CN103092447B - Graphical circuit structure, its preparation method and application - Google Patents
Graphical circuit structure, its preparation method and application Download PDFInfo
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- CN103092447B CN103092447B CN201310023162.2A CN201310023162A CN103092447B CN 103092447 B CN103092447 B CN 103092447B CN 201310023162 A CN201310023162 A CN 201310023162A CN 103092447 B CN103092447 B CN 103092447B
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Abstract
The invention discloses a kind of graphical circuit structure, its preparation method and application.The main points of technical solution of the present invention are: by the region beyond the visible area for arranging transparency conductive electrode, insulation material layer is covered in region especially for formation circuit trace structure, and circuit trace structure is formed at insulation material layer surface, avoid because transparent conductive material patterning in the region for the formation of circuit trace structure is not thorough or have residual, and then cause the problems such as circuit trace inside configuration short circuit.Present invention process is simple, with low cost, is easy to scale and implements, and effectively can improve properties of product, improve product yield, and can be widely used in photoelectric device and electronic equipment.
Description
Technical field
The present invention be more particularly directed to a kind of graphical circuit structure, its preparation method and application.
Background technology
Along with popularizing of smart mobile phone, touch technology has become the important means improving man-machine conversation efficiency.In numerous touch technologies, capacitance touching control, because of better experience sense (only need touch gently), simplicity (without the need to correcting) and the comparatively factor such as long life, achieves application in a series of terminals such as smart mobile phone, notebook, palm PC.
With regard to the structure of capacitive touch screen, be positioned at the patterned transparent conductive layer of visible area and constitute the core of whole touch-control circuit in the connecting circuit of non-visible area.In the design of touch-screen, the border width of the space shared by connecting circuit and touch-screen screen has direct relation, in the narrow limitization design of Current demands touch-screen, under namely requiring the prerequisite that the design of frame is the smaller the better, needs make more carefully, more intensive circuit trace.Will certainly require that circuit itself is more and more thinner like this, the distance between circuit and circuit is also more and more less.Current touch-screen normally adopts the method for etching or printing to realize the patterning of visible area conductive layer, but not the circuit of visible area then mainly adopts the techniques such as ald, serigraphy or laser-induced thermal etching to realize, wherein, laser-induced thermal etching, because of advantages such as more efficient, environmental protection, is applied in the pattern etched of visible area and non-visible area circuit structure just more and more.But for primarily of one-dimensional material, such as carbon nano-tube, the transparency conductive electrode that metal and metal oxide nano-wire etc. are formed, often there is following defect in laser-etching process, namely, etching can be produced not thorough to whole or large live width (as more than 40 μm) etching, the problems such as etch residue splashing, and then cause transparent conductive material to have residual in the region of P.e.c. Wiring structure, when adjacent two circuit spacings are enough little, these remain and can cause connecting circuit short circuit, this will reduce product yield greatly, have a strong impact on production, laser etching technology can be hindered in the application in novel conductive film field simultaneously.
Summary of the invention
For deficiency of the prior art, an object of the present invention is the preparation method providing a kind of graphical circuit structure, to stop the problems such as the short circuit that causes because of transparent conductive material residual in the region for the formation of circuit trace structure.
For achieving the above object, the preparation method of the graphical circuit structure of the present invention's employing comprises:
(1) at least in the first setting regions of substrate surface, transparent conductive material layer is formed;
(2) in the second setting regions of substrate surface, insulation material layer is formed;
(3) at described insulation material layer circuit forming surface Wiring structure, and described circuit trace structure is electrically connected with transparent conductive material layer.
Further, described second setting regions is around being arranged at around the first setting regions, and at least described inner edge portion of insulation material layer engages with the outer edge of transparent conductive material layer.
As one of comparatively preferred embodiment, this preparation method also can comprise:
After step (1) completes, along the direction vertical with substrate surface, rupturing operation is carried out to the selection area between the first setting regions and the second setting regions, cut off the degree of depth support to substrate surface or go deep in base material, thus the transparent conductive material layer at least making to be formed in the first setting regions and the second setting regions are cut off completely, carry out thereafter the operation of step (2).
