CN103087503B - Electronic pouring sealant and preparation method thereof - Google Patents
Electronic pouring sealant and preparation method thereof Download PDFInfo
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- CN103087503B CN103087503B CN201310012160.3A CN201310012160A CN103087503B CN 103087503 B CN103087503 B CN 103087503B CN 201310012160 A CN201310012160 A CN 201310012160A CN 103087503 B CN103087503 B CN 103087503B
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- glue
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- pouring sealant
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- 239000000565 sealant Substances 0.000 title claims abstract description 31
- 238000002360 preparation method Methods 0.000 title claims abstract description 30
- 239000002994 raw material Substances 0.000 claims abstract description 7
- 239000003292 glue Substances 0.000 claims description 76
- 150000002148 esters Chemical class 0.000 claims description 9
- LFQSCWFLJHTTHZ-UHFFFAOYSA-N Ethanol Chemical compound CCO LFQSCWFLJHTTHZ-UHFFFAOYSA-N 0.000 claims description 8
- 239000004902 Softening Agent Substances 0.000 claims description 8
- 238000006243 chemical reaction Methods 0.000 claims description 7
- 239000003795 chemical substances by application Substances 0.000 claims description 3
- 239000002699 waste material Substances 0.000 abstract description 3
- 229910019142 PO4 Inorganic materials 0.000 abstract 2
- NBIIXXVUZAFLBC-UHFFFAOYSA-K phosphate Chemical compound [O-]P([O-])([O-])=O NBIIXXVUZAFLBC-UHFFFAOYSA-K 0.000 abstract 2
- 239000010452 phosphate Substances 0.000 abstract 2
- 239000004014 plasticizer Substances 0.000 abstract 2
- 150000005846 sugar alcohols Polymers 0.000 abstract 2
- 239000012948 isocyanate Substances 0.000 abstract 1
- 150000002513 isocyanates Chemical class 0.000 abstract 1
- 238000007599 discharging Methods 0.000 description 10
- MQIUGAXCHLFZKX-UHFFFAOYSA-N Di-n-octyl phthalate Natural products CCCCCCCCOC(=O)C1=CC=CC=C1C(=O)OCCCCCCCC MQIUGAXCHLFZKX-UHFFFAOYSA-N 0.000 description 8
- WYURNTSHIVDZCO-UHFFFAOYSA-N Tetrahydrofuran Chemical compound C1CCOC1 WYURNTSHIVDZCO-UHFFFAOYSA-N 0.000 description 8
- BJQHLKABXJIVAM-UHFFFAOYSA-N bis(2-ethylhexyl) phthalate Chemical compound CCCCC(CC)COC(=O)C1=CC=CC=C1C(=O)OCC(CC)CCCC BJQHLKABXJIVAM-UHFFFAOYSA-N 0.000 description 8
- YEVQZPWSVWZAOB-UHFFFAOYSA-N 2-(bromomethyl)-1-iodo-4-(trifluoromethyl)benzene Chemical compound FC(F)(F)C1=CC=C(I)C(CBr)=C1 YEVQZPWSVWZAOB-UHFFFAOYSA-N 0.000 description 5
- 229920001451 polypropylene glycol Polymers 0.000 description 4
- YLQBMQCUIZJEEH-UHFFFAOYSA-N tetrahydrofuran Natural products C=1C=COC=1 YLQBMQCUIZJEEH-UHFFFAOYSA-N 0.000 description 4
- UKLDJPRMSDWDSL-UHFFFAOYSA-L [dibutyl(dodecanoyloxy)stannyl] dodecanoate Chemical compound CCCCCCCCCCCC(=O)O[Sn](CCCC)(CCCC)OC(=O)CCCCCCCCCCC UKLDJPRMSDWDSL-UHFFFAOYSA-L 0.000 description 3
- ZEMPKEQAKRGZGQ-AAKVHIHISA-N 2,3-bis[[(z)-12-hydroxyoctadec-9-enoyl]oxy]propyl (z)-12-hydroxyoctadec-9-enoate Chemical compound CCCCCCC(O)C\C=C/CCCCCCCC(=O)OCC(OC(=O)CCCCCCC\C=C/CC(O)CCCCCC)COC(=O)CCCCCCC\C=C/CC(O)CCCCCC ZEMPKEQAKRGZGQ-AAKVHIHISA-N 0.000 description 2
- YSMRWXYRXBRSND-UHFFFAOYSA-N TOTP Chemical compound CC1=CC=CC=C1OP(=O)(OC=1C(=CC=CC=1)C)OC1=CC=CC=C1C YSMRWXYRXBRSND-UHFFFAOYSA-N 0.000 description 2
- 229920001577 copolymer Polymers 0.000 description 2
- DOIRQSBPFJWKBE-UHFFFAOYSA-N dibutyl phthalate Chemical compound CCCCOC(=O)C1=CC=CC=C1C(=O)OCCCC DOIRQSBPFJWKBE-UHFFFAOYSA-N 0.000 description 2
- 150000002009 diols Chemical class 0.000 description 2
- 150000002334 glycols Chemical class 0.000 description 2
- 229920000909 polytetrahydrofuran Polymers 0.000 description 2
- 238000010521 absorption reaction Methods 0.000 description 1
- IMUDHTPIFIBORV-UHFFFAOYSA-N aminoethylpiperazine Chemical compound NCCN1CCNCC1 IMUDHTPIFIBORV-UHFFFAOYSA-N 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 239000012153 distilled water Substances 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 239000003063 flame retardant Substances 0.000 description 1
- 238000009413 insulation Methods 0.000 description 1
- 238000007711 solidification Methods 0.000 description 1
