Current feed insulated enclosure connecting joint under a kind of ultra low temperature vacuum
Technical field
the present invention relates to current feed joint field, be specially the current feed insulated enclosure connecting joint under a kind of ultra low temperature vacuum.
Background technique
Cryostat is all double layer constructions of content device and outer container, in inner container, cryogenic liquide is housed: such as liquid nitrogen (-196 DEG C), liquid hydrogen (-253 DEG C), liquid helium (-269 DEG C), a vacuum cavity is soaked in the cryogenic liquide of inner container, be cryogenic liquide outside this vacuum cavity, inner side vacuum environment.The various required test data of sensor collection is put at vacuum cavity lining.Draw outside vacuum cavity at measurement lead-in wire, draw in thermostat process through cryogenic liquide, how accomplishing to ensure that the degree of vacuum under low temperature environment collects test data simultaneously from vacuum chamber, is a technological difficulties.At present, a method for design is had kind to be: weld with the flanged surface of inner chamber body by vacuum tube, measurement is gone between and drawn by vacuum tube.This kind of design deficiency is: because vacuum tube is that lower contacts cryogenic liquide is in low temperature environment, top is then along with high gradually away from Low Temperature Liquid surface temperature, become stepped, such heat will pass to low temperature by measuring lead-in wire from high temperature, there is heat transfer phenomenon, finally cause the steam output that cryogenic liquide is larger, the data of sensor acquisition are simultaneously unstable, inaccurate, even cannot collect cryogenic temperature when truly testing.
Summary of the invention
The object of the invention is exactly the defect in order to make up prior art, current feed insulated enclosure under a kind of ultra low temperature vacuum connecting joint is provided, solve and under cryogenic vacuum, measurement lead-in wire is guided to outside cavity, avoid because the different meeting of each layer temperature environment, by measuring lead-in wire, heat transfer phenomenon occurs simultaneously, guarantee to reach required low temperature test environment, there is stability, and have good sealing and insulating properties under cryogenic vacuum.
In order to achieve the above object, the technical solution adopted in the present invention is:
Current feed insulated enclosure connecting joint under a kind of ultra low temperature vacuum, it is characterized in that: include material filling cylinder, described material filling cylinder is presented thick lower narrow stepped, and material filling cylinder top, bottom is set to nozzle respectively, also comprise penetration pipe, described penetration pipe is inserted in material filling cylinder from material filling cylinder bottom nozzle, measurement lead-in wire is had to penetrate penetration pipe from material filling cylinder top nozzle and pass from penetration pipe bottom, described penetration pipe is provided with adpting flange, described material filling cylinder, exuberant in penetration pipe have potting compound, described potting compound is the epoxy resin of 618 by model, 650 curing agent, bulking agent cement flour mixes, in potting compound, each component optimum proportioning ratio is: epoxy resin, the weight ratio of 1:0.65 pressed by curing agent, cement flour presses epoxy resin, 30% of both curing agent total amount.
Current feed insulated enclosure connecting joint under described a kind of ultra low temperature vacuum, is characterized in that: the lower end surface of described adpting flange is provided with annular boss.
Current feed insulated enclosure connecting joint under described a kind of ultra low temperature vacuum, is characterized in that: be equipped with several bolt hole in described adpting flange.
Current feed insulated enclosure connecting joint under described a kind of ultra low temperature vacuum, it is characterized in that: when being installed on vacuum cavity, on the flanged surface of vacuum cavity, the flange matched with the flanged surface of described adpting flange is stretched out in welding, the upper-end surface of the flange on vacuum cavity is provided with the annular groove matched with described adpting flange annular boss, adopt indium silk to seal between described annular boss and annular groove, between the flange on adpting flange and vacuum cavity, adopt brass Bolt Connection.
Current feed insulated enclosure under described a kind of ultra low temperature vacuum connects joint, it is characterized in that: described penetration pipe adopts German alloy silver tube, and the junction end face that penetration pipe contacts with potting compound is polished into cutting edge shape.
