 is light-emitting area, and sends illumination light from this light-emitting area.In the present embodiment, light-emitting area is formed as quadrangle, but is not limited to this, also can be circular or other shape.In addition, illuminating part 36 also can use SMD (SurfaceMountDevice: the Surface Mounted Device) assembly of the band splicing ear being equiped with LED element.
The face of substrate 35 end side forms wiring pattern by not shown insulating barrier.Multiple LED element is electrically connected with this wiring pattern.On the periphery of substrate 35, be formed with multiple locating slot 37 accordingly with the position of each locating hole 23 of matrix 20, and be formed with wiring groove 38 on a position.
Heat transfer plate 31 is formed by the metal such as such as aluminium of heat conductivity excellence or pottery.On the periphery of heat transfer plate 31, be formed with multiple locating slot 40 accordingly with the position of each locating hole 23 of matrix 20, and be formed with wiring groove 41 on the position that the position of the wiring groove 38 with substrate 35 is corresponding.
Lens 32 (being shown in Fig. 1) are formed by the such as transparent resin such as Merlon or glass.These lens 32 have: lens body 43; The installation portion 44 of ring-type, the installation portion 44 of this ring-type is positioned at the periphery of this lens body 43; And multiple installation sheet 45, these installation sheets 45 are given prominence to from the periphery of this installation portion 44.A part for installation portion 44 is cut and forms wiring groove 44a.Lens body 43 injects for the light penetrated by illuminating part 36, and to the component that the injection direction of the light injected controls, it is formed as the shape corresponding to required luminous intensity distribution.Such as, lens 32 are configured to be controlled to and make light towards the luminous intensity distribution of the horizontal proliferation intersected with lamp axle.
The material that fixed component 33 has insulating properties by synthetic resin etc. is formed.Fixed component 33 has the annulus 47 being formed as circular.Be formed with opening portion 48 in the inner side of this annulus 47, this opening portion 48 embeds for lens body 43, passes through to make the light penetrated from illuminating part 36.A face of annulus 47 is formed as being inclined to from internal side diameter towards the close inclined plane of outside diameter and another face, is formed with the stage portion 49 embedded for bulb 14 at the periphery in a face.In addition, the bearing surface 50 abutted with the periphery of substrate 35 is formed on the other surface.
Opening portion 48 embeds for the installation portion 44 of lens 32, is formed with multiple lens maintaining part 51 at bearing surface 50, and these lens maintaining parts 51 can embed respectively for multiple installation sheets 45 of the lens 32 embedding opening portion 48.Lens maintaining part 51 is formed as being communicated with opening portion 48 and in the channel-shaped of bearing surface 50 upper shed.
The periphery of annulus 47 is formed with multiple Embedded Divisions 52 of the engaging portion 25 embedding matrix 20.These Embedded Divisions 52 are given prominence to from the outer peripheral face of annulus 47, also give prominence to from bearing surface 50 simultaneously.The imaginary diameter of a circle connecting the most outer diameter part of multiple Embedded Division 52 is set as the size that the internal diameter of the edge 24 than matrix 20 is little, larger than the internal diameter of engaging portion 25.The face of Embedded Division 52 end side is formed the hook face 52a hooking engaging portion 25, is formed with conical surface 52b in the part of the face of another side and the face institute angulation of outside diameter.
Pin-shaped multiple location divisions 53 are vertically extruded with bearing surface 50 respectively from the position of multiple Embedded Division 52.These location divisions 53 are such as formed as prism, but also can be cylinders, can also be pyramid or circular cone.In addition, multiple locating slots 37 of multiple location division 53, substrate 35, multiple locating slots 40 of heat transfer plate 31, multiple locating holes 23 of matrix 20 are configured to arrange along lamp direction of principal axis respectively.Therefore, when fixed component 33 is installed on matrix 20, each location division 53 is inserted in each locating hole 23 of matrix 20 through each locating slot 37 of substrate 35 and each locating slot 40 of heat transfer plate 31.In addition, each Embedded Division 52 is also inserted in each locating slot 37 of substrate 35 and each locating slot 40 of heat transfer plate 31.In addition, the face of the internal side diameter of each location division 53 is formed with locating surface 54, this locating surface 54 abuts with the medial surface of each locating slot 37 of substrate 35 and each locating slot 40 of heat transfer plate 31, to position the radial position orthogonal with lamp axle.In addition, a part for bearing surface 50 is cut form wiring groove 55.
