CN103092404B - Transparent touch-control panel - Google Patents
Transparent touch-control panel Download PDFInfo
- Publication number
- CN103092404B CN103092404B CN201210434961.4A CN201210434961A CN103092404B CN 103092404 B CN103092404 B CN 103092404B CN 201210434961 A CN201210434961 A CN 201210434961A CN 103092404 B CN103092404 B CN 103092404B
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- Prior art keywords
- glass substrate
- clear sensor
- sensor electrode
- input operation
- lead
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- Expired - Fee Related
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Classifications
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- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F3/00—Input arrangements for transferring data to be processed into a form capable of being handled by the computer; Output arrangements for transferring data from processing unit to output unit, e.g. interface arrangements
- G06F3/01—Input arrangements or combined input and output arrangements for interaction between user and computer
- G06F3/03—Arrangements for converting the position or the displacement of a member into a coded form
- G06F3/041—Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means
- G06F3/044—Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means by capacitive means
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- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F2203/00—Indexing scheme relating to G06F3/00 - G06F3/048
- G06F2203/041—Indexing scheme relating to G06F3/041 - G06F3/045
- G06F2203/04103—Manufacturing, i.e. details related to manufacturing processes specially suited for touch sensitive devices
Abstract
Even if the present invention provides a kind of distribution region distribution to high-density at chemically reinforced glass substrate many lead-out wires, the transparent touch-control panel that the intensity of chemically reinforced glass substrate is deteriorated also will not be made.The distribution region having the described plane of the glass substrate of multiple lead-out wire at distribution is formed with the insulating barrier being made up of synthetic resin, and use photo-engraving process is on the insulating layer with the conductive membrane engraved pattern of forming sputtering film, to form multiple lead-out wire.
Description
Technical field
The present invention relates to the transparent touch-control panel of a kind of lead-out wire being configured with in the plane by chemical enhanced glass substrate and clear sensor electrode being led to outside, and then in detail, relate to a kind of thin film engraved pattern to being formed by sputter and form the transparent touch-control panel of lead-out wire.
Background technology
The display of display device is carried out the contact panel of input operation as index in input operation region, forms clear sensor electrode, so that the display to the display device being configured at device interior of the input operation regional observation can be passed, simultaneously as being formed with the insulated substrate of clear sensor electrode in input operation region, use glass substrate.Additionally, the input operation region of this glass substrate is exposed along the surface of equipment, there is the possibility of breakage by external force, so its surface and the back side being carried out ion exchange become stress reinforced chemically reinforced glass substrate.
Fig. 7, Fig. 8 represent the conventional transparent touch-control panel 100 of the optics electrostatic capacitance mode being recorded in patent documentation 1, in being set in the input operation region 102a on surface of chemically reinforced glass substrate 101, multiple X side clear sensor electrode 103x along the X direction are formed as intersecting with multiple Y side clear sensor electrode 103y along the Y direction.
Each clear sensor electrode 103x, 103y are formed as lozenge continuous print banding with transparent conductive material, at the two position intersected, across insulating coating 104 cross X side clear sensor electrode 103x connect electrode 105 by the lozenge of the Y side clear sensor electrode 103y interrupted at cross part between electrical connection, thereby, each clear sensor electrode 103x, 103y insulated from each other and distribution the most across in the 102a of input operation region.
The side of each clear sensor electrode 103x, 103y or both sides are connected to the lead-out wire 106 in distribution distribution region 102b around the 102a of input operation region, it is drawn to be located at the external connecting 107 of a part of distribution region 102b, and electrically connects with the testing circuit detecting input operation position via external connecting 107.
As shown in Figure 7, the transparent top coat 108 that the whole surface of the face side being formed with the chemically reinforced glass substrate 101 of clear sensor electrode 103x, 103y, lead-out wire 106 etc. is formed with transparent insulation material covers, additionally, the rear side printing being formed with distribution region 102b is formed with insulation light shield layer 109.Lead-out wire 106 is formed with transparent conductive material, so would not observe that, but insulation light shield layer 109 is formed on the lead-out wire 106 of the face side carrying out input operation, and the transparent touch-control panel covering lead-out wire 106 is also recited as other embodiment of aforementioned patent literature 1.
