CN103000622A - Structure and method for packaging light-emitting diodes - Google Patents
Structure and method for packaging light-emitting diodes Download PDFInfo
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- CN103000622A CN103000622A CN2012105331868A CN201210533186A CN103000622A CN 103000622 A CN103000622 A CN 103000622A CN 2012105331868 A CN2012105331868 A CN 2012105331868A CN 201210533186 A CN201210533186 A CN 201210533186A CN 103000622 A CN103000622 A CN 103000622A
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
- H05B45/00—Circuit arrangements for operating light-emitting diodes [LED]
- H05B45/20—Controlling the colour of the light
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
- H01L25/16—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof the devices being of types provided for in two or more different main groups of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. forming hybrid circuits
- H01L25/167—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof the devices being of types provided for in two or more different main groups of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. forming hybrid circuits comprising optoelectronic devices, e.g. LED, photodiodes
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
Abstract
An embodiment of the invention discloses a structure and method for packaging light-emitting diodes. When the structure and method for packaging light-emitting diodes is used for high-resolution display applications, the structure and method for packaging light-emitting diodes reduces wiring difficulty and simultaneously reduces requirements for number of layers and accuracy of a printed circuit board (PCB). The structure comprises a packaging element, a power supply module for providing electric energy to the packaging structure, a ground wire and a data bus for transmitting data information. The packaging element comprises N light-emitting diode chip groups and driving chips for controlling the N light-emitting diode chip groups, the N light-emitting diode chip groups are connected with the driving chips, and N is a positive integer.
Description
Technical field
The present invention relates to light-emitting diode (LED, Light Emitting Diode) encapsulation technology field, especially relate to a kind of LED encapsulating structure and method for packing towards the high-resolution display application.
Background technology
The resolution of LED display curtain refers to the ranks number of LED display curtain pixel.Resolution is the pixel total amount of LED display curtain, and it has determined the information capacity of the disposable demonstration of a display screen.At present, along with the raising of LED display curtain resolution, the quantity of lamp significantly rises under the same light-emitting area, and the distance between lamp and the lamp is also more and more less, and this will cause lamp and the wiring that drives chip chamber difficult all the more.
Existing a kind of LED encapsulating structure commonly used at first is encapsulated in led chip (being three kinds of light-emitting diode chip for backlight unit of RGB RGB (RedGreen Blue)) in the components and parts, these components and parts is connected with power supply again; Drive chip (IC, Integrated Circuit) and be positioned at the lamp plate back side, by the wiring of complexity, drive IC is coupled together with the led chip of its corresponding control; In addition as required can be by between components and parts and drive IC, resistance being set, the electric current of led chip thereby control is flowed through; Sometimes in order to increase the density that can connect up, printed circuit board (PCB) (the PCB of tradition high-resolution LED display screen curtain, PrintedCircuit Board) used more multi-layered pcb board, can with one two-sidedly make internal layer, two single faces are done outer or two two-sidedly make internal layer, two single faces are made outer field printed substrate, by navigation system and adhesive material alternately together and the printed substrate that interconnects by designing requirement of conductive pattern, namely become four layers, six-layer printed circuit board, be also referred to as multilayer printed circuit board.The problem of multi-layer PCB board is that the complex manufacturing technology yield is relatively poor, and cost is higher, and along with the increasing of display density, pcb board is also harsher in manufacture process requirement such as precision, the numbers of plies.
Summary of the invention
The embodiment of the invention provides a kind of encapsulating structure and method for packing of light-emitting diode, reduces the wiring difficulty when being used for the high-resolution display application, has reduced simultaneously the requirement to the pcb board number of plies and precision.
In view of this, the present invention provides respectively:
A kind of encapsulating structure of light-emitting diode can comprise:
The encapsulation components and parts, the data/address bus of supply module, ground wire and the data information of electric energy is provided for described encapsulating structure; Wherein, described encapsulation components and parts comprise N LED chip and the driving chip that a described N LED chip is controlled, and a described N LED chip is connected with described driving chip, and described N is positive integer.
Further, comprise R, G, three kinds of light-emitting diode chip for backlight unit of B in the described LED chip,
The negative electrode of described R, G, B light-emitting diode chip for backlight unit is connected with the driving chip respectively, and anode is connected together, and links to each other with described supply module.
