CN103062656A - Light-emitting diode (LED) lamp bulb and installing method thereof - Google Patents
Light-emitting diode (LED) lamp bulb and installing method thereof Download PDFInfo
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- CN103062656A CN103062656A CN2012105831055A CN201210583105A CN103062656A CN 103062656 A CN103062656 A CN 103062656A CN 2012105831055 A CN2012105831055 A CN 2012105831055A CN 201210583105 A CN201210583105 A CN 201210583105A CN 103062656 A CN103062656 A CN 103062656A
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- Prior art keywords
- radiator
- heat conduction
- led bulb
- filler
- bayonet
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- 238000000034 method Methods 0.000 title claims description 26
- 229910052782 aluminium Inorganic materials 0.000 claims abstract description 38
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- 230000001681 protective effect Effects 0.000 claims abstract description 31
- 238000009434 installation Methods 0.000 claims abstract description 13
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- 239000004033 plastic Substances 0.000 claims description 57
- 239000000945 filler Substances 0.000 claims description 49
- 239000000463 material Substances 0.000 claims description 48
- KAKZBPTYRLMSJV-UHFFFAOYSA-N Butadiene Chemical compound C=CC=C KAKZBPTYRLMSJV-UHFFFAOYSA-N 0.000 claims description 34
- 239000004411 aluminium Substances 0.000 claims description 33
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- 239000007822 coupling agent Substances 0.000 claims description 24
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- 235000012211 aluminium silicate Nutrition 0.000 claims description 16
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- XLOMVQKBTHCTTD-UHFFFAOYSA-N Zinc monoxide Chemical compound [Zn]=O XLOMVQKBTHCTTD-UHFFFAOYSA-N 0.000 description 2
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- 239000005062 Polybutadiene Substances 0.000 description 1
- BLRPTPMANUNPDV-UHFFFAOYSA-N Silane Chemical compound [SiH4] BLRPTPMANUNPDV-UHFFFAOYSA-N 0.000 description 1
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 1
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Abstract
The invention discloses a light-emitting diode (LED) lamp bulb which comprises a lamp holder, a radiator, an aluminum substrate, LED lamp beads and a protective cover. The LED lamp bulb is further provided with a bayonet lamp socket. The lamp holder is connected with the radiator through the bayonet lamp socket. The LED lamp beads are arranged on the aluminum substrate. The aluminum substrate is provided with the LED lamp beads, one face of the aluminum substrate is connected with the protective cover, and the other face of the aluminum substrate is connected with the radiator. The bayonet lamp socket is fixedly connected with a bayonet groove arranged on the lamp holder through a bayonet arranged on the bayonet lamp socket. The LED lamp bulb adopts a bayonet type structure, can solve the problems of existing LED illuminating lamps and adopt a production assembly mode that automatic installation and production line assembly mutual matched usage are combined, and has the advantages of being simple in production assembly, high in production efficiency, low in production cost, firm in connection, attractive, good in illuminating effect, safe in use and long in service life.
Description
Technical field
The mechanical device technique field that the present invention relates to throw light on particularly relates to a kind of Novel LED bulb and preparation thereof and installation method.
Background technology
The mode that present LED illuminating lamp adopts filament to connect more, it exists production stage loaded down with trivial details, produce the accessory long processing time, and the high problem of production cost, in addition, it also exists the material thermal conductivity energy relatively poor, and stability is not ideal enough, and moulding, fire-retardant and the relatively poor problem of insulating properties, for this reason, need a kind of LED illuminating lamp that can address the above problem, its material can have preferably heat conductivility and stability, and can well solve moulding, the problem of fire-retardant and insulating properties, simplify simultaneously assemble method, enhance productivity, improve production cost and service life, thereby satisfy the needs of actual conditions.
Now, because electronic product more and more is tending towards miniaturization, therefore those integrated and miniaturization and the good complex plastic substrate of pliability are widely used easily, but because the multiple stratification of the highly integrated and laminate of integrated circuit certainly leads to the heat release problem, so the requirement of the heat conductivility of these materials just become the task of top priority.
The methods of forming such as ABS resin can be with injection moulding, extrude, vacuum, blowing and roll-in are processed as plastic cement, and also available machinery, bonding, coating, the vacuum method such as steaming is carried out secondary operations.Because its high comprehensive performance, purposes is more extensive, mainly as engineering material, also can be used for the family life apparatus.Because its oil resistant and acid and alkali resistance, salt and chemical reagent etc. are functional, and have electrodepositable, plate the advantages such as glossy good, light specific gravity behind the metal level, price are low, can be used to replace some metal.Also can synthesize many kinds such as self-extinguishing type and heat resistant type, to adapt to various uses.
People have tentatively solved this problem with dielectric metal oxide and other compound filled polymers in recent years.The filler of insulated type heat conduction plastic cement mainly comprises: metal oxide such as BeO, MgO, A1
2O
3, CaO, NIO; Metal nitride such as AlN, BN etc.; Carbide such as SiC, B
4C
3Deng.They have higher thermal conductivity factor, and what is more important compares with metal powder excellent electrical insulating property is arranged, so they can guarantee that end article has good electrical insulating property, and this is vital in electronic apparatus industry.
Research and application for the heat conduction plastic cement are a lot, can simply classify to it, can be divided into thermoplasticity heat-conducting resin and thermosetting heat-conducting resin according to the matrix material kind; Kind by particle filled composite can be divided into: metal filled type, metal oxide filled-type, metal nitride filled-type, inorganic non-metallic filled-type, fiber-filled type heat conduction plastic cement; Also can divide according to a certain character of heat conduction plastic cement, such as can be divided into insulated type heat conduction plastic cement and nonisulated type heat conduction plastic cement according to its electrical insulation capability.