As more specifically one of application scheme, this preparation method can comprise following concrete steps:
(1) at least in the visible area of substrate surface, patterned transparent conductive electrode is formed;
(2) intersection between the non-visible area of substrate surface except visible area and described visible area carries out etching operation, and etch depth supports to substrate surface or gos deep in base material, thus transparency conductive electrode and non-visible area are cut off completely;
(3) in described non-visible area, cover insulating material form insulation material layer;
(4) form on insulation material layer surface the circuit trace structure be connected with transparency conductive electrode edge electric.
Two of object of the present invention is to provide a kind of graphical circuit structure, comprising:
At least be distributed in the transparent conductive material layer in the first setting regions of substrate surface;
Be distributed in the circuit trace structure in the second setting regions of substrate surface, described circuit trace structure is electrically connected with transparent conductive material layer;
And, be formed at the insulation material layer in described second setting regions, and described circuit trace structure is formed at described insulation material layer surface.
Further, described second setting regions is around being arranged at around the first setting regions, and at least described inner edge portion of insulation material layer engages with the outer edge of transparent conductive material layer.
All kinds of transparent conductive materials that described transparent conductive material layer can adopt those skilled in the art to know are formed, and its material can comprise metal, non-metallic conducting material or its combination;
Described metal material can comprise any one or two or more combinations in the thin metal layer (such as metal and/or its oxide are as the coating, sedimentary deposit etc. of ITO, ZnO) of metal nanometer line (nano wire of any one or its alloy in such as gold, silver, copper etc.) or metal nanoparticle (nano particle of any one or its alloy in such as gold, silver, copper etc. or cluster) and continuous distribution;
Described non-metallic conducting material can comprise any one or two or more combinations in the nonmetal thin layer of radio frequency nano wire or nano particle and continuous distribution.Wherein, described " nonmetal " can be inorganic material (e.g., carbon and silicon), organic material (e.g., conducting polymer composite) or its combination.For example, foregoing non-metal conducting nanowires can be carbon nano-tube, silicon nanowires, and the nonmetal thin layer of continuous distribution can be conducting polymer composite coating, grapheme material etc.
More specifically, described circuit trace structure is electrically connected with the edge part of transparent conductive material layer.
Another object of the present invention is to the application of graphical circuit structure in photoelectric device and/or electronic equipment former figures circuit structure being provided or being prepared by preceding method.
Another object of the present invention is to provide a kind of touch-screen, the graphical circuit structure comprising graphical circuit structure as above or prepare with method described above.
Another object of the present invention is to provide a kind of touch control device, comprises circuit structure as above graphical or the graphical circuit structure prepared with method described above or touch-screen as above.
Compared with prior art, advantage of the present invention is at least: by forming the region beyond transparency conductive electrode, insulation material layer is covered in region especially for formation circuit trace structure, and circuit trace structure is formed at insulation material layer surface, avoid transparency conductive electrode in manufacturing process because the patterning produced whole or large live width (as more than 40 μm) etching is not thorough or transparent conductive material has residual in the region for the formation of circuit trace structure, and then cause the wire in circuit trace structure because of residual transparent conductive material and the problem of short circuit.Present invention process is simple, with low cost, is easy to scale and implements, and effectively can improve properties of product, improve product yield.
Accompanying drawing explanation
Fig. 1 is the close-up top view of graphical circuit structure in a preferred embodiment of the present invention;
Fig. 2 is the cross-sectional view of graphical circuit structure shown in Fig. 1;
Description of reference numerals: 1-visible area, the non-visible area of 2-, 3-etching area, 11-transparent base, 12-pattern conductive coating area, 21-regions of conductive material, 22-insulation material layer, 23-circuit trace structural sheet.
Embodiment
Because the deficiencies in the prior art, the present invention aims to provide a kind of graphical circuit structure and preparation method thereof, elaborates below to its technical scheme.
