CN103037622A - Circuit board provided with buried resistor - Google Patents
Circuit board provided with buried resistor Download PDFInfo
- Publication number
- CN103037622A CN103037622A CN2013100025288A CN201310002528A CN103037622A CN 103037622 A CN103037622 A CN 103037622A CN 2013100025288 A CN2013100025288 A CN 2013100025288A CN 201310002528 A CN201310002528 A CN 201310002528A CN 103037622 A CN103037622 A CN 103037622A
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- resistance
- grille
- electrode
- circuit board
- resistance area
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Abstract
The invention discloses a circuit board provided with a buried resistor, which comprises an insulation substrate, at least one pair of electrodes and a resistance layer. The at least one pair of electrodes is arranged on the surface of the insulation substrate; and each pair of electrodes includes a first electrode and a second electrode. The first electrode comprises a first main body and a first guard fence connected with the first main body. The second electrode is opposite to the first electrode, and forms an interval with the first electrode; and the second electrode comprises a second main body and a second guard fence connected with the second main body. The resistance layer is arranged on the insulation substrate among the first main body, the second main body, the first guard fence and the second guard fence. According to the circuit board provided with the buried resistor, the resistor is buried in the circuit board; compared with a circuit board produced by using the SMT (Surface Mounting Technology) technology, the circuit board provided with the buried resistor reduces welding points of devices, improves the stability of the assembled devices, reduces the signal crosstalk, and satisfies the increasingly stringent product requirements of being lighter and thinner.
Description
Technical field
The present invention relates to the circuit board technology field, particularly a kind of circuit board with built-in type resistance.
Background technology
Since on the market consumption electronic products for example the demand of mobile phone, notebook computer, digital camera and game machine significantly improve and frivolous, high frequency and the multi-functional development trend that has become electronic product.In order to make electronic product more frivolous, functional good, the integrated level of electronic product is more and more higher, usually needs to integrate more electronic component, such as resistance, electric capacity etc. on circuit board.
At present, the manufacture view of circuit board mainly utilizes surface mounting technology (surface mounted technology, SMT) or plug-in mounting technique the electronic components such as resistance are incorporated in the printed circuit board (PCB), but the method easily produces impedance, cause signal cross-talk, and can not satisfy the frivolous requirement of product increasingly stringent.
Therefore, be necessary to provide improved technical scheme to overcome the above technical problem that exists in the prior art.
Summary of the invention
The main technical problem to be solved in the present invention provides a kind of circuit board with built-in type resistance, and it can reduce signal cross-talk, satisfies the frivolous requirement of product increasingly stringent.
For solving the problems of the technologies described above, the invention provides a kind of circuit board with built-in type resistance, it comprises insulated substrate, at least one pair of electrode and resistive layer.Described at least one pair of electrode is located at the surface of described insulated substrate, and each comprises the first electrode and the second electrode to electrode.Described the first electrode comprises the first noumenon and the first grille that links to each other with the first noumenon.Described the second electrode and interval relative with described the first electrode arranges, and described the second electrode comprises the second body and the second grille that links to each other with described the second body.Described resistive layer is formed on the insulated substrate between the first noumenon, the second body, the first grille and the second grille.
According to one embodiment of present invention, described the first grille and described the second grille are rectangle, and the first grille extends to form to the second electrode one by the first noumenon, and the second grille is extended to form to the first electrode one by the second body.
According to one embodiment of present invention, described resistive layer comprises the first resistance area, the second resistance area and the 3rd resistance area.The width of described the first resistance area equates with the width of described the first grille, and the length of described the first resistance area is the spacing of described the first grille and described the second body.The width of described the second resistance area be the width of described the first noumenon and described the first grille and the second grille width and difference, the length of described the second resistance area is the spacing of described the first noumenon and described the second body.The width of described the 3rd resistance area equates with the width of described the second grille, and the length of described the 3rd resistance area is the spacing of described the second grille and described the first noumenon.
According to one embodiment of present invention, the resistance of described the first resistance area, the second resistance area and the 3rd resistance area is equal to the merchant's of the length of the resistivity of this resistance area and this resistance area and width product.
According to one embodiment of present invention, the inverse of the resistance of described resistive layer is the sum reciprocal of reciprocal and described the 3rd resistance area resistance of the inverse of described the first resistance area resistance, described the second resistance area resistance.
According to one embodiment of present invention, described resistive layer is carbon ink layer.
Circuit board with built-in type resistance of the present invention will be embedded in the resistance in the circuit board, compare with the circuit board that utilizes the manufacturing of SMT technology, reduce the pad of components and parts, improved the stability after components and parts are assembled. reduce signal cross-talk, and satisfied the frivolous requirement of product increasingly stringent.