Further, be provided with between the negative electrode of described R light-emitting diode chip for backlight unit and the described driving chip for flow through first resistance of electric current of R light-emitting diode chip for backlight unit of control, be provided with between the negative electrode of described G light-emitting diode chip for backlight unit and the described driving chip for flow through second resistance of electric current of G light-emitting diode chip for backlight unit of control, be provided with between the negative electrode of described B light-emitting diode chip for backlight unit and the described driving chip for flow through the 3rd resistance of electric current of B light-emitting diode chip for backlight unit of control.
Further, comprise R, G, three kinds of light-emitting diode chip for backlight unit of B in the described LED chip,
The anode of described R, G, B light-emitting diode chip for backlight unit is connected with the driving chip respectively, and negative electrode is connected together, and links to each other with described ground wire.
Further, described supply module comprises the first input voltage, the second input voltage and the 3rd input voltage, described the first input voltage is described R light-emitting diode chip for backlight unit power supply, described the second input voltage is described G light-emitting diode chip for backlight unit power supply, and described the 3rd input voltage is described B light-emitting diode chip for backlight unit power supply.
Further, if described encapsulating structure comprises that three drive chip, then described the first input voltage, the second input voltage and the 3rd input voltage drive with described three that chip is corresponding to link to each other respectively, and the anode of described R, G, B light-emitting diode chip for backlight unit is corresponding continuous with described three driving chips respectively.
The embodiment of the invention also provides a kind of method for packing of light-emitting diode, is applied to the encapsulating structure of aforesaid light-emitting diode, comprising:
Be encapsulated in one with N LED chip by described driving chip controls and encapsulate in the components and parts driving chip, described N is positive integer;
Utilize wire that described encapsulation components and parts and supply module, data/address bus and ground wire are linked together.
As can be seen from the above technical solutions, the encapsulating structure of the light-emitting diode that the embodiment of the invention provides and method for packing, with N LED chip with drive chip package in same components and parts, being connected in the encapsulation components and parts between the two finished, traditional light-emitting diode chip for backlight unit and the wire that is connected that drives chip chamber have been reduced, and both are positioned at same plane, the wire of encapsulation components and parts inside connects more simple, thereby when the high-resolution display application, reduce the wiring difficulty, and reduced the requirement to the pcb board number of plies and precision.
Description of drawings
In order to be illustrated more clearly in the technical scheme of the embodiment of the invention, the below will describe to embodiment the simply introduction of accompanying drawing do of required use, apparently, accompanying drawing in the following describes only is some embodiments of the present invention, for those of ordinary skills, under the prerequisite of not paying creative work, can also obtain according to these accompanying drawings other accompanying drawing.
The encapsulating structure schematic diagram of a kind of light-emitting diode that Fig. 1 provides for the embodiment of the invention;
Another encapsulating structure schematic diagram of the light-emitting diode that Fig. 2 provides for the embodiment of the invention;
Another encapsulating structure schematic diagram of the light-emitting diode that Fig. 3 provides for the embodiment of the invention;
Another encapsulating structure schematic diagram of the light-emitting diode that Fig. 4 provides for the embodiment of the invention;
Another encapsulating structure schematic diagram of the light-emitting diode that Fig. 5 provides for the embodiment of the invention;
Another encapsulating structure schematic diagram of the light-emitting diode that Fig. 6 provides for the embodiment of the invention;
Another encapsulating structure schematic diagram of the light-emitting diode that Fig. 7 provides for the embodiment of the invention;
Another encapsulating structure schematic diagram of the light-emitting diode that Fig. 8 provides for the embodiment of the invention;
Another encapsulating structure schematic diagram of the light-emitting diode that Fig. 9 provides for the embodiment of the invention;
The method for packing schematic flow sheet of the light-emitting diode that Figure 10 provides for the embodiment of the invention.
Embodiment
The embodiment of the invention provides a kind of encapsulating structure and method for packing of light-emitting diode, reduces the wiring difficulty when being used for the high-resolution display application, has reduced simultaneously the requirement to the pcb board number of plies and precision.
