CN103066001B - Universal leveling suction nozzle for collecting co-crystallizing welding machine chips - Google Patents
Universal leveling suction nozzle for collecting co-crystallizing welding machine chips Download PDFInfo
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- CN103066001B CN103066001B CN201210581519.4A CN201210581519A CN103066001B CN 103066001 B CN103066001 B CN 103066001B CN 201210581519 A CN201210581519 A CN 201210581519A CN 103066001 B CN103066001 B CN 103066001B
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Abstract
The invention belongs to the technical field of integrated circuit manufacture, and relates to an auxiliary device which is assembled on a welding head of a co-crystallizing welding machine and used for collecting co-crystallizing welding chips, in particular to a universal leveling suction nozzle for collecting the co-crystallizing welding machine chips. The lower portion of an installation support penetrates through a copper sleeve inner hole and is arranged inside a copper sleeve inner cavity. After a sealing ring is sleeved on the lower portion of the installation support, the lower portion of the installation support is screwed into the copper sleeve inner cavity through a pressing nut, and the installation support is provided with a first air passage along an axis. The universal leveling suction nozzle is simple, compact and reasonable in structure. The chips can be kept horizontally by means of rotation of a stainless piece-absorbing head, and the problems that the chips are broken or fissure slightly due to the fact that uneven stress is exerted on the chips during co-crystallizing welding are solved. The problems that the chips are not collected smoothly and the stress on the chips is uneven are solved. The universal leveling suction nozzle is made of metal materials such as stainless steel, and is high temperature resistant, wear resistant and long in service life.
Description
Technical field
The invention belongs to ic manufacturing technology field, relate to one and be assemblied on eutectic welding machine welding head, for the auxiliary implement of eutectic welding pick-up chip, specifically a kind of Universal leveling suction nozzle of eutectic welding machine pick-up chip.
Background technology
At present, eutectic welding pick-up chip has the following two kinds method usually: by tweezers gripping chip or the method adopting vacsorb chip.Wherein, the mode of tweezers gripping picks up by pneumatic tweezers and put down chip, vacuum cups picks up and puts down weld tabs, prefabricated solder sheet vacuum cups is held, be placed on the position of required eutectic, pick up tube core with tweezers, tweezers pass through mechanical friction action, until chip surrounding occurs that molten alloy just completes an eutectic.The mode of vacsorb chip is that suction nozzle position holds chip by vacuum, then aims at the position that will sinter, chip placement, in heat with under the effect of pressure, suction nozzle is fused by frictional vibration and substrate, until see that chip circumference has obvious fusion to occur, completes an eutectic.Require during chip eutectic that chip keeps level, in order to avoid chip discontinuity, chip crushing or eutectic rear-inclined can not be met bonding requirement.
There is following problem in actual use:
1, when the grip force of tweezers gripping chip is improper, be easily caught broken chip edge, even directly cause the situation that chip breakage, the particularly fragility such as ultra-thin chip or GaAs material are more easily damaged; In addition, with in tweezers gripping chip processes, when chip occurring and tilting, weld failure can be caused.
2, conventional vacuum inhales the suction nozzle of sheet when chip pick-up tilts, or during substrate surface out-of-flatness, can make chip unbalance stress, causes the solder around welding zone uneven.In chip eutectic process, chip eutectic rear-inclined produces harmful effect to postorder bond technology, causes losing efficacy, and crushes chip or make chip produce micro-crack.
Summary of the invention
The object of the invention is to overcome the deficiencies in the prior art, the Universal leveling suction nozzle of a kind of structure simple, ingenious, rational eutectic welding machine pick-up chip is provided, different chip size can be applicable to, when chip contacts with base plan, in the curved portions of copper sleeve, adjustment is rotated by iron spheroid, thus regulate the relative level of chip and substrate, make chip and base plan maintenance level, the chip level of packaged chip eutectic welding, the requirement of uniform force can be adapted to.