- 230000008023 solidification Effects 0.000 description 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Chemical compound O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 1
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- Sealing Material Composition (AREA)
- Compositions Of Macromolecular Compounds (AREA)
- Adhesives Or Adhesive Processes (AREA)
Abstract
The invention relates to the field of electronic pouring sealants, and in particular relates to an electronic pouring sealant and a preparation method thereof. The electronic pouring sealant is characterized by comprising a sealant A and a sealant B which can be mixed with the sealant A, wherein the sealant A is prepared from the following raw materials in parts by weight: 200-300 parts of polyhydric alcohol, 600-1200 parts of a plasticizer, 500-800 parts of trimester phosphate and 1500-3000 parts of isocyanate; and the sealant B is prepared from the following raw materials in parts by weight: 1000-2000 parts of polyhydric alcohol, 600-1200 parts of a plasticizer, 500-800 parts of trimester phosphate and 800-1000 parts of chlorinated paraffin-52. The product is convenient to use, transparent and attractive after curing and easy to dismantle, so that a circuit board is not damaged and can be continuously used and the waste is avoided.
Description
(1) technical field
The present invention relates to electron pouring sealant field, particularly a kind of electron pouring sealant and preparation method thereof.
(2) background technology
Electron pouring sealant is mainly used in encapsulating for wiring board, to play waterproof and dampproof, dust-proof, insulation, anticreep, fire-retardant effect, but easily there is flavescence phenomenon after present electron pouring sealant for some time, affect attractive in appearance, and on wiring board, electron pouring sealant remove difficulty, if wiring board goes wrong, cannot repair, continue use, can only abandon, one piece of general 200-300 unit of wiring board, even higher, be very waste.
(3) summary of the invention
The invention provides a kind of transparent, be convenient to the electron pouring sealant and preparation method thereof removed.
The present invention is achieved through the following technical solutions:
A kind of electron pouring sealant, its special character is: comprise A glue and can be used in combination with it B glue,
Wherein A glue is made up of the raw material of following parts by weight:
Polyvalent alcohol 200-300 part
Softening agent 600-1200 part
Tricresyl phosphate fat 500-800 part
Isocyanic ester 1500-3000 part;
Wherein B glue is made up of the raw material of following parts by weight:
Polyvalent alcohol 1000-2000 part
Softening agent 600-1200 part
Tricresyl phosphate fat 500-800 part
Chlorinated paraffin-52 800-1000 part.
The preparation method of electron pouring sealant of the present invention, its special character is: comprise the following steps:
(1) A glue preparation: by polyvalent alcohol, softening agent, phosphotriester mixing, be heated to 110-130 DEG C, be cooled to 10-60 DEG C after dewatering, then add isocyanic ester, the obtained A glue of reaction;
(2) B glue preparation: by polyvalent alcohol, softening agent, phosphotriester mixing, be heated to 110-130 DEG C, add chlorinated paraffin-52 after dewatering, be then cooled to 90-110 DEG C, then dewater and obtain B glue;
(3) A glue, the mixing of B glue: A glue is mixed with B glue, then pours encapsulating mould into and solidify.
The preparation method of electron pouring sealant of the present invention, the weight ratio of A glue and B glue is that the weight ratio of 1:1-3, A glue and B glue is preferably 1:2 in step (3).
The preparation method of electron pouring sealant of the present invention, in step (2), after adding chlorinated paraffin-52, add the solidifying agent of the heavy 0.01%-0.1% of B glue, the addition of solidifying agent is according to customer requirement.
The technical parameter of this product is:
Voltage strength is 15.4kv/mm, and volume resistance is 8.9 × 10
11Ω ﹒ cm, specific inductivity is 3.5, and tangent of the dielectric loss angle is 1.1 × 10
-1, specific absorption (under room temperature, being placed in distilled water 48h) is 0.14%, and tensile strength is 0.62Mpa, and elongation rate of tensile failure is 110%.