Because plastic cement itself has insulating properties, the therefore electrical insulation capability of most heat conduction plastic cement finally is that the insulating properties by particle filled composite determine.The filler that is used for nonisulated type heat conduction plastic cement usually is metal powder, graphite, carbon black, carbon fiber etc., the characteristics of this class filler are to have good thermal conductivity, can easily make material obtain high heat conductivility, but simultaneously also so that the decreasing insulating of material even become conductive material.Therefore in the less demanding situation, can use above-mentioned filler for electrical insulating property at the working environment of material.And also necessarily require under certain conditions the heat conduction plastic cement to have low electrical insulating property to meet specific requirement, such as anti-static material, electromagnetic shielding material etc.
Flourish information industry in the last few years, performance to macromolecular material has proposed Secretary, especially the development for the heat conduction plastic cement provides development space, the application of heat conduction plastic cement on computer fittings will improve the heat dissipation problem of computer and improve its speed of service and stability, such as CPU, notebook computer shell and various surface-mounted integrated circuit, these materials all require heat conductive insulating.Macromolecular material insulate, but as Heat Conduction Material, pure macromolecular material generally is inefficient, because macromolecular material is the non-conductor of heat mostly, the macromolecular material thermal conductivity factor is about the 1/500-1/600 of metal.The thermal conductivity factor of foam plastic only has 0.02-0.046W/m.K, is about 1/1500 of metal, 1/40 of cement concrete, and 1/20 of common brick is desirable heat-insulating material. expand it in the application in heat conduction field, must carry out modification to macromolecular material.The thermal conductivity factor of macromolecular material, metal and metal oxide sees Table 1-1, table 1-2, table 1-3.
The high molecular thermal conductivity factor of table 1-1
The thermal conductivity factor of table 1-2 metal and metal oxide
Can substantially have following several as metal and the inorganic filler of heat conduction particle:
(l) metal powder filler: copper powder, aluminium powder, bronze, silver powder.
(2) metal oxide: aluminium oxide, oxidation is secret, barium monoxide, magnesia, zinc oxide.
(3) metal nitride: aluminium nitride, boron nitride.
(4) inorganic non-metallic: graphite, carborundum.
Inorganic Non-metallic Materials is during as heat filling filled high polymer material matrix, and the quality of filling effect depends primarily on following factor: (l) kind of polymeric matrix, characteristic; (2) shape of filler, particle diameter, distribution of sizes; (3) interaction of the interface binding characteristic of filler and matrix and two-phase.
The thermal conductivity factor of some packing materials of table 1-3
Because the adding of filler descends the mechanical performance of material.Therefore, the conductibility that in the design of composite, not only will consider, and require that stability of material is good, nontoxic, satisfactory mechanical property and inexpensive.Another selection with respect to filled polymer is the polymer that use itself has the good heat conductive performance, but materials is expensive and performance on deficient in stability, become their major defect in the use.Plastic cement is the material of output maximum in the macromolecular material.
The market demand of conductibility macromolecular material is all increasing every year, and wherein the market demand of heat conduction plastic cement increases faster.Therefore the research of plastic cement heat conductivility is caused various countries researcher's interest, and done good work.The at present research of fillibility heat conduction plastic cement, most of method that adopts physics to fill, heat conductivility is poor, and mechanical performance descends serious, and production cost is high.But along with the market of expanding day and going deep into of research, the heat conduction plastic cement will have a large development, especially the research and development of nano heat-conductive material, high heat conduction bulk polymer material preparation, the discussion of polymer thermal conduction mechanism should become the developing direction of heat-conducting polymer material.
Summary of the invention
Technical problem to be solved by this invention is to be, a kind of high heat conduction plastic cement and preparation method and LED bulb and installation method have been proposed, it is by improving raw material components and prescription, its heat conductivility and stability have further been improved, and moulding, fire-retardant and insulating properties have been improved largely, simultaneously, the assemble method of its product is more simplified, and the production efficiency of its product, production cost and service life all are improved largely, and it has reasonable raw material proportioning, the simple characteristics of technique.
The technical solution used in the present invention is: a kind of LED bulb is provided, has comprised: lamp socket, radiator, aluminium base, LED lamp pearl and protective cover.
Described LED bulb can further have the bayonet type socket;
Described lamp socket can be connected with described radiator by the bayonet type socket;
Described LED lamp pearl can be arranged on the described aluminium base;
Described aluminium base can be provided with described LED lamp pearl;
The one side of described aluminium base can be connected with described protective cover, and the another side of described aluminium base can be connected with radiator;
Described bayonet type socket can be attached thereto by the bayonet slot that arranges on the bayonet socket that arranges on it and the lamp socket connect fixing.
Described radiator can be comprised of fin.
Described fin can adopt arcuate structure and be evenly distributed.
Described protective cover can adopt the light-transmitting materials structure.
Described protective cover can be made as the hemisphere face shape.
The material that described radiator preferably adopts is the high heat conduction complex plastic of each described nanometer in the following content.
For solving the problems of the technologies described above, the present invention also provides a kind of installation method of described LED bulb, may further comprise the steps: adopt the Auto-mounting mode to be installed on the aluminium base LED lamp pearl; Adopt the Auto-mounting mode to be connected with described protective cover and described radiator respectively the aluminium base that LED lamp pearl is housed; With lamp socket by the bayonet type socket by the manual assembly installation that is connected with radiator.
