CN103037627A

CN103037627A - Method of removing copper in middle of wall of hole of printed circuit board (PCB) board by using T-shaped tool

Info

Publication number: CN103037627A
Application number: CN2012104962105A
Authority: CN
Inventors: 马夕松; 秦仪
Original assignee: HUSHI ELECTRONICS CO Ltd
Current assignee: HUSHI ELECTRONICS CO Ltd; Wus Printed Circuit Co Ltd
Priority date: 2012-11-29
Filing date: 2012-11-29
Publication date: 2013-04-10

Abstract

The invention discloses a method of removing copper in the middle of a wall of a hole of a printed circuit board (PCB) board by using a T-shaped tool. The method of removing copper in the middle of the wall of the hole of the PCB board by using the T-shaped tool comprises the following steps: (1) through-holes with uniform bore diameter are drilled in the PCB board, (2) copper layers are deposited in the wall of the hole of the through-holes, (3) the T-shaped tool are entered a direction inside the through-holes needing to remove the copper, (4) a tool bit of the T-shaped tool fits the inner wall to rotate to remove all or parts of copper connection which is needed to remove. The method of removing copper in the middle of the wall of the hole of the PCB board by using the T-shaped tool contributes to adding density of PCB board arrangement of wires and plug-in modules, promotes upgrade of the PCB board correlation technique, improves product yield to more than 50%, and contributes to reducing cost of raw material, rate of remade, and processing charges. The method of removing copper in the middle of the wall of the hole of the PCB board by using the T-shaped tool shortens process flows, simplifies the flows, and saves labor power. Simultaneously, an existing technique existing all processing risks such as drillroid easy to break needles, dislocation to drill holes, and low in flowing of the holes are largely reduced in the method of removing copper in the middle of the wall of the hole of the PCB board by using the T-shaped tool.

Description

Utilize T-shaped cutter to remove the method for the copper on the hole wall of pcb board stage casing

Technical field

The present invention relates to the removal method of the copper on the hole wall of a kind of pcb board stage casing, relate in particular to a kind of method of utilizing T-shaped cutter to remove the copper on the hole wall of pcb board stage casing.

Background technology

Hole on the existing pcb board and the copper processing method on the hole wall comprise as shown in Figure 1:

(1) for the first time boring: design attitude bores macropore A on the pcb board upper side;

(2) for the second time boring: relative position bores macropore B on the pcb board downside;

(3) for the third time boring: on the pcb board upper side, extend the macropore A on the upper side, side surface direction is bored aperture C downwards;

(4) the 4th boring: on the pcb board downside, extend the macropore B on the downside, upwards side surface direction is bored aperture D, and realization aperture D is communicated with aperture C's;

(5) copper layer: the hole wall (hole wall that comprises macropore A, macropore B, aperture C and aperture D) at pcb board passes through chemical copper, chemical copper+plating thin copper or other method covered with the copper layer;

(6) the 5th boring: on the pcb board upper side, the copper layer on the aperture C hole wall is removed in side surface direction boring downwards;

(7) the 6th boring: on the pcb board downside, the copper layer on the aperture D hole wall is removed in upwards side surface direction boring, realizes that the copper on the hole wall of pcb board stage casing is removed.

There are the following problems for said method:

1, because the aperture of aperture C and aperture D is less, hole depth is large and the ladder that has macropore and aperture, easy residual dust in the hole;

2, because the aperture of aperture is less, reaches easy residual dust and cause chemical copper and follow-up plating difficulty, even do not deposit upper copper layer;

3, owing to bore macropore, bore aperture and remove the bit diameter that each step of copper layer uses and have certain drop, if can not accurately hold this drop and locational precision, cause easily and should not bore that the copper that removes is drilled to be removed, maybe the copper that removes of this brill does not have drilled removing;

4, owing to bore the drill bit of aperture and can not unrestrictedly dwindle, the drill bit that can minimum use at present as the too small drill bit below the 0.30mm(0.30mm occur easily boring partially, broken needle, the twice pair of problem such as brill decentraction); And the drill bit of removing the copper layer is larger than the drill bit that bores aperture, just can guarantee to bore the copper except on the hole wall, if but the excessive copper that then can lose on the macropore hole wall of drill bit, thus cause the aperture of macropore further to dwindle, finally cause the wiring density of pcb board not increase;

5, process often, efficient is low;

When 6, electroplating, because the aperture of aperture is less, increased the difficulty of chemical plating and electro-coppering;

7, processing occurs easily in the junction of macropore and aperture unusually, dust or burr plugging hole are arranged, cause easily subsequent chemistry plating and electro-coppering unusual;

8, this centre is little, the hole that two is large, and operation after being shaped if there is dust to fall into, also reaches to snap in wherein easily and is difficult to out, causes subsequent chemistry plating and electro-coppering unusual.