Beneficial effect of the present invention is: this product is easy to use, transparent shape, attractive in appearance after solidification, and removes easily, can not damaged line plate, is convenient to wiring board and continues to use, avoid waste.
(4) embodiment
Embodiment 1:
The preparation method of the electron pouring sealant of the present embodiment is:
(1) A glue preparation: Viscotrol C 200kg, dioctyl phthalate (DOP) 1200kg, phosphotriester 650kg are placed in reactor, are heated to 130 DEG C, be cooled to 10 DEG C after vaccum dewatering, then add isocyanic ester 3000kg, reaction 2h discharging obtains A glue;
(2) B glue preparation: Viscotrol C 1500kg, dioctyl phthalate (DOP) 1200kg, phosphotriester 800kg are added in reactor, be heated to 120 DEG C, chlorinated paraffin-52 is added after vaccum dewatering, 900kg, add dibutyl tin laurate (adding by 0.01% of B glue gross weight), then be cooled to 100 DEG C, then vaccum dewatering 1.5h discharging obtains B glue;
(3) A glue, the mixing of B glue: A glue is mixed by weight 1:3 with B glue, then pours encapsulating mould into and solidify.
Embodiment 2
The preparation method of the electron pouring sealant of the present embodiment is:
(1) A glue preparation: polytetrahydrofuran diol 300kg dioctyl phthalate (DOP) 900kg, phosphotriester 500kg are placed in reactor, are heated to 110 DEG C, are cooled to 40 DEG C after vaccum dewatering, then add isocyanic ester 2250kg, reaction 1h discharging obtains A glue;
(2) B glue preparation: polytetrahydrofuran diol 1000kg, dioctyl phthalate (DOP) 800kg, phosphotriester 600kg are added in reactor, be heated to 130 DEG C, chlorinated paraffin-52 is added after vaccum dewatering, 800kg, add dibutyl tin laurate (by 0.1% interpolation that B glue is heavy), then be cooled to 90 DEG C, then after vaccum dewatering 1h, discharging obtains B glue;
(3) A glue, the mixing of B glue: A glue is mixed by weight 1:2 with B glue, then pours encapsulating mould into and solidify.
Embodiment 3
The preparation method of the electron pouring sealant of the present embodiment is:
(1) A glue preparation: tetrahydrofuran (THF)-propylene oxide copolymer glycols 250kg, trioctyl phosphate 600kg, phosphotriester 800kg are placed in reactor, be heated to 120 DEG C, be cooled to 60 DEG C after vaccum dewatering, then add isocyanic ester 1500kg, reaction 1h discharging obtains A glue;
(2) B glue preparation: tetrahydrofuran (THF)-propylene oxide copolymer glycols 2000kg, dibutyl phthalate 600kg, phosphotriester 500kg are added in reactor, be heated to 110 DEG C, chlorinated paraffin-52 is added after vaccum dewatering, 1000kg, add dibutyl tin laurate (by 0.05% interpolation that B glue is heavy), then be cooled to 100 DEG C, then after vaccum dewatering 2h, discharging obtains B glue;
(3) A glue, the mixing of B glue: A glue is mixed by weight 1:2 with B glue, then pours encapsulating mould into and solidify.
Embodiment 4
The preparation method of the electron pouring sealant of the present embodiment is:
(1) A glue preparation: polypropylene glycol 250kg, trioctyl phosphate 600kg, phosphotriester 800kg are placed in reactor, are heated to 120 DEG C, be cooled to 40 DEG C after vaccum dewatering, then add isocyanic ester 2250kg, reaction 1h discharging obtains A glue;
(2) B glue preparation: polypropylene glycol 2000kg, trioctyl phosphate 600kg, phosphotriester 500kg are added in reactor, be heated to 120 DEG C, chlorinated paraffin-52 is added after vaccum dewatering, 1000kg, add aminoethyl piperazine AE(to add by the 0.01%-0.1% of B glue gross weight), then be cooled to 110 DEG C, then after vaccum dewatering 2h, discharging obtains B glue;
(3) A glue, the mixing of B glue: A glue is mixed by weight 1:1 with B glue, then pours encapsulating mould into and solidify.
Embodiment 5
The preparation method of the electron pouring sealant of the present embodiment is:
(1) A glue preparation: polypropylene glycol 250kg, trioctyl phosphate 900kg, phosphotriester 800kg are placed in reactor, are heated to 120 DEG C, be cooled to 40 DEG C after vaccum dewatering, then add isocyanic ester 2250kg, reaction 1h discharging obtains A glue;
(2) B glue preparation: polypropylene glycol 2000kg, trioctyl phosphate 1000kg, phosphotriester 500kg are added in reactor, be heated to 120 DEG C, after vaccum dewatering, add chlorinated paraffin-52,1000kg, then be cooled to 110 DEG C, then after vaccum dewatering 2h, discharging obtains B glue;
(3) A glue, the mixing of B glue: A glue is mixed by weight 1:2 with B glue, then pours encapsulating mould into and solidify.