Below in conjunction with the accompanying drawing in the embodiment of the invention, the technical scheme in the embodiment of the invention is clearly and completely described, obviously, described embodiment only is the present invention's part embodiment, rather than whole embodiment.Based on the embodiment among the present invention, those of ordinary skills belong to the scope of protection of the invention not making all other embodiment that obtain under the creative work prerequisite.
Below be elaborated respectively.
Please refer to Fig. 1, the encapsulating structure schematic diagram of a kind of light-emitting diode that Fig. 1 provides for the embodiment of the invention; Wherein, described encapsulating structure comprises:
Encapsulation components and parts 9, the data/address bus 3 of supply module 1 (being power supply), ground wire 4 and the data information of electric energy is provided for described encapsulating structure; Wherein, described encapsulation components and parts 9 comprise N LED chip and the driving chip 2 that a described N LED chip is controlled, and a described N LED chip is connected with described driving chip 2, and described N is positive integer.
Further, can comprise R, G, three kinds of light-emitting diode chip for backlight unit of B in the described LED chip; Be convenient and understand that R, G, three kinds of light-emitting diode chip for backlight unit of B can be labeled as respectively 5,6,7 in Fig. 1, below encapsulating structure provided by the invention is made a concrete analysis of:
In the present embodiment first aspect, the negative electrode of described R, G, B light-emitting diode chip for backlight unit (5,6,7) is connected with driving chip 2 respectively, anode is connected together, and link to each other with described supply module 1 (being power supply), namely R, G, three kinds of light-emitting diode chip for backlight unit of B (5,6,7) common anode utmost point connect;
In the first execution mode of first aspect, as shown in Figure 1, described N is 1, and namely described encapsulating structure comprises a LED chip; Wherein, drive chip 2 and R, G, three light-emitting diode chip for backlight unit of B (5,6,7) and be packaged together, form encapsulation components and parts 9.Namely drive 3 light-emitting diode chip for backlight unit of chip 2 controls, encapsulation components and parts 9 link together by wire and supply module 1 (being power supply), data/address bus 3 and ground wire 4.In original traditional LED encapsulating structure, R, G, B light-emitting diode chip for backlight unit need to be connected with the driving chip by 3 wires, and because the position of driving chip and R, G, B light-emitting diode chip for backlight unit is not on the same plane, it is large that wire connects difficulty; And in the present embodiment, R, G, B light-emitting diode chip for backlight unit (5,6,7) are encapsulated in the same components and parts with driving chip 2, being connected in the encapsulation components and parts 9 between the two finished, traditional light-emitting diode chip for backlight unit and the wire that is connected that drives chip chamber have been reduced, and both are positioned at same plane, and the wire of encapsulation components and parts 9 inside connects more simple.
Be understandable that, be provided with between the negative electrode of described R light-emitting diode chip for backlight unit 5 and the described driving chip 2 for flow through first resistance 81 of electric current of R light-emitting diode chip for backlight unit 5 of control, be provided with between the negative electrode of described G light-emitting diode chip for backlight unit 6 and the described driving chip 2 for flow through second resistance 82 of electric current of G light-emitting diode chip for backlight unit 6 of control, be provided with between the negative electrode of described B light-emitting diode chip for backlight unit 7 and the described driving chip 2 for flow through the 3rd resistance 83 of electric current of B light-emitting diode chip for backlight unit 7 of control; What expect easily in addition is, the concrete resistance of the first resistance 81, the second resistance 82 and the 3rd resistance 83 can arrange according to the practical application needs, also can not arrange, and present embodiment is not done concrete restriction to this.
In the second execution mode of first aspect, as shown in Figure 2, another encapsulating structure schematic diagram of the light-emitting diode that Fig. 2 provides for the embodiment of the invention, in this embodiment, described N is 2, be that described encapsulating structure comprises two LED chip, drive 6 light-emitting diode chip for backlight unit of chip 2 controls; In the third execution mode of first aspect, as shown in Figure 3, another encapsulating structure schematic diagram of the light-emitting diode that Fig. 3 provides for the embodiment of the invention, in this embodiment, described N is 4, be that described encapsulating structure comprises four LED chip, drive 12 light-emitting diode chip for backlight unit of chip 2 controls, be understandable that, in the second execution mode of described first aspect and the third execution mode of first aspect, the encapsulating structure of light-emitting diode and principle control can be carried out specific implementation according to first aspect the first execution mode, no longer specifically set forth herein.
