CN103018647B - Method and spot measuring machine for testing multiple chips - Google Patents
Method and spot measuring machine for testing multiple chips Download PDFInfo
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- CN103018647B CN103018647B CN201110297443.8A CN201110297443A CN103018647B CN 103018647 B CN103018647 B CN 103018647B CN 201110297443 A CN201110297443 A CN 201110297443A CN 103018647 B CN103018647 B CN 103018647B
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Abstract
The invention discloses a method and a spot measuring machine for testing multiple chips. The method for testing the multiple chips is used for the spot measuring machine to carry out spot measurement on the multiple chips to be tested; the spot measuring machine comprises a plurality of probe sets. The method for testing the multiple chips comprises the following steps of: obtaining position data of the multiple chips to be tested; carrying out spot measurement on the un-deviated to-be-tested chips by the probe sets according to the position data; and moving at least one of the probe sets and the chips to be tested according to the position data, and carrying out spot measurement on the deviated to-be-tested chips by at least one of the probe sets. Besides, the invention further discloses the spot measuring machine for testing the multiple chips.
Description
Technical field
The present invention relates to a kind of method of testing and point measurement machine thereof, particularly relate to a kind of method of testing and point measurement machine thereof of multi-chip.
Background technology
The technology of light emitting diode (LED) is increasingly mature, and the field of application is also more and more wider, wall lamp, assist illuminator and garden lamp etc. that such as general house uses, or applies to the backlight of display.
But along with the Fast Growth of light emitting diode, except the advantage such as high brightness, high power, longer life that light emitting diode itself has, the quality that how will maintain light emitting diode is also quite important, therefore after light-emitting diodes pipe manufacturer completes, the characteristics of luminescence of light emitting diode must be detected, whether good to judge the quality of light emitting diode.
Light emitting diode can be grown up during fabrication on disk (wafer), and recycling cut forms many LED chips on disk.When LED chip detects, be then carry out with a probe groups of point measurement machine, with two electrodes of activation LED chip in same side, make tested single LEDs chip light emitting, and sense the characteristics of luminescence of LED chip according to this.
In order to increase the speed of detection, point measurement machine is gradually towards the future development that multi-chip point is surveyed, and also namely point measurement machine starts to have multiprobe group, to detect multiple chip in time detecting simultaneously.But in a process surveyed, chip is attached on a film, this film can shrink gradually and cause partial chip to produce skew, also therefore makes the electrode of the activation LED chip that probe cannot be correct.
Summary of the invention
The present invention for solve technical matters and object:
Edge this, an object of the present invention is the method for testing providing a kind of multi-chip, this method of testing can chip offset situation occur time, continue correctly and carry out fast multi-chip point survey action.
Meanwhile, the present invention is also provided for the point measurement machine of multi-chip test, to realize the method for testing of above-mentioned multi-chip.
The technological means that the present invention deals with problems:
A method of testing for multi-chip, carry out a survey for a point measurement machine to multiple chip to be measured, this point measurement machine comprises multiprobe group, and this method of testing comprises the following steps: the position data obtaining the plurality of chip to be measured; According to this position data, with those probe groups, a survey is carried out to the chip to be measured not producing skew; And at least one of those probe groups and those chips to be measured is moved according to this position data, with at least one of those probe groups, a survey is carried out to the chip to be measured producing skew.
In a preferred embodiment of the present invention, wherein according to this position data with those probe groups, carrying out a survey to the chip to be measured not producing skew comprises the following steps: when the position of those probe groups corresponds to this position data, judges that those chips to be measured do not produce skew; And control those probe groups and be in one and go out needle-like state, use and carry out surveying to the chip to be measured not producing skew.
In a preferred embodiment of the present invention, the at least one of those probe groups and those chips to be measured is wherein moved according to this position data, carrying out a survey with at least one of those probe groups to the chip to be measured producing skew comprises the following steps: when the position of those probe groups cannot correspond to this position data, judges that those chips to be measured produce skew; And at least one of those probe groups mobile and those chips to be measured, and at least one controlling those probe groups is in this goes out needle-like state, uses and carries out a survey to the chip to be measured producing skew.
The present invention also discloses a kind of point measurement machine of multi-chip, and to test multiple chip to be measured simultaneously, this point measurement machine comprises detection platform, multiprobe group, multiple narrowing module and a control module; Detection platform is in order to carry those chips to be measured; Multiple narrowing module is linked to those probe groups respectively, to move be in a narrowing state with at least one controlling those probe groups relative to those Chip Verticals to be measured; Control module carries out upper and lower start and in-plane displancement in order at least one moving those probe groups and this detection platform according to a position data of those chips to be measured.
In a preferred embodiment of the present invention, wherein this narrowing module comprises at least one of a voice coil motor and a battery valve.
In a preferred embodiment of the present invention, also comprise one scan module, in order to scan those chips to be measured, to obtain this position data.
The present invention's effect against existing technologies:
Compared to existing point measurement machine test procedure and point measurement machine, the method of testing of multi-chip of the present invention and point measurement machine thereof can not only carry out a survey to multiple chip simultaneously, can also when chip produces skew, continue correct carrying out and survey action, and do not need to stop whole test procedure, therefore, it is possible to reach the also efficient test of more existing point measurement machine test procedure.
