CN103077915A - Adjustable double swing arm system three-core alignment method of chip grading equipment - Google Patents
Adjustable double swing arm system three-core alignment method of chip grading equipment Download PDFInfo
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- CN103077915A CN103077915A CN201310007466XA CN201310007466A CN103077915A CN 103077915 A CN103077915 A CN 103077915A CN 201310007466X A CN201310007466X A CN 201310007466XA CN 201310007466 A CN201310007466 A CN 201310007466A CN 103077915 A CN103077915 A CN 103077915A
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Abstract
The invention discloses an adjustable double swing arm system three-core alignment method of chip grading equipment. The method comprises the following steps of: step I, confirming chip taking positions of a first swing arm and a second swing arm, and enabling centers of a chip taking position of a first suction nozzle hole of the first swing arm and a chip taking position of a second suction nozzle hole of the second swing arm to be coincided with a center of a supply area lens cross curve; and step II, adjusting an XY moving platform of an ejector pin seat, aligning a center of the ejector pin to the center of the supply area lens cross curve, and finishing three-core alignment operation. The three-core alignment operation method is simple to operate, can accurately realize three-core alignment process, and in addition, a deviation compensation value of an arraying area platform for the swing arm system can be obtained, and the chip grading yield and the chip arraying accuracy can be improved.
Description
Technical field
The present invention relates to the die grading technical field, particularly relate to a kind of regulated double-pendulum arms system three-core alignment method of die grading equipment.
Background technology
Die grading equipment is used for chip is carried out classified emission.In the course of work, chip to be sorted is evenly sticked on to turn on the epitaxial, turns over epitaxial and is tauted and is fixed on the pallet; Pallet is installed on can X, Y-direction moves and on the supply platform of self axis rotation, and the top of supplying with platform arranges scanning CCD system to turning on the epitaxial every chips of drainage area and identify and locating; XY cross platform is transferred crystal grain to the thimble center; Thimble jack-up is also stung film, and crystal grain is peeled off; Chip transfer system grab chips, and it is placed into the alignment area of receiving platform according to rule, thus finish the chip sorting process.
The swing arm system is important building block on the die grading equipment, belongs to the chip transfer system, and its major function is by the rotation of swing arm and lifting chip to be transferred to receiving platform from supplying with platform.The swing arm system realizes the key of chip sorting technique, and the motion feature of swing arm rotation and lifting has determined the success or failure that chip is transferred and transferred efficient.
Will guarantee normal sorting in the die grading equipment, three that need satisfy optical center, suction nozzle center and thimble center are centered close to same straight line, and this process is called three-core to bit manipulation.
In the double-pendulum arms system of die grading equipment, two swing arms all need to carry out three-core to bit manipulation, because the error of making and installing is so that not necessarily 180 ° of angles between two swing arms of the double-pendulum arms system of die grading equipment, and the length of two swing arms is also not necessarily identical, therefore, two swing arms are carried out three-core to bit manipulation comparatively the difficulty.
Die grading equipment of the prior art is set to the simple pendulum arm system mostly, and is comparatively simple to bit manipulation for the three-core of simple pendulum arm system, easily finishes; And for the double-pendulum arms system, its three-core alignment process operation is comparatively complicated, and operation is also inconvenient and quick.
Therefore, need badly and provide the technology of a kind of regulated double-pendulum arms of die grading equipment system three-core alignment method to seem particularly important.
Summary of the invention
The regulated double-pendulum arms system three-core alignment method that the object of the invention is to avoid weak point of the prior art and a kind of die grading equipment is provided.
Purpose of the present invention is achieved through the following technical solutions:
A kind of regulated double-pendulum arms system three-core alignment method of die grading equipment is provided, includes following steps:
Step 1 is determined the chip position of getting of the first swing arm and the second swing arm, with the second suction nozzle hole of getting chip position and the second swing arm in the first suction nozzle hole of the first swing arm get chip position all with drainage area camera lens cross hairs center superposition;
Step 2, the XY mobile platform of adjustment thimble seat with camera lens cross hairs center, thimble centrally aligned drainage area, is finished three-core to bit manipulation.
Wherein,Also comprise step 3, after three-core is finished bit manipulation, by alignment area platform motion compensation deviation, so that the center in the center in the first suction nozzle hole and the second suction nozzle hole overlaps in the position at camera lens cross hairs center, alignment area.
