CN103014820A - Method for sand burial electroplating of cubic boron nitride - Google Patents
Method for sand burial electroplating of cubic boron nitride Download PDFInfo
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- CN103014820A CN103014820A CN2012105773736A CN201210577373A CN103014820A CN 103014820 A CN103014820 A CN 103014820A CN 2012105773736 A CN2012105773736 A CN 2012105773736A CN 201210577373 A CN201210577373 A CN 201210577373A CN 103014820 A CN103014820 A CN 103014820A
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Abstract
The invention discloses a method for stand burial electroplating of cubic boron nitride. According to the method, the components of the plating solution are improved, the temperature is raised, the pH is reduced, thus the content of cobalt in the plating is increased, and the abrasion resistance of the final product is improved; and each of the emery balls prepared by the method for sand burial electroplating of cubic boron nitride can be chamfered 1500 to 2000 times, the grinding effect and the wear resistance are improved, and as a result, the cost is saved.
Description
Technical field
The present invention relates to a kind of method of burying the sand electroplating cubic boron nitride, be specifically related to a kind of can effectively increase the matrix wear resistance bury the sand electro-plating method.
Background technology
The Cylinder Surface Hole chamfering is adopted twist drill or manually with deburring cutter processing, the angle of pouring out is inhomogeneous, and surface irregularity, has both affected product appearance, does not reach again product requirement usually.Workman's labour intensity is large simultaneously, inefficiency.Therefore consider to adopt the silicon carbide ball as the chamfering ball, utilize the chamfering ball to rotate into and carry out chamfering in the Cylinder Surface hole.But the hardness of silicon carbide ball is inadequate, and wears no resistance, and can't carry out long-term processing and use, and therefore need to carry out the superhard material electroplating processes to the silicon carbide ball surface as the chamfering ball.
Summary of the invention
To the objective of the invention is in order addressing the deficiencies of the prior art, to provide a kind of the treatment process that superhard material is electroplated is carried out on silicon carbide ball surface.
In order to achieve the above object, the invention provides a kind of method of burying the sand electroplating cubic boron nitride.The method may further comprise the steps:
(1) preplating: nickel preplating cobalt-base alloy layer on matrix;
(2) bury the sand plating: the nickel cobalt (alloy) layer take step (1) preparation is mounted to cubic boron nitride on the matrix as carcass utilizes sand buring method;
(3) thicken plating: after burying sand and finishing, thicken plating;
Wherein, above-mentioned plating bath comprises the component of following concentration: seven water single nickel salt 270-290g/L, heptahydrate 28-32g/L, sodium-chlor 14-16g/L, boric acid 30-34g/L, sodium sulfate 0.8-1.0g/L, asccharin 0.8-1.0g/L, Isosorbide-5-Nitrae-butynediol 0.4-0.6g/L, sodium lauryl sulphate 0.06-0.08g/L; The pH value of plating bath is 4.8-4.9; When electroplating, bath temperature is 55-57 ℃.The thickness of coating is 0.4-0.5mm.
Above-mentioned thicken the plating finish after, the sand buring method that repeats successively step (2) is inlayed the plating that thickens of cubic boron nitride and step (3).The total thickness of coating is 0.6-0.8mm.
Plating bath comprises the component of following concentration: seven water single nickel salt 280g/L, heptahydrate 30g/L, sodium-chlor 15g/L, boric acid 32g/L, sodium sulfate 0.8g/L, asccharin 0.9g/L, Isosorbide-5-Nitrae-butynediol 0.4g/L, sodium lauryl sulphate 0.06g/L; The pH value of plating bath is 4.8.
During nickel preplating cobalt-base alloy layer, the control current density is 1A/dm
2The thickness of described nickel preplating cobalt-base alloy layer is 10 μ m.
Matrix is that diameter is the silicon carbide ball of 2-4cm; The size of cubic boron nitride is 100-120 order, 80-100 order or 60-80 order; When the size of cubic boron nitride was the 100-120 order, the current density of burying the sand plating in the control step (2) was 0.4-0.5A/dm
2When the size of cubic boron nitride was the 80-100 order, the current density of burying the sand plating in the control step (2) was 0.5-0.7A/dm
2When the size of cubic boron nitride was the 60-80 order, the current density of burying the sand plating in the control step (2) was 0.7-0.8A/dm
2
Above-mentioned matrix carries out first degreasing and activation treatment before carrying out preplating.
The present invention has the following advantages compared to existing technology: by improving the content of heptahydrate in the plating bath, reduce simultaneously the pH value of plating bath, improve electroplating temperature, thereby improve the content of cobalt in the coating, increase the fastness to rubbing of matrix.The present invention adopts and buries the sand plating for twice, has increased the ablation of sand grains, and has further increased fastness to rubbing.By the control current density, can reach better, faster electroplating effect simultaneously.The every ball of silicon carbide ball of crossing through electroplating processes of the present invention can carry out chamfering 1500-2000 time/only, by the lifting of ablation and wear resisting property, save cost.