For solving the problems of the technologies described above, the present invention provides again the radiator that uses in a kind of LED bulb, and the material that described radiator adopts is the high heat conduction complex plastic of each described nanometer in the following content.
For solving the problems of the technologies described above, the present invention provides a kind of nanometer high heat conduction complex plastic again, and the raw material of the high heat conduction complex plastic of described nanometer comprises matrix and filler; Described matrix is ABS; Comprise that filler comprises: MgO, Al
2O
3, Si
3N
4And BN; The parts by weight of described raw material are: ABS63-85 part, MgO26-31 part, Al
2O
316-21 part, Si
3N
44-7 part, BN7-11 part.
Described filler may further include: high-purity carbon dust 14-19 part, AlN5-12 part, CuO9-16 part.
Described filler may further include: alum 2-6 part, kaolin 2-6 part.
Described ABS is acrylonitrile, butadiene and cinnamic terpolymer, and A represents acrylonitrile, and B represents butadiene, and S represents styrene; Wherein, acrylonitrile accounts for 25% ~ 30%, and butadiene accounts for 16% ~ 28%, and styrene accounts for 45% ~ 60%; Described filler AlN is: AlN whisker and AlN particle are done filler.
The high heat conduction complex plastic of described nanometer can prepare by following steps:
The first step, synthetic rubber: by plastic modified mechanical pelleting, with the matrix among the embodiment 1-8, auxiliary material, and coupling agent is made plastic grains;
The parts by weight of described raw material are: ABS63-85 part, MgO26-31 part, Al
2O
316-21 part, Si
3N
44-7 part, BN7-11 part; High-purity carbon dust 15-18 part; AlN6-10 part, CuO8-15 part; Alum 3-5 part, kaolin 3-5 part; Coupling agent: 2-4 part;
Second step, moulding: by the injection machine injection mo(u)lding;
The 3rd step, baking material: the plastic cement after the moulding is added in the injecting machine material tube baking material temperature degree 110-130 degree 2-4 hour; Be the injection moulding pressurizations when spending of 220 degree-260 in temperature again, injection moulding pressurization scope is 50-65kgf/ ㎝
2, the time is 45-50 second, carries out injection moulding.
The technique effect that the present invention has a mind to is: proposed a kind of high heat conduction plastic cement and preparation method and LED bulb and installation method, it is by improving raw material components and prescription, its heat conductivility and stability have further been improved, and moulding, fire-retardant and insulating properties have been improved largely, it has reasonable raw material proportioning, the simple characteristics of technique; Its product of while, the LED bulb of namely being made by described high heat conduction plastic cement passes through to adopt the bayonet type structure, can solve the existing existing problem of LED illuminating lamp, the production and assembly mode that can adopt Auto-mounting and assembly line manually to be used, it is succinct to have production and assembly, production efficiency is high, production cost is low, it is attractive in appearance to be connected firmly, good illumination effect is used safety, the advantage that the life-span is long, the public places such as market, factory, office family can be widely used in, the needs of actual conditions can be satisfied.The present invention mixes the capacity of heat transmission that uses the raising Polymers by the filler to various difformities and size and has carried out the experiment contrast, and filler comprises MgO, Al
2O
3, Si
3N
4, BN, high-purity carbon dust, AlN, CuO, KAl (SO
4)
212H
2O(alum) and/or Al
2O
3-2SiO
2-2H
2O(kaolin) etc.The present invention significantly improves the thermal conductivity of composite with mixed fillers.Utilization of the present invention has particle, the whisker of certain draw ratio to form continuous heat conduction network chain; Select the filler combination of different particle diameters, reach higher filling density: the interface that utilizes coupling agent to improve filler and matrix, to reduce thermal resistance at the interface; Improve thermal conductivity factor with nanomaterial-filled plastic cement.The high heat conduction complex plastic of nanometer of the present invention is that thermal conductivity is up to the thermoplastic composite resin of 22.45 ~ 33.75w/mK.The technology of the present invention is utilized unique MOLECULE DESIGN, has improved the interaction force of molecule between thermoplastic plastic and the filler, and filler high efficiency contact has each other formed the heat passage, has increased substantially thermal conductivity.
Description of drawings
The invention will be further described below in conjunction with drawings and embodiments:
Fig. 1 is its assembled state structural representation of LED bulb of one embodiment of the invention;
Fig. 2 is its split status architecture schematic diagram of LED bulb of one embodiment of the invention;
Fig. 3 is its lamp socket surface structure schematic diagram of LED bulb of one embodiment of the invention;
Fig. 4 is its lamp socket front view of LED bulb of one embodiment of the invention;
Fig. 5 is its lamp base part view of LED bulb of one embodiment of the invention;
Fig. 6 is its bayonet type socket surface structure schematic diagram of LED bulb of one embodiment of the invention;
Fig. 7 is its bayonet type socket front view of LED bulb of one embodiment of the invention;
Fig. 8 is its bayonet type socket side view of LED bulb of one embodiment of the invention;
Fig. 9 is its radiator surface structure schematic diagram of LED bulb of one embodiment of the invention;
Figure 10 is its radiator view of LED bulb of one embodiment of the invention;
Figure 11 is its heat sink side view of LED bulb of one embodiment of the invention;
Figure 12 is its aluminium base front view of LED bulb of one embodiment of the invention;
Figure 13 is its rate aluminium base side view of LED bulb of one embodiment of the invention;
Figure 14 is its LED lamp pearl structural representation of LED bulb of one embodiment of the invention;
Figure 15 is its protective cover surface structure schematic diagram of LED bulb of one embodiment of the invention;
Figure 16 is its protective cover front view of LED bulb of one embodiment of the invention;
Figure 17 is its protective cover side view of LED bulb of one embodiment of the invention.