Wherein,Described step 3 specifically comprises:
(1) the first swing arm is moved to the alignment area;
(2) mobile alignment area camera lens makes the center superposition in camera lens cross hairs center, alignment area and the first suction nozzle hole;
(3) the first swing arm is rotated to an angle, so that the alignment area camera lens can be seen the alignment area chip, mobile arbitrary alignment area chip makes it to be positioned at camera lens cross hairs center, alignment area, and record Bin sits crosslegged and is designated as A;
(4) the second swing arm is moved to the alignment area;
(5) mobile alignment area camera lens makes the center superposition in camera lens cross hairs center, alignment area and the second suction nozzle hole;
(6) the second swing arm is rotated to an angle, so that the alignment area camera lens can be seen the alignment area chip, that alignment area chip of mobile step (3) is to camera lens cross hairs center, alignment area, and record Bin sits crosslegged and is designated as B;
(7) Bin mark A and the Bin mark B that sits crosslegged that sits crosslegged subtracts each other and namely gets the alignment area platform and move to the grid deviation offset of the second swing arm.
Wherein,Described step 1 specifically comprises:
(1) moves the first swing arm and initially get chip position to it, adjust the position of the first swing arm, make the first suction nozzle hole of the first swing arm nearest far from optical center, drainage area cross hairs;
(2) adjust the length of the first swing arm by the cam mechanism in the first swing arm, make the first suction nozzle hole be positioned at camera lens cross hairs center, drainage area, setting this position is the chip position of getting of the first swing arm;
(3) with the first swing arm Rotate 180 °, the second swing arm this moment is positioned at it and initially gets chip position, adjusts the position of the second swing arm, makes the second suction nozzle hole nearest far from camera lens cross hairs center, drainage area;
(4) adjust the length of the second swing arm by the cam mechanism in the second swing arm, make the second suction nozzle hole be positioned at camera lens cross hairs center, drainage area, setting this position is the chip position of getting of the second swing arm.
In wherein said (1), adjust the first swing arm and optical center, drainage area and be positioned on the same level line, the first suction nozzle hole of the first swing arm this moment is nearest far from optical center, drainage area cross hairs.
In wherein said (3), adjust the second swing arm and optical center, drainage area and be positioned on the same level line, the second suction nozzle hole of the second swing arm this moment is nearest far from optical center, drainage area cross hairs.
Beneficial effect of the present invention:
The regulated double-pendulum arms system three-core alignment method of a kind of die grading equipment of the present invention, include following steps: determine the chip position of getting of the first swing arm and the second swing arm, with the second suction nozzle hole of getting chip position and the second swing arm in the first suction nozzle hole of the first swing arm get chip position all with drainage area camera lens cross hairs center superposition; Adjust the XY mobile platform of thimble seat, with camera lens cross hairs center, thimble centrally aligned drainage area, finish three-core to bit manipulation.This three-core alignment method is simple to operate, can realize more accurately the three-core alignment process, in addition, can also obtain the alignment area platform to the deviation compensation value of swing arm system, can improve die grading and become rate and arrangements of chips precision.
Description of drawings
Utilize accompanying drawing that invention is described further, but the embodiment in the accompanying drawing does not consist of any limitation of the invention, for those of ordinary skill in the art, under the prerequisite of not paying creative work, can also obtain according to the following drawings other accompanying drawing.
Fig. 1 is the structure explanation schematic diagram of the regulated double-pendulum arms system three-core alignment method of a kind of die grading equipment of the present invention.
Fig. 2 is the flow chart of step 1 of the regulated double-pendulum arms system three-core alignment method of a kind of die grading equipment of the present invention.
Fig. 3 is the flow chart of step 3 of the regulated double-pendulum arms system three-core alignment method of a kind of die grading equipment of the present invention.
In Fig. 1, Fig. 2 and Fig. 3, include:
21---the first swing arm, 211---the first suction nozzle hole, 22---the second swing arm, 221---the second suction nozzle hole, 23---spin motor shaft, 24---drainage area camera lens cross hairs, 25---alignment area camera lens cross hairs.
Embodiment
The invention will be further described with the following Examples.
Need to prove, the regulated double-pendulum arms system that mentions among the present invention as shown in Figure 1, specifically comprise the first swing arm 21 and the second swing arm 22, one end of the first swing arm 21 is provided with the first suction nozzle hole 211, the other end that one end of the second swing arm 22 is provided with 221, the first swing arms 21 of the second suction nozzle hole be connected the other end of swing arm 22 and connect by spin motor shaft 23; Wherein the first swing arm 21 and the second swing arm 22 are equipped with the cam mechanism of adjustable length.
Embodiment 1.
