CN103094695A - Encapsulation method of metamaterial - Google Patents
Encapsulation method of metamaterial Download PDFInfo
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- CN103094695A CN103094695A CN201110336516XA CN201110336516A CN103094695A CN 103094695 A CN103094695 A CN 103094695A CN 201110336516X A CN201110336516X A CN 201110336516XA CN 201110336516 A CN201110336516 A CN 201110336516A CN 103094695 A CN103094695 A CN 103094695A
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Abstract
The invention provides an encapsulation method of metamaterial. The encapsulation method includes forming a glue layer on the surface of a first metamaterial board; absorbing the first metamaterial board which is coated with the glue layer on a base of a preset chip mounter through vacuum; proofreading an image of the first metamaterial board and obtaining an image standard; pasting a second metamaterial board on the surface of the surface of the first metamaterial board according to the image standard; baking and solidifying the jointly pasted first metamaterial board and second metamaterial board. Therefore, accuracy and efficiency of encapsulation are improved.
Description
[technical field]
The present invention relates to the packaging technology of sheet material, be specifically related to a kind of super encapsulation of the materials method.
[background technology]
" super material " refers to artificial composite structure or the composite material that some have the not available extraordinary physical property of natural material.Structurally ordered design by on the key physical yardstick of material can break through the restriction of some apparent natural law, thereby obtains to exceed the meta-materials function of the intrinsic common character of nature.The course of processing of super material is mainly that the pcb board with metal micro structure array is together laminated, fills other media between laminate.Need in stacked pcb board process with metal micro structure array each laminate whole, and need to be with the metal micro structure array alignment of different pcb board layers.
Encapsulation about " super material " at present only rests in some manual operations, in manual encapsulation process, need manually with the super material of micro-structural, couple together with double faced adhesive tape, this operation human error easily causes the micro-structural dislocation, thickness of dielectric layers between micro-structural is inhomogeneous, cause the performance of sample and design to differ too large, and packaging efficiency is very low.
[summary of the invention]
Technical problem to be solved by this invention is to provide a kind of super encapsulation of the materials method, can improve encapsulation precision and the efficient of super material substrate.
For solving the problems of the technologies described above, one embodiment of the invention provides a kind of super encapsulation of the materials method, and this method for packing comprises:
Form glue-line on the surface that the first surpasses plate of material;
What will have glue-line the first surpasses the plate of material vacuum suction at the chip mounter base that presets, and proofreading the first surpasses the image of plate of material, obtains the image standard;
Paste the described surface that the first surpasses plate of material with the second surpassing plate of material by described image standard;
The first surpass plate of material and the second surpass the curing of plate of material barbecue what be pasted together.
Compared with prior art, technique scheme has the following advantages: the super plate of material brush coating packaged type that adopts automation, the first surpass with what be coated with glue-line the chip mounter base that the plate of material vacuum suction is presetting, proofreading the first surpasses the image of plate of material, obtain the image standard, then continue on the basis that the first surpasses plate of material according to this image to paste other super plate of material, can guarantee the precision of encapsulating structure, and improve packaging efficiency.
[description of drawings]
In order to be illustrated more clearly in the technical scheme in the embodiment of the present invention, during the below will describe embodiment, the accompanying drawing of required use is done to introduce simply, apparently, accompanying drawing in the following describes is only some embodiments of the present invention, for those of ordinary skills, under the prerequisite of not paying creative work, can also obtain according to these accompanying drawings other accompanying drawing.
Fig. 1 is a kind of super encapsulation of the materials method flow diagram that the embodiment of the present invention one provides;
Fig. 2 is a kind of super encapsulation of the materials method flow diagram that the embodiment of the present invention two provides.
[embodiment]
Below in conjunction with the accompanying drawing in the embodiment of the present invention, the technical scheme in the embodiment of the present invention is clearly and completely described, obviously, described embodiment is only the present invention's part embodiment, rather than whole embodiment.Based on the embodiment in the present invention, those of ordinary skills belong to the scope of protection of the invention not making all other embodiment that obtain under the creative work prerequisite.
