CN103093868A - Alloy filler tensile earphone wire - Google Patents
Alloy filler tensile earphone wire Download PDFInfo
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- CN103093868A CN103093868A CN2013100316423A CN201310031642A CN103093868A CN 103093868 A CN103093868 A CN 103093868A CN 2013100316423 A CN2013100316423 A CN 2013100316423A CN 201310031642 A CN201310031642 A CN 201310031642A CN 103093868 A CN103093868 A CN 103093868A
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Abstract
The invention relates to the technical field of earphone wires, and particularly relates to an alloy filler tensile earphone wire. The alloy filler tensile earphone wire comprises a center alloy post, a plurality of conductive core bundles and outer insulation layers, wherein the plurality of conductive core bundles are wound on the outer side of the center alloy post, and the outer insulation layers are sleeved to the center alloy post and the conductive core bundles. Each conductive core bundle comprises a single alloy wire and a plurality of conductive cores wound on the single alloy wire. One insulation layer is arranged on the outer side of each conductive core. According to the alloy filler tensile earphone wire and the processing technique of the alloy filler tensile earphone wire, due to the fact that the center alloy post is arranged in the earphone wire, and the single alloy wires are arranged in the conductive core bundles, the tensile resistance of the earphone wire is improved, the antijamming capability of the earphone wire is improved through the electromagnetic shielding of the center alloy post and the single alloy wires, and the processing technique enables processing to be conveniently performed, and capable of improving product quality.
Description
Technical field
The present invention relates to the headset cord technical field, particularly relate to a kind of alloy and fill tensile earphone wire.
Background technology
Earphone cord commonly used is to comprise insulating barrier, twisted wire, center conductor, and twisted wire is formed by the wire stranding of several or several groups mutually insulateds, and twisted wire is around a center conductor twist, and insulating barrier is socketed on the outside of twisted wire, center line wire.For the electric wire of this structure, due to poor anti jamming capability, in use usually because extraneous interference and both poor sound quality, and the electric wire of this structure, tensile property is poor, can not be used for some earphone cords that voice quality is had relatively high expectations, as use in motion, police or military earphone cord.
For the problems referred to above, the applicant discloses " a kind of tensile earphone wire " in the patent No. is the Chinese utility model patent of " 201120267754.5 ", it is by replacing above-mentioned center conductor with cotton, and be arranged with alloy column in the outside of twisted wire and cotton, the inboard of insulating barrier, improve the antijamming capability of earphone cord by alloy column, and improve the resistance to tension of earphone cord by cotton.But, for this technical scheme, be arranged at the centre of earphone cord due to cotton, it easily is out of shape, and causes the technology difficulty when winding twisted wire, alloy column larger, and, the alloy column winding is in the outside of twisted wire, cotton, when earphone cord was subjected to pulling force, alloy column possibility pair twist zygonema, cotton carried out stranded, extruding, thereby destroy wire.
Summary of the invention
The object of the invention is to for the deficiencies in the prior art, and provide a kind of alloy to fill tensile earphone wire and processing technology thereof, this headset cord scientific structure, antijamming capability is strong, resistance to tension is strong, and this processing technology is easy to process, improves the quality of products.
The technical solution adopted for the present invention to solve the technical problems is: a kind of alloy is filled tensile earphone wire, comprise the center alloy column, be set around the some conductive cores bundles in the described center alloy column outside, be socketed on the external insulation layer of described center alloy column, conductive cores bundle, described conductive cores bundle comprises single alloy wire, is set around the some conductive cores that described list props up alloy wire, and the arranged outside of every conductive cores has insulating barrier.
Preferably, described center alloy column comprises metal internal layer and insulating outer layer.
Wherein, described conductive cores bundle is at least two.
Preferably, described conductive cores Shu Weiwu root.
Preferably, some conductive cores are set around described list and prop up alloy wire and form inner conductor outward, and some conductive cores are set around that described inner conductor is outer forms outer wire in addition.
Wherein, to prop up alloy wire be a wires to described list or formed by many wires twist.
Wherein, the metal internal layer of described center alloy column or the material of single alloy wire are monel, gun-metal, CTB alloy, manganin or lithium-copper alloy.
Wherein, described center alloy column, conductive cores bundle, external insulation layer form cylindric electric wire.
Perhaps, described center alloy column, conductive cores bundle, external insulation layer form flat-shaped electric wire.