In addition, the material such as synthetic resin or glass that bulb 14 has light transmission by such as Merlon, acrylic acid, poly terephthalic acid second two fat etc. is formed.And end side and the front end 14a of bulb 14 are sharp, the other end and cardinal extremity 14b opening, see on the whole and be formed as roughly conical shape.The cardinal extremity 14b of bulb 14 abuts with the face of matrix 20 end side, and embeds the stage portion 49 of fixed component 33.Give prominence at this cardinal extremity 14b and be formed with insertion section 57, this insertion section 57 is inserted between the engaging portion 25 of matrix 20 and the periphery of fixed component 33.The multiple locking pawls 58 hooking engaging portion 25 and be fixed are formed in this insertion section 57.
The inner surface of bulb 14 is through antifreeze processing.Therefore, bulb 14 is not transparent, but translucent or milky.
When being formed bulb 14 by synthetic resin, by using the synthetic resin containing diffusion filler (Japanese: Expansion fall apart Off イ ラ mono-), the light diffusing of bulb 14 is uprised.In addition, make the light transmittance of the 14a side, front end away from light emitting module 13 of bulb 14 higher than the light transmittance of the cardinal extremity 14b side of close light emitting module 13.Specifically, the wall thickness of the 14a side, front end of bulb 14 is formed as thinner than the wall thickness of cardinal extremity 14b side.
In addition, lamp holder 15 be formed as can with such as E17 type general illumination bulb with the shape that is connected of lamp socket, it has: shell 60, and this shell 60 screws togather fixing with the side face of the lamp holder installation portion 27 of lid 21; Insulation division 61, this insulation division 61 is located at another side of above-mentioned shell 60; And eyelet 62, this eyelet 62 is arranged on the top of above-mentioned insulation division 61.
In addition, bright light circuit 16 is circuit of the LED element supply bright light electric current to light emitting module 13, its not shown multiple bright light circuit blocks having bright light circuit substrate 64 and be arranged on this bright light circuit substrate 64.Bright light circuit block have to alternating voltage carry out rectification, level and smooth rectifier smoothing circuit electrolytic capacitor, the voltage transformation after rectification is level and smooth is become the inductor of the breaker circuit of assigned voltage, is used for the small parts etc. such as switch element, capacitor, diode of the large components such as the resistor of other circuit and other breaker circuit.
Bright light circuit substrate 64 is inserted circuit substrate installation portion 28 by the end side from lid 21 and installs.Specifically, bright light circuit substrate 64 is configured in lid 21 along the axial mode of lamp to make its length direction.
Be connected with input wire at the input side of bright light circuit 16, shell 60 and the eyelet 62 of this input wire and lamp holder 15 are connected.In addition, be connected with output wire at the outlet side of bright light circuit 16, this outlet side wire is connected with the wiring pattern on the substrate 35 being formed in light emitting module 30.
Then, when assembling bulb type lamp 11, bright light circuit 16 being inserted in lid 21, the input of bright light circuit 16 wire is connected with lamp holder 15, thus lamp holder 15 is arranged on the lamp holder installation portion 27 of lid 21.
The lid 21 having assembled lamp holder 15 and bright light circuit 16 is inserted matrix 20.
Be filled with for by lid 21 and the hot linked heat radiation silicone resin of bright light circuit 16 in lid 21.The installed surface 22 of matrix 20 is coated with for by installed surface 22 and the hot linked heat radiation lubricating fat of heat transfer plate 31.
Heat transfer plate 31 is configured on the installed surface 22 of matrix 20 across heat radiation lubricating fat.Now, in advance by the locating slot 40 of heat transfer plate 31 and locating hole 23 contraposition of matrix 20, and the wiring groove 41 of the output wire of bright light circuit 16 from heat transfer plate 31 is derived towards the outside.
The surface of matrix 31 is coated with for by heat transfer plate 31 and the hot linked heat radiation lubricating fat of substrate 35.