By the detailed description below with reference to accompanying drawing, it is obvious that other side of the present invention and feature become.But should be known in the only purpose design for explaining of this accompanying drawing, rather than as the restriction of scope of the present invention, this is because it should be with reference to additional claim.Should also be appreciated that, unless otherwise noted, the unnecessary accompanying drawing of drawing to scale, they only try hard to illustrate conceptually structure described herein and flow process.
Description of drawings
Below in conjunction with accompanying drawing, the specific embodiment of the present invention is described in detail.
Fig. 1 is the structural representation of the circuit board with built-in type resistance of one embodiment of the invention.
Embodiment
For above-mentioned purpose of the present invention, feature and advantage can be become apparent more, below in conjunction with accompanying drawing the specific embodiment of the present invention is described in detail.
Fig. 1 is the structural representation of the circuit board with built-in type resistance of one embodiment of the invention.As shown in Figure 1, circuit board 10 comprises insulated substrate 11, at least one pair of electrode 12 and resistive layer 13.Each is formed at the surface of insulated substrate 11 to electrode 12.Each includes the first electrode 120 and the second electrode 121 to electrode 12.The first electrode 120 comprises the first noumenon 120a and the first grille 120b that links to each other with the first noumenon 120a.The second electrode 121 and the 120 relative and interval settings of the first electrode, the second electrode 121 comprises the second body 121a and the second grille 121b that links to each other with the second body 121a.Resistive layer 13 is formed on the insulated substrate 11 between the first noumenon 120a, the second body 121a, the first grille 120b and the second grille 121b.Wherein, the first noumenon 120a, the second body 121a, the first grille 120b and the second grille 121b are rectangle, and the first grille 120b is extended to form to the second electrode 121 one by the first noumenon 120a, the second grille 121b is extended to form to the first electrode 120 one by the second body 121a, that is to say, the first grille 120b and the second grille 121b are between the first noumenon 120a and the second body 121a, so, the first grille 120b and the second grille 121b can prevent that in course of processing resistive layer 13 is subjected to artificial or machinery scraping and the fracture that causes.
In an embodiment of the invention, the resistivity of supposing resistive layer 13 is ρ, the width of the first electrode 120 and the first electrode 121 is C, the spacing of the first noumenon 120a and the second body 121a is B, the length of the first grille 120b is that the width of E1, the first grille 120b is F1, the length of the second grille 121b is that the width of E2, the second grille 121b is F2, and then the width of the first resistance area 130 is F1, and the length of the first resistance area is B-E1.The width of the second resistance area 131 is C-F1-F2, and the length of the second resistance area 131 is B.The width of the 3rd resistance area 132 is F2, and the width of the 3rd resistance area 132 is B-E2.In the present embodiment, the resistance of each resistance area is equal to the merchant's of the length of the resistivity of this resistance area and this resistance area and width product, that is to say, the resistance r1=of the first resistance area 130 (B-E1) * ρ/F1, the resistance r2=B* ρ of the second resistance area 131/(C-F1-F2), the resistance r3=of the 3rd resistance area 132 (B-E2) * ρ/F2.
In an embodiment of the present invention, the inverse of the resistance of resistive layer 13 is the sum reciprocal of reciprocal and the 3rd resistance area 132 resistances of inverse, the second resistance area 131 resistances of the first resistance area 130 resistances, brings the computing formula that obtains the resistance r of resistive layer 13 after the computing formula of r1, r2, r3 into to be:
r=B*(B-E1)*(B-E2)*ρ/[B*(B-E1)*F2+(B-E1)*(B-E2)*(C-F1-F2)+B*F1*(B-E2)]
Material at resistive layer 13 is among the embodiment of carbon ink, supposes B=8, E1=4, E2=4, F1=9, F2=3, F1=9, C=20, and the electricalresistivityρ of carbon ink=45 then can calculate the resistance r1=20ohm of the first resistance area 130, the resistance r2=45ohm of the second resistance area 131 according to above-mentioned formula, the resistance r3=60ohm of the 3rd resistance area 132, the resistance r=11.25ohm of resistive layer 13.
In sum, circuit board with built-in type resistance of the present invention will be embedded in the resistance in the circuit board, compare with the circuit board that utilizes the manufacturing of SMT technology, reduced the pad of components and parts, improved the stability after components and parts are assembled. reduce signal cross-talk, and satisfied the frivolous requirement of product increasingly stringent.
Used specific case herein principle and the execution mode with circuit board of built-in type resistance of the present invention set forth, the explanation of above execution mode just is used for helping to understand method of the present invention and core concept thereof; Simultaneously, for one of ordinary skill in the art, according to thought of the present invention; all will change in specific embodiments and applications; in sum, this description should not be construed as limitation of the present invention, and protection scope of the present invention should be as the criterion with appended claim.