Embodiment one,
Referring to Fig. 1, be a kind of super encapsulation of the materials method flow diagram that the embodiment of the present invention one provides, this method for packing comprises:
S11: design the chip mounter base corresponding with the first surpassing the plate of material size.
Wherein, the first surpass the area of plate of material less than 15 * 15mm.
S12: default steel mesh is placed in the surface that the first surpasses plate of material, with scraper, colloid is scraped uniformly to the steel mesh zone, thereby formed glue-line on the surface that the first surpasses plate of material, and glue-line is heated to viscous state.
Wherein, default steel mesh is to design according to the requirement that the first surpasses plate of material, comprises the aperture position, size and the thickness that design steel mesh.
Wherein, glue-line is thermosetting resin.
S13: what sucker will be coated with glue-line the first surpasses the plate of material vacuum suction at the chip mounter base that presets, and proofreading the first surpasses the image of plate of material, obtains the image standard.
S14: paste the surface that the first surpasses plate of material by the image standard with the second surpassing plate of material.
S15: the first surpass plate of material and the second surpass the curing of plate of material barbecue what be pasted together.
Wherein, the first surpass plate of material and the second surpass spacing distance between plate of material less than 5mm.
In the present embodiment, adopt the super material brush coating packaged type of automation, the first surpass with what be coated with glue-line the chip mounter base that the plate of material vacuum suction is presetting, proofreading the first surpasses the image of plate of material, obtain the image standard, then continue on the basis that the first surpasses plate of material according to this image to paste other super plate of material, can guarantee the precision of encapsulating structure, and improve packaging efficiency.
Embodiment two,
Referring to Fig. 2, be a kind of super encapsulation of the materials method flow diagram that the embodiment of the present invention two provides, this method for packing comprises:
S21: design the chip mounter base corresponding with the first surpassing the plate of material size.
S22: adopt the mode of spraying, form glue-line on the described surface that the first surpasses plate of material, and this glue-line is heated to viscous state.
S23: what sucker will be coated with glue-line the first surpasses the plate of material vacuum suction at the chip mounter base that presets, and proofreading the first surpasses the image of plate of material, obtains the image standard.
S24: paste the surface that the first surpasses plate of material by the image standard with the second surpassing plate of material.
S25: the first surpass plate of material and the second surpass the curing of plate of material barbecue what be pasted together.
S26: form glue-line on the surface that the second is surpassing plate of material, paste the and three surpass plate of material on this glue-line, and barbecue solidifies.Then repeating step S26 obtains the packaging body of the super plate of material of multilayer.
The present embodiment has been described the super encapsulation of the materials process of multilayer with respect to embodiment one, and technological process is simple, the precision of the encapsulation that can improve and efficient.
Above the embodiment of the present invention is described in detail, has used specific case herein principle of the present invention and execution mode are set forth, the explanation of above embodiment just is used for helping to understand method of the present invention and core concept thereof; Simultaneously, for one of ordinary skill in the art, according to thought of the present invention, all will change in specific embodiments and applications, in sum, this description should not be construed as limitation of the present invention.
Claims (10)
1. a super encapsulation of the materials method, is characterized in that, the method comprises:
Form glue-line on the surface that the first surpasses plate of material;
The first surpass the plate of material vacuum suction at the chip mounter base that presets with what be coated with glue-line, proofreading the first surpasses the image of plate of material, obtains the image standard;
Paste the described surface that the first surpasses plate of material with the second surpassing plate of material by described image standard;
The first surpass plate of material and the second surpass the curing of plate of material barbecue what be pasted together.
2. method for packing according to claim 1, is characterized in that, also comprises before described method:
Design and described chip mounter base corresponding to plate of material size that the first surpass.
3. method for packing according to claim 1, is characterized in that, described method also comprises:
Further paste super plate of material in described the second surpassing on plate of material by described image standard, obtain the packaging body of the super plate of material of multilayer.
4. method for packing according to claim 1, is characterized in that, described glue-line is thermosetting resin.
