CN103033089A - Anti-infrared cloaking electronic blanket - Google Patents
Anti-infrared cloaking electronic blanket Download PDFInfo
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- CN103033089A CN103033089A CN201210543887XA CN201210543887A CN103033089A CN 103033089 A CN103033089 A CN 103033089A CN 201210543887X A CN201210543887X A CN 201210543887XA CN 201210543887 A CN201210543887 A CN 201210543887A CN 103033089 A CN103033089 A CN 103033089A
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Abstract
The invention relates to an anti-infrared cloaking electronic blanket, which comprises a first layer of high-thermal-conductivity thin sheet, wherein the upper surface of the first layer of high-thermal-conductivity thin sheet is provided with a semiconductor refrigerating sheet array consisting of a plurality of semiconductor refrigerating sheets; the work of the semiconductor refrigerating sheet array is controlled by a control system; the upper part of the upper surface of the first layer of high-thermal-conductivity thin sheet is provided with a thermal insulation layer; the thermal insulation layer is provided with a plurality of holes corresponding to each semiconductor refrigerating sheet; the upper part of the thermal insulation layer is also provided with a second layer of high-thermal-conductivity thin sheet and an auxiliary covering blanket in sequence; at the first layer of high-thermal-conductivity thin sheet, an exhaust pipe and an exhaust fan are also arranged; the lower surface of the first layer of high-thermal-conductivity thin sheet is provided with a first group of temperature sensors; the detected surface temperature of a sharp shooter covering body is transmitted to the control system by the first group of temperature sensors; the detected external environment temperature of a constant-temperature cloaking blanket is transmitted to the control system by a second group of temperature sensors; the working state of the semiconductor refrigerating sheet array is controlled by the control system according to the two groups of received temperature values; and the control system is powered by using a storage battery.
Description
Technical field
The present invention relates to a kind of stealthy equipment, particularly about a kind of stealthy electronic blanket of anti-infrared that when the sniper hides, uses.
Background technology
The condition that the sniper executes the task is comparatively abominable, especially in the open air, it often is ambuscade several hours and even several days time of not moving at all, and sniper's hidden measure is usually comparatively simple, easily give away one's position, especially along with the development of various infrared detection techniques, such as infrared induction equipment such as infrared forward sight imagers, by the invisible IR of human body naked eyes, can find easily the targets such as sniper.At present, conventional way is to cover auxiliary blindages such as hanging down the heat radiation woollen blanket at human body, but because the continuous distribute heat of human body, increase along with the time, the situation of surrounding enviroment still can appear being higher than in the blindage surface, thereby is easy to be detected by the infrared surveillance instrument and give away one's position, and makes sniper or military equipment be absorbed in immediately the condition that is in extreme danger, so not only task can not be finished, and sniper's life all has been subject to threat.Under the current conditions, usually adopt camouflage fabric to reduce infrared emittance, promote the thermal infrared protection level.Said method is subject to material itself usually, and actual accessible performance is limited, is difficult to realize long infrared protection.
Summary of the invention
For the problems referred to above, the purpose of this invention is to provide a kind of stealthy electronic blanket of anti-infrared that can carry out for a long time infrared protection.
For achieving the above object, the present invention takes following technical scheme: the stealthy electronic blanket of a kind of anti-infrared is characterized in that: it comprises the first floor height heat conduction thin slice, semiconductor refrigerating chip arrays, control system, thermal insulation layer, hole, the second floor height heat conduction non-metal plate, auxiliary blanket, blast pipe, scavenger fan, first group of temperature sensor, second group of temperature sensor and the battery of covering; Described the first floor height heat conduction thin slice, semiconductor refrigerating chip arrays, thermal insulation layer, the second floor height heat conduction non-metal plate and the auxiliary blanket that covers consist of the stealthy blanket of constant temperature; The upper surface of described the first floor height heat conduction thin slice is provided with the described semiconductor refrigerating chip arrays that is made of some semiconductor chilling plates, and the work of described semiconductor refrigerating chip arrays is controlled by described control system; The upper surface top that is positioned at described the first floor height heat conduction non-metal plate is provided with described thermal insulation layer, offer some holes corresponding with each described semiconductor chilling plate on the described thermal insulation layer, the top of described thermal insulation layer also is disposed with described the second floor height heat conduction thin slice, the auxiliary blanket that covers; Described the first floor height heat conduction thin slice place also is provided with described blast pipe and scavenger fan; The lower surface that is positioned at described the first floor height heat conduction thin slice is provided with described first group of temperature sensor, and described first group of temperature sensor transfers to the sniper's nappe surface temperature that detects in the described control system; The stealthy blanket ambient temperature of described constant temperature that described second group of temperature sensor will detect transfers in the described control system, and described control system is controlled the duty of described semiconductor refrigerating chip arrays according to two groups of temperature values that receive; Described control system adopts described storage battery power supply.