Claims (6)
1. the circuit board with built-in type resistance is characterized in that, comprising:
Insulated substrate;
At least one pair of electrode is located at the surface of described insulated substrate, comprising:
The first electrode comprises the first noumenon and the first grille that links to each other with the first noumenon; And
The second electrode, described the second electrode and interval relative with described the first electrode arranges, and described the second electrode comprises the second body and the second grille that links to each other with described the second body; And
Resistive layer is formed on the insulated substrate between the first noumenon, the second body, the first grille and the second grille.
2. the circuit board with built-in type resistance as claimed in claim 1, it is characterized in that, described the first grille and described the second grille are rectangle, and the first grille extends to form to the second electrode one by the first noumenon, and the second grille is extended to form to the first electrode one by the second body.
3. the circuit board with built-in type resistance as claimed in claim 1 is characterized in that, described resistive layer comprises:
The first resistance area, the width of described the first resistance area equate with the width of described the first grille, and the length of described the first resistance area is the spacing of described the first grille and described the second body;
The second resistance area, the width of described the second resistance area be the width of described the first noumenon and described the first grille and the second grille width and difference, the length of described the second resistance area is the spacing of described the first noumenon and described the second body;
The 3rd resistance area, the width of described the 3rd resistance area equate with the width of described the second grille, and the length of described the 3rd resistance area is the spacing of described the second grille and described the first noumenon.
4. the circuit board with built-in type resistance as claimed in claim 3 is characterized in that, the resistance of described the first resistance area, the second resistance area and the 3rd resistance area is equal to the merchant's of the length of the resistivity of this resistance area and this resistance area and width product.
5. the circuit board with built-in type resistance as claimed in claim 4 is characterized in that, the inverse of the resistance of described resistive layer is the sum reciprocal of reciprocal and described the 3rd resistance area resistance of the inverse of described the first resistance area resistance, described the second resistance area resistance.
6. the circuit board with built-in type resistance as claimed in claim 1 is characterized in that, described resistive layer is carbon ink layer.
Priority Applications (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201310002528.8A CN103037622B (en) | 2013-01-05 | 2013-01-05 | There is the circuit board of built-in type resistance |
| TW102106247A TWI473546B (en) | 2013-01-05 | 2013-02-22 | Printed circuit board with embedded resistor |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201310002528.8A CN103037622B (en) | 2013-01-05 | 2013-01-05 | There is the circuit board of built-in type resistance |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN103037622A true CN103037622A (en) | 2013-04-10 |
| CN103037622B CN103037622B (en) | 2015-08-12 |
Family
ID=48023952
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201310002528.8A Expired - Fee Related CN103037622B (en) | 2013-01-05 | 2013-01-05 | There is the circuit board of built-in type resistance |
Country Status (2)
| Country | Link |
|---|---|
| CN (1) | CN103037622B (en) |
| TW (1) | TWI473546B (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2014106331A1 (en) * | 2013-01-05 | 2014-07-10 | 上海卓凯电子科技有限公司 | Circuit board with buried resistor |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1615070A (en) * | 2003-11-05 | 2005-05-11 | 三星电机株式会社 | Manufacture of PCB with resistors embedded |
| CN100449655C (en) * | 2003-09-17 | 2009-01-07 | Lg电线有限公司 | Surface-mounted thermistor and manufacturing method thereof |
| CN203027605U (en) * | 2013-01-05 | 2013-06-26 | 上海卓凯电子科技有限公司 | Circuit board provided with built-in type resistor |
Family Cites Families (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2006156913A (en) * | 2004-12-01 | 2006-06-15 | Ricoh Co Ltd | Printed wiring board |
| JP6015445B2 (en) * | 2010-08-06 | 2016-10-26 | 日立化成株式会社 | Liquid composition, resistor film using the same, resistor film manufacturing method, resistor element, and wiring board |
-
2013
- 2013-01-05 CN CN201310002528.8A patent/CN103037622B/en not_active Expired - Fee Related
- 2013-02-22 TW TW102106247A patent/TWI473546B/en not_active IP Right Cessation
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN100449655C (en) * | 2003-09-17 | 2009-01-07 | Lg电线有限公司 | Surface-mounted thermistor and manufacturing method thereof |
| CN1615070A (en) * | 2003-11-05 | 2005-05-11 | 三星电机株式会社 | Manufacture of PCB with resistors embedded |
| CN203027605U (en) * | 2013-01-05 | 2013-06-26 | 上海卓凯电子科技有限公司 | Circuit board provided with built-in type resistor |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2014106331A1 (en) * | 2013-01-05 | 2014-07-10 | 上海卓凯电子科技有限公司 | Circuit board with buried resistor |
Also Published As
| Publication number | Publication date |
|---|---|
| CN103037622B (en) | 2015-08-12 |
| TWI473546B (en) | 2015-02-11 |
| TW201429334A (en) | 2014-07-16 |
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| C06 | Publication | ||
| PB01 | Publication | ||
| C10 | Entry into substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20150812 Termination date: 20180105 |
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| CF01 | Termination of patent right due to non-payment of annual fee |