Describe the present invention below in conjunction with the drawings and specific embodiments, but not as a limitation of the invention.
Accompanying drawing explanation
Fig. 1 be multiple chip all without skew time, the relative position relation figure of probe groups and chip chamber;
When Fig. 2 is chip generation skew, the relative position relation figure of probe groups and chip chamber;
Fig. 3 is the block diagram of point measurement machine multi-chip test program; And
Fig. 4 is the structural drawing of the point measurement machine of multi-chip of the present invention.
Wherein, Reference numeral
Probe groups 11a, 11b
Probe 111a, 112a, 111b, 112b
Chip 12a, 12b to be measured
Point measurement machine 200
Detection platform 21
Scan module 22
Probe groups 23
Probe 231,232
Narrowing module 24
Control module 25
Chip 300 to be measured
Point measurement machine multi-chip test program step S101-S105
Embodiment
Below hereby enumerate a preferred embodiment so that the present invention to be described, right those skilled in the art all know that this is only a citing, and and be not used to limit invention itself.About the detailed description of this preferred embodiment is as follows.
Refer to Fig. 1, Fig. 2 and Fig. 3, Fig. 1 be multiple chip all without skew time, the relative position relation figure of probe groups and chip chamber, Fig. 2 be chip produce offset time, the relative position relation figure of probe groups and chip chamber, Fig. 3 are the block diagram of point measurement machine multi-chip test program.Point measurement machine multi-chip test program of the present invention, carry out a survey for point measurement machine to multiple chip 12a and 12b to be measured, point measurement machine comprises multiprobe group 11a and 11b; Wherein, probe groups 11a and 11b comprises probe 111a, 112a, 111b and 112b, with activation chip to be measured 12a and 12b in time surveying; As shown in Figure 1, when the position of chip 12a and 12b to be measured is correct, probe 111a, the 112a of probe groups 11a and 11b, the position of 111b and 112b are the electrodes that can correspond to chip 12a and 12b to be measured, and as shown in Figure 2, when the position of chip 12a to be measured produces skew, the position of probe 111a and the 112a of probe groups 11a is the electrode that cannot correspond to chip 12a to be measured, a survey is carried out according to normal procedure if now continue, will the electrode of activation chip 12a, and make a result surveyed lose referential.
Therefore point measurement machine multi-chip test program of the present invention comprises the following steps:
S101: the position data obtaining the plurality of chip 12a and 12b to be measured;
S103: according to this position data with those probe groups 11a and 11b, carries out a survey to chip 12a and the 12b to be measured not producing skew; Wherein, this step can also comprise following steps in a preferred embodiment: first, a probe groups position data of this position data and those probe groups 11a and 11b is compared, to determine chip 12a and the 12b to be measured not producing skew; Then, then control those probe groups 11a and 11b and be in one and go out needle-like state, use and carry out surveying to chip 12a and the 12b to be measured not producing skew; Described herein go out needle-like state refer to that the horizontal level of probe groups 11a and 11b is comparatively close to chip 12a and 12b to be measured, on the contrary, when the horizontal level of probe groups 11a and 11b is comparatively away from chip 12a and 12b to be measured, then can be considered a narrowing state.
S105: move those probe groups 11a and 11b and at least one of those chip 12a and 12b to be measured according to this position data, a survey is carried out to chip 12a and the 12b to be measured producing skew; Wherein, this step can also comprise following steps in a preferred embodiment: first, the probe groups position data of this position data and those probe groups 11a and 11b is compared, to determine chip 12a and the 12b to be measured producing skew; Then, then at least one of mobile those probe groups 11a and 11b and those chip 12a and 12b to be measured, and at least one controlling those probe groups 11a and 11b is in out needle-like state, uses and carries out a survey to chip 12a and the 12b to be measured producing skew.
In another embodiment of the invention, the point measurement machine of multi-chip also first can carry out a survey to the chip to be measured producing skew, then carries out a survey to the chip to be measured not producing skew, namely first carries out step S105, then carries out step S103.Therefore, above-mentioned step the restriction of out-of-order, the order of test with test duration shorter person for preferred embodiment.
Refer to Fig. 4, Fig. 4 is the structural drawing of the point measurement machine of multi-chip of the present invention.The present invention also discloses a kind of point measurement machine 200 of multi-chip, and to test multiple chip to be measured 300 simultaneously, this point measurement machine 200 comprises detection platform 21, scan module 22, multiple probe groups 23, multiple narrowing module 24 and a control module 25.
Detection platform 21 carries those chips 300 to be measured; Scan module 22 is in order to scan those chips 300 to be measured, to obtain a position data of those chips 300 to be measured, in addition, chip 300 to be measured can be scanned the position data of generation in advance by outside, then point measurement machine 200 directly can import position data and differentiate whether chip 300 to be measured produces skew.