The input operation bodies such as finger are close to clear sensor electrode 103x, 103y, the electric capacity that swims can increase, so from testing circuit toward the position detection signal of each clear sensor electrode 103x, 103y output rectangular pulse shape, from the allocation position of each clear sensor electrode 103x, 103y of the position detection signal of output waveform distortion because the electric capacity that swims increases, detect the input operation position toward input operation region 102a.
Prior art literature
Patent documentation
Patent documentation 1 Japanese Unexamined Patent Publication 2011-192124 publication
The surface layer of glass substrate and the sodium ion of back layer are replaced by the potassium ion that ionic radius is big by the chemically reinforced glass substrate 101 being used in transparent touch-control panel 100, thus thereby will not can produce compressive stress layers in surface layer and back layer because of damaged from outside impact as mentioned above.Owing to the hot strength of glass is much smaller than compressive strength, so chemically reinforced glass produces compressive stress layers in advance on its top layer, thereby, can reach not carry out the intensity of about 5 times of chemical enhanced glass substrate for external force.
On the other hand, in order to input operation position can be detected with high de-agglomeration, must at input operation region 102a configuration many clear sensor electrode 103x, 103y, and be necessary to carry out distribution to high-density in being connected to many lead-out wires of each clear sensor electrode 103x, 103y limited distribution region 102b around the 102a of input operation region.Therefore, distribution according to conventional mode of printing has it to limit to, on the surface of chemically reinforced glass substrate 101, the conductive material forming lead-out wire 106 is carried out film forming, and the pattern quarterization of the part do not wanted by use photo-engraving process removing with sputtering way, form each lead-out wire 106.
During according to sputtering method toward chemically reinforced glass 101 film forming, the film on the surface that cluster (cluster) of the conductive material of lead-out wire 106 is squeezed into glass substrate 101 at high speed, unnecessary atom it is pressed in the lattice of film, even if considering the difference of glass substrate and the thermal coefficient of expansion of conductive material, the internal stress in the direction making film expand along surface can also be produced, by film forming to the surface action of chemically reinforced glass substrate 101 with tensile stress.Its result is, the compression stress on the top layer of chemically reinforced glass substrate 101 is occurred conductive material film forming to be cancelled in the sputter operation on its surface, even if sufficient effect also cannot be obtained by chemical enhanced, the problem having the structure becoming breakage easy for external force.
Summary of the invention
The invention that the present invention allows for such conventional problem points and reaches, even if purpose is that provide a kind of uses the many lead-out wires of sputtering method and photo-engraving process distribution to high-density, the transparent touch-control panel that the intensity of chemically reinforced glass substrate also will not be deteriorated in the distribution region of chemically reinforced glass substrate.
In order to reach object defined above, the feature of the transparent touch-control panel of technical scheme 1 is, including: planar side is by chemical enhanced glass substrate；The multiple clear sensor electrodes formed at the input operation region mutually insulated of aforesaid plane of glass substrate；Distribution is around the input operation region of the aforesaid plane of glass substrate, with multiple lead-out wires that multiple each clear sensor electrodes connecting portion the most towards the outside is drawn, according to the electric signal exported from each clear sensor electrode by external connecting, detect the input operation towards input operation region, the distribution region having the aforesaid plane of the glass substrate of multiple lead-out wire at distribution is formed with the insulating barrier being made up of synthetic resin, use photo-engraving process on the insulating layer with the conductive membrane engraved pattern of forming sputtering film, thus form aforesaid plurality of lead-out wire.
Insulating barrier can be formed at distribution region by the method beyond sputtering method, multiple lead-out wires are formed by the conductive membrane of forming sputtering film on the insulating layer, so, the tensile stress carrying out resulting from during sputter conductive membrane acts on the surface of insulating barrier, will not be communicated to the surface of chemically reinforced glass substrate in distribution region.
Shell etc. is fixed in the surrounding of glass substrate, during so the input operation region near central authorities affords external force, can produce big bending stress in the distribution region near fixing end.But, the tensile stress that the plane of the glass substrate in distribution region will not be caused by sputter, maintain by chemical enhanced state, even if so by external force, glass substrate is also not easy breakage.
The feature of the transparent touch-control panel of technical scheme 2 is, to cover the insulation light shield layer formation insulating barrier of the surrounding in input operation region.