Substrate 35 is configured on the surface of heat transfer plate 31 across heat radiation lubricating fat.Now, in advance by the locating slot 37 of substrate 35 and the locating hole 23 of matrix 20 and locating slot 40 contraposition of heat transfer plate 31, and the wiring groove 38 of the output wire of bright light circuit 16 from substrate 35 is derived towards the outside.
The output wire of bright light circuit 16 is electrically connected with substrate 35.
Fixed component 33 is covered lens 32, and the installation portion 44 of lens 32 is embedded the opening portion 48 of fixed component 33, and multiple installation sheets 45 of lens 32 are embedded multiple lens maintaining parts 51 of fixed component 33 respectively.
Each location division 53 of fixed component 33 is inserted in each locating hole 23 of matrix 20 through after each locating slot 37 of substrate 35 and each locating slot 40 of heat transfer plate 31.
If make fixed component 33 move to matrix 20 side, then multiple Embedded Divisions 52 of fixed component 33 abut with the engaging portion 25 of matrix 20, but by the part of each Embedded Division 52 of fixed component 33 being pressed into towards matrix 20, thus make each Embedded Division 52 cross engaging portion 25.
Because each Embedded Division 52 crosses engaging portion 25, therefore, each Embedded Division 52 is embedded into engaging portion 25.Under embedding state, the hook face 52a of each Embedded Division 52 is hooked in engaging portion 25 and makes fixed component 33 be fixed on matrix 20, sandwiches substrate 35 and heat transfer plate 31 is fixed between the bearing surface 50 and the installed surface 22 of matrix 20 of fixed component 33.That is, by fixed component 33, substrate 35 and heat transfer plate 31 are touched, and heat transfer plate 31 is touched with the installed surface 22 of matrix 20, thus make substrate 35, heat transfer plate 31 thermally coupled with matrix 20.In addition, the output wire of bright light circuit 16 is configured in the wiring groove 55 of fixed component 33 and the wiring groove 44a of lens 32.
The bonding agents such as silicone resin are coated with between the periphery and the engaging portion 25 of matrix 20 of fixed component 33.
The bulb 14 covering light source cell 13 is covered on basket 12, the insertion section 57 of bulb 14 is inserted between the periphery of fixed component 33 and the engaging portion 25 of matrix 20, and the engaging portion 25 of multiple locking pawl 58 being hooked matrix 20 is fixed.In addition, by bonding agent, bulb 14 and matrix 20 and fixed component 33 are adhesively fixed.
In addition, the number of assembling steps of bulb type lamp 11 is not limited to this, also can be other number of assembling steps.
In addition, Fig. 5 represents an example of the lighting device 71 using bulb type lamp 11.Above-mentioned lighting device 71 has the appliance body 72 be arranged on wall, and above-mentioned appliance body 72 is provided with lamp socket 74 upward by arm 73.In addition, bulb type lamp 11 is connected with lamp socket 74 with the front end 14a of bulb 14 state upward.
In addition, after being energized to bulb type lamp 11, the bright light electric power carrying out selfigniting light circuit 16 is supplied to multiple LED element of light emitting module 13, makes multiple LED element bright light, and light penetrates from the surface of illuminating part 36.The light penetrated from illuminating part 36 injects lens 32, is dispersed towards the outside by bulb 14 by the light after these lens 32 pairs of luminous intensity distributions control.
Because the light transmittance of the 14a side, front end away from light emitting module 13 of bulb 14 is higher than the light transmittance of the cardinal extremity 14b side of close light emitting module 13, therefore, when bulb type lamp 11 bright light, the 14a side, front end of bulb 14 becomes brighter than cardinal extremity 14b side, thus can show the sensation close to candle flame.
The heat that during bright light, multiple LED element sends mainly by heat trnasfer to substrate 35, and from this substrate 35 heat trnasfer to heat transfer plate 31, then, from this heat transfer plate 31 heat trnasfer to matrix 20, and from the surface radiating of matrix 20 to air.
In addition, bulb type lamp 11 according to the present embodiment, by the Embedded Division 52 of fixed component 33 is embedded basket 12, can sandwich substrate 35 and be fixed between fixed component 33 and basket 12, therefore, the multiple screws in the past used are not needed when substrate 35 being fixed to basket 12.Owing to eliminating the problem of insulation on substrate 35, therefore, the enlarged areas of the illuminating part 36 on substrate 35 can be made, or make substrate 35 miniaturized.
