CN103102816B - 各向异性导电膜和半导体装置 - Google Patents
各向异性导电膜和半导体装置 Download PDFInfo
- Publication number
- CN103102816B CN103102816B CN201210447253.4A CN201210447253A CN103102816B CN 103102816 B CN103102816 B CN 103102816B CN 201210447253 A CN201210447253 A CN 201210447253A CN 103102816 B CN103102816 B CN 103102816B
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- Prior art keywords
- anisotropic conductive
- conductive film
- urethane resin
- resin
- film
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
- H01B1/00—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
- H01B1/06—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors mainly consisting of other non-metallic substances
- H01B1/12—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors mainly consisting of other non-metallic substances organic substances
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L24/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
- H01L24/28—Structure, shape, material or disposition of the layer connectors prior to the connecting process
- H01L24/29—Structure, shape, material or disposition of the layer connectors prior to the connecting process of an individual layer connector
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J175/00—Adhesives based on polyureas or polyurethanes; Adhesives based on derivatives of such polymers
- C09J175/04—Polyurethanes
- C09J175/14—Polyurethanes having carbon-to-carbon unsaturated bonds
- C09J175/16—Polyurethanes having carbon-to-carbon unsaturated bonds having terminal carbon-to-carbon unsaturated bonds
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J9/00—Adhesives characterised by their physical nature or the effects produced, e.g. glue sticks
- C09J9/02—Electrically-conducting adhesives
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
- H01B5/00—Non-insulated conductors or conductive bodies characterised by their form
- H01B5/14—Non-insulated conductors or conductive bodies characterised by their form comprising conductive layers or films on insulating-supports
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
- H01L2224/28—Structure, shape, material or disposition of the layer connectors prior to the connecting process
- H01L2224/29—Structure, shape, material or disposition of the layer connectors prior to the connecting process of an individual layer connector
- H01L2224/29001—Core members of the layer connector
- H01L2224/29099—Material
- H01L2224/29198—Material with a principal constituent of the material being a combination of two or more materials in the form of a matrix with a filler, i.e. being a hybrid material, e.g. segmented structures, foams
- H01L2224/29199—Material of the matrix
- H01L2224/2929—Material of the matrix with a principal constituent of the material being a polymer, e.g. polyester, phenolic based polymer, epoxy
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
- H01L2224/31—Structure, shape, material or disposition of the layer connectors after the connecting process
- H01L2224/32—Structure, shape, material or disposition of the layer connectors after the connecting process of an individual layer connector
- H01L2224/321—Disposition
- H01L2224/32151—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/32221—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/32225—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
- H01L2224/83—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector
- H01L2224/831—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector the layer connector being supplied to the parts to be connected in the bonding apparatus
- H01L2224/83101—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector the layer connector being supplied to the parts to be connected in the bonding apparatus as prepeg comprising a layer connector, e.g. provided in an insulating plate member
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L24/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
- H01L24/31—Structure, shape, material or disposition of the layer connectors after the connecting process
- H01L24/32—Structure, shape, material or disposition of the layer connectors after the connecting process of an individual layer connector
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/06—Polymers
- H01L2924/078—Adhesive characteristics other than chemical
- H01L2924/07802—Adhesive characteristics other than chemical not being an ohmic electrical conductor
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/06—Polymers
- H01L2924/078—Adhesive characteristics other than chemical
- H01L2924/0781—Adhesive characteristics other than chemical being an ohmic electrical conductor
- H01L2924/07811—Extrinsic, i.e. with electrical conductive fillers
Landscapes
- Chemical & Material Sciences (AREA)
- Organic Chemistry (AREA)