According to technical scheme provided by the invention: a kind of Universal leveling suction nozzle of eutectic welding machine pick-up chip, be characterised in that: mounting bracket bottom is through copper hub internal bore, be in copper barrel bore, after the suit sealing ring of described mounting bracket bottom, be tightened in copper barrel bore by clamp nut, described mounting bracket is provided with the first airway along axle center, and the end that mounting bracket is in copper barrel bore arranges magnet; Copper sleeve is positioned on irony hemisphere, and described irony hemisphere lower end arranges stainless steel and inhales head, irony hemisphere is arranged the second airway, and described stainless steel is inhaled on head and arranged the 3rd airway corresponding to the second airway place.
As a further improvement on the present invention, described mounting bracket boss fits tightly in copper sleeve end face, and mounting bracket tightly fits in copper hub internal bore.
As a further improvement on the present invention, described copper sleeve and the hemispheroidal binding site of irony are set to arc shape.
As a further improvement on the present invention, described magnet is bonded in mounting bracket end by glue.
As a further improvement on the present invention, described irony hemisphere is inhaled head by glue and stainless steel and is closely bonded.
Compared with prior art, advantage is in the present invention: structure of the present invention is simple, compact, reasonable; Can make chip maintenance level by rotating stainless steel suction head, when solving eutectic welding, chip (as the fragility such as ultra-thin chip or GaAs material) discontinuity, causes fragment or makes chip produce micro-crack; The invention solves the problem of chip pickup out-of-flatness, unbalance stress; The present invention adopts stainless steel and other metal materials to be processed into, high temperature resistant, wear-resistant, long service life.
Accompanying drawing explanation
Fig. 1 is structural representation of the present invention.
Fig. 2 is the upward view of Fig. 1.
Fig. 3 is cross-sectional view of the present invention.
Embodiment
Below in conjunction with concrete drawings and Examples, the invention will be further described.
As shown in Fig. 1 ~ 3, comprise mounting bracket 1, magnet 2, copper sleeve 3, sealing ring 4, clamp nut 5, irony hemisphere 6, stainless steel suction head 7, sleeve 7-1, base plate 7-2, substrate 7-3, mounting bracket boss 8, copper barrel bore 9, first airway 10, copper hub internal bore 11, the 3rd airway 12, second airway 13 etc.
As shown in Fig. 1 ~ 3, the present invention is a kind of Universal leveling suction nozzle of eutectic welding machine pick-up chip, mounting bracket 1 bottom is through copper hub internal bore 11, be in copper barrel bore 9, after the suit sealing ring 4 of described mounting bracket 1 bottom, be tightened in copper barrel bore 9 by clamp nut 5, described mounting bracket 1 is provided with the first airway 10 along axle center, and the end that mounting bracket 1 is in copper barrel bore 9 arranges magnet 2; Copper sleeve 3 is positioned on irony hemisphere 6, described irony hemisphere 6 lower end arranges stainless steel and inhales head 7, head 7 inhaled by stainless steel can adjust horizontal plane arbitrarily, to guarantee that chip is horizontal all the time, irony hemisphere 6 is arranged the second airway 13, described stainless steel is inhaled on head 7 and is arranged the 3rd airway 12 corresponding to the second airway 13 place.
Described mounting bracket boss 8 fits tightly on copper sleeve 3 end face, and mounting bracket 1 tightly fits in copper hub internal bore 11, by this kind of friction tight mode, avoids between mounting bracket 1 with copper sleeve 3 owing to coordinating not the closely gas leak phenomenon caused.
Described copper sleeve 3 is set to arc shape with the binding site of irony hemisphere 6, and the outer surface of this arc shape and irony hemisphere 6 is fitted completely.
Described magnet 2 is bonded in mounting bracket 1 end by glue.
Described irony hemisphere 6 is inhaled head 7 by glue and stainless steel and is closely bonded.
Described stainless steel is inhaled head 7 and is comprised sleeve 7-1, base plate 7-2, substrate 7-3, and copper sleeve 3 is enclosed in wherein by sleeve 7-1.
Mounting bracket 1 of the present invention inserts in the connecting hole of eutectic welding machine pressure-welding head, is fixedly screwed by screw, can normally work.