Current feed insulated enclosure connecting joint under described a kind of ultra low temperature vacuum, is characterized in that: described embedding cylinder adopts polytetrafluoroethylmaterial material.
Current feed insulated enclosure under described a kind of ultra low temperature vacuum connects joint, it is characterized in that: described potting compound is prepared by following manufacturing process:
First heating ring epoxy resins about 50 DEG C, is mixed into epoxy resin the cement flour of the amount of getting ready, and at 50 DEG C of temperature, fully at the uniform velocity equidirectional stirring, will toast before cement flour mixing, guarantees drying, without knot grain phenomenon; The cement flour be stirred and the mixture of epoxy resin, add the curing agent of the amount of getting ready after naturally cooling to normal temperature, at the uniform velocity equidirectional stirring, after making it fully mix, leaves standstill a bit of time to allow air entrapment emersion, obtain potting compound after being discharged by bubble.
Advantage of the present invention is:
(1) each component material of potting compound is the common material arrived on the market, and harmless to health, good economy performance, cost is low.
(2) embedding cylinder adopts polytetrafluoroethylmaterial material, and teflon is not stained with mutually with epoxy resin, gets surface and removes conveniently; Under teflon low temperature, shrinkage is large, and the enclasping force of generation is large, and this enclasping force is inwardly beneficial to holds the sealing that penetration pipe improves joint tightly.
(3) Placement of flange achieves to live and connects, and is convenient to install, dismantle, maintenance, repair.
(4) the present invention can use under minimum temperature liquid helium (-269 DEG C), there is good insulated enclosure, flange-type bolt connects, facilitate installation and removal, maintain and repair methods, has filled up and has measured lead-in wire at low temperatures without the blank be flexibly connected, adopted special proportioning mode simultaneously, common epoxy resin is made, cheap.
Accompanying drawing explanation
Fig. 1 is structural representation of the present invention.
Fig. 2 is the example that the present invention is installed on thermostat.
Embodiment
As shown in Figure 1 and Figure 2.Current feed insulated enclosure under a kind of ultra low temperature vacuum connects joint, include the material filling cylinder 1 of polytetrafluoroethylmaterial material, material filling cylinder 1 is presented thick lower narrow stepped, and material filling cylinder 1 top, bottom is set to nozzle respectively, also comprise penetration pipe 2, penetration pipe 2 is inserted in material filling cylinder 1 from material filling cylinder 1 bottom nozzle, measurement lead-in wire 3 is had to penetrate penetration pipe 2 from material filling cylinder 1 top nozzle and pass from penetration pipe 2 bottom, penetration pipe 2 is provided with adpting flange 5, material filling cylinder 1, exuberant in penetration pipe 2 have potting compound 4, potting compound is the epoxy resin of 618 by model, 650 curing agent, bulking agent cement flour mixes, in potting compound, each component optimum proportioning ratio is: epoxy resin, the weight ratio of 1:0.65 pressed by curing agent, cement flour presses epoxy resin, 30% of both curing agent total amount.
In potting compound of the present invention, curing agent is many then solidification after epoxy resin easily chap at low temperatures, poor in flexibility.Curing agent has lacked cure cycle prolongation, or does not solidify, even if having cured crisp at low temperatures, can not meet sealing.Cement flour plays the effect of bulking agent, and strengthen intensity, but it can not be too many, and it is very crisp that many epoxy resin becomes, and very little, can not lack easy be full of cracks.
The lower end surface of adpting flange 5 is provided with annular boss 6.
Several bolt hole 7 is equipped with in adpting flange 5.
On the flanged surface of vacuum cavity 8, the flange 9 matched with the flanged surface of adpting flange 5 is stretched out in welding, the upper-end surface of the flange 9 on vacuum cavity 8 is provided with the annular groove matched with annular boss 6, adopt indium silk to seal between annular boss 6 and annular groove, between the flange 9 on adpting flange 5 and vacuum cavity 8, adopt brass Bolt Connection.
Penetration pipe 2 adopts German alloy silver tube, and one end that penetration pipe 2 contacts with potting compound 4 is polished into cutting edge shape.