The specific embodiment
Describe embodiments of the present invention in detail below with reference to drawings and Examples, how the application technology means solve technical problem to the present invention whereby, and the implementation procedure of reaching technique effect can fully understand and implements according to this.
The high heat conduction complex plastic of nanometer of the present invention, its raw materials comprises matrix and filler; Described matrix is ABS.
ABS resin is little yellow solid, and certain toughness is arranged, and density is about 1.04 ~ 1.06g/cm3.It is antiacid, the corrosive power of alkali, salt is more intense, also can tolerate to a certain extent organic solvent dissolution.ABS resin can be acted normally under-25 ℃ ~ 60 ℃ environment, and good mouldability is arranged, and the product surface that processes is bright and clean, is easy to dyeing and plating.Therefore it can be used to the articles for daily use such as appliance shell, toy.The high building blocks of common pleasure are exactly the ABS goods.
When the adjustment of three kinds of component ratios of blend, the physical property of ABS resin has certain variation: 1,3-butadiene provides low temperature ductility and impact resistance for ABS resin, but too much butadiene can reduce hardness, gloss and the flowability of resin; Acrylonitrile provides the character of the chemical attacks such as hardness, heat resistance, acidproof alkali salt for ABS resin; Styrene provides the flowability of hardness, processing and the fineness of product surface for ABS resin.In ABS resin, rubber grain is decentralized photo, is scattered in the resin continuous phase.When being hit, crosslinked rubber grain bears and absorbs this energy, makes stress dispersion, thereby stops the breach development, improves impart tear with this.
ABS is acrylonitrile, butadiene and cinnamic terpolymer, and A represents acrylonitrile, and B represents butadiene, and S represents styrene.Wherein, acrylonitrile accounts for 15% ~ 35%, and butadiene accounts for 5% ~ 30%, and styrene accounts for 40% ~ 60%, and modal ratio is A:B:S=20:30:50, and this moment, the ABS resin fusing point was 175 ℃.
When the adjustment of three kinds of component ratios of blend, the physical property of resin has certain variation: 1,3-butadiene provides low temperature ductility and impact resistance for ABS resin, but too much butadiene can reduce hardness, gloss and the flowability of resin; Acrylonitrile provides the character of the chemical attacks such as hardness, heat resistance, acidproof alkali salt for ABS resin; Styrene provides the flowability of hardness, processing and the fineness of product surface for ABS resin.In ABS resin, rubber grain is decentralized photo, is scattered in the SAN resin continuous phase.When being hit, crosslinked rubber grain bears and absorbs this energy, makes stress dispersion, thereby stops the breach development, improves impart tear with this.
ABS resin is as raw material take butadiene, styrene, acrylonitrile.Adopt emulsion polymerization to make polybutadiene latex, carry out emulsion graft copolymerization with this latex and styrene and acrylonitrile again, just make the ABS powder.Adopt suspension polymerization to make AS(SAN) emulsified material.Then with ABS powder, SAN emulsified material and the according to a certain ratio blending of various additive, through extruding pelletization, finally obtain the ABS resin product.
Embodiment 1: the ABS that the embodiment of the invention is used is acrylonitrile, butadiene and cinnamic terpolymer, and A represents acrylonitrile, and B represents butadiene, and S represents styrene; Wherein, acrylonitrile accounts for 25% ~ 30%, and butadiene accounts for 16% ~ 28%, and styrene accounts for 45% ~ 60%.
The high heat conduction complex plastic of nanometer of the present invention, the filler that comprises in the raw materials are one or more in the following compounds (or mixture): MgO, Al
2O
3, Si
3N
4, BN, high-purity carbon dust, AlN, CuO, KAl (SO
4)
212H
2O(alum), Al
2O
3-2SiO
2-2H
2O(kaolin).
Embodiment 2: the MgO that the embodiment of the invention is used is the nano-MgO particle.
The nano-powder material industrialized producing technology requires the preparation method simple, and production cost is suitable, good reproducibility, and powder granularity is even, product purity is high, the reunion degree is low.A lot of about the synthetic method of nano magnesia in the prior art, but in fact can be applied to industrial less.The one, because problems such as equipment, cost, raw material, scale, investments; The 2nd, some technique still is in the laboratory research stage, and the realization suitability for industrialized production is had any problem, even some may not realize suitability for industrialized production.
Present embodiment adopts indoor temperature solid phase method to prepare the MgO particle.
Solid-phase reaction of the present invention has overcome conventional wet and has prepared the agglomeration traits that the bitter earth nano particle exists, and has reaction and need not the advantages such as solvent, productive rate is high, reaction condition is easy; And overcome that the efficient that exists in original solid-phase reaction is low, the shortcoming of the easy oxidation distortion of particle.