One of embodiment of the regulated double-pendulum arms system three-core alignment method of a kind of die grading equipment of the present invention includes following steps:
Step 1 is determined the chip position of getting of the first swing arm 21 and the second swing arm 22, with the second suction nozzle hole 221 of getting chip position and the second swing arm 22 in the first suction nozzle hole 211 of the first swing arm 21 get chip position all with drainage area camera lens cross hairs 24 center superpositions;
Step 2 is taken out the Wafer dish, adjusts the XY mobile platform of thimble seat, with camera lens cross hairs 24 centers, thimble centrally aligned drainage area, finishes three-core to bit manipulation.
Three-core alignment method of the present invention is simple to operate, can realize more accurately the three-core alignment process.
Preferably, as shown in Figure 2, described step 1 specifically comprises:
S11: mobile the first swing arm 21 is initially got chip position to it.
S12: adjust the position of the first swing arm 21, make the first suction nozzle hole 211 of the first swing arm 21 nearest from optical center, drainage area cross hairs.
S13: adjust the length of the first swing arm 21 by the cam mechanism in the first swing arm 21, make the first suction nozzle hole 211 be positioned at camera lens cross hairs 24 centers, drainage area, setting this position is the chip position of getting of the first swing arm 21, i.e. the second swing arm 22 put chip position.
S14: with the first swing arm 21 Rotate 180s °, the second swing arm 22 this moment is positioned at it and initially gets chip position.
S15: adjust the position of the second swing arm 22, make the second suction nozzle hole 221 nearest from camera lens cross hairs 24 centers, drainage area.
S16: adjust the length of the second swing arm 22 by the cam mechanism in the second swing arm 22, make the second suction nozzle hole 221 be positioned at camera lens cross hairs 24 centers, drainage area, setting this position is the chip position of getting of the second swing arm 22, i.e. the first swing arm 21 put chip position.
S17: mobile the first swing arm 21 finds that to the drainage area center in the second suction nozzle hole 221 is not at camera lens cross hairs 25 centers, alignment area.
Among the S11 described above, adjust the first swing arm 21 and be positioned on the same level line with the optical center, drainage area, the first suction nozzle hole 211 of the first swing arm 21 this moment is nearest from optical center, drainage area cross hairs.
Among the S13 described above, adjust the second swing arm 22 and be positioned on the same level line with the optical center, drainage area, the second suction nozzle hole 221 of the second swing arm 22 this moment is nearest from optical center, drainage area cross hairs.
Embodiment 2.
Two of the embodiment of the regulated double-pendulum arms system three-core alignment method of a kind of die grading equipment of the present invention, the main technical schemes of the present embodiment is identical with embodiment 1, unaccounted feature adopts the explanation among the embodiment 1 in the present embodiment, no longer gives unnecessary details at this.
The difference of the present embodiment and embodiment 1 is, also comprise step 3, after three-core is finished bit manipulation, by alignment area platform motion compensation deviation, so that the center in the center in the first suction nozzle hole 211 and the second suction nozzle hole 221 overlaps in the position at camera lens cross hairs 25 centers, alignment area.The present invention can also obtain the alignment area platform to the deviation compensation value of two swing arms, can improve die grading and become rate and arrangements of chips precision.
Preferably, as shown in Figure 3, described step 3 specifically comprises:
S31: the first swing arm 21 is moved to the alignment area; Find that 211 centers, the first suction nozzle hole are not or not camera lens cross hairs 25 centers, alignment area.
S32: mobile alignment area camera lens makes the center superposition in camera lens cross hairs 25 centers, alignment area and the first suction nozzle hole 211.
S33: the first swing arm 21 is rotated to an angle, so that the alignment area camera lens can be seen the alignment area chip, mobile arbitrary alignment area chip makes it to be positioned at camera lens cross hairs 25 centers, alignment area, and record Bin sits crosslegged and is designated as A.
S34: the second swing arm 22 is moved to the alignment area.
S35: mobile alignment area camera lens makes the center superposition in camera lens cross hairs 25 centers, alignment area and the second suction nozzle hole 221.
S36: the second swing arm 22 is rotated to an angle, so that the alignment area camera lens can be seen the alignment area chip, that alignment area chip of mobile step (3) is to camera lens cross hairs 25 centers, alignment area, and record Bin sits crosslegged and is designated as B.
S37:Bin mark A and the Bin mark B that sits crosslegged that sits crosslegged subtracts each other and namely gets the alignment area platform and move to the grid deviation offset of the second swing arm 22.