To sum up the first execution mode of first aspect, the second execution mode and the third execution mode are described, if R, G, three kinds of light-emitting diode chip for backlight unit common anodes of B utmost point in the N group LED chip connect, then drive 3*N light-emitting diode chip for backlight unit of chip 2 controls, in original traditional package structure for LED, R, G, B light-emitting diode chip for backlight unit need to be connected with the driving chip by 3*N bar wire, and because the position of driving chip and R, G, B light-emitting diode chip for backlight unit is not on the same plane, it is large that wire connects difficulty; And in the execution mode of first aspect present invention, R, G, B light-emitting diode chip for backlight unit (being N group LED chip) are encapsulated in the same components and parts with driving chip 2, being connected in the encapsulation components and parts 9 between the two finished, traditional light-emitting diode chip for backlight unit and the wire that is connected that drives chip chamber have been reduced, and both are positioned at same plane, the wire of encapsulation components and parts 9 inside connects more simple, thereby when the high-resolution display application, reduce the wiring difficulty, and reduced the requirement to the pcb board number of plies and precision.In addition, through practice as can be known, this package structure for LED connects under the execution mode at the common anode utmost point of light-emitting diode chip for backlight unit, preferentially is selected to the encapsulation technology improvement of 12 and 27 light-emitting diode chip for backlight unit and following quantity.
In the present embodiment second aspect, the anode of described R, G, B light-emitting diode chip for backlight unit (5,6,7) is connected with driving chip 2 respectively, negative electrode is connected together, and links to each other with described ground wire 4, and namely R, G, three kinds of light-emitting diode chip for backlight unit of B (5,6,7) common cathode connect;
Be understandable that, in the second aspect execution mode, driving chip 2 can adopt has special dividing potential drop function-driven chip, can provide optimal voltage for each light-emitting diode chip for backlight unit in the LED chip, so that each light-emitting diode chip for backlight unit reaches energy-conservation purpose.
Need to prove that in the general work situation, the optimal voltage of R light-emitting diode chip for backlight unit can be 2.0 to 2.8 volts, the optimal voltage of G light-emitting diode chip for backlight unit and B light-emitting diode chip for backlight unit can be 3.0 to 3.5 volts; What expect easily in addition is, the light-emitting diode chip for backlight unit of different brands, model is under different application scenarioss, its concrete optimal voltage can be not identical to some extent, hundred million light, 1010 packaged chips for example, its R light-emitting diode chip for backlight unit optimal voltage is 2.0 volts, G light-emitting diode chip for backlight unit and the suitableeest voltage of B light-emitting diode chip for backlight unit are 3.3 volts, but can not be as limitation of the invention.
In the first execution mode of second aspect, as shown in Figure 4, another encapsulating structure schematic diagram of the light-emitting diode that Fig. 4 provides for the embodiment of the invention, described N is 1, namely described encapsulating structure comprises a LED chip; Wherein, drive chip 2 and R, G, three light-emitting diode chip for backlight unit of B (5,6,7) and be packaged together, form encapsulation components and parts 9.Namely drive 3 light-emitting diode chip for backlight unit of chip 2 controls, encapsulation components and parts 9 link together by wire and supply module 1 (being power supply), data/address bus 3 and ground wire 4.In original traditional package structure for LED, R, G, B light-emitting diode chip for backlight unit need to be connected with the driving chip by 3 wires, and because the position of driving chip and R, G, B light-emitting diode chip for backlight unit is not on the same plane, it is large that wire connects difficulty; And in the present embodiment, R, G, B light-emitting diode chip for backlight unit (5,6,7) are encapsulated in the same components and parts with driving chip 2, being connected in the encapsulation components and parts 9 between the two finished, traditional light-emitting diode chip for backlight unit and the wire that is connected that drives chip chamber have been reduced, and both are positioned at same plane, and the wire of encapsulation components and parts 9 inside connects more simple; And can adopt simultaneously to possess the mode that dividing potential drop function-driven chip is connected with the light-emitting diode chip for backlight unit common cathode, for each light-emitting diode chip for backlight unit provides optimal voltage, make this scheme more energy-conservation.