Described first group of temperature sensor is comprised of more than one infrared sensor, and described first group of temperature sensor works in positive temperature coefficient or negative temperature coefficient; Described second group of temperature sensor is comprised of more than one infrared sensor or PTC protractor, and described second group of temperature sensor works in positive temperature coefficient or negative temperature coefficient.
The stealthy blanket peripheral region of described constant temperature is provided with fixedly nail.
The front portion that is positioned at the stealthy blanket of described constant temperature also offers the front end window, also is provided with two for the reservation air channel that ventilates in the stealthy blanket to constant temperature in the anterior bottom of the stealthy blanket of described constant temperature.
The stealthy electronic blanket of described anti-infrared outside also is provided with packaging bag.
Described the first floor height heat conduction thin slice and the second floor height heat conduction thin slice all adopt high heat conduction nonmetallic slices to make, or adopt the high-thermal conductive metal thin slice to make.
Described auxiliary covering blanket adopts the low-infrared radiation material to make.
Described auxiliary covering blanket adopts camouflage fabric to make.
The present invention is owing to taking above technical scheme, it has the following advantages: 1, the present invention adopts the stealthy blanket of constant temperature by the first floor height heat conduction thin slice, the semiconductor refrigerating chip arrays, thermal insulation layer, the second floor height heat conduction non-metal plate and the auxiliary blanket that covers consist of, the semiconductor refrigerating chip arrays is controlled its duty by control system according to the temperature value of two groups of temperature sensor collections and is changed the nappe surface temperature, so that the nappe surface temperature approaches with ambient temperature or is consistent, with the probability that reduces to be monitored by infrared equipment, realized for a long time the sniper being carried out the function of infrared protection.2, the present invention is because when the semiconductor refrigerating chip arrays was worked, thermal insulation layer can effectively play heat-blocking action, and then avoids the stealthy blanket of constant temperature that cold and hot short circuit occurs, and has guaranteed that it can work.3, the present invention is owing to adopting first group of temperature sensor and second group of temperature sensor carries out respectively the detection of dynamic of temperature to sniper's nappe surface and the stealthy blanket external environment condition of constant temperature, control system is controlled the semiconductor chilling plate array according to two groups of temperature values, has guaranteed that effectively sniper or equipment can work than in the better suited temperature at one.4, the present invention is owing to being provided with blast pipe and scavenger fan at the first floor height heat conduction thin slice place, the stealthy blanket of constant temperature is covered a part of heat that its inner human body or military equipment send, and by blast pipe internal heat to be discharged to the stealthy blanket of constant temperature through scavenger fan outside, and then avoid the stealthy blanket over-heat inside of constant temperature.5, the present invention can assist the infra-red radiation that covers blanket itself by reduce like this owing to the auxiliary blanket that covers adopts low radiative material to make, and plays simultaneously certain accumulation of energy carrier function, prevents that the surface temperature fluctuation is excessive and semiconductor work is too frequent.The present invention can extensively snipe middle application in the open air.
Description of drawings
Fig. 1 is overall structure schematic diagram of the present invention;
Fig. 2 is the decomposition texture schematic diagram of Fig. 1;
Fig. 3 is A-A cutaway view among Fig. 1;
Fig. 4 is the dazzle system side view at B-B place among Fig. 1;
Fig. 5 is the leading portion bottom air channel structure schematic diagram at C-C place among Fig. 1;
Fig. 6 is the shooting at D-D place among Fig. 1 and monitors the mouth structure schematic diagram.