5. method for packing according to claim 1, is characterized in that, forms glue-line on the surface that the first surpasses plate of material, comprising:
Default steel mesh is placed in the surface that the first surpasses plate of material, with scraper, colloid is scraped uniformly to the steel mesh zone, thereby formed glue-line on the surface that the first surpasses plate of material.
6. method for packing according to claim 5, is characterized in that, before default steel mesh is placed in the surface that the first surpasses plate of material, also comprises:
Require aperture position, size and the thickness of the described steel mesh of design according to encapsulation.
7. method for packing according to claim 1, is characterized in that, forms glue-line on the surface that the first surpasses plate of material, comprising:
Adopt the mode of spraying, form glue-line on the described surface that the first surpasses plate of material.
8. according to claim 5 or 7 described method for packing, it is characterized in that, after the surface that the first surpasses plate of material forms glue-line, also comprise:
Described glue-line is heated to viscous state.
9. method for packing according to claim 1, is characterized in that, the described area of plate of material that the first surpasses is less than 15 * 15mm.
10. method for packing according to claim 1, is characterized in that, describedly the first surpasses plate of material and the second surpass spacing distance between plate of material less than 5mm.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
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| CN201110336516.XA CN103094695B (en) | 2011-10-31 | 2011-10-31 | A kind of method for packing of super material |
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| CN201110336516.XA CN103094695B (en) | 2011-10-31 | 2011-10-31 | A kind of method for packing of super material |
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| CN103094695A true CN103094695A (en) | 2013-05-08 |
| CN103094695B CN103094695B (en) | 2016-05-04 |
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Citations (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101031199A (en) * | 2007-01-18 | 2007-09-05 | 深圳职业技术学院 | Linear form and position adapting method based on pin |
| CN101149458A (en) * | 2007-10-31 | 2008-03-26 | 无锡凯尔科技有限公司 | Chip packaged fixed focus focusing-free imaging module processing method |
| CN101383450A (en) * | 2008-10-23 | 2009-03-11 | 中国科学院光电技术研究所 | Dual frequency dual polarization microstrip patch antenna of low refraction guiding dielectric material |
| CN101431171A (en) * | 2008-12-12 | 2009-05-13 | 东南大学 | Polarization conversion method and polarization converter based on artificial electromagnetic material |
| CN101447276A (en) * | 2007-09-28 | 2009-06-03 | 富士通媒体部品株式会社 | Electric device |
| CN101826494A (en) * | 2010-04-13 | 2010-09-08 | 北京大学 | Heat dissipation device based on carbon nanotube arrays and low temperature co-fired ceramics and preparation method |
| CN101867094A (en) * | 2010-05-02 | 2010-10-20 | 兰州大学 | Focusing panel antenna |
-
2011
- 2011-10-31 CN CN201110336516.XA patent/CN103094695B/en active Active
Patent Citations (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101031199A (en) * | 2007-01-18 | 2007-09-05 | 深圳职业技术学院 | Linear form and position adapting method based on pin |
| CN101447276A (en) * | 2007-09-28 | 2009-06-03 | 富士通媒体部品株式会社 | Electric device |
| CN101149458A (en) * | 2007-10-31 | 2008-03-26 | 无锡凯尔科技有限公司 | Chip packaged fixed focus focusing-free imaging module processing method |
| CN101383450A (en) * | 2008-10-23 | 2009-03-11 | 中国科学院光电技术研究所 | Dual frequency dual polarization microstrip patch antenna of low refraction guiding dielectric material |
| CN101431171A (en) * | 2008-12-12 | 2009-05-13 | 东南大学 | Polarization conversion method and polarization converter based on artificial electromagnetic material |
| CN101826494A (en) * | 2010-04-13 | 2010-09-08 | 北京大学 | Heat dissipation device based on carbon nanotube arrays and low temperature co-fired ceramics and preparation method |
| CN101867094A (en) * | 2010-05-02 | 2010-10-20 | 兰州大学 | Focusing panel antenna |
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| CN103094695B (en) | 2016-05-04 |
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