Embodiment
Below in conjunction with specific embodiment the method that the present invention buries the sand electroplating cubic boron nitride is elaborated.
Embodiment one
Pre-treatment: cut-off directly is the silicon carbide ball of 3cm, adopts grease-removing agent to carry out chemical degreasing 20min under 40 ℃; The component of grease-removing agent is as follows: sodium hydroxide 40～50g/L, anhydrous sodium carbonate 30～40g/L, sodium sesquicarbonate 20～30 g/L, water glass 2～3 g/L;
Then immerse in the sulphuric acid soln that concentration is 50g/L, activate cathode treatment 5min.
Plating bath preparation: take off that dissolving is configured to respective concentration in the hot water that the row component adds 60 ℃: seven water single nickel salt 280g/L, heptahydrate 30g/L, sodium-chlor 15g/L, boric acid 32g/L, sodium sulfate 0.8g/L, asccharin 0.9g/L, 1, then 4-butynediol 0.4g/L, sodium lauryl sulphate 0.06g/L use sulphur acid for adjusting pH value to 4.8.Anode employing content is 99.8% nickel.
Preplating: groove is got the stainless steel coating bath that is of a size of 1000mm * 500mm * 300mm, pretreated silicon carbide ball is placed on coating bath is built in the plating bath, and the control bath temperature is 55 ℃, and current density is 1A/dm
2, carry out the plating of nickel cobalt composite bed.It is major equipment that electroplating power supply adopts 0-12V, 0-50A silicon rectifier machine.
Bury sand plating: adopting thickness is that the synthetic glass of 2mm prepares the yi word pattern anchor clamps of 800mm * 60mm * 40mm, and to adopt diameter on the anchor clamps be that the drill bit of 1.2mm punches pitch-row 2mm at synthetic glass.When the thickness of the nickel cobalt composite bed of preplating reaches 10 μ m, yi word pattern anchor clamps with preparation place plating bath to clamp the silicon carbide ball, thrown in 60-80 purpose cubic boron nitride sand grains in the yi word pattern anchor clamps, need to be put into the yi word pattern anchor clamps in the plating bath and can use when burying the sand plating.The control current density is 0.7-0.8 A/dm
2, continue 5 hours, change simultaneously the upper sand direction of silicon carbide ball, bury the sand plating cubic boron nitride sand grains is mounted in the nickel cobalt composite bed.
Thicken plating: after burying sand plating end, the silicon carbide ball is moved in the coating bath, increase current density to 1 A/dm
2, thicken approach between the thickness that is plating to coating and the grit size till, sand grains firmly is embedded in the coating.
Repeat to bury the sand plating and thicken plating, final thickness of coating is 0.6～0.8mm.Finally obtain the silicon carbide ball of electroplating surface superhard material.
Embodiment two
Pre-treatment: cut-off directly is the silicon carbide ball of 2cm, adopts the grease-removing agent among the embodiment one, carries out chemical degreasing 10min under 80 ℃; Then immerse after the cleaning in the sulphuric acid soln that concentration is 50g/L, activate cathode treatment 5min.
Plating bath preparation: take off that dissolving is configured to respective concentration in the hot water that the row component adds 80 ℃: seven water single nickel salt 290g/L, heptahydrate 32g/L, sodium-chlor 16g/L, boric acid 34g/L, sodium sulfate 1.0g/L, asccharin 1.0g/L, 1, then 4-butynediol 0.6g/L, sodium lauryl sulphate 0.08g/L use sulphur acid for adjusting pH value to 5.0.Anode employing content is 99.8% nickel.
Preplating: get the stainless steel coating bath that is of a size of 1000mm * 500mm * 300mm, pretreated silicon carbide ball is placed on coating bath is built in the plating bath, the control bath temperature is 57 ℃, and current density is 1A/dm
2, carry out the plating of nickel cobalt composite bed.
Bury sand plating: adopting thickness is that the synthetic glass of 2mm prepares the yi word pattern anchor clamps of 800mm * 60mm * 40mm, and to adopt diameter on the anchor clamps be that the drill bit of 1.5mm punches pitch-row 4mm at synthetic glass.Yi word pattern anchor clamps with preparation place plating bath to clamp the silicon carbide ball, when the thickness of the nickel cobalt composite bed of preplating reaches 10 μ m, drop into 80-100 purpose cubic boron nitride sand grains in plating bath, and the control current density is 0.4-0.5 A/dm
2, continue 5 hours, change simultaneously the upper sand direction of silicon carbide ball, bury the sand plating cubic boron nitride sand grains is mounted in the nickel cobalt composite bed.