Insulation light shield layer owing to the part beyond input operation region being covered is insulating barrier, so need not add the operation forming insulating barrier.
The feature of the transparent touch-control panel of technical scheme 3 is, multiple clear sensor electrodes are made up of with multiple Y sides clear sensor electrode multiple X sides clear sensor electrode mutually orthogonal in input operation region, and each cross part at X side clear sensor electrode Yu Y side clear sensor electrode makes X side clear sensor electrode and the insulating coating of Y side clear sensor electricity electrode insulation and the insulating barrier in distribution region be to be formed in the same printing process using dielectric ink.
Make X side clear sensor electrode can concurrently form insulating barrier with the printing process of the insulating coating of Y side clear sensor electricity electrode insulation at cross part.
The feature of the transparent touch-control panel of technical scheme 4 is, clear sensor electrode is formed by Indium sesquioxide., and lead-out wire is formed by the conductive material containing molybdenum.
Even if form the molybdenum film of hard metal with sputtering method, tensile stress also will not act on the surface of glass substrate.
According to the invention of technical scheme 1, even if using sputtering method distribution to high-density to go out the lead-out wire in wired distribution region in the plane of glass substrate, the intensity of chemically reinforced glass substrate also will not be deteriorated.
According to the invention of technical scheme 2, owing to insulation light shield layer is insulating barrier, it is possible to form the insulating barrier being located between lead-out wire and glass substrate in the formation process of insulation light shield layer.
According to the invention of technical scheme 3, X side clear sensor electrode can be made with the printing process of the insulating coating of Y side clear sensor electricity electrode insulation, form the insulating barrier being located between lead-out wire and glass substrate.
According to the invention of technical scheme 4, even if the conductive material of the molybdenum to comprise hard metal forms lead-out wire, the intensity of glass substrate also will not be deteriorated.Lead-out wire can be formed with the conductive material comprising molybdenum of the electrical contact characteristic that the Indium sesquioxide. constituting clear sensor electrode is had excellence.
Accompanying drawing explanation
Fig. 1 (a) is the top view of the transparent touch-control panel 1 of an embodiment of the present invention, and Fig. 1 (b) is the sectional view of the line A-A along Fig. 1 (a).
Fig. 2 represents the first operation forming insulation light shield layer 8.Fig. 2 (a) is top view, and Fig. 2 (b) is at the sectional view cut off along the position of line A-A.
Fig. 3 represents the second operation forming connection electrode 6 at input operation region 2a.Fig. 3 (a) is top view, and Fig. 3 (b) is at the sectional view cut off along the position of line A-A.
Fig. 4 represents the 3rd operation covering connection electrode 6 and insulation light shield layer 8 with insulating coating 7.Fig. 4 (a) is top view, and Fig. 4 (b) is at the sectional view cut off along the position of line A-A.
Fig. 5 represents the 4th operation at distribution region 2b configuration lead-out wire 5.Fig. 5 (a) is top view, and Fig. 5 (b) is at the sectional view cut off along the position of line A-A in the figure of Fig. 1 (a).
Fig. 6 is the sectional view in the position cut-out along line A-A representing the 5th operation at input operation region 2a formation clear sensor electrode 3,4.
Fig. 7 is the top view of conventional transparent touch-control panel 100.
Fig. 8 is the sectional side elevation of transparent touch-control panel 100.
(symbol description)
1: transparent touch-control panel
2: glass substrate
2a: input operation region
2b: distribution region
3:X side clear sensor electrode (clear sensor electrode)
4:Y side clear sensor electrode (clear sensor electrode)
5: lead-out wire
7: insulating coating (insulating barrier)
8: insulation light shield layer (insulating barrier)
9: external connecting
Detailed description of the invention
Hereinafter, use Fig. 1 to Fig. 6 that the transparent touch-control panel 1 of the first embodiment of the present invention is described.This transparent touch-control panel 1 is as the input equipment of the electronic equipments such as mobile phone, the inner side above towards electronic equipment of Fig. 1 (b) is installed on shell, make the lower side in figure near the outside of shell to carry out input operation, hereinafter, the upper surface using the glass substrate shown in this figure illustrates as plane.