As one aspect of the present invention, the preparation method of this graphical circuit structure comprises:
(1) at least in the first setting regions of substrate surface, transparent conductive material layer is formed;
(2) in the second setting regions of substrate surface, insulation material layer is formed;
(3) at described insulation material layer circuit forming surface Wiring structure, and circuit trace structure is electrically connected with transparent conductive material layer, preferably, circuit trace structure is electrically connected with the edge part of transparent conductive material layer.
In some embody rule scheme, described second setting regions system is around being arranged at around the first setting regions, and at least described inner edge portion of insulation material layer engages with the outer edge of transparent conductive material layer.
As one of comparatively preferred embodiment, this preparation method also can comprise:
Step (1X): after step (1) completes, along the direction vertical with substrate surface, rupturing operation is carried out to the selection area between the first setting regions and the second setting regions, cut off the degree of depth support to substrate surface or go deep in base material, thus the transparent conductive material layer at least making to be formed in the first setting regions and the second setting regions are cut off completely, carry out thereafter the operation of step (2).
Aforementioned rupturing operation can be utilize infrared laser or Ultra-Violet Laser to etch transparency conducting layer, and classical acid alkaline etching lithography also can be utilized to carry out pattern etching to transparency conducting layer.
By the operation of abovementioned steps (1X), the impact that transparent conductive material layer may cause the inner structure of circuit trace structure can be blocked further, boost device yield.
Postscript, specifically, aforementioned transparent conductive material layer can comprise the patterned transparent conductive electrode formed primarily of monodimension nanometer material, described monodimension nanometer material can select carbon nano-tube and/or metal gold, silver and copper nano-wire and/or metal oxide (as zinc paste etc.) etc., but is not limited to this.
Attached and; consider in the preparation process of the device comprising the elements such as patterned transparent conductive electrode; usually also the operations such as cleaning treatment need be carried out with water, ethanol, sherwood oil equal solvent to device; so; aforementioned dielectric material should adopt and present stability property and the material of not degrading to these solvents; such as, the macromolecule polymer materials such as organic siliconresin, epoxy resin, polyurethane or bimaleimide resin can be selected.
Again and, aforementioned circuit Wiring structure can be the patterned circuit or the conducting wire that formed through laser-induced thermal etching, entire area that are formed by the technique such as ald, serigraphy.In general, the live width of the circuit formed by serigraphy about 100 μm, the live width of the circuit formed by laser-induced thermal etching again by whole printed conductive layer then can be down to about 40 μm even less.
Summarize it, system of the present invention is by before preparing the circuit trace structure coordinated with patterned transparent conductive material layer, insulating material is covered to stop the problem of short circuit between the wire in the circuit trace structure caused because of residual transparent conductive material in the region for arranging circuit trace structure, and then effectively improve the yields of product, reduce production cost.
Obviously, the present invention can be widely used in all kinds ofly comprising in the equipment of patterned transparent conductive material layer, such as, and photovoltaic device, LED component or other electronic equipment.
Consult Fig. 1-Fig. 2, as a preferred embodiment of the present invention, it relates to a kind of preparation method being applied to the graphical circuit structure of touch-screen, comprises following concrete steps:
(1) at least at transparent base 11(hereinafter referred to as base material) formation patterned transparent conductive electrode 12 in the visible area 1 on surface;
(2) at substrate surface except visible area 1(dotted line left field) except non-visible area 2(dotted line right side area) and described visible area between intersection 3(namely, etching area) carry out etching operation, etch depth supports to substrate surface or gos deep in base material, thus make pattern conductive coating area 12(namely, transparency conductive electrode) with the residual conductive material region 21(of non-visible area namely, transparent conductive material residual layer) cut off completely;
(3) in described non-visible area, cover insulating material, and form insulation material layer 22 by hot blast, the heat curing such as infrared and ultraviolet light polymerization mode;
(4) form on insulation material layer surface the graphical circuit trace structural sheet 23 be connected with transparency conductive electrode edge electric.
Obviously, by aforementioned operation, the impact that patterned transparent conductive electrode may cause each wire in circuit trace structure can be stopped completely, prevent the defects such as short circuit.
If select the macromolecule polymer material such as organic siliconresin or epoxy resin, polyurethane or bimaleimide resin as insulating material, then said curing mode can adopt hot blast or infrared curing, and solidification temperature is 70-120 DEG C.Also ultraviolet light polymerization mode can be adopted.