The concrete grammar that the present embodiment indoor temperature solid phase method prepares the MgO particle is: with MgCI solution and Na
2CO
3(raw material mass mixture ratio 1:1.2) solution, take PVA solution (poly-vinyl alcohol solution) as modifier, reaction produces precipitation MgCO
3Precipitation, then under 75 ~ 85 ℃ of constant temperature, the mode that transforms by precipitation has obtained alkali formula carbon formula magnesium presoma.50 ~ 60 ℃ left standstill alkali formula carbon formula magnesium presoma precipitation 24-30 hour.Pass at the Ar air-flow at last, temperature is calcination under 600 ~ 650 ℃ the condition, has obtained the nano-MgO particle.Adopt PVA as high molecular surfactant, controlled the reunion of particle, prepared nano-MgO particle dispersion is better, is cubic structure, and is substantially spherical in shape, and its particle diameter is 25-35nm.
Embodiment 3-1: the Si that the embodiment of the invention is used
3N
4Be the nano silicon nitride silicon grain, satisfy following index:
Embodiment 3-2: the Si that the embodiment of the invention is used
3N
4Can also be highly heat-conductive silicon nitride.Common silicon nitride has randomly-oriented sintering structure.Highly heat-conductive silicon nitride is to add kind of crystal grain (diameter 1um, long 3-4um) at material powder (below the particle diameter 1um), makes the sub-orientations of this all crystal grain, forms the fibrous silicon nitride structure that reaches 100um with orientation.Because the formation of filamentary structure, thermal conductivity factor presents each diversity, and thermal conductivity factor is 120w/ (mK) on the orientation texture direction, is 3 times of common silicon nitride, is equivalent to the thermal conductivity factor of steel.
Embodiment 4: the BN that the embodiment of the invention is used is the nano silicon nitride boron particles, satisfies following index:
Embodiment 5: the high-purity carbon dust that the embodiment of the invention is used is: the 10000 high pure carbon powder of pulling together to produce in the Dongguan.Performance indications are:
| Fixed carbon: | 99.99% | Specification: | 10000 orders |
| The trade mark: | 18925457433 | Moisture: | 0.015% |
| Dilation: | 1-2 doubly | The oversize granularity: | 0.0006% |
| Ash content: | 0.85 | Volatile matter: | 0.01％ |
| The screenings granularity: | 0.0005% | ? | ? |
Embodiment 6: the AlN filler that the embodiment of the invention is used is: AlN whisker and AlN particle are done filler.In the embodiment of the invention, as matrix, AlN whisker and AlN particle (6um is following) are filled, and obtain the composite of the highest thermal conductivity 28.2W/ (m.K) with ABS, and AlN whisker and AlN particle ratio (mass ratio) are l:40 ~ 60.What the present invention had further studied filler mixes effect and coupling agent to the impact of composite heat conductivility.With AlN whisker and the AlN mix particles of adequate rate, give composite higher heat-conductivity and lower thermal coefficient of expansion than independent with whisker and particle.By using the coupling agent silane treatment, the thermal conductivity of the ABS composite of AlN particulate reinforcement improves 98%, and it is because by improving the interface of matrix and particle, the contact resistance of filler-matrix reduces that thermal conductivity improves.
Embodiment 7: the CuO that the embodiment of the invention is used is: the nano cupric oxide particle.Its performance indications are:
Outward appearance black powder purity (%) 〉=99.5 granularity (nm) 40 specific area m2/g70-80 moisture (%)≤0.05 hydrochloric acid insoluble substances (%)≤0.10.
Embodiment 8: the high heat conduction complex plastic of embodiment of the invention nanometer prepares by following steps:
The first step, synthetic rubber: by plastic modified mechanical pelleting, with the matrix among the embodiment 1-8, auxiliary material, and coupling agent is made plastic grains;
The parts by weight of described raw material are: ABS63-85 part, MgO26-31 part, Al
2O
316-21 part, Si
3N
44-7 part, BN7-11 part; High-purity carbon dust 15-18 part; AlN6-10 part, CuO8-15 part; Alum 3-5 part, kaolin 3-5 part; Coupling agent: 2-4 part.
Second step, moulding: by the injection machine injection mo(u)lding;
The 3rd step, baking material: the plastic cement after the moulding is added in the injecting machine material tube baking material temperature degree 110-130 degree 2-4 hour; Be the injection moulding pressurizations when spending of 220 degree-260 in temperature again, injection moulding pressurization scope is 50-65kgf/ ㎝
2, the time is 45-50 second, carries out injection moulding.
Embodiment 9: performance test and sign experiment contrast.
Heat conductivility: (GB9342288) carry out with reference to national standard " plastics Determination of conductive coefficients method ", specimen finish is 100mm; The employing steady state method is measured; Tensile property test: (GB1040292) carry out with reference to national standard " plastic tensile method for testing performance ", adopt I type sample, impact property test: (GB1043293) carry out by national standard " plastics charpy impact test method ", adopt the non-notch impact specimen; Scanning electron microscope analysis: after the tensile sample stretch broken, fracture surface of sample surface metal spraying is observed in the JXA2840 SEM.
The sample preparation
The preliminary treatment of raw material: baking oven is put in the inorganic filler that will add coupling agent, and drying condition is 100 ° of lower oven dry 3～5h, make coupling agent and filler grain further combined with.Must carry out drying to pellet before the ABS moulding, drying condition is at 120 ℃ of oven dry 4～6h.
Extruding pelletization: the resin after will drying, filler are put into height and are stirred the machine batch mixing, with TE234 double screw extruder extruding pelletization.
Injection moulding: with plastic injection agent injection stretch sample, impact specimen, carry out Mechanics Performance Testing.