In order to it be carried out input operation while being visually configured at the display device inside equipment, transparent touch-control panel 1 uses the transparent glass substrate 2 as the insulated substrate forming sensor electrode.Glass substrate 2 is along the surface configuration of shell, even if for making it also will not be damaged by external force, glass substrate 2 impregnated in the potassium nitrate solution of about 380 DEG C, and the sodium ion (Na+) substituting its table backing layer with potassium ion (K+) carries out chemical enhanced.The ratio of ionic radii sodium ion (Na+) of potassium ion (K+) is bigger, so the table backing layer of the glass substrate 2 after chemical enhanced produces compression stress.It is said that in general, the hot strength of glass substrate 2 is significantly less than compressive strength, produce at the table back side tensile stress can breakage, so producing compression stress in advance on its table backing layer, can make its intensity reach chemical enhanced before about 5 times of intensity.
As it is shown in figure 1, the plane of glass substrate 2 is divided into: many X sides clear sensor electrode 3,3 ... with Y side clear sensor electrode 4,4 ... be formed as rectangular input operation region 2a along orthogonal XY direction；And be configured with many lead-out wires 5,5 around the 2a of input operation region ... distribution region 2b.
It is formed between the X-pattern body of the rhombus that multiple each X side clear sensor electrode 3 of input operation region 2a is spaced in the intersection region intersected with Y side clear sensor electrode 4 and electrically connects with the connection electrode 6 of faciola shape, the most wired for banding.In addition, it is formed at the Y pattern body of the rhombus almost identical with X-pattern body of multiple each Y side clear sensor electrode 4 of input operation region 2a, in the intersection region intersected with X side clear sensor electrode 3 by the connecting pattern of narrower width distribution continuously along the X direction.The connecting pattern of Y side clear sensor electrode 4 strides across connection electrode 6 across being formed at the insulating coating 7 connected on electrode 6, thereby mutually insulated and distribution between X side clear sensor the electrode 3 and Y side clear sensor electrode 4 that each intersection region intersects.
X side clear sensor electrode 3 and Y side clear sensor electrode 4 can be formed with the arbitrary transparent conductive material can being formed at after being formed by thin film and patterned on glass substrate 2, but at this, formed with indium tin oxide (ITO, IndiumTinOxide) as connecting electrode 6.Additionally, insulating coating 7 uses silicon dioxide (SiO2) etc. insulant.
In distribution region 2b around the 2a of input operation region, the insulation light shield layer 8 being made up of the insulating resin of light-proofness is printed and is formed at region entirety.Insulation light shield layer 8, by covering around the 2a of input operation region, can highlight input operation region 2a, make the offscreen part of the display inside it become the most eye-catching simultaneously, as long as so there being light-proofness, can arbitrarily colour, using black herein operator.Additionally, in the present invention, as the substrate of the lead-out wire 5 being formed at distribution region 2b through sputter operation, as described later, the effect of the strength deterioration of the distribution region 2b preventing glass substrate 2 can be played.
In the present embodiment, insulation light shield layer 8 is formed with the material containing carbon or chromium etc. in the insulating resin of photo-hardening, during so configuring multiple lead-out wire 5 on insulation light shield layer 8, sufficient insulating properties cannot be obtained between lead-out wire 5, with the operation as forming insulating coating 7 in the printing of aforementioned intersection region, the insulation light shield layer 8 of distribution region 2b also forms insulating coating 7.
The distribution multiple lead-out wires 5 on the insulating coating 7 of distribution region 2a are connected to the both sides of each X side clear sensor electrode 3 and each Y side clear sensor electrode 4, mutually insulated and be drawn out to the external connecting 9 of distribution region 2a.
All of lead-out wire 5 arranges distribution in external connecting 9, be connected to the corresponding electrode of flexible wiring substrate by anisotropy electrically conducting adhesive etc., each X side clear sensor electrode 3 is connected with the not shown testing circuit of the input operation detected input operation region 2a by external connecting 9 with the both sides of each Y side clear sensor electrode 4.
Therefore, the total number of lead-out wire 5 is formed at 2 times of the sensor electrode 3,4 of input operation region 2a, it is necessary to make all of lead-out wire 5 mutually insulated and distribution in limited distribution region 2a, so by sputter on insulating coating 7 after film forming, carve pattern with photo-engraving process and distribution to high-density.
