CN103074651B - Electroplating jig for local gold plating of cover plate - Google Patents
Electroplating jig for local gold plating of cover plate Download PDFInfo
- Publication number
- CN103074651B CN103074651B CN201310051228.9A CN201310051228A CN103074651B CN 103074651 B CN103074651 B CN 103074651B CN 201310051228 A CN201310051228 A CN 201310051228A CN 103074651 B CN103074651 B CN 103074651B
- Authority
- CN
- China
- Prior art keywords
- cover plate
- plating
- contact surface
- electroplating
- block
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
- 238000007747 plating Methods 0.000 title claims abstract description 86
- 238000009713 electroplating Methods 0.000 title claims abstract description 22
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 title abstract description 4
- 239000010931 gold Substances 0.000 title abstract description 4
- 229910052737 gold Inorganic materials 0.000 title abstract description 4
- 210000000078 claw Anatomy 0.000 claims description 20
- 238000000034 method Methods 0.000 abstract description 10
- 239000000463 material Substances 0.000 abstract description 5
- 239000011248 coating agent Substances 0.000 description 10
- 238000000576 coating method Methods 0.000 description 10
- 239000010970 precious metal Substances 0.000 description 6
- 238000010586 diagram Methods 0.000 description 5
- 238000003672 processing method Methods 0.000 description 4
- 229920002120 photoresistant polymer Polymers 0.000 description 3
- 230000005540 biological transmission Effects 0.000 description 2
- 238000009413 insulation Methods 0.000 description 2
- 239000002184 metal Substances 0.000 description 2
- 229910052751 metal Inorganic materials 0.000 description 2
- BFKJFAAPBSQJPD-UHFFFAOYSA-N tetrafluoroethene Chemical group FC(F)=C(F)F BFKJFAAPBSQJPD-UHFFFAOYSA-N 0.000 description 2
- 208000012260 Accidental injury Diseases 0.000 description 1
- 238000004026 adhesive bonding Methods 0.000 description 1
- 230000007812 deficiency Effects 0.000 description 1
- 238000004100 electronic packaging Methods 0.000 description 1
- 238000005538 encapsulation Methods 0.000 description 1
- 208000014674 injury Diseases 0.000 description 1
- 239000012528 membrane Substances 0.000 description 1
- 230000001681 protective effect Effects 0.000 description 1
- 239000002904 solvent Substances 0.000 description 1
Abstract
Description
Claims (2)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN201310051228.9A CN103074651B (en) | 2013-02-16 | 2013-02-16 | Electroplating jig for local gold plating of cover plate |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN201310051228.9A CN103074651B (en) | 2013-02-16 | 2013-02-16 | Electroplating jig for local gold plating of cover plate |
Publications (2)
Publication Number | Publication Date |
---|---|
CN103074651A CN103074651A (en) | 2013-05-01 |
CN103074651B true CN103074651B (en) | 2015-05-13 |
Family
ID=48151343
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CN201310051228.9A Active CN103074651B (en) | 2013-02-16 | 2013-02-16 | Electroplating jig for local gold plating of cover plate |
Country Status (1)
Country | Link |
---|---|
CN (1) | CN103074651B (en) |
Families Citing this family (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN108221033B (en) * | 2016-12-12 | 2020-05-05 | 中国航空工业标准件制造有限责任公司 | Electroplating clamp capable of shielding tip effect |
Family Cites Families (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS6024190B2 (en) * | 1980-05-28 | 1985-06-11 | 株式会社日立製作所 | selective plating jig |
JPS5877588A (en) * | 1981-10-31 | 1983-05-10 | Tanaka Denshi Kogyo Kk | Method and device for plating |
JPH07252685A (en) * | 1994-03-11 | 1995-10-03 | Shimonoseki Mekki Kk | Plating method for metallic sheet and jig for plating |
KR100495340B1 (en) * | 1999-12-21 | 2005-06-14 | 스미토모 쇼지 플라스틱 가부시키가이샤 | Method for partially plating on a base |
CN102041530B (en) * | 2009-10-13 | 2012-12-26 | 深圳国宝造币有限公司 | Protective clamp for local metal plating of workpiece and cyanide-free gold plating method thereof |
CN102011159B (en) * | 2010-12-15 | 2012-08-08 | 安徽华东光电技术研究所 | Device and method for implementing local electroplating of parts |
-
2013
- 2013-02-16 CN CN201310051228.9A patent/CN103074651B/en active Active
Also Published As
Publication number | Publication date |
---|---|
CN103074651A (en) | 2013-05-01 |
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Legal Events
Date | Code | Title | Description |
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C06 | Publication | ||
PB01 | Publication | ||
C10 | Entry into substantive examination | ||
SE01 | Entry into force of request for substantive examination | ||
C14 | Grant of patent or utility model | ||
GR01 | Patent grant | ||
ASS | Succession or assignment of patent right |
Owner name: JACAL ELECTRONIC (WUXI) CO., LTD. Free format text: FORMER OWNER: MA GUORONG Effective date: 20150901 |
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C41 | Transfer of patent application or patent right or utility model | ||
TR01 | Transfer of patent right |
Effective date of registration: 20150901 Address after: 214161 lakes in Jiangsu province Wuxi City foreshore Hu Dai Joint Industrial Park North Road No. 10 Patentee after: Jacal Electronic (Wuxi) Co., Ltd. Address before: 214062 room 67, No. 401, Shan Sheng village, Binhu District, Jiangsu, Wuxi Patentee before: Ma Guorong |
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C41 | Transfer of patent application or patent right or utility model | ||
TR01 | Transfer of patent right |
Effective date of registration: 20151104 Address after: 214161 lakes in Jiangsu province Wuxi City foreshore Hu Dai Joint Industrial Park North Road No. 10 Patentee after: Jacal Electronic (Wuxi) Co., Ltd. Patentee after: Ma Guorong Patentee after: Li Baoyun Address before: 214161 lakes in Jiangsu province Wuxi City foreshore Hu Dai Joint Industrial Park North Road No. 10 Patentee before: Jacal Electronic (Wuxi) Co., Ltd. |
|
C41 | Transfer of patent application or patent right or utility model | ||
TR01 | Transfer of patent right |
Effective date of registration: 20160120 Address after: 214161 lakes in Jiangsu province Wuxi City foreshore Hu Dai Joint Industrial Park North Road No. 10 Patentee after: Jacal Electronic (Wuxi) Co., Ltd. Address before: 214161 lakes in Jiangsu province Wuxi City foreshore Hu Dai Joint Industrial Park North Road No. 10 Patentee before: Jacal Electronic (Wuxi) Co., Ltd. Patentee before: Ma Guorong Patentee before: Li Baoyun |
|
TR01 | Transfer of patent right |
Effective date of registration: 20220111 Address after: 214200 Ding Shu Zhen Qing Long Shan, Yixing City, Wuxi City, Jiangsu Province Patentee after: YIXING JITAI ELECTRONICS CO.,LTD. Address before: 214161 No. 10, Lianhe Road, North District, Hudai Industrial Park, Binhu District, Wuxi City, Jiangsu Province Patentee before: JACAL ELECTRONIC (WUXI) Co.,Ltd. |
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TR01 | Transfer of patent right |