A kind of alloy is filled the processing technology of tensile earphone wire, comprises the steps:
A, single alloy wire of preparation, center alloy column, single alloy wire and center alloy column are a wires or are formed by many wires twist;
B, some conductive cores are around in outside single alloy wire, form the conductive cores bundle;
C, some conductive cores bundles are around in outside the alloy column of center;
D, generate external insulation layer by extruder outside conductive cores bundle, center alloy column.
The invention has the beneficial effects as follows: a kind of alloy is filled tensile earphone wire, it is by arranging the center alloy column, single alloy wire being set in the conductive cores bundle in headset cord, thereby improved the resistance to tension of headset cord, and the electromagnetic shielding by center alloy column, single alloy wire, improved the antijamming capability of headset cord, processing technology of the present invention is easy to process, can improve the quality of products.
Comprise the center alloy column, be set around the some conductive cores bundles in the described center alloy column outside, be socketed on the external insulation layer of described center alloy column, conductive cores bundle, described conductive cores bundle comprises single alloy wire, is set around the some conductive cores that described list props up alloy wire, and the arranged outside of every conductive cores has insulating barrier.
Description of drawings
Fig. 1 is that alloy of the present invention is filled the tensile earphone wire structural representation.
Description of reference numerals:
1---center alloy column 2---conductive cores bundle
21---single alloy wire 22---conductive cores
23---insulating barrier 3---external insulation layer.
Embodiment
The present invention is further detailed explanation below in conjunction with the drawings and specific embodiments, is not practical range of the present invention is limited to this.
Embodiment one.
As shown in Figure 1, the alloy of the present embodiment is filled tensile earphone wire, comprise center alloy column 1, be set around the some conductive cores bundles 2 in alloy column 1 outside, described center, be socketed on the external insulation layer 3 of described center alloy column 1, conductive cores bundle, described conductive cores bundle comprises single alloy wire 21, is set around the some conductive cores 22 that described list props up alloy wire 21, and the arranged outside of every conductive cores 22 has insulating barrier 23.The present invention by center alloy column 1 is set in headset cord, at interior single the alloy wire 21 that arranges of conductive cores bundle 2, thereby improved the resistance to tension of headset cord, and by the electromagnetic shielding of center alloy column 1, single alloy wire 21, improved the antijamming capability of headset cord.
Wherein, described center alloy column 1 comprises metal internal layer and insulating outer layer, and what the material of metal internal layer can be in monel, gun-metal or CTB alloy is a kind of.
Further, described conductive cores bundle 2 is at least two, and in the present embodiment, described conductive cores bundle 2 is five.
Further, as shown in Figure 1, conductive cores bundle 2 outer conductive cores 22 are full of two-layer, concrete, some conductive cores 22 are set around described list and prop up the outer formation inner conductor of alloy wire 21, and some conductive cores 22 are set around the outer wire of the outer formation of described inner conductor in addition.
Further, described list props up alloy wire 21 to be a wires or to be formed by many wires twist, and the material of single alloy wire 21 is monel, gun-metal, CTB alloy, manganin or lithium-copper alloy etc., and its cost is lower, intensity is good, and resistance to tension is strong.
As shown in Figure 1, described center alloy column 1, conductive cores bundle 2, external insulation layer 3 form cylindric electric wire, and certainly, described center alloy column 1, conductive cores bundle 2, external insulation layer 3 also can form flat-shaped electric wire.
Embodiment two.
The present embodiment provides alloy of the present invention to fill the processing technology of tensile earphone wire, and it comprises the steps:
A, single alloy wire 21 of preparation, center alloy column 1, single alloy wire 21 and center alloy column 1 are a wires or are formed by many wires twist;
B, some conductive cores 22 are around in outside single alloy wire 21, form conductive cores bundle 2;
C, some conductive cores bundles 2 are around in outside center alloy column 1;
D, by extruder at conductive cores bundle 2, the outer generation external insulation layer 3 of center alloy column 1.
Processing technology of the present invention utilizes existing equipment just can complete, cost is low, and easy to process, can be by the center alloy column being set in headset cord, single alloy wire being set in the conductive cores bundle, thereby improved the resistance to tension of headset cord, can improve the quality of products.
Should be noted that at last; above embodiment is only in order to illustrate technical scheme of the present invention; but not limiting the scope of the invention; although with reference to preferred embodiment, the present invention has been done to explain; those of ordinary skill in the art is to be understood that; can modify or be equal to replacement technical scheme of the present invention, and not break away from essence and the scope of technical solution of the present invention.