In the second execution mode of second aspect, as shown in Figure 5, another encapsulating structure schematic diagram of the light-emitting diode that Fig. 5 provides for the embodiment of the invention, in this execution mode, described N is 2, be that described encapsulating structure comprises two LED chip, drive 6 light-emitting diode chip for backlight unit of chip 2 controls; In the third execution mode of second aspect, as shown in Figure 6, another encapsulating structure schematic diagram of the light-emitting diode that Fig. 6 provides for the embodiment of the invention, in this execution mode, described N is 4, be that described encapsulating structure comprises four LED chip, drive 12 light-emitting diode chip for backlight unit of chip 2 controls, be understandable that, in the second execution mode of described second aspect and the third execution mode of second aspect, the encapsulating structure of light-emitting diode and principle control can be carried out specific implementation according to second aspect the first execution mode, no longer specifically set forth herein.
To sum up the first execution mode of second aspect, the second execution mode and the third execution mode are described, if the three kinds of light-emitting diode chip for backlight unit common cathodes of R, G, B in the N group LED chip connect, then drive 3*N light-emitting diode chip for backlight unit of chip 2 controls, in original traditional package structure for LED, R, G, B light-emitting diode chip for backlight unit need to be connected with the driving chip by 3*N bar wire, and because the position of driving chip and R, G, B light-emitting diode chip for backlight unit is not on the same plane, it is large that wire connects difficulty; And in the execution mode of second aspect present invention, R, G, B light-emitting diode chip for backlight unit (being N group LED chip) are encapsulated in the same components and parts with driving chip 2, being connected in the encapsulation components and parts 9 between the two finished, traditional light-emitting diode chip for backlight unit and the wire that is connected that drives chip chamber have been reduced, and both are positioned at same plane, the wire of encapsulation components and parts 9 inside connects more simple, thereby when the high-resolution display application, reduce the wiring difficulty, and reduced the requirement to the pcb board number of plies and precision; And can adopt simultaneously to possess the mode that dividing potential drop function-driven chip is connected with the light-emitting diode chip for backlight unit common cathode, for each light-emitting diode chip for backlight unit provides optimal voltage, make this scheme more energy-conservation.In addition, through practice as can be known, this package structure for LED connects under the execution mode at the common cathode of light-emitting diode chip for backlight unit, preferentially is selected to the encapsulation technology improvement of 12 and 27 light-emitting diode chip for backlight unit and following quantity.
In the present embodiment third aspect, the anode of described R, G, B light-emitting diode chip for backlight unit (5,6,7) is connected with driving chip 2 respectively, negative electrode is connected together, and links to each other with described ground wire 4, and namely R, G, three kinds of light-emitting diode chip for backlight unit of B (5,6,7) common cathode connect;
Be understandable that, in third aspect execution mode, drive chip 2 for not having special dividing potential drop function-driven chip;
In the first execution mode of the third aspect, as shown in Figure 7, another encapsulating structure schematic diagram of the light-emitting diode that provides for the embodiment of the invention, described N is 1, namely described encapsulating structure comprises a LED chip; Wherein, described supply module 1 (being power supply) comprises the first input voltage V
R(namely marking 10 among the figure), the second input voltage V
G(namely marking 11 among the figure) and the 3rd input voltage V
B(namely marking 12 among the figure), described the first input voltage V
RBe described R light-emitting diode chip for backlight unit 5 power supplies, described the second input voltage is described G light-emitting diode chip for backlight unit 6 power supplies, described the 3rd input voltage V
BBe described B light-emitting diode chip for backlight unit 7 power supplies; Wherein, the first input voltage V
RThe optimal voltage of R light-emitting diode chip for backlight unit 5, the second input voltage V
GThe optimal voltage of G light-emitting diode chip for backlight unit 6, the 3rd input voltage V
BIt is the optimal voltage of B light-emitting diode chip for backlight unit 7;
Need to prove that in the general work situation, the optimal voltage of R light-emitting diode chip for backlight unit can be 2.0 to 2.8 volts, the optimal voltage of G light-emitting diode chip for backlight unit and B light-emitting diode chip for backlight unit can be 3.0 to 3.5 volts; What expect easily in addition is, the light-emitting diode chip for backlight unit of different brands, model is under different application scenarioss, its concrete optimal voltage can be not identical to some extent, hundred million light, 1010 packaged chips for example, its R light-emitting diode chip for backlight unit optimal voltage is 2.0 volts, G light-emitting diode chip for backlight unit and the suitableeest voltage of B light-emitting diode chip for backlight unit are 3.3 volts, but can not be as limitation of the invention.