The specific embodiment
The invention provides the stealthy electronic blanket of a kind of anti-infrared, it adopts the electronic cooling mode to regulate the blanket surface temperature, mainly be by active accommodation body surface temperature, realized nappe surface temperature and ambient temperature approach or consistent, with the probability that reduces to be monitored by infrared equipment.Below in conjunction with drawings and Examples the present invention is described in detail.
Such as Fig. 1～shown in Figure 6, the present invention includes the first floor height heat conduction thin slice 1, semiconductor refrigerating chip arrays 2, control system 3, thermal insulation layer 4, hole 5, the second floor height heat conduction thin slice 6, auxiliary blanket 7, blast pipe 8, scavenger fan 9, first group of temperature sensor 10, second group of temperature sensor 11 and the battery 12 of covering; Wherein, the first floor height heat conduction thin slice 1, semiconductor refrigerating chip arrays 2, thermal insulation layer 4, the second floor height heat conduction thin slice 6 and the auxiliary blanket 7 that covers consist of the stealthy blanket 13 of constant temperature.
The upper surface of the first floor height heat conduction thin slice 1 is provided with the semiconductor refrigerating chip arrays 2 that is made of some semiconductor chilling plates, and the work of semiconductor refrigerating chip arrays 2 is by control system 3 controls.The upper surface top that is positioned at the first floor height heat conduction thin slice 1 is provided with thermal insulation layer 4, offer some holes corresponding with each semiconductor chilling plate 5 on the thermal insulation layer 4, semiconductor refrigerating chip arrays 2 is when work, thermal insulation layer 4 plays heat-blocking action, and then avoid the stealthy blanket 13 of constant temperature that cold and hot short circuit occurs, guaranteed that it can work.The top of thermal insulation layer 4 also is disposed with the second floor height heat conduction thin slice 6, the auxiliary blanket 7 that covers.At the first floor height heat conduction thin slice 1 place, also be provided with blast pipe 8 and scavenger fan 9, the stealthy blanket 13 of constant temperature is covered a part of heat that inner human body sends by blast pipe 8 internal heat is discharged to the stealthy blanket of constant temperature 13 outsides through scavenger fan 9, avoid stealthy blanket 13 over-heat insides of constant temperature, so that sniper or equipment can work than in the better suited temperature at one.
The upper surface that is positioned at the second floor height heat conduction thin slice 6 is provided with 10, the first groups of temperature sensors 10 of first group of temperature sensor the sniper's nappe surface temperature that detects is transferred in the control system 3; Second group of temperature sensor 11 transfers to stealthy blanket 13 ambient temperature of the constant temperature that detects in the control system 3, and control system 3 is controlled the duty of the semiconductor refrigerating chip arrays 2 in the stealthy blanket 13 of constant temperature according to two groups of temperature values that receive.Operation principle according to semiconductor chilling plate, when a surface works in refrigerating state, another surface namely works in the state of heating, therefore, when the environment temperature that detects when second group of temperature sensor 11 is low, the second floor height heat conduction thin slice 6 upper surfaces are refrigerating state, accordingly, work in the state of heating with the lower surface of people's contact level, the stealthy blanket 13 upper surface temperature of constant temperature approach or when equaling the surrounding enviroment temperature, control system 3 is just controlled semiconductor refrigerating chip arrays 2 and quit work until first group of temperature sensor 10 detects.Wherein, control system 3 can adopt battery 12 power supplies.
In above-described embodiment, during semiconductor chilling plate work, if freeze on one side in its above and below, then another side will heat, and semiconductor chilling plate effectively carries out the heat transmission by the first floor height heat conduction thin slice 1 and the second floor height heat conduction thin slice 6 respectively.
In the various embodiments described above, the first floor height heat conduction thin slice 1 and the second floor height heat conduction thin slice 6 can adopt high heat conduction nonmetallic slices to make, and perhaps adopt the high-thermal conductive metal thin slice to make.
In the various embodiments described above, be provided with fixedly nail 14 at stealthy blanket 13 peripheral regions of constant temperature, be convenient to the fixedly stealthy blanket 13 of constant temperature, and form in use wind inlet channel.
In the various embodiments described above, first group of temperature sensor 10 is comprised of more than one infrared sensor, and first group of temperature sensor 10 works in positive temperature coefficient or negative temperature coefficient.Second group of temperature sensor 11 is comprised of more than one infrared sensor or PTC protractor, and second group of temperature sensor 11 works in positive temperature coefficient or negative temperature coefficient.