In addition, fixed component 33 has the annulus 47 abutted with the periphery of substrate 35, owing to being provided with the opening portion 48 passed through for the light penetrated from illuminating part 36 in the inner side of this annulus 47, and be provided with Embedded Division 52 at the periphery of annulus 47, therefore, when the injection of light not affecting illuminating part 36, substrate 35 can be fixed on basket 12.
In addition, when having the heat of light emitting module reached substrate 35 heat transfer plate 31, also between itself and basket 12, substrate 35 is sandwiched by fixed component 33 and heat transfer plate 31 fixes integral.
In addition, when have to the luminous intensity distribution of the light penetrated from illuminating part 36 control lens 32, also between itself and basket 12, sandwich substrate 35 by fixed component 33 and lens 32 fix integral.And the lens maintaining part 51 pairs of lens 32 by fixed component 33 are kept.
And, when there are heat transfer plate 31 and lens 32 at the same time, also between itself and basket 12, sandwich substrate 35, heat transfer plate 31 and lens 32 by fixed component 33 and fix integral.
In addition, because fixed component 33 has the location division 53 being inserted into basket 12 through substrate 35 (or substrate 35 and heat transfer plate 31), therefore, can position relative to the radial position of basket 12 and circumferential position (or substrate 35 and heat transfer plate 31 are relative to the radial position of basket 12 and circumferential position) substrate 35.
In addition, because the light transmittance of the 14a side, front end away from light emitting module 13 of bulb 14 is higher than the light transmittance of the cardinal extremity 14b side of close light emitting module 13, therefore, the 14a side, front end of bulb 14 becomes brighter than cardinal extremity 14b side, thus can close to the sensation of candle flame.
Then, Fig. 6 represents the second embodiment.In addition, identical symbol is used to the structure identical with the first embodiment, but the description thereof will be omitted.
Arrange multiple bulb Embedded Division 81 at the outer peripheral face of fixed component 33, arrange multiple engaging portion 82 at the inner peripheral surface of the cardinal extremity 14b of bulb 14, these bulbs can embed fixing by Embedded Division 81 and engaging portion 82.In the present embodiment, bulb Embedded Division 81 is grooves, and engaging portion 82 is projections, but also can conversely, and bulb Embedded Division 81 is projections, and engaging portion 82 is grooves.
In addition, when the assembling of bulb type lamp 11, the locking pawl 58 of bulb 14 embeds the engaging portion 25 of matrix 20 and makes bulb 14 be fixed on basket 12, and the engaging portion 82 of bulb 14 embeds the bulb Embedded Division 81 of fixed component 33 and makes bulb 14 be fixed on basket 12 simultaneously.
Therefore, even if do not use bonding agent bulb 14 being fixed on basket 12, also reliably bulb 14 can be fixed on basket 12, thus the manufacture efficiency of bulb type lamp 11 can be made to improve.
In addition, in the present embodiment, to using the bulb type lamp 11 of lens 32 to be illustrated, but when not using bulb type lamp 11 of lens 32, also can use fixed component 33 that substrate 35 or heat transfer plate 31 are fixed on basket 12.
In addition, also can not use heat transfer plate 31 that substrate 35 is directly installed on basket 12.
In addition, present embodiment also can be applicable in the bulb type lamp of the lamp holder using E26 type etc.
Although present invention illustrates multiple embodiment, only illustratively, it does not attempt to be limited scope of invention these embodiments.These new embodiments are implemented by other various mode, and it can carry out various omission, displacement, change in the scope of object not departing from invention.These embodiments and distortion thereof are included in scope of invention or object, and in the scope of the invention be included in described in claim and equalization thereof.
Claims (9)
1. a bulb type lamp, is characterized in that, comprising:
Basket, this basket has matrix and inserts the lid of inner side of described matrix, and described matrix has locating hole;
Light emitting module, this light emitting module has the illuminating part being provided with semiconductor light-emitting elements on substrate, on the periphery of described substrate, be formed with locating slot accordingly with the position of the described locating hole of described matrix, described light emitting module is configured in the end side of described basket;
Lamp holder, this lamp holder is located at another side of described basket;
Bright light circuit, this bright light circuit is housed in described basket; And
Fixed component, this fixed component has insulating properties and has Embedded Division and location division, this location division is inserted into the described locating hole of described matrix through the described locating slot of described substrate, be fixed described substrate by the end side described Embedded Division being embedded described basket.