Structure of the present invention is simple, compact, reasonable; Can make chip maintenance level by rotating stainless steel suction head, when solving eutectic welding, chip (as the fragility such as ultra-thin chip or GaAs material) discontinuity, causes fragment or makes chip produce micro-crack; The invention solves the problem of chip pickup out-of-flatness, unbalance stress; The present invention adopts stainless steel and other metal materials to be processed into, high temperature resistant, wear-resistant, long service life.
Claims (5)
1. the Universal leveling suction nozzle of an eutectic welding machine pick-up chip, it is characterized in that: mounting bracket (1) bottom is through copper hub internal bore (11), be in copper barrel bore (9), behind described mounting bracket (1) bottom suit sealing ring (4), be tightened in copper barrel bore (9) by clamp nut (5), described mounting bracket (1) is provided with the first airway (10) along axle center, mounting bracket (1) end be in copper barrel bore (9) arranges magnet (2); Copper sleeve (3) is positioned on irony hemisphere (6), described irony hemisphere (6) lower end arranges stainless steel and inhales head (7), irony hemisphere (6) is arranged the second airway (13), described stainless steel is inhaled upper the second airway (13) place that corresponds to of head (7) and is arranged the 3rd airway (12); In the curved portions of copper sleeve, rotate adjustment by iron spheroid (6), thus regulate the relative level of chip and substrate, make chip and base plan maintenance level, the chip level of packaged chip eutectic welding, the requirement of uniform force can be adapted to.
2. the Universal leveling suction nozzle of eutectic welding machine pick-up chip as claimed in claim 1, is characterized in that: mounting bracket boss (8) fits tightly on copper sleeve (3) end face, and mounting bracket (1) tightly fits in copper hub internal bore (11).
3. the Universal leveling suction nozzle of eutectic welding machine pick-up chip as claimed in claim 1, is characterized in that: described copper sleeve (3) is set to arc shape with the binding site of irony hemisphere (6).
4. the Universal leveling suction nozzle of eutectic welding machine pick-up chip as claimed in claim 1, is characterized in that: described magnet (2) is bonded in mounting bracket (1) end by glue.
5. the Universal leveling suction nozzle of eutectic welding machine pick-up chip as claimed in claim 1, is characterized in that: described irony hemisphere (6) is inhaled head (7) by glue and stainless steel and closely bonded.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201210581519.4A CN103066001B (en) | 2012-12-28 | 2012-12-28 | Universal leveling suction nozzle for collecting co-crystallizing welding machine chips |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201210581519.4A CN103066001B (en) | 2012-12-28 | 2012-12-28 | Universal leveling suction nozzle for collecting co-crystallizing welding machine chips |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN103066001A CN103066001A (en) | 2013-04-24 |
| CN103066001B true CN103066001B (en) | 2015-04-22 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201210581519.4A Active CN103066001B (en) | 2012-12-28 | 2012-12-28 | Universal leveling suction nozzle for collecting co-crystallizing welding machine chips |
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Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN108257904B (en) * | 2016-12-28 | 2021-10-22 | 林彦全 | Assembling structure for connecting suction nozzle |
Family Cites Families (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2005029574A1 (en) * | 2003-09-18 | 2005-03-31 | Nec Machinery Corporation | Collet, die bonder, and chip pick-up method |
| JP2009064905A (en) * | 2007-09-05 | 2009-03-26 | Disco Abrasive Syst Ltd | Extension method and extension apparatus |
| CN201708140U (en) * | 2010-04-06 | 2011-01-12 | 河南鸿昌电子有限公司 | Tool for picking up semi-conductor crystal block |
| JP5123357B2 (en) * | 2010-06-17 | 2013-01-23 | 株式会社日立ハイテクインスツルメンツ | Die bonder and pickup device |
| CN202205727U (en) * | 2011-08-19 | 2012-04-25 | 关羽翔 | Suction nozzle device |
| CN102496594B (en) * | 2011-11-16 | 2013-12-04 | 扬州扬杰电子科技股份有限公司 | Lifting and putting suction nozzle suitable for light and lamellate component |
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2012
- 2012-12-28 CN CN201210581519.4A patent/CN103066001B/en active Active
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|---|---|
| CN103066001A (en) | 2013-04-24 |
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