Should be noted that at last; above embodiment is only in order to illustrate technical scheme of the present invention; but not limiting the scope of the invention; although with reference to preferred embodiment the present invention has been done to explain; those of ordinary skill in the art is to be understood that; can make amendment or be equal to replacement technical scheme of the present invention, and not break away from essence and the scope of technical solution of the present invention.
Claims (6)
1. the regulated double-pendulum arms system three-core alignment method of a die grading equipment is characterized in that, includes following steps:
Step 1 is determined the chip position of getting of the first swing arm and the second swing arm, with the second suction nozzle hole of getting chip position and the second swing arm in the first suction nozzle hole of the first swing arm get chip position all with drainage area camera lens cross hairs center superposition;
Step 2, the XY mobile platform of adjustment thimble seat with camera lens cross hairs center, thimble centrally aligned drainage area, is finished three-core to bit manipulation.
2. the regulated double-pendulum arms system three-core alignment method of a kind of die grading equipment according to claim 1, it is characterized in that: also comprise step 3, after three-core is finished bit manipulation, by alignment area platform motion compensation deviation, so that the center in the center in the first suction nozzle hole and the second suction nozzle hole overlaps in the position at camera lens cross hairs center, alignment area.
3. the regulated double-pendulum arms system three-core alignment method of a kind of die grading equipment according to claim 2 is characterized in that, described step 3 specifically comprises:
(1) the first swing arm is moved to the alignment area;
(2) mobile alignment area camera lens makes the center superposition in camera lens cross hairs center, alignment area and the first suction nozzle hole;
(3) the first swing arm is rotated to an angle, so that the alignment area camera lens can be seen the alignment area chip, mobile arbitrary alignment area chip makes it to be positioned at camera lens cross hairs center, alignment area, and record Bin sits crosslegged and is designated as A;
(4) the second swing arm is moved to the alignment area;
(5) mobile alignment area camera lens makes the center superposition in camera lens cross hairs center, alignment area and the second suction nozzle hole;
(6) the second swing arm is rotated to an angle, so that the alignment area camera lens can be seen the alignment area chip, that alignment area chip of mobile step (3) is to camera lens cross hairs center, alignment area, and record Bin sits crosslegged and is designated as B;
(7) Bin mark A and the Bin mark B that sits crosslegged that sits crosslegged subtracts each other and namely gets the alignment area platform and move to the grid deviation offset of the second swing arm.
4. the regulated double-pendulum arms system three-core alignment method of a kind of die grading equipment according to claim 1 is characterized in that, described step 1 specifically comprises:
(1) moves the first swing arm and initially get chip position to it, adjust the position of the first swing arm, make the first suction nozzle hole of the first swing arm nearest far from optical center, drainage area cross hairs;
(2) adjust the length of the first swing arm by the cam mechanism in the first swing arm, make the first suction nozzle hole be positioned at camera lens cross hairs center, drainage area, setting this position is the chip position of getting of the first swing arm;
(3) with the first swing arm Rotate 180 °, the second swing arm this moment is positioned at it and initially gets chip position, adjusts the position of the second swing arm, makes the second suction nozzle hole nearest far from camera lens cross hairs center, drainage area;
(4) adjust the length of the second swing arm by the cam mechanism in the second swing arm, make the second suction nozzle hole be positioned at camera lens cross hairs center, drainage area, setting this position is the chip position of getting of the second swing arm.
5. the double-pendulum arms system three-core alignment method of a kind of die grading equipment according to claim 4, it is characterized in that: in wherein said (1), adjust the first swing arm and optical center, drainage area and be positioned on the same level line, the first suction nozzle hole of the first swing arm this moment is nearest far from optical center, drainage area cross hairs.
6. the double-pendulum arms system three-core alignment method of a kind of die grading equipment according to claim 4, it is characterized in that: in wherein said (3), adjust the second swing arm and optical center, drainage area and be positioned on the same level line, the second suction nozzle hole of the second swing arm this moment is nearest far from optical center, drainage area cross hairs.