The preparation of heat conduction sample: with the disk mold heated to 120 of Φ 100mm ℃, then the molten mass in the injection machine is expelled in the disk mould shaped by fluid pressure under the pressure of 11MPa with hydraulic press.
Formula Design: with ABS as matrix; With in the following raw material one or more as filler: MgO, Al
2O
3, Si
3N
4, BN, high-purity carbon dust, AlN, CuO, KAl (SO
4)
212H
2O(alum), Al
2O
3-2SiO
2-2H
2O(kaolin); Be total to 12 kinds of designs with VTES (A-151) as coupling agent, see the following form.The thermal conductivity factor of pure ABS matrix is 0.24W/m.K.
Filler 1:ABS63 part, MgO26 part, Al
2O
316 parts, Si
3N
4(nano particle) 4 parts, BN7 part; 15 parts of high-purity carbon dusts; AlN6 part, CuO8 part; 3 parts in alum, 3 parts of kaolin; 2 parts of coupling agents { VTES (A-151) }.
Filler 2:ABS65 part, MgO27 part, Al
2O
317 parts, Si
3N
4(high-termal conductivity) 5 parts, BN8 part; 16 parts of high-purity carbon dusts; 3 parts of coupling agents { VTES (A-151) }.
Filler 3:ABS70 part, MgO28 part, Al
2O
318 parts, Si
3N
4(nano particle) 6 parts, BN10 part; CuO12 part; 3 parts in alum, 4 parts of kaolin; 2 parts of coupling agents { VTES (A-151) }.
Filler 4:ABS72 part, MgO29 part, Al
2O
318 parts, Si
3N
4(nano particle) 6 parts, BN7-11 part; 16 parts of high-purity carbon dusts; AlN9 part, CuO10 part; 5 parts in alum, 5 parts of kaolin; 2 parts of coupling agents { VTES (A-151) }.
Filler 5:ABS82 part, MgO30 part, Al
2O
318 parts, Si
3N
4(high-termal conductivity) 6 parts, BN8 part; 16 parts of high-purity carbon dusts; AlN8 part, CuO9 part; 4 parts in alum, 4 parts of kaolin; 3 parts of coupling agents { VTES (A-151) }.
Filler 6:ABS80 part, MgO28 part, Al
2O
317 parts, Si
3N
4(high-termal conductivity) 5 parts, BN8 part; 17 parts of high-purity carbon dusts; AlN8 part, CuO12 part; 5 parts in alum, 3 parts of kaolin; 3 parts of coupling agents { VTES (A-151) }.
Filler 7:ABS83 part, MgO27 part, Al
2O
318 parts, Si
3N
4(nano particle) 6 parts, BN10 part; 16 parts of high-purity carbon dusts; AlN9 part, CuO11 part; 2 parts of coupling agents { VTES (A-151) }.
Filler 8:ABS84 part, MgO27 part, BN8 part; 16 parts of high-purity carbon dusts; AlN9 part, CuO13 part; 3 parts in alum, 3 parts of coupling agents { VTES (A-151) }.
Filler 9:ABS79 part, MgO28 part, Al
2O
317 parts, Si
3N
4(high-termal conductivity) 5 parts, BN8 part; 17 parts of high-purity carbon dusts; AlN9 part, CuO14 part; 4 parts of kaolin; 2 parts of coupling agents { VTES (A-151) }.
Filler 10:ABS81 part, MgO31 part, Al
2O
321 parts, Si
3N
4(nano particle) 7 parts, BN11 part; 17 parts of high-purity carbon dusts; AlN7 part, CuO11 part; 3 parts in alum, 3 parts of kaolin; 3 parts of coupling agents { VTES (A-151) }.
Filler 11:ABS70 part, MgO28 part, Si
3N
4(high-termal conductivity) 7 parts, BN8 part; 16 parts of high-purity carbon dusts; AlN9 part, CuO9 part; 4 parts of coupling agents { VTES (A-151) }.
Filler 12:ABS85 part, MgO31 part, Al
2O
321 parts, Si
3N
4(high-termal conductivity) 7 parts, BN11 part; 18 parts of high-purity carbon dusts; AlN10 part, CuO15 part; 5 parts in alum, 5 parts of kaolin; 4 parts of coupling agents { VTES (A-151) }.
Various prescription heat conductivilitys and mechanical property
The high heat conduction complex plastic of nanometer of the present invention is that thermal conductivity can be up to the thermoplastic composite resin of 21.78 ~ 32.45w/mK.The technology of the present invention is utilized unique MOLECULE DESIGN, has improved the interaction force of molecule between thermoplastic plastic and the filler, and filler high efficiency contact has each other formed the heat passage, has increased substantially thermal conductivity.
Embodiment 10: shown in Fig. 1 ~ 17, be respectively: its assembled state structural representation of the LED bulb of one embodiment of the invention; Its split status architecture schematic diagram of LED bulb; Its lamp socket surface structure schematic diagram of LED bulb; Its lamp socket front view of LED bulb; Its lamp base part view of LED bulb; Its bayonet type socket surface structure schematic diagram of bulb; Its bayonet type socket front view of LED bulb; Its bayonet type socket side view of LED bulb; Its radiator surface structure schematic diagram of LED bulb; Its radiator view of LED bulb; Its heat sink side view of LED bulb; Its aluminium base front view of LED bulb; Its rate aluminium base side view of LED bulb; Its LED lamp pearl structural representation of LED bulb; Its protective cover surface structure schematic diagram of LED bulb; Its protective cover front view of LED bulb; Its protective cover side view of LED bulb.