Form former figures circuit trace structure according to modes such as serigraphy silver slurries, then the mode of solidification silver slurry can select hot blast or infrared curing, and solidification temperature is 120-160 DEG C.Also ultraviolet light polymerization mode can be adopted.
Below in conjunction with some more specifically embodiments, technical scheme of the present invention is further described in detail.
embodiment 1
The present embodiment provide firstly a kind of as transparency conductive electrode be covered on base material, with the carbon nano tube transparent conductive thin-film of the argyle designs of 4.3 inches.Carry out continuous etching operation around visible area, etch depth should support to substrate surface or go deep into base material inside, uses and visible area transparency conductive electrode and non-visible area is cut off completely.By accurate location, adopt the method for flexographic printing at argyle design frame (i.e. visible area), print epoxy resin in the region (i.e. non-visible area) of printing silver-colored line outward, through 80 DEG C of baking oven heated-air dryings, by serigraphy epoxy resin surface printing silver slurry after hardening, make it form the circuit trace be connected with electrode material edge, namely obtain capacitive touch screen sensor through 130 DEG C of hot-air seasonings.
embodiment 2
The present embodiment provide firstly a kind of as transparency conductive electrode be covered on base material, with the nano silver wire transparent conductive film of the argyle designs of 4.3 inches.Carry out continuous etching operation around visible area, etch depth should support to substrate surface or go deep into base material inside, uses and visible area transparency conductive electrode and non-visible area is cut off completely.By accurate location, adopt the method for flexographic printing at argyle design frame (i.e. visible area), print organic siliconresin in the region (i.e. non-visible area) of printing silver-colored line outward, through 120 DEG C of baking oven heated-air dryings, by serigraphy surface of silicone resin printing silver slurry after hardening, make it form the circuit trace be connected with electrode material edge, namely obtain capacitive touch screen sensor through 130 DEG C of hot-air seasonings.
embodiment 3
The present embodiment provide firstly and is a kind ofly covered in transparent conductive film on base material, that formed with carbon nano-tube and the nano silver wire codeposition of the bar patens of 3.4 inches as transparency conductive electrode.Carry out continuous etching operation around visible area, etch depth should support to substrate surface or go deep into base material inside, uses and visible area transparency conductive electrode and non-visible area is cut off completely.By accurate location, adopt the method for flexographic printing at bar paten frame (i.e. visible area), print polyurethane in the region (i.e. non-visible area) of printing silver-colored line outward, through 100 DEG C of baking oven heated-air dryings, by flexographic printing polyurethane surface printing full wafer silver slurry after hardening, it is made to be connected with electrode material edge, through 130 DEG C of hot-air seasonings, then carve circuit trace structure by laser-induced thermal etching and namely obtain capacitive touch screen sensor.
It should be noted that, the foregoing is only preferred embodiment of the present invention, be not limited to the present invention, all do within principle of the present invention and spirit any amendment, equivalent to replace and improvement etc., be all just included within protection scope of the present invention.
Claims (9)
1. a graphical circuit structure, comprising:
At least be distributed in the transparent conductive material layer in the first setting regions of substrate surface,
Be distributed in the circuit trace structure in the second setting regions of substrate surface, described circuit trace structure is electrically connected with transparent conductive material layer,
And be formed at the insulation material layer in described second setting regions, described circuit trace structure is located at described insulation material layer surface;
It is characterized in that, it also comprises:
Be located at the cutting portion between the first setting regions and the second setting regions, in order to make to be formed at transparent conductive material layer in the first setting regions and the second setting regions is cut off completely, described cutting portion is supported to substrate surface along the direction that substrate surface is vertical or gos deep in base material.
2. graphical circuit structure according to claim 1, is characterized in that, described second setting regions is around being arranged at around the first setting regions, and the inner edge portion of described insulation material layer engages with the outer edge of transparent conductive material layer.
3. graphical circuit structure according to claim 1, is characterized in that, described circuit trace structure is electrically connected with the edge part of transparent conductive material layer.