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CN201310007466.XA CN103077915B (en) | 2013-01-09 | 2013-01-09 | A kind of adjustable double-pendulum arms system three-core alignment method of die grading equipment |
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Cited By (6)
Publication number | Priority date | Publication date | Assignee | Title |
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CN103357584A (en) * | 2013-07-05 | 2013-10-23 | 深圳市矽电半导体设备有限公司 | Double-welding-arm pickup mechanism and chip sorting machine |
CN104992918A (en) * | 2015-05-08 | 2015-10-21 | 江苏艾科瑞思封装自动化设备有限公司 | Die bonder automatic calibration method and system |
CN107716324A (en) * | 2017-11-21 | 2018-02-23 | 中邮科技有限责任公司 | Double-pendulum arms vertical belt mail sorting equipment and the method using its sort mail |
CN113838789A (en) * | 2021-11-26 | 2021-12-24 | 河北圣昊光电科技有限公司 | Automatic chip supply device and method |
CN114688934A (en) * | 2022-06-02 | 2022-07-01 | 中海油能源发展股份有限公司采油服务分公司 | Three-center alignment detection method and device for bilge part of ship |
CN115732378A (en) * | 2021-08-30 | 2023-03-03 | 深圳市智立方自动化设备股份有限公司 | Automatic calibration system and method for suction nozzle |
Citations (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN1194456A (en) * | 1997-03-26 | 1998-09-30 | 财团法人工业技术研究院 | Chip connection method and device |
CN101780456A (en) * | 2010-01-08 | 2010-07-21 | 东莞华中科技大学制造工程研究院 | Crystal grain angle correction method applied to chip separating system |
JP2010267970A (en) * | 2009-05-14 | 2010-11-25 | Asm Assembly Automation Ltd | Alignment method for singulation system |
KR101042591B1 (en) * | 2003-04-22 | 2011-06-20 | 파나소닉 주식회사 | Device and method for mounting part |
CN102183880A (en) * | 2011-05-11 | 2011-09-14 | 武汉东羽光机电科技有限公司 | Quick pre-locating device for base plate of light emitting diode (LED) automatic exposure machine |
CN102881621A (en) * | 2012-10-19 | 2013-01-16 | 无锡尚实电子科技有限公司 | Inverting and aligning method and device |
-
2013
- 2013-01-09 CN CN201310007466.XA patent/CN103077915B/en not_active Expired - Fee Related
Patent Citations (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN1194456A (en) * | 1997-03-26 | 1998-09-30 | 财团法人工业技术研究院 | Chip connection method and device |
KR101042591B1 (en) * | 2003-04-22 | 2011-06-20 | 파나소닉 주식회사 | Device and method for mounting part |
JP2010267970A (en) * | 2009-05-14 | 2010-11-25 | Asm Assembly Automation Ltd | Alignment method for singulation system |
CN101780456A (en) * | 2010-01-08 | 2010-07-21 | 东莞华中科技大学制造工程研究院 | Crystal grain angle correction method applied to chip separating system |
CN102183880A (en) * | 2011-05-11 | 2011-09-14 | 武汉东羽光机电科技有限公司 | Quick pre-locating device for base plate of light emitting diode (LED) automatic exposure machine |
CN102881621A (en) * | 2012-10-19 | 2013-01-16 | 无锡尚实电子科技有限公司 | Inverting and aligning method and device |
Cited By (10)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN103357584A (en) * | 2013-07-05 | 2013-10-23 | 深圳市矽电半导体设备有限公司 | Double-welding-arm pickup mechanism and chip sorting machine |
CN103357584B (en) * | 2013-07-05 | 2015-05-20 | 深圳市矽电半导体设备有限公司 | Double-welding-arm pickup mechanism and chip sorting machine |
CN104992918A (en) * | 2015-05-08 | 2015-10-21 | 江苏艾科瑞思封装自动化设备有限公司 | Die bonder automatic calibration method and system |
CN107716324A (en) * | 2017-11-21 | 2018-02-23 | 中邮科技有限责任公司 | Double-pendulum arms vertical belt mail sorting equipment and the method using its sort mail |
CN107716324B (en) * | 2017-11-21 | 2024-06-11 | 中邮科技股份有限公司 | Double-swing-arm vertical belt mail sorting equipment and mail sorting method using same |
CN115732378A (en) * | 2021-08-30 | 2023-03-03 | 深圳市智立方自动化设备股份有限公司 | Automatic calibration system and method for suction nozzle |
CN115732378B (en) * | 2021-08-30 | 2023-09-26 | 深圳市智立方自动化设备股份有限公司 | Automatic calibration system and method for suction nozzle |
CN113838789A (en) * | 2021-11-26 | 2021-12-24 | 河北圣昊光电科技有限公司 | Automatic chip supply device and method |
CN114688934A (en) * | 2022-06-02 | 2022-07-01 | 中海油能源发展股份有限公司采油服务分公司 | Three-center alignment detection method and device for bilge part of ship |
CN114688934B (en) * | 2022-06-02 | 2022-07-29 | 中海油能源发展股份有限公司采油服务分公司 | Three-center alignment detection method and device for bilge position of ship |
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