In Fig. 1 ~ 17, each Reference numeral is respectively: 1 is lamp socket, and 2 is the bayonet type socket, and 3 is radiator, and 4 is aluminium base, and 5 is LED lamp pearl, and 6 is protective cover.
The LED bulb that described high heat conduction plastic cement is made comprises lamp socket 1, radiator 3, aluminium base 4, LED lamp pearl 5 and protective cover 6, also comprises bayonet type socket 2; Described lamp socket 1 is connected with radiator 3 by bayonet type socket 2; Described LED lamp pearl 1 is arranged on the aluminium base 4; The one side that described aluminium base 4 is provided with LED lamp pearl 5 is connected with protective cover 6, and its another side is connected with radiator 3; Described bayonet type socket 2 by the bayonet slot that arranges on the bayonet socket that arranges on it and the lamp socket be attached thereto connect fixing; Described radiator 3 is comprised of fin; Described fin adopts arcuate structure and is evenly distributed; Described protective cover 6 adopts the light-transmitting materials structure; Described protective cover 6 is made as the hemisphere face shape.
The installation method of described LED bulb may further comprise the steps: adopt the Auto-mounting mode to be installed on the aluminium base 4 LED lamp pearl 5; Adopt the Auto-mounting mode to be connected with protective cover 6 and radiator 3 respectively the aluminium base 4 that LED lamp pearl 5 is housed; With lamp socket 1 by bayonet type socket 2 by the manual assembly installation that is connected with radiator 3.
Embodiment 11: shown in Fig. 1 ~ 17, be respectively: its assembled state structural representation of the LED bulb of one embodiment of the invention; Its split status architecture schematic diagram of LED bulb; Its lamp socket surface structure schematic diagram of LED bulb; Its lamp socket front view of LED bulb; Its lamp base part view of LED bulb; Its bayonet type socket surface structure schematic diagram of bulb; Its bayonet type socket front view of LED bulb; Its bayonet type socket side view of LED bulb; Its radiator surface structure schematic diagram of LED bulb; Its radiator view of LED bulb; Its heat sink side view of LED bulb; Its aluminium base front view of LED bulb; Its rate aluminium base side view of LED bulb; Its LED lamp pearl structural representation of LED bulb; Its protective cover surface structure schematic diagram of LED bulb; Its protective cover front view of LED bulb; Its protective cover side view of LED bulb.
In Fig. 1 ~ 17, each Reference numeral is respectively: 1 is lamp socket, and 2 is the bayonet type socket, and 3 is radiator, and 4 is aluminium base, and 5 is LED lamp pearl, and 6 is protective cover.
Its LED bulb of making of the described high heat conduction plastic cement of present embodiment comprises lamp socket 1, radiator 3, aluminium base 4, LED lamp pearl 5 and protective cover 6, in addition, also comprises bayonet type socket 2; Described lamp socket 1 is connected with radiator 3 by bayonet type socket 2; Described LED lamp pearl 5 is arranged on the aluminium base 4; The one side that described aluminium base 4 is provided with LED lamp pearl 5 is connected with protective cover 6, and its another side is connected with radiator 3.
The bayonet slot of described bayonet type socket 2 by setting on the bayonet socket that arranges on it and the lamp socket 1 be attached thereto connect fixing.
Described radiator 3 is comprised of fin.
Described fin adopts arcuate structure and is evenly distributed.
Described protective cover 6 adopts the light-transmitting materials structure.
Described protective cover 6 is made as the hemisphere face shape.
Described its installation method of LED bulb may further comprise the steps: adopt the Auto-mounting mode to be installed on the aluminium base 4 LED lamp pearl 5; Adopt the Auto-mounting mode to be connected with protective cover 6 and radiator 3 respectively the aluminium base 4 that LED lamp pearl 5 is housed; With lamp socket 1 by bayonet type socket 2 by the manual assembly installation that is connected with radiator 3.
This intellectual property of primary enforcement that all are above-mentioned is not set restriction this new product of other forms of enforcement and/or new method.Those skilled in the art will utilize this important information, and foregoing is revised, to realize similar implementation status.But all modifications or transformation belong to the right of reservation based on new product of the present invention.
The above only is preferred embodiment of the present invention, is not to be the restriction of invention being made other form, and any those skilled in the art may utilize the technology contents of above-mentioned announcement to be changed or be modified as the equivalent embodiment of equivalent variations.But every technical solution of the present invention content that do not break away to any simple modification, equivalent variations and remodeling that above embodiment does, still belongs to the protection domain of technical solution of the present invention according to technical spirit of the present invention.
Claims (10)
1. a LED bulb is characterized in that, comprising: lamp socket, radiator, aluminium base, LED lamp pearl and protective cover.
2. described LED bulb according to claim 1 is characterized in that described LED bulb further has the bayonet type socket; Described lamp socket is connected with described radiator by the bayonet type socket; Described LED lamp pearl is arranged on the described aluminium base; Described aluminium base is provided with described LED lamp pearl, and the one side of described aluminium base is connected with described protective cover, and the another side of described aluminium base is connected with radiator; Described bayonet type socket by the bayonet slot that arranges on the bayonet socket that arranges on it and the lamp socket be attached thereto connect fixing.
3. described LED bulb according to claim 1 and 2 is characterized in that, the material that described radiator adopts is the high heat conduction complex plastic of each described nanometer in the claim 6 ~ 10.