Lead-out wire 5 uses the ITO constituting the clear sensor electrode 3,4 connected, in addition, because physically, chemically, electric aspect contact performance is the most excellent and resistivity is low, and uses the composite of three-layer structure being laminated with MAM (molybdenum, aluminum, molybdenum).Therefore, in the operation of the film forming by sputter, it is divided into molybdenum aluminum molybdenum these three layers to form thin film, but in this sputter operation, owing to clustering, (cluster) (sputter material) is squeezed at a high speed overlay film, unnecessary atom it is pressed into, so that overlay film expands along substrate surface in the lattice of film.As a result of which it is, base material is stretched stress by the overlay film formed along surface.
Particularly being formed directly into substrate surface molybdenum is hard metal, so in the film formation process of the molybdenum carried out by sputter, can produce big tensile stress at substrate surface.Herein, as in the past, the plane of glass substrate 2 is directly formed in the case of lead-out wire 5, chemical enhanced and produce the plane of the glass substrate 2 of compression stress and be stretched stress and cancel out each other, become the most damaged substrate.On the other hand, in present embodiment, in the plane of glass substrate 2, form the thin film of MAM across the insulation light shield layer 8 formed by insulating synthetic resin and insulating coating 7, even if so in sputter operation the plane of glass substrate 2 also will not be stretched stress, maintain chemical enhanced intensity.
(for this part, if the internal stress directly forming the plane along glass substrate in the case of the lead-out wire 5 being made up of MAM on glass substrate 2 can be obtained with on insulating coating 7, form the lead-out wire 5 being made up of MAM in the case of stress measured value if, then can compare with experiment value and represent).
As it is shown in figure 1, be formed with clear sensor electrode 3,4, the overall top coat 10 being made up of transparent insulating resin covers with the planar side of the glass substrate 2 of lead-out wire 5, makes clear sensor electrode 3,4 and lead-out wire 5 be protected.
At input operation bodies such as fingers by the lower section of Fig. 1 (b) close to if the input operation region 2a of transparent touch-control panel 1 configured as described above, across glass substrate 2, the electrostatic capacitance of close clear sensor electrode 3,4 increases input operation body, so the X side clear sensor electrode 3 and Y side clear sensor electrode 4 that electrostatic capacitance changes can be detected respectively, the equipping position on the input operation region 2a of this detecting electrode 3,4 on XY direction, detect input operation position.
Hereinafter, the manufacturing process of aforementioned transparent contact panel 1 is described.First, as shown in Fig. 2 (a), the distribution region 2b overall printing in the plane of chemical enhanced glass substrate 2 forms insulation light shield layer 8.The formation of this insulation light shield layer 8 does not use the film formation process carried out with sputter, so the intensity of distribution region 2b will not deteriorate.
Then, to comprise insulation light shield layer 8 glass substrate 2 plane on the whole, by sputter formed ITO thin film.In this sputter operation, the input operation region 2a of the plane of glass substrate 2 directly forms the thin film of ITO, but due to ITO compared with the molybdenum constituting MAM the most soft, so will not be by big tensile stress in its film forming procedure.
In addition, the surrounding of glass substrate 2 is fixedly installed in shell, when the input operation region 2a near outside is by unexpected external force, big bending moment can be produced, so not having the big tensile stress effect making glass substrate 2 level of breakage in the plane of input operation region 2a from the distribution region 2b close to fixing end.Therefore, even if at input operation region 2a with forming sputtering film, the intensity of glass substrate 2 entirety also will not be undermined.
Photo-engraving process is used film forming to be removed in the ito thin film etching that the plane of glass substrate 2 is overall and only retain the position of the connection electrode 6 becoming each intersection region, as shown in Fig. 3 (a), Fig. 3 (b), it is formed along a y-direction elongated connection electrode 6 in each intersection region of input operation region 2a.
Then, as shown in Fig. 4 (a), Fig. 4 (b), in the 2a of input operation region, in the way of intersection on each connection electrode 6, in the 2b of distribution region, in the way of covering insulation light shield layer 8 entirety, formed by SiO by printing2The insulating coating 7 constituted.