In the various embodiments described above, also be provided with packaging bag in the stealthy electronic blanket of anti-infrared of the present invention outside, with convenient the stealthy electronic blanket packing of anti-infrared of the present invention carried.
In the various embodiments described above, the front portion that is positioned at the stealthy blanket 13 of constant temperature also offers front end window 15, in use, makes things convenient for Ju Ji Shou lookout, is used for to the stealthy blanket 13 interior ventilations of constant temperature simultaneously.Also be provided with two in the stealthy blanket of constant temperature 13 anterior bottoms and reserve air channel 16, be used for to the stealthy blanket 13 interior ventilations of constant temperature.
In the various embodiments described above, the auxiliary blanket 7 that covers adopts the low-infrared radiation material to make, for example camouflage fabric.Like this can the reduce auxiliary infra-red radiation that covers blanket 7 itself plays certain accumulation of energy carrier function simultaneously, prevents that surface wave is excessive.
In the various embodiments described above, control system 3 is as follows to the control of semiconductor chilling plate array 2 work according to two groups of temperature values:
Second group of temperature sensor 11 transfers to control system 3 with the ambient temperature signal IR1 that detects, and ambient temperature signal IR1 forms reference signal IR1-1 after control system 3 is processed; First group of temperature sensor 10 transfers to control system 3 with the stealthy blanket 13 surface temperature signal IR2 of the constant temperature that detects, process the rear comparison signal IR2-1 that forms by control system 3, control system 3 is by comparing IR2-1 and IR1-1, the control electric current of output semiconductor cooling piece array 2, and then driving semiconductor refrigerating chip arrays 2 is worked or is quit work.
When IR2-1＞IR1-1, it is refrigerating state (i.e. upper surface one side of the first floor height heat conduction thin slice 1) that the control signal of control system 3 outputs makes semiconductor refrigerating chip arrays 2 upper surface duties, and covering Homogeneouslly-radiating on the second floor height heat conduction thin slice 6 that blanket 7 contacts with auxiliary, and be delivered on the auxiliary covering blanket 7, so that auxiliary blanket 7 surface temperatures that cover reduce, until auxiliaryly cover that blanket 7 surface temperatures equal or very near environment temperature (temperature range can be monitored the temperature range of identification less than outside infrared monitoring instrument).At this moment, semiconductor refrigerating chip arrays 2 quits work, operation principle according to semiconductor chilling plate, when one side (upper surface) when working in refrigerating state, semiconductor chilling plate lower surface this moment (contacting a side with human body) works in the state of heating, and surface temperature is Homogeneouslly-radiating on the first floor height heat conduction thin slice 1, so that the stealthy blanket 13 overlay area temperature of constant temperature raise, thermal insulation layer 4 is kept efficient normal operation with hot junction and the cold junction isolation of semiconductor refrigerating chip arrays 2.At this moment, scavenger fan 9 is discharged to relatively hidden place by blast pipe 8 with the stealthy blanket 13 overlay area hot-airs of constant temperature, thereby keep the stealthy blanket 13 overlay area internal temperatures of constant temperature and be unlikely too high, so that sniper or equipment can work than in the better suited temperature at one.
When IR2-1≤IR1-1, the control signal of control system 3 outputs quits work semiconductor chilling plate, like this, the human heat distributes continuing, the stealthy blanket 13 surface temperature climbeds of constant temperature, until the IR2-1 that first group of temperature sensor 10 and second group of temperature sensor 11 detect＞during IR1-1, it is refrigerating state that the control signal of control system 3 outputs makes semiconductor refrigerating chip arrays 2 upper surface duties, with this continuous periodic duty.
In sum, such as Fig. 1, Fig. 4～shown in Figure 6, the present invention in use, infrared monitoring equipment 17 is by the thermal source distribution situation of infrared detection monitoring range, can form image and show, when the sniper executes the task, cover the stealthy blanket 13 of constant temperature at sniper 18, equipment 19, control system 3 and battery 12, the stealthy blanket 13 of constant temperature fixes on the ground by nail 14, and blast pipe 8 is well placed.Reason owing to covering projection inequality, form and cover inner chamber 20, under the effect of scavenger fan 9, wind reserves air channel 16 by stealthy blanket 13 front bottom end of constant temperature and front end window 15 enters covering inner chamber 20, and the air that will cover in the inner chamber 20 by blast pipe 8 are discharged to the outside, form covering the adjusting of inner chamber 20 air themperatures.