Measure lead-in wire 3 to require to select the measurement of different-diameter, different radical to go between to thermal leakage ratio according to client.
Potting compound preparation process of the present invention is:
First heating ring epoxy resins about 50 DEG C, is mixed into epoxy resin the cement flour of the amount of getting ready, at 50 DEG C of temperature, fully stirs.To toast before cement flour mixing, guarantee drying, without knot grain phenomenon (cement flour is more thin better, preferably selects >=200 orders).The cement flour be stirred and the mixture of epoxy resin, add the curing agent of the amount of getting ready after naturally cooling to normal temperature, at the uniform velocity equidirectional stirring, after making it fully mix, leaves standstill a bit of time.Quiescence time is appropriate and determine, leaves standstill about 2 minutes when measuring the half cup into Disposable paper cup, allows air entrapment emersion, eliminating bubble.The vacuumizing and exhausting that can adopt with good conditionsi steeps.
The process of potting compound embedding of the present invention is:
Embedding front connector penetration pipe inwall hacking, is beneficial to the adhesion of epoxy resin; Joint, measurement lead-in wire all must be clean with alcohol washes, use after baking.
Measurement lead-in wire gummed paper tapes needed for joint is bundled into a branch of, tie up a little about 100mm place, this is for reserving weld length, and this length gets length, if welded unsuccessfully when not affecting and leaking heat as far as possible, can cut off, again weld, in use have breakage herein simultaneously, also can cut off, again weld, this just gives the chance later having reserved rectification.Be all contact pin type on the market, if a certain pin welds bad, be difficult to remedy.
After electric drier heats about 50 DEG C measurement lead-in wire embedding section, stop heating, evenly epoxy resin is coated fast in measurement leading wire heating section, use the flange of electric drier heated sealant joint simultaneously, after joint heat, measurement lead-in wire from there being the one end of tying up to penetrate the penetration pipe of joint, place is tied up to what expose gummed paper tapes in position.After threading completes, tying up place, blocking the lower end of penetration pipe with aluminium foil or linen-cotton dry goods, making wire harness placed in the middle as far as possible.Because the epoxy resin of glue has mobility, can flow out along with Action of Gravity Field when pouring into, so block aperture bottom penetration pipe; Simultaneously due to Action of Gravity Field, the measurement lead-in wire bundle of attachment band epoxy resins can slowly sink, and causes the length in reserve of upper end to shorten, be also unfavorable for simultaneously the embedding of epoxy resin and embedding good after solidification, so wire harness will be fastened firmly with threading duct tapes.
After fixing wire harness, start injection ring epoxy resins.Injection needle tubing can be used.Epoxy resin first injects penetration pipe, and reinject after being fully full of embedding cylinder, the flange position of continuous heated coupling in potting process, increases the mobility of epoxy resin, makes more closely knit, reduces bubble.
In potting process, each measurement lead-in wire separately, can not touch mutually or tactile wall; Clamp joint with vice, minor impact several times, makes the epoxy resin of injection more closely knit up and down stably simultaneously.
Epoxy resin and about 40 minutes of the mixed operable time of curing agent, after 40 minutes, epoxy resin and curing agent enter the Procuring phase, and all embedding work will complete in these 40 minutes.
After embedding terminates, continue heated coupling about 10 minutes, fully the bubble that inside hides is driven out of.In the process of heating, constantly there is bubble emersion surface, notice that the time of natural explosion is long now with these bubbles of punctures.Do not need heating after 10 minutes, continue the bubble puncturing emersion.After half an hour, joint is moved on to the place of safety, unmanned touching, spontaneous curing.To treat without proper respect in moving process, rigorously to rock.In the process of spontaneous curing, be interrupted concern joint has without exception.
The use equipment drawing of joint of the present invention, as Fig. 2.
The present invention is used for low temperature (4.2K liquid helium temperature), under vacuum pressure environment and insulated enclosure, lead-in wire radical can reach 1 ~ 60, fixed according to customer demand.