Hereafter, be respectively adopted molybdenum, aluminum, molybdenum are repeated sputter as sputter material, the glass substrate 2 shown in Fig. 4 (a), Fig. 4 (b) plane on the whole, form the thin film of the three-decker being made up of MAM, as shown in Fig. 5 (a), Fig. 5 (b), use photo-engraving process, remain the pattern of the lead-out wire 5 to external connecting 9 of the position by X side clear sensor electrode 3 and each both sides of Y side clear sensor electrode 4, and remove remaining.In the sputter operation of the thin film of distribution region 2b formation MAM, owing to across insulation light shield layer 8 and insulating coating 7, film forming is in the plane of glass substrate 2, so the plane of glass substrate 2 will not be produced the effect of tensile stress.Although additionally, input operation region 2a can temporarily be stretched stress in same sputter operation, but owing to the MAM thin film on the 2a of input operation region is all removed, so the most not having tensile stress effect.
Then, again the plane of glass substrate 2 is formed ito thin film entirely through sputter, as shown in Figure 6, use photo-engraving process, remain X side clear sensor electrode 3, Y side clear sensor electrode 4 and the position of lead-out wire 5 and remove ito thin film.By using the pattern quarterization of this photo-engraving process, being electrically connected by connection electrode 6 between the X-pattern body of the rhombus being formed at input operation region 2a, distribution goes out the X side clear sensor electrode 3 of banding along the Y direction.In addition, the thinner connecting pattern of Y side clear sensor electrode 4 is formed at and strides across connection electrode 6 and be formed on the insulating coating 7 of intersection region, mutually insulated between X side clear sensor the electrode 3 and Y side clear sensor electrode 4 that each intersection region intersects and distribution.Form each X side clear sensor electrode 3 ito thin film with each Y side clear sensor electrode 4 owing to remaining on lead-out wire 5 in its both sides, thus electrically connect with lead-out wire 5.
In foregoing sequence, by sputter by ITO direct formation of film at surface in the input operation region 2a of glass substrate 2, so though stress can be stretched, the reason as forming the operation of film with sputter for forming connection electrode 6, glass substrate 2 entirety intensity to external force will not be undermined.
Then, after external connecting 9 connects flexible wiring substrate, use roller spreader overall with the plane of top coat 10 cover glass substrate 2, thus produce transparent touch-control panel 1.
In the foregoing embodiment, illustrate from be formed X side clear sensor electrode 3, Y side clear sensor electrode 4, lead-out wire 5 plane across the opposition side of glass substrate 2 to carry out the transparent touch-control panel 1 of input operation, but also may be used to carry out input operation by the top forming top coat.
In addition, as long as form the transparent touch-control panel of lead-out wire 5 in the distribution region 2b of glass substrate 2 across insulating barrier if, the shape of sensor electrode 3,4, its formation process can be any, in addition, it is not limited to electrostatic capacitance mode, it is also possible to be by making the resistance mode of the resistance value of sensor electrode per unit length uniform resistance overlay film detect the transparent touch-control panel of input operation.
If not additionally, the insulating barrier being formed between plane and the lead-out wire 5 of the glass substrate 2 of distribution region 2b is with sputtering method film forming, being then not limited to aforesaid insulating coating 7, insulation light shield layer 8, also can being the insulating barrier formed by other operation.
The present invention is applicable to be configured with to high-density the transparent touch-control panel of lead-out wire around the input operation region of glass substrate.
Claims (3)
1. a transparent touch-control panel, it is characterised in that including:
Planar side is by chemical enhanced glass substrate；
The multiple clear sensor electrodes formed at the input operation region mutually insulated of described plane of glass substrate；And
Distribution around the input operation region of the described plane of glass substrate with by multiple each clear sensor electrodes multiple lead-out wires that respectively connecting portion is drawn the most towards the outside,
Electric signal according to being exported from each clear sensor electrode by external connecting detects the input operation towards input operation region,
The distribution region having the described plane of the glass substrate of multiple lead-out wire at distribution is formed with dielectric layers, and the layer insulating in dielectric layers is the insulation light shield layer being made up of synthetic resin and the surrounding in input operation region being covered,
Use photo-engraving process in described dielectric layers with the conductive membrane engraved pattern of forming sputtering film, to form the plurality of lead-out wire,
The formation of insulation light shield layer does not use the film formation process carried out with sputter, and wherein, insulation light shield layer is formed directly on glass substrate.