Summary of the invention

Goal of the invention: in order to overcome the deficiencies in the prior art, the invention provides a kind of method of utilizing the copper on the hole wall of T-shaped cutter removal pcb board stage casing that number of times is few, difficulty of processing is low and the subsequent handling risk is low of processing.

Technical scheme: for achieving the above object, the technical solution used in the present invention is:

Utilize T-shaped cutter to remove the method for the copper on the hole wall of pcb board stage casing, comprise the steps:

(1) gets out the through hole of uniform pore size at pcb board;

(2) copper layer on the hole wall of through hole;

(3) T-shaped cutter is extend into the position that needs the copper removed to connect in the through hole;

(4) with the cutter head applying inwall rotation of T-shaped cutter, brill connects except all or part of copper that needs to remove.

As a kind of optimal way, in the described step (4), with the rotation of the cutter head applying inwall of T-shaped cutter and cooperate along the axial moving movement of through hole, strike off the copper connection that all needs to remove.

As another kind of optimal way, in the described step (3), T-shaped cutter is extend into upper circle position or the Xia Quan position that needs the copper removed to connect in the through hole; In the described step (4), with the cutter head applying inwall rotation of T-shaped cutter, the lower circle copper that the upper circle copper that the copper that striking off needs removal connects and the copper that need to remove connect.In this mode, the copper layer between described upper circle copper and the lower circle copper can not gone up tin by follow-up plating, uses the mode of alkali etching to remove.

Beneficial effect: the method for utilizing T-shaped cutter to remove the copper on the hole wall of pcb board stage casing provided by the invention, help to increase pcb board wiring and package density, promote the upgrading of pcb board correlation technique, thereby reduce the consumption such as material, processing electric energy, manpower; Improve product yield and reach more than 50%, help the reduction of the cost of raw material, rework rate, processing charges; Shorten work flow, be improved to+1 severity control of 1 boring by existing 6 borings and drag for the hole, simplified flow process, saved manpower; Simultaneously, the various processing risks that exist in the existing method such as the easily broken pin of little drill bit,, easy plug-hole low to boring dislocation, hole patency etc., all greatly reduce in the method.

Description of drawings

Fig. 1 is existing methodical flow process chart;

Fig. 2 is the flow process chart of the inventive method;

Fig. 3 is the action schematic diagram of T-shaped cutter in the inventive method.

Embodiment

Below in conjunction with accompanying drawing the present invention is further described.

Such as Fig. 2, Figure 3 shows that a kind of method of utilizing T-shaped cutter to remove the copper on the hole wall of pcb board stage casing, comprise the steps:

(1) gets out the through hole of uniform pore size at pcb board;

(2) copper layer on the hole wall of through hole;

Connect if adopt to bore the copper of removing except whole needs, then in the described step (4), with the cutter head applying inwall rotation of T-shaped cutter and cooperate along the axial moving movement of through hole, strike off the copper connection that all needs to remove.

Connect if adopt to bore the copper of removing except the needs of part, then in the described step (3), T-shaped cutter is extend into upper circle position or the Xia Quan position that the copper that needs in the through hole to remove connects; In the described step (4), with the rotation of the cutter head applying inwall of T-shaped cutter, bore the upper circle copper that connects except the copper that needs to remove and lower circle copper that the copper that needs to remove connects.In this mode, the copper layer between described upper circle copper and the lower circle copper can not gone up tin by follow-up plating, uses the mode of alkali etching to remove.

The above only is preferred implementation of the present invention; be noted that for those skilled in the art; under the prerequisite that does not break away from the principle of the invention, can also make some improvements and modifications, these improvements and modifications also should be considered as protection scope of the present invention.

Claims

1. utilize T-shaped cutter to remove the method for the copper on the hole wall of pcb board stage casing, it is characterized in that: comprise the steps:

(1) gets out the through hole of uniform pore size at pcb board;

(2) copper layer on the hole wall of through hole;

2. the method for utilizing T-shaped cutter to remove the copper on the hole wall of pcb board stage casing according to claim 1, it is characterized in that: in the described step (4), with the rotation of the cutter head applying inwall of T-shaped cutter and cooperate along the axial moving movement of through hole, bore except the copper connection that all need to remove.

3. the method for utilizing T-shaped cutter to remove the copper on the hole wall of pcb board stage casing according to claim 1 is characterized in that: in the described step (3), T-shaped cutter is extend into upper circle position or the Xia Quan position that the copper that needs in the through hole to remove connects; In the described step (4), with the cutter head applying inwall rotation of T-shaped cutter, the lower circle copper that the upper circle copper that the copper that striking off needs removal connects and the copper that need to remove connect.

4. the method for utilizing T-shaped cutter to remove the copper on the hole wall of pcb board stage casing according to claim 3, it is characterized in that: the copper layer between described upper circle copper and the lower circle copper is removed by the alkali etching mode.