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Computer Hardware Design (AREA)
- Physics & Mathematics (AREA)
- Spectroscopy & Molecular Physics (AREA)
- Non-Insulated Conductors (AREA)
- Polymers & Plastics (AREA)
- Medicinal Chemistry (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Health & Medical Sciences (AREA)
- Adhesives Or Adhesive Processes (AREA)
- Adhesive Tapes (AREA)
Abstract
Description
实施例1 | 实施例2 | 对比例1 | 对比例2 | |
空间产生的气泡面积(%) | 5 | 4 | 40 | 7 |
粘结强度(gf/cm) | 920 | 1020 | 960 | 520 |
Claims (7)
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
KR10-2011-0118240 | 2011-11-14 | ||
KR1020110118240A KR101403863B1 (ko) | 2011-11-14 | 2011-11-14 | 이방성 도전 필름 |
Publications (2)
Publication Number | Publication Date |
---|---|
CN103102816A CN103102816A (zh) | 2013-05-15 |
CN103102816B true CN103102816B (zh) | 2015-05-13 |
Family
ID=48279827
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CN201210447253.4A Active CN103102816B (zh) | 2011-11-14 | 2012-11-09 | 各向异性导电膜和半导体装置 |
Country Status (4)
Country | Link |
---|---|
US (1) | US8872357B2 (zh) |
KR (1) | KR101403863B1 (zh) |
CN (1) | CN103102816B (zh) |
TW (1) | TWI555810B (zh) |
Families Citing this family (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO2018043296A1 (ja) * | 2016-09-02 | 2018-03-08 | 株式会社スリーボンド | (メタ)アクリル樹脂組成物およびそれを用いた導電性接着剤 |
JP6961922B2 (ja) * | 2016-10-27 | 2021-11-05 | Jsr株式会社 | 液晶表示素子及びその製造方法 |
CN111100562B (zh) * | 2019-12-20 | 2021-08-17 | 深圳市撒比斯科技有限公司 | 一种双重固化型各向异性导电胶膜及其制备方法 |
Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN1703773A (zh) * | 2002-06-03 | 2005-11-30 | 3M创新有限公司 | 层压体,以及用该层压体制造超薄基片的方法和设备 |
CN101475780A (zh) * | 2009-01-14 | 2009-07-08 | 长兴化学工业股份有限公司 | 无溶剂导电胶组成物及使用上述组成物的太阳能电池组件 |
CN101760167A (zh) * | 2008-12-23 | 2010-06-30 | 第一毛织株式会社 | 用于电气和电子装置的粘性膜组合物和使用其的粘性膜 |
Family Cites Families (9)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US6762249B1 (en) * | 1999-08-25 | 2004-07-13 | Hitachi Chemical Company, Ltd. | Wiring-connecting material and process for producing circuit board with the same |
DE10115605A1 (de) * | 2001-03-29 | 2002-10-24 | Basf Coatings Ag | Thermisch und mit aktinischer Strahlung härtbare Pulverslurries, Verfahren zu ihrer Herstellung und ihre Verwendung |
KR20030037017A (ko) * | 2001-11-01 | 2003-05-12 | 엘지전선 주식회사 | 이방성 도전 접착필름 |
KR100710957B1 (ko) * | 2006-01-03 | 2007-04-24 | 엘에스전선 주식회사 | 이방 도전성 접착제, 이를 이용한 회로 접속 방법 및 회로 접속 구조체 |
KR100787727B1 (ko) * | 2006-10-31 | 2007-12-24 | 제일모직주식회사 | 스티렌-아크릴로니트릴 공중합체를 이용한 고신뢰성 이방전도성 필름용 조성물 |
KR100920612B1 (ko) * | 2007-11-08 | 2009-10-08 | 제일모직주식회사 | 이방 전도성 필름용 조성물 및 이를 이용한 이방 전도성필름 |
KR101127099B1 (ko) | 2008-11-27 | 2012-03-23 | 제일모직주식회사 | 이방 전도성 필름용 조성물 및 이를 이용한 이방 전도성 필름 |
KR101097428B1 (ko) | 2008-12-11 | 2011-12-23 | 제일모직주식회사 | 이방 전도성 필름용 조성물 및 이를 이용한 이방 전도성 필름 |
KR101381118B1 (ko) * | 2011-11-04 | 2014-04-04 | 제일모직주식회사 | 이방 전도성 접착 필름용 조성물 및 이를 이용한 이방 전도성 접착 필름 |
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2011
- 2011-11-14 KR KR1020110118240A patent/KR101403863B1/ko active IP Right Grant
-
2012
- 2012-11-07 US US13/670,569 patent/US8872357B2/en active Active
- 2012-11-09 CN CN201210447253.4A patent/CN103102816B/zh active Active
- 2012-11-13 TW TW101142193A patent/TWI555810B/zh active
Patent Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN1703773A (zh) * | 2002-06-03 | 2005-11-30 | 3M创新有限公司 | 层压体,以及用该层压体制造超薄基片的方法和设备 |
CN101760167A (zh) * | 2008-12-23 | 2010-06-30 | 第一毛织株式会社 | 用于电气和电子装置的粘性膜组合物和使用其的粘性膜 |
CN101475780A (zh) * | 2009-01-14 | 2009-07-08 | 长兴化学工业股份有限公司 | 无溶剂导电胶组成物及使用上述组成物的太阳能电池组件 |
Non-Patent Citations (1)
Title |
---|
各向异性导电胶粘剂膜的研究进展;黎文部等;《电子元件与材料》;20060228;第25卷(第2期);第4-7页 * |
Also Published As
Publication number | Publication date |
---|---|
TW201326337A (zh) | 2013-07-01 |
US8872357B2 (en) | 2014-10-28 |
KR101403863B1 (ko) | 2014-06-09 |
US20130119563A1 (en) | 2013-05-16 |
CN103102816A (zh) | 2013-05-15 |
TWI555810B (zh) | 2016-11-01 |
KR20130052904A (ko) | 2013-05-23 |
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C14 | Grant of patent or utility model | ||
GR01 | Patent grant | ||
CP03 | Change of name, title or address | ||
CP03 | Change of name, title or address |
Address after: Han Guojingjidao Patentee after: Samsung SDI Co.,Ltd. Address before: Han Guoqingshangbeidao Patentee before: CHEIL INDUSTRIES Inc. |
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TR01 | Transfer of patent right | ||
TR01 | Transfer of patent right |
Effective date of registration: 20191126 Address after: Seoul, South Kerean Patentee after: GUKTOH CHEMICAL Co.,Ltd. Address before: Han Guojingjidao Patentee before: Samsung SDI Co.,Ltd. |
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Effective date of registration: 20220914 Address after: Gyeonggi Do, South Korea Patentee after: Guo Dujianduansucai Address before: Seoul, South Kerean Patentee before: GUKTOH CHEMICAL Co.,Ltd. |