Before executing the task, need guarantee first that battery 12 is filled with enough electric weight, the charging circuit that can adopt civil power to pass through in the control system 3 is processed rear accumulators 12 chargings, when the stealthy blanket 13 of constant temperature is in temperature constant state and does not have civil power to provide, battery 12 provides electric weight for the stealthy electronic blanket of whole anti-infrared, to guarantee its normal operation.
The various embodiments described above only are used for explanation the present invention; the connection of each parts and structure all can change to some extent; on the basis of technical solution of the present invention; all improvement and equivalents of connection and the structure of individual component being carried out according to the principle of the invention all should not got rid of outside protection scope of the present invention.
Claims (10)
1. stealthy electronic blanket of anti-infrared is characterized in that: it comprises the first floor height heat conduction thin slice, semiconductor refrigerating chip arrays, control system, thermal insulation layer, hole, the second floor height heat conduction non-metal plate, auxiliary blanket, blast pipe, scavenger fan, first group of temperature sensor, second group of temperature sensor and the battery of covering; Described the first floor height heat conduction thin slice, semiconductor refrigerating chip arrays, thermal insulation layer, the second floor height heat conduction non-metal plate and the auxiliary blanket that covers consist of the stealthy blanket of constant temperature;
The upper surface of described the first floor height heat conduction thin slice is provided with the described semiconductor refrigerating chip arrays that is made of some semiconductor chilling plates, and the work of described semiconductor refrigerating chip arrays is controlled by described control system; The upper surface top that is positioned at described the first floor height heat conduction non-metal plate is provided with described thermal insulation layer, offer some holes corresponding with each described semiconductor chilling plate on the described thermal insulation layer, the top of described thermal insulation layer also is disposed with described the second floor height heat conduction thin slice, the auxiliary blanket that covers; Described the first floor height heat conduction thin slice place also is provided with described blast pipe and scavenger fan;
The lower surface that is positioned at described the first floor height heat conduction thin slice is provided with described first group of temperature sensor, and described first group of temperature sensor transfers to the sniper's nappe surface temperature that detects in the described control system; The stealthy blanket ambient temperature of described constant temperature that described second group of temperature sensor will detect transfers in the described control system, and described control system is controlled the duty of described semiconductor refrigerating chip arrays according to two groups of temperature values that receive; Described control system adopts described storage battery power supply.
2. the stealthy electronic blanket of a kind of anti-infrared as claimed in claim 1, it is characterized in that: described first group of temperature sensor is comprised of more than one infrared sensor, and described first group of temperature sensor works in positive temperature coefficient or negative temperature coefficient; Described second group of temperature sensor is comprised of more than one infrared sensor or PTC protractor, and described second group of temperature sensor works in positive temperature coefficient or negative temperature coefficient.
3. the stealthy electronic blanket of a kind of anti-infrared as claimed in claim 1, it is characterized in that: the stealthy blanket peripheral region of described constant temperature is provided with fixedly nail.
4. the stealthy electronic blanket of a kind of anti-infrared as claimed in claim 2, it is characterized in that: the stealthy blanket peripheral region of described constant temperature is provided with fixedly nail.
5. as claimed in claim 1 or 2 or 3 or 4 the stealthy electronic blanket of a kind of anti-infrared, it is characterized in that: the front portion that is positioned at the stealthy blanket of described constant temperature also offers the front end window, also is provided with two for the reservation air channel that ventilates in the stealthy blanket to constant temperature in the anterior bottom of the stealthy blanket of described constant temperature.
6. as claimed in claim 1 or 2 or 3 or 4 the stealthy electronic blanket of a kind of anti-infrared, it is characterized in that: the stealthy electronic blanket of described anti-infrared outside also is provided with packaging bag.
7. the stealthy electronic blanket of a kind of anti-infrared as claimed in claim 5, it is characterized in that: the stealthy electronic blanket of described anti-infrared outside also is provided with packaging bag.