Above-described embodiment desired raw material all can commercially buy.
Claims (3)
1. an electron pouring sealant, is characterized in that: comprise A glue and can be used in combination with it B glue,
Wherein A glue is made up of the raw material of following parts by weight:
Polyvalent alcohol 200-300 part
Softening agent 600-1200 part
Phosphotriester 500-800 part
Isocyanic ester 1500-3000 part;
Wherein B glue is made up of the raw material of following parts by weight:
Polyvalent alcohol 1000-2000 part
Softening agent 600-1200 part
Phosphotriester 500-800 part
Chlorinated paraffin-52 800-1000 part,
The preparation method of described electron pouring sealant, is characterized in that: comprise the following steps:
(1) A glue preparation: by polyvalent alcohol, softening agent, phosphotriester mixing, be heated to 110-130 DEG C, be cooled to 10-60 DEG C after dewatering, then add isocyanic ester, the obtained A glue of reaction;
(2) B glue preparation: by polyvalent alcohol, softening agent, phosphotriester mixing, be heated to 110-130 DEG C, add chlorinated paraffin-52 after dewatering, be then cooled to 90-110 DEG C, then dewater and obtain B glue;
(3) A glue, the mixing of B glue: A glue is mixed with B glue, then pours encapsulating mould into and solidify.
2. electron pouring sealant according to claim 1, is characterized in that: in the step (3) of the preparation method of described electron pouring sealant, the weight ratio of A glue and B glue is 1:1-3.
3. electron pouring sealant according to claim 2, is characterized in that: in the step (2) of the preparation method of described electron pouring sealant, adds the solidifying agent of the heavy 0.01%-0.1% of B glue after adding chlorinated paraffin-52.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201310012160.3A CN103087503B (en) | 2013-01-14 | 2013-01-14 | Electronic pouring sealant and preparation method thereof |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201310012160.3A CN103087503B (en) | 2013-01-14 | 2013-01-14 | Electronic pouring sealant and preparation method thereof |
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| CN103087503A CN103087503A (en) | 2013-05-08 |
| CN103087503B true CN103087503B (en) | 2015-04-01 |
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| Publication number | Priority date | Publication date | Assignee | Title |
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| CN105001828A (en) * | 2015-06-27 | 2015-10-28 | 山东晨旭新材料股份有限公司 | Mildew-resistant flame-retardant potting adhesive and preparation method thereof |
| CN107189749A (en) * | 2017-06-23 | 2017-09-22 | 华娜 | A kind of electron pouring sealant and preparation method thereof |
| CN109536118A (en) * | 2018-11-24 | 2019-03-29 | 红旗集团电力金具有限公司 | A kind of cable connector casting glue and preparation method thereof |
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| CN101838513B (en) * | 2010-01-27 | 2013-07-31 | 北京高盟新材料股份有限公司 | Preparation method of bi-component siloxane modified polyurethane sealant |
| CN102102006B (en) * | 2010-12-20 | 2013-12-11 | 东莞市宏达聚氨酯有限公司 | Method for preparing bi-component polyurethane pouring sealant and product thereof |
| JP5712706B2 (en) * | 2011-03-15 | 2015-05-07 | 東洋インキＳｃホールディングス株式会社 | Adhesive, adhesive sheet and display |
| CN102703017B (en) * | 2012-01-05 | 2013-11-27 | 北京东方雨虹防水技术股份有限公司 | High speed railway ballast glue and preparation method and application method thereof |
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Owner name: SHANDONG CHENXUN NEW MATERIALS CO., LTD. Free format text: FORMER OWNER: XU GUANGMIN Effective date: 20150420 |
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Free format text: CORRECT: ADDRESS; FROM: 250022 JINAN, SHANDONG PROVINCE TO: 251200 DEZHOU, SHANDONG PROVINCE |
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Effective date of registration: 20150420 Address after: 251200, Dezhou, Shandong province Yucheng high tech Zone Innovation street, east of the South Patentee after: SHANDONG CHENXU NEW MATERIAL CO., LTD. Address before: The central city of Ji'nan City Jiwei road 250022 Shandong province No. 146 Ji'nan Chenxu Chemical Co. Ltd. Patentee before: Xu Guangmin |
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Denomination of invention: The invention relates to an electronic potting adhesive and a preparation method thereof Effective date of registration: 20220412 Granted publication date: 20150401 Pledgee: China Postal Savings Bank Co.,Ltd. Yucheng sub branch Pledgor: SHANDONG CHENXU NEW MATERIAL Co.,Ltd. Registration number: Y2022980004120 |
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