2. transparent touch-control panel as claimed in claim 1, it is characterised in that
Multiple clear sensor electrodes are made up of with multiple Y sides clear sensor electrode multiple X sides clear sensor electrode mutually orthogonal in input operation region,
Each cross part at X side clear sensor electrode Yu Y side clear sensor electrode makes X side clear sensor electrode and the insulating coating of Y side clear sensor electricity electrode insulation and the insulating barrier in distribution region be to be formed in the same printing process using dielectric ink.
3. transparent touch-control panel as claimed in claim 1 or 2, it is characterised in that
Clear sensor electrode is formed by ITO, and lead-out wire is formed by the conductive material containing molybdenum.
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2011-242810 | 2011-11-04 | ||
| JP2011242810A JP5133449B1 (en) | 2011-11-04 | 2011-11-04 | Transparent touch panel |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN103092404A CN103092404A (en) | 2013-05-08 |
| CN103092404B true CN103092404B (en) | 2016-08-03 |
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| Application Number | Title | Priority Date | Filing Date |
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| CN201210434961.4A Expired - Fee Related CN103092404B (en) | 2011-11-04 | 2012-11-02 | Transparent touch-control panel |
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| Country | Link |
|---|---|
| JP (1) | JP5133449B1 (en) |
| KR (1) | KR101488678B1 (en) |
| CN (1) | CN103092404B (en) |
| TW (1) | TWI490741B (en) |
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| JP2015164000A (en) * | 2012-06-18 | 2015-09-10 | シャープ株式会社 | Touch panel, display device with touch panel, and method of manufacturing touch panel |
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| JP6121204B2 (en) * | 2013-03-15 | 2017-04-26 | 富士フイルム株式会社 | Touch panel laminate and method for manufacturing touch panel laminate |
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| CN101299102A (en) * | 2008-06-18 | 2008-11-05 | 汕头超声显示器（二厂）有限公司 | Capacitance type touch control panel and manufacturing method thereof |
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| JP2010177345A (en) * | 2009-01-28 | 2010-08-12 | Sony Corp | Circuit board and method of manufacturing the same, touch panel, and display device |
| CN201945987U (en) * | 2011-01-19 | 2011-08-24 | 漳州市百昱工贸有限公司 | Approach induction touch-screen |
| JP2011192124A (en) * | 2010-03-16 | 2011-09-29 | Sony Corp | Touch panel and method for manufacturing the same |
Family Cites Families (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TWI616707B (en) * | 2008-11-28 | 2018-03-01 | 半導體能源研究所股份有限公司 | Liquid crystal display device |
-
2011
- 2011-11-04 JP JP2011242810A patent/JP5133449B1/en not_active Expired - Fee Related
-
2012
- 2012-02-02 KR KR20120010614A patent/KR101488678B1/en active IP Right Grant
- 2012-09-21 TW TW101134725A patent/TWI490741B/en not_active IP Right Cessation
- 2012-11-02 CN CN201210434961.4A patent/CN103092404B/en not_active Expired - Fee Related
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN201174007Y (en) * | 2008-03-18 | 2008-12-31 | 宸鸿光电科技股份有限公司 | Capacitive touching control panel |
| CN101299102A (en) * | 2008-06-18 | 2008-11-05 | 汕头超声显示器（二厂）有限公司 | Capacitance type touch control panel and manufacturing method thereof |
| JP2010177345A (en) * | 2009-01-28 | 2010-08-12 | Sony Corp | Circuit board and method of manufacturing the same, touch panel, and display device |
| JP2011192124A (en) * | 2010-03-16 | 2011-09-29 | Sony Corp | Touch panel and method for manufacturing the same |
| CN201945987U (en) * | 2011-01-19 | 2011-08-24 | 漳州市百昱工贸有限公司 | Approach induction touch-screen |
Also Published As
| Publication number | Publication date |
|---|---|
| TWI490741B (en) | 2015-07-01 |
| TW201319890A (en) | 2013-05-16 |
| JP2013097739A (en) | 2013-05-20 |
| JP5133449B1 (en) | 2013-01-30 |
| KR101488678B1 (en) | 2015-02-02 |
| CN103092404A (en) | 2013-05-08 |
| KR20130049692A (en) | 2013-05-14 |
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