4. the installation method such as the described LED bulb of any one in the claim 1 ~ 3 is characterized in that, may further comprise the steps: adopt the Auto-mounting mode to be installed on the aluminium base LED lamp pearl; Adopt the Auto-mounting mode to be connected with described protective cover and described radiator respectively the aluminium base that LED lamp pearl is housed; With lamp socket by the bayonet type socket by the manual assembly installation that is connected with radiator.
5. the radiator that uses in the LED bulb is characterized in that, the material that described radiator adopts is the high heat conduction complex plastic of each described nanometer in the claim 5 ~ 10.
6. the high heat conduction complex plastic of nanometer is characterized in that the raw material of the high heat conduction complex plastic of described nanometer comprises matrix and filler; Described matrix is ABS; Comprise that filler comprises: MgO, Al
2O
3, Si
3N
4And BN; The parts by weight of described raw material are: ABS63-85 part, MgO26-31 part, Al
2O
316-21 part, Si
3N
44-7 part, BN7-11 part.
7. the high heat conduction complex plastic of described nanometer according to claim 6 is characterized in that described filler further comprises: high-purity carbon dust 14-19 part, AlN5-12 part, CuO9-16 part.
8. according to claim 6 or the high heat conduction complex plastic of 7 described nanometers, it is characterized in that described filler further comprises: alum 2-6 part, kaolin 2-6 part.
9. the high heat conduction complex plastic of each described nanometer is characterized in that according to claim 6 ~ 8, and described ABS is acrylonitrile, butadiene and cinnamic terpolymer, and A represents acrylonitrile, and B represents butadiene, and S represents styrene; Wherein, acrylonitrile accounts for 25% ~ 30%, and butadiene accounts for 16% ~ 28%, and styrene accounts for 45% ~ 60%; Described filler AlN is: AlN whisker and AlN particle are done filler.
10. the high heat conduction complex plastic of each described nanometer is characterized in that according to claim 6 ~ 9, prepares by following steps:
The first step, synthetic rubber: by plastic modified mechanical pelleting, with the matrix among the embodiment 1-8, auxiliary material, and coupling agent is made plastic grains;
The parts by weight of described raw material are: ABS63-85 part, MgO26-31 part, Al
2O
316-21 part, Si
3N
44-7 part, BN7-11 part; High-purity carbon dust 15-18 part; AlN6-10 part, CuO8-15 part; Alum 3-5 part, kaolin 3-5 part; Coupling agent: 2-4 part;
Second step, moulding: by the injection machine injection mo(u)lding;
The 3rd step, baking material: the plastic cement after the moulding is added in the injecting machine material tube baking material temperature degree 110-130 degree 2-4 hour; Be the injection moulding pressurizations when spending of 220 degree-260 in temperature again, injection moulding pressurization scope is 50-65kgf/ ㎝
2, the time is 45-50 second, carries out injection moulding.
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| CN201210583105.5A CN103062656B (en) | 2012-12-26 | 2012-12-26 | Light-emitting diode (LED) lamp bulb and installing method thereof |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201210583105.5A CN103062656B (en) | 2012-12-26 | 2012-12-26 | Light-emitting diode (LED) lamp bulb and installing method thereof |
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Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103899954A (en) * | 2014-03-12 | 2014-07-02 | 浙江阳光照明电器集团股份有限公司 | LED bulb lamp capable of achieving automatic assembly |
| CN105423168A (en) * | 2014-09-17 | 2016-03-23 | 叶际爽 | LED module |
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| JPS61221262A (en) * | 1985-03-27 | 1986-10-01 | Fujikura Ltd | Method for processing thermoplastic resin |
| CN101333320A (en) * | 2007-06-25 | 2008-12-31 | 晟茂（青岛）先进材料有限公司 | Conductive heat conducting material and method for manufacturing same |
| CN201407535Y (en) * | 2009-03-31 | 2010-02-17 | 保定电谷科技有限公司 | High-power LED bulb lamp |
| CN102286207A (en) * | 2011-06-22 | 2011-12-21 | 四川大学 | Thermoplastic polymer based thermal conductive composite and preparation method thereof |
| CN202281078U (en) * | 2011-09-28 | 2012-06-20 | 董金浩 | LED lamp with transparent lampshade |
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2012
- 2012-12-26 CN CN201210583105.5A patent/CN103062656B/en not_active Expired - Fee Related
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS61221262A (en) * | 1985-03-27 | 1986-10-01 | Fujikura Ltd | Method for processing thermoplastic resin |
| CN101333320A (en) * | 2007-06-25 | 2008-12-31 | 晟茂（青岛）先进材料有限公司 | Conductive heat conducting material and method for manufacturing same |
| CN201407535Y (en) * | 2009-03-31 | 2010-02-17 | 保定电谷科技有限公司 | High-power LED bulb lamp |
| CN102286207A (en) * | 2011-06-22 | 2011-12-21 | 四川大学 | Thermoplastic polymer based thermal conductive composite and preparation method thereof |
| CN202281078U (en) * | 2011-09-28 | 2012-06-20 | 董金浩 | LED lamp with transparent lampshade |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
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| CN103899954A (en) * | 2014-03-12 | 2014-07-02 | 浙江阳光照明电器集团股份有限公司 | LED bulb lamp capable of achieving automatic assembly |
| CN105423168A (en) * | 2014-09-17 | 2016-03-23 | 叶际爽 | LED module |
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|---|---|
| CN103062656B (en) | 2015-06-10 |
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