8. such as the stealthy electronic blanket of the described a kind of anti-infrared of claim 1～7 any one, it is characterized in that: described the first floor height heat conduction thin slice and the second floor height heat conduction thin slice all adopt high heat conduction nonmetallic slices to make, or adopt the high-thermal conductive metal thin slice to make.
9. such as the stealthy electronic blanket of the described a kind of anti-infrared of claim 1～8 any one, it is characterized in that: described auxiliary covering blanket adopts the low-infrared radiation material to make.
10. the stealthy electronic blanket of a kind of anti-infrared as claimed in claim 9 is characterized in that: described auxiliary covering blanket adopts camouflage fabric to make.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201210543887XA CN103033089A (en) | 2012-12-14 | 2012-12-14 | Anti-infrared cloaking electronic blanket |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201210543887XA CN103033089A (en) | 2012-12-14 | 2012-12-14 | Anti-infrared cloaking electronic blanket |
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| CN103033089A true CN103033089A (en) | 2013-04-10 |
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| CN201210543887XA Pending CN103033089A (en) | 2012-12-14 | 2012-12-14 | Anti-infrared cloaking electronic blanket |
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Cited By (9)
| Publication number | Priority date | Publication date | Assignee | Title |
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| CN103292636A (en) * | 2013-04-28 | 2013-09-11 | 中国人民解放军61489部队 | Counterfeit planar 3D false target and device and method for counterfeiting the counterfeit planar 3D false target |
| CN103424034A (en) * | 2013-08-19 | 2013-12-04 | 青岛大学 | Anti-infrared disguise shelter |
| CN104031507A (en) * | 2014-06-04 | 2014-09-10 | 中国人民解放军总后勤部军需装备研究所 | Infrared brown camouflage paint and preparation method and application thereof |
| CN104585913A (en) * | 2013-11-01 | 2015-05-06 | 无锡慧思顿科技有限公司 | Water resistible and breathable human body air-conditioning intelligent garment with infrared stealth function |
| CN105324627A (en) * | 2013-07-09 | 2016-02-10 | 贝以***哈格伦斯公司 | Device for signature adaptation and object provided with device for signature adaptation |
| CN109855326A (en) * | 2019-02-26 | 2019-06-07 | 电子科技大学 | A kind of adaptive infrared temperature control module |
| CN109980317A (en) * | 2019-03-15 | 2019-07-05 | 北京航空航天大学 | With the spatial overlay cold plate for actively adjusting cooling capacity distribution |
| CN112992084A (en) * | 2019-12-16 | 2021-06-18 | 上海航空电器有限公司 | Pixelized warm color liquid crystal array system for optical stealth |
| CN114557507A (en) * | 2022-02-28 | 2022-05-31 | 清华大学 | Manufacturing method and using method of infrared camouflage pattern and infrared camouflage garment |
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Cited By (13)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103292636A (en) * | 2013-04-28 | 2013-09-11 | 中国人民解放军61489部队 | Counterfeit planar 3D false target and device and method for counterfeiting the counterfeit planar 3D false target |
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| CN105324627A (en) * | 2013-07-09 | 2016-02-10 | 贝以***哈格伦斯公司 | Device for signature adaptation and object provided with device for signature adaptation |
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| CN104585913A (en) * | 2013-11-01 | 2015-05-06 | 无锡慧思顿科技有限公司 | Water resistible and breathable human body air-conditioning intelligent garment with infrared stealth function |
| CN104031507A (en) * | 2014-06-04 | 2014-09-10 | 中国人民解放军总后勤部军需装备研究所 | Infrared brown camouflage paint and preparation method and application thereof |
| CN109855326A (en) * | 2019-02-26 | 2019-06-07 | 电子科技大学 | A kind of adaptive infrared temperature control module |
| CN109980317A (en) * | 2019-03-15 | 2019-07-05 | 北京航空航天大学 | With the spatial overlay cold plate for actively adjusting cooling capacity distribution |
| CN112992084A (en) * | 2019-12-16 | 2021-06-18 | 上海航空电器有限公司 | Pixelized warm color liquid crystal array system for optical stealth |
| CN114557507A (en) * | 2022-02-28 | 2022-05-31 | 清华大学 | Manufacturing method and using method of infrared camouflage pattern and infrared camouflage garment |
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Application publication date: 20130410 |