Claims (10)
1. alloy is filled tensile earphone wire, it is characterized in that: comprise center alloy column (1), be set around the some conductive cores bundles (2) in described center alloy column (1) outside, be socketed on the external insulation layer (3) of described center alloy column (1), conductive cores bundle, described conductive cores bundle comprises single alloy wire (21), is set around the some conductive cores (22) that described list props up alloy wire (21), and the arranged outside of every conductive cores (22) has insulating barrier (23).
2. alloy according to claim 1 is filled tensile earphone wire, and it is characterized in that: described center alloy column (1) comprises metal internal layer and insulating outer layer.
3. alloy according to claim 1 is filled tensile earphone wire, and it is characterized in that: described conductive cores bundle (2) is at least two.
4. alloy according to claim 3 is filled tensile earphone wire, and it is characterized in that: described conductive cores bundle (2) is five.
5. alloy according to claim 3 is filled tensile earphone wire, it is characterized in that: some conductive cores (22) are set around described list and prop up the outer inner conductor that forms of alloy wire (21), and some conductive cores (22) are set around the outer wire of the outer formation of described inner conductor in addition.
6. alloy according to claim 1 is filled tensile earphone wire, it is characterized in that: described list props up alloy wire (21) to be a wires or to be formed by many wires twist.
7. alloy according to claim 1 is filled tensile earphone wire, and it is characterized in that: the material of the metal internal layer of described center alloy column (1) or single alloy wire (21) is monel, gun-metal, CTB alloy, manganin or lithium-copper alloy.
8. alloy according to claim 1 is filled tensile earphone wire, and it is characterized in that: described center alloy column (1), conductive cores bundle (2), external insulation layer (3) form cylindric electric wire.
9. alloy according to claim 1 is filled tensile earphone wire, and it is characterized in that: described center alloy column (1), conductive cores bundle (2), external insulation layer (3) form flat-shaped electric wire.
10. the alloy of claim 1 is filled the processing technology of tensile earphone wire, it is characterized in that: comprise the steps:
A, preparation single alloy wire (21), center alloy column (1), single alloy wire (21) and center alloy column (1) they are a wires or are formed by many wires twist;
B, some conductive cores (22) are around in outside single alloy wire (21), form conductive cores bundle (2);
C, some conductive cores bundles (2) are around in outside center alloy column (1);
D, generate external insulation layer (3) by extruder outside conductive cores bundle (2), center alloy column (1).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2013100316423A CN103093868A (en) | 2013-01-28 | 2013-01-28 | Alloy filler tensile earphone wire |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2013100316423A CN103093868A (en) | 2013-01-28 | 2013-01-28 | Alloy filler tensile earphone wire |
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| CN103093868A true CN103093868A (en) | 2013-05-08 |
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| CN2013100316423A Pending CN103093868A (en) | 2013-01-28 | 2013-01-28 | Alloy filler tensile earphone wire |
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104505171A (en) * | 2014-12-11 | 2015-04-08 | 东莞市瀛通电线有限公司 | Preparation method of nanometer coated earphone line and product thereof |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| EP1280167A1 (en) * | 2001-07-25 | 2003-01-29 | Nexans | Semiconductive screen for power cable |
| CN201698836U (en) * | 2010-01-14 | 2011-01-05 | 北京德茂线材有限公司 | Wire feeding device used for wire stranding machine for multiple copper stranded wire strands |
| CN102103899A (en) * | 2010-12-24 | 2011-06-22 | 江苏远洋东泽电缆股份有限公司 | High-performance cable for field logging and manufacturing method thereof |
-
2013
- 2013-01-28 CN CN2013100316423A patent/CN103093868A/en active Pending
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| EP1280167A1 (en) * | 2001-07-25 | 2003-01-29 | Nexans | Semiconductive screen for power cable |
| CN201698836U (en) * | 2010-01-14 | 2011-01-05 | 北京德茂线材有限公司 | Wire feeding device used for wire stranding machine for multiple copper stranded wire strands |
| CN102103899A (en) * | 2010-12-24 | 2011-06-22 | 江苏远洋东泽电缆股份有限公司 | High-performance cable for field logging and manufacturing method thereof |
Non-Patent Citations (1)
| Title |
|---|
| 杨国治: "《常用电工测量仪表问答》", 29 February 1988 * |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104505171A (en) * | 2014-12-11 | 2015-04-08 | 东莞市瀛通电线有限公司 | Preparation method of nanometer coated earphone line and product thereof |
| CN104505171B (en) * | 2014-12-11 | 2017-01-11 | 东莞市瀛通电线有限公司 | Preparation method of nanometer coated earphone line and product thereof |
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Application publication date: 20130508 |