4. the graphical circuit structure according to any one of claim 1-3, is characterized in that, the material of described transparent conductive material layer comprises metal and/or non-metallic conducting material;
Described metal material comprises any one or two or more combinations in the thin metal layer of metal nanometer line or metal nanoparticle and continuous distribution;
Described non-metallic conducting material comprises any one or two or more combinations in the nonmetal thin layer of radio frequency nano wire or nano particle and continuous distribution.
5. a preparation method for graphical circuit structure, is characterized in that, comprises;
(1) at least in the first setting regions of substrate surface, homogeneous electrically conducting transparent material is formed;
(1X) after step (1) completes, along the direction vertical with substrate surface, rupturing operation is carried out to the selection area between the first setting regions and the second setting regions, cut off the degree of depth to support to substrate surface or go deep in base material, thus the transparent conductive material layer at least making to be formed in the first setting regions and the second setting regions are cut off completely;
(2) in the second setting regions of substrate surface, insulation material layer is formed;
(3) at described insulation material layer circuit forming surface Wiring structure, and described circuit trace structure is electrically connected with the transparent conductive material layer in described first setting regions.
6. the preparation method of graphical circuit structure according to claim 5, is characterized in that, described second setting regions is around being arranged at around the first setting regions, and the inner edge portion of described insulation material layer engages with the outer edge of transparent conductive material layer.
7. a preparation method for graphical circuit structure, is characterized in that, comprising:
(1) at least in the visible area of substrate surface, patterned transparent conductive electrode is formed;
(2) intersection between the non-visible area of substrate surface except visible area and described visible area carries out etching operation, and etch depth supports to substrate surface or gos deep in base material, thus transparency conductive electrode and non-visible area are cut off completely;
(3) in described non-visible area, cover insulating material form insulation material layer;
(4) form on insulation material layer surface the circuit trace structure be connected with transparency conductive electrode edge electric.
8. the graphical circuit structure according to any one of claim 1-4 or the application of graphical circuit structure in photoelectric device and/or electronic equipment that according to any one of claim 5-7 prepared by method.
9. a touch control device, is characterized in that, it comprises the graphical circuit structure according to any one of claim 1-4 or graphical circuit structure that according to any one of claim 5-7 prepared by method.
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| CN201310023162.2A CN103092447B (en) | 2013-01-22 | 2013-01-22 | Graphical circuit structure, its preparation method and application |
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| CN105899042B (en) * | 2016-04-15 | 2019-07-05 | Oppo广东移动通信有限公司 | A kind of heat-conducting piece, its production method and the smart machine with the heat-conducting piece |
| CN108919999B (en) * | 2018-06-30 | 2021-04-30 | 云谷（固安）科技有限公司 | Touch panel, manufacturing method thereof and display device |
| CN111309192A (en) * | 2019-11-06 | 2020-06-19 | 江西蓝沛泰和新材料有限公司 | Touch screen, conductive film thereof and preparation method of conductive film |
| WO2023222059A1 (en) * | 2022-05-18 | 2023-11-23 | 利多(香港)有限公司 | Biosensor and manufacturing method therefor |
Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101950216A (en) * | 2010-09-26 | 2011-01-19 | 友达光电股份有限公司 | Making method of touch panel |
| CN202422065U (en) * | 2011-12-31 | 2012-09-05 | 宸鸿科技(厦门)有限公司 | Touch panel |
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| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101950216A (en) * | 2010-09-26 | 2011-01-19 | 友达光电股份有限公司 | Making method of touch panel |
| CN202422065U (en) * | 2011-12-31 | 2012-09-05 | 宸鸿科技(厦门)有限公司 | Touch panel |
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Address after: 215000, 07, 102, Jinji Road, northwest Suzhou, Jinji Road, Suzhou Industrial Park, Jiangsu Province Patentee after: Hanano Material Science and Technology Co., Ltd.Suzhou Address before: Suzhou City, Jiangsu Province, Suzhou Industrial Park 215000 Xinghu Street No. 218 BioBAY A4-508 Patentee before: Hanano Material Science and Technology Co., Ltd.Suzhou |