Thicken plating: after burying sand plating end, the silicon carbide ball is moved in the coating bath, increase current density to 1 A/dm
2, thicken approach between the thickness that is plating to coating and the grit size till, sand grains firmly is embedded in obtains the finished product in the coating.Final thickness of coating is 0.4～0.5mm.
Embodiment three
The silicon carbide ball that obtains at embodiment two repeats to bury the sand plating and thickens plating, and the total thickness of final coating is 0.6～0.7mm.
Embodiment four
Pre-treatment, preplating, bury sand plating and thicken plating with embodiment two, repeat to bury the sand plating and thicken plating.Wherein bury the sand plating and adopt 100～120 purpose cubic boron nitride sand grains, the thickness of coating that finally obtains is 0.5～0.6mm.
The ball-type anchor clamps that adopt technique of the present invention preparation high energy in the process of angle lap reaches more than 8000, has been us since dropping into cubic boron nitride and using, and wear resistance is once the highest.The cubic boron nitride quality has obvious lifting at present, and the overwhelming majority surpasses 3000, is 3～4 times of fastness to rubbings in the past.
Claims (8)
1. method of burying the sand electroplating cubic boron nitride, the method may further comprise the steps:
(1) preplating: nickel preplating cobalt-base alloy layer on matrix;
(2) bury the sand plating: the nickel cobalt (alloy) layer take step (1) preparation is mounted to cubic boron nitride on the matrix as carcass utilizes sand buring method;
(3) thicken plating: after burying sand and finishing, thicken plating;
It is characterized in that:
Described plating bath comprises the component of following concentration: seven water single nickel salt 270-290g/L, heptahydrate 28-32g/L, sodium-chlor 14-16g/L, boric acid 30-34g/L, sodium sulfate 0.8-1.0g/L, asccharin 0.8-1.0g/L, 1,4-butynediol 0.4-0.6g/L, sodium lauryl sulphate 0.06-0.08g/L; The pH value of described plating bath is 4.8-4.9; When electroplating, described bath temperature is 55-57 ℃.
2. method according to claim 1 is characterized in that: described thicken plating and finish after, the sand buring method that repeats successively described step (2) is inlayed the plating that thickens of cubic boron nitride and step (3).
3. method according to claim 1 and 2, it is characterized in that: described plating bath comprises the component of following concentration: seven water single nickel salt 280g/L, heptahydrate 30g/L, sodium-chlor 15g/L, boric acid 32g/L, sodium sulfate 0.8g/L, asccharin 0.9g/L, Isosorbide-5-Nitrae-butynediol 0.4g/L, sodium lauryl sulphate 0.06g/L; The pH value of described plating bath is 4.8.
4. method according to claim 1 and 2, it is characterized in that: during described nickel preplating cobalt-base alloy layer, the control current density is 1A/dm
2The thickness of described nickel preplating cobalt-base alloy layer is 10 μ m.
5. method according to claim 1 and 2, it is characterized in that: described matrix is that diameter is the silicon carbide ball of 2-4cm; The size of described cubic boron nitride is 100-120 order, 80-100 order or 60-80 order; When the size of described cubic boron nitride was the 100-120 order, controlling the current density of burying the sand plating in the described step (2) was 0.4-0.5A/dm
2When the size of described cubic boron nitride was the 80-100 order, controlling the current density of burying the sand plating in the described step (2) was 0.5-0.7A/dm
2When the size of described cubic boron nitride was the 60-80 order, controlling the current density of burying the sand plating in the described step (2) was 0.7-0.8A/dm
2
6. method according to claim 1, it is characterized in that: after described buildup thickness was finished, the thickness of coating was 0.4-0.5mm.
7. method according to claim 2, it is characterized in that: thicken after the plating the described first time, carries out burying the second time sand plating again and thicken plating, and the total thickness that obtains coating is 0.6-0.8mm.
8. method according to claim 1 and 2, it is characterized in that: described matrix carries out first degreasing and activation treatment before carrying out preplating.
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Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
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| CN106312765A (en) * | 2016-09-26 | 2017-01-11 | 中车株洲电机有限公司 | Chamfering processing device and method for small holes in shaft |
| CN112622063A (en) * | 2020-12-20 | 2021-04-09 | 华中光电技术研究所（中国船舶重工集团公司第七一七研究所） | Diamond drill bit for high-precision deep hole machining and preparation method thereof |
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Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106312765A (en) * | 2016-09-26 | 2017-01-11 | 中车株洲电机有限公司 | Chamfering processing device and method for small holes in shaft |
| CN112622063A (en) * | 2020-12-20 | 2021-04-09 | 华中光电技术研究所（中国船舶重工集团公司第七一七研究所） | Diamond drill bit for high-precision deep hole machining and preparation method thereof |
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