2. bulb type lamp as claimed in claim 1, is characterized in that,
Described fixed component has the annulus abutted with the periphery of described substrate, is provided with the opening portion passed through for the light penetrated from described illuminating part, and is provided with described Embedded Division at the periphery of described annulus in the inner side of this annulus.
3. bulb type lamp as claimed in claim 1, is characterized in that,
Be formed with edge at the periphery of the end side of described matrix, the inner peripheral portion of the end side in described edge is outstanding is formed with engaging portion,
The described Embedded Division of described fixed component embeds described engaging portion.
4. bulb type lamp as claimed any one in claims 1 to 3, is characterized in that,
Described bulb type lamp comprises the heat transfer plate heat of described light emitting module being reached described substrate,
Described substrate and described heat transfer plate are located between described fixed component and described basket.
5. bulb type lamp as claimed in claim 4, is characterized in that,
Described location division is formed multiple, and respectively with pin-shaped outstanding, it through multiple locating slot of described substrate and multiple locating slots of described heat transfer plate, and inserts multiple locating holes of described matrix.
6. bulb type lamp as claimed any one in claims 1 to 3, is characterized in that,
Described bulb type lamp has the lens controlled the luminous intensity distribution of the light penetrated from described illuminating part,
Described substrate and described lens are located between described fixed component and described basket.
7. bulb type lamp as claimed any one in claims 1 to 3, is characterized in that,
Described bulb type lamp has the bulb of the end side being installed on described basket,
Described fixed component has the bulb Embedded Division embedded for described bulb.
8. bulb type lamp as claimed in claim 7, is characterized in that,
The light transmittance of the front away from described light emitting module of described bulb is higher than the light transmittance of the base end side near described light emitting module.
9. a lighting device, is characterized in that, comprising:
Lamp socket; And
Be installed on the bulb type lamp according to any one of claim 1 to 8 of described lamp socket.
Priority Applications (1)
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CN201110379478.6A CN103104827B (en) | 2011-11-14 | 2011-11-14 | Bulb type lamp and lighting device |
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CN201110379478.6A CN103104827B (en) | 2011-11-14 | 2011-11-14 | Bulb type lamp and lighting device |
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CN103104827A CN103104827A (en) | 2013-05-15 |
CN103104827B true CN103104827B (en) | 2016-03-30 |
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CN201110379478.6A Expired - Fee Related CN103104827B (en) | 2011-11-14 | 2011-11-14 | Bulb type lamp and lighting device |
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CN111503537B (en) * | 2019-01-29 | 2022-05-24 | 松下知识产权经营株式会社 | Lighting device |
Citations (3)
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CN201081146Y (en) * | 2007-08-31 | 2008-07-02 | 中山泰腾灯饰有限公司 | LED lamp with improved lens fixing structure |
CN101344227A (en) * | 2007-06-30 | 2009-01-14 | 奥斯兰姆施尔凡尼亚公司 | LED lamp module |
CN202001887U (en) * | 2011-01-07 | 2011-10-05 | 惠州Tcl照明电器有限公司 | LED candle-flame-shaped bulb |
Family Cites Families (2)
Publication number | Priority date | Publication date | Assignee | Title |
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JP5337512B2 (en) * | 2009-02-04 | 2013-11-06 | 日本放送協会 | Horizont light and lighting device provided with the same |
JP2010225842A (en) * | 2009-03-24 | 2010-10-07 | Toyoda Gosei Co Ltd | Light source for back light of liquid crystal display, back light of liquid crystal display, and liquid crystal display |
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2011
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Patent Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
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CN101344227A (en) * | 2007-06-30 | 2009-01-14 | 奥斯兰姆施尔凡尼亚公司 | LED lamp module |
CN201081146Y (en) * | 2007-08-31 | 2008-07-02 | 中山泰腾灯饰有限公司 | LED lamp with improved lens fixing structure |
CN202001887U (en) * | 2011-01-07 | 2011-10-05 | 惠州Tcl照明电器有限公司 | LED candle-flame-shaped bulb |
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