Multiple narrowing module 24 is linked to those probe groups 23 respectively, to control at least one of those probe groups 23 relative to those chip 300 to be measured vertically movements; Wherein, probe groups 23 can comprise probe 231 and 232, and narrowing module then links probe 231 and 232 respectively, controls probe 231 according to this with 232 relative to the vertical movement of those chips 300 to be measured; When probe groups 23 moves towards chip 300 to be measured, be aforesaid go out needle-like state.Otherwise, when probe groups 23 moves towards the opposite direction of chip 300 to be measured, be aforesaid narrowing state; In a preferred embodiment of the present invention, this narrowing module 24 can be a voice coil motor or a battery valve.
Control module 25 can carry out upper and lower start and in-plane displancement according to the position data traveling probe group 23 of chip 300 to be measured with at least one of detection platform 21.Point measurement machine 200 carries out a survey two kinds of modes, after normally first probe groups 23 being adjusted to fixed position, carries out a survey by control module 25 according to the position data movable detecting platform 21 of chip 300 to be measured.On the other hand, if detection platform 21 is fixing, then control module 25 traveling probe group 23 carries out a survey.
Comprehensive the above, compared to existing point measurement machine test procedure and point measurement machine, the method of testing of multi-chip of the present invention and point measurement machine thereof can not only carry out a survey to multiple chip to be measured simultaneously, can also when chip to be measured produces skew, continue correct carrying out and survey action, and do not need to stop whole test procedure, therefore, it is possible to reach the also efficient test of more existing point measurement machine test procedure.
Certainly; the present invention also can have other various embodiments; when not deviating from the present invention's spirit and essence thereof; those of ordinary skill in the art are when making various corresponding change and distortion according to the present invention, but these change accordingly and are out of shape the protection domain that all should belong to the claim appended by the present invention.
Claims (4)
1. a method of testing for multi-chip, carry out a survey for a point measurement machine to multiple chip to be measured, this point measurement machine comprises multiprobe group, it is characterized in that, this method of testing comprises the following steps:
Obtain a position data of the plurality of chip to be measured;
According to this position data, when the position of those probe groups corresponds to this position data, judge that those chips to be measured do not produce skew, with those probe groups, a survey is carried out to the chip to be measured not producing skew; And
At least one of those probe groups and those chips to be measured is moved according to this position data, when the position of those probe groups cannot correspond to this position data, judge that those chips to be measured produce skew, with at least one of those probe groups, a survey is carried out to the chip to be measured producing skew.
2. the method for testing of multi-chip according to claim 1, is characterized in that, according to this position data with those probe groups, carries out a survey comprise with those probe groups to the chip to be measured not producing skew:
Control those probe groups to be in one and to go out needle-like state, use and carry out surveying to the chip to be measured not producing skew.
3. the method for testing of multi-chip according to claim 2, is characterized in that, moves at least one of those probe groups and those chips to be measured according to this position data, carries out a survey comprise with at least one of those probe groups to the chip to be measured producing skew:
At least one of those probe groups mobile and those chips to be measured, and at least one controlling those probe groups is in this goes out needle-like state, uses and carries out a survey to the chip to be measured producing skew.
4. the method for testing of multi-chip according to claim 2, is characterized in that, controls those probe groups and is in this and goes out needle-like state and control this probe groups and move towards those chips to be measured and make those probe groups be in this to go out needle-like state.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201110297443.8A CN103018647B (en) | 2011-09-27 | 2011-09-27 | Method and spot measuring machine for testing multiple chips |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201110297443.8A CN103018647B (en) | 2011-09-27 | 2011-09-27 | Method and spot measuring machine for testing multiple chips |
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| Publication Number | Publication Date |
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| CN103018647A CN103018647A (en) | 2013-04-03 |
| CN103018647B true CN103018647B (en) | 2015-07-22 |
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| CN201110297443.8A Expired - Fee Related CN103018647B (en) | 2011-09-27 | 2011-09-27 | Method and spot measuring machine for testing multiple chips |
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| Publication number | Priority date | Publication date | Assignee | Title |
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| CN104965163B (en) * | 2015-07-09 | 2018-03-16 | 厦门市三安光电科技有限公司 | A kind of method of testing of Parallelogrammic LED chip |
| DE102016109741B4 (en) * | 2016-05-26 | 2017-12-21 | TSK Prüfsysteme GmbH | Test point card device for a test table |
| CN107578733A (en) * | 2017-08-22 | 2018-01-12 | 武汉华星光电半导体显示技术有限公司 | One kind lights tool and device |
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| US7014527B2 (en) * | 2003-12-16 | 2006-03-21 | Xerox Corporation | Die level testing using machine grooved storage tray with vacuum channels |
| TWI266064B (en) * | 2005-03-23 | 2006-11-11 | Fittech Co Ltd | Composite prober |
| TWI291563B (en) * | 2006-01-20 | 2007-12-21 | Chroma Ate Inc | Sensing system with multiple probe sets, probe card and testing method |
| CN100565219C (en) * | 2006-08-11 | 2009-12-02 | 日月光半导体制造股份有限公司 | Bar formula method of testing and device for testing functions |
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Granted publication date: 20150722 Termination date: 20180927 |