As shown in Figure 7, under this execution mode, package structure for LED comprises that three drive chip 2, then described the first input voltage V
R, the second input voltage V
GWith the 3rd input voltage V
BDrive 2 corresponding linking to each other of chip with described three respectively, the anode of described R, G, B light-emitting diode chip for backlight unit (5,6,7) drives 2 corresponding linking to each other of chip with described three respectively.Three drive chip 2 and R, G, three light-emitting diode chip for backlight unit of B (5,6,7) are packaged together, form encapsulation components and parts 9, and three drive chips 2 and control separately a coupled light-emitting diode chip for backlight unit, and encapsulation components and parts 9 link together by wire and supply module 1 (being power supply), corresponding three data buses 3 and ground wire 4.In original traditional package structure for LED, R, G, B light-emitting diode chip for backlight unit need to be connected with the driving chip by 3 wires, and because the position of driving chip and R, G, B light-emitting diode chip for backlight unit is not on the same plane, it is large that wire connects difficulty; And in the present embodiment, R, G, B light-emitting diode chip for backlight unit (5,6,7) are encapsulated in the same components and parts with driving chip 2, being connected in the encapsulation components and parts 9 between the two finished, traditional light-emitting diode chip for backlight unit and the wire that is connected that drives chip chamber have been reduced, and both are positioned at same plane, and the wire of encapsulation components and parts 9 inside connects more simple; And can adopt independent input voltage and the mode that the light-emitting diode chip for backlight unit common cathode is connected simultaneously, be respectively each light-emitting diode chip for backlight unit optimal voltage is provided, make this scheme more energy-conservation.
In the second execution mode of the third aspect, as shown in Figure 8, another encapsulating structure schematic diagram of the light-emitting diode that Fig. 8 provides for the embodiment of the invention, in this execution mode, described N is 2, be that described encapsulating structure comprises two LED chip, three drive chip 2 and control separately two coupled light-emitting diode chip for backlight unit; In the third execution mode of the third aspect, as shown in Figure 9, another encapsulating structure schematic diagram of the light-emitting diode that Fig. 9 provides for the embodiment of the invention, in this execution mode, described N is 4, be that described encapsulating structure comprises four LED chip, three drive chip 2 and control separately four coupled light-emitting diode chip for backlight unit, be understandable that, in the second execution mode of the described third aspect and the third execution mode of the third aspect, the encapsulating structure of light-emitting diode and principle control can be carried out specific implementation according to third aspect the first execution mode, no longer specifically set forth herein.
To sum up the first execution mode of the third aspect, the second execution mode and the third execution mode are described, if the three kinds of light-emitting diode chip for backlight unit common cathodes of R, G, B in the N group LED chip connect, three drive chip 2 and control separately a coupled 3*N light-emitting diode chip for backlight unit, in original traditional package structure for LED, N group LED chip need to be connected with the driving chip by 3*N bar wire, and because the position of driving chip and R, G, B light-emitting diode chip for backlight unit is not on the same plane, it is large that wire connects difficulty; And in the execution mode of third aspect present invention, R, G, B light-emitting diode chip for backlight unit (being N group LED chip) are encapsulated in the same components and parts with driving chip 2, being connected in the encapsulation components and parts 9 between the two finished, traditional light-emitting diode chip for backlight unit and the wire that is connected that drives chip chamber have been reduced, and both are positioned at same plane, the wire of encapsulation components and parts 9 inside connects more simple, thereby when the high-resolution display application, reduce the wiring difficulty, and reduced the requirement to the pcb board number of plies and precision; And can adopt independent input voltage and the mode that the light-emitting diode chip for backlight unit common cathode is connected simultaneously, be respectively each light-emitting diode chip for backlight unit optimal voltage is provided, make this scheme more energy-conservation.In addition, through practice as can be known, this package structure for LED connects under the execution mode at the common cathode of light-emitting diode chip for backlight unit, preferentially is selected to the encapsulation technology improvement of 12 and 27 light-emitting diode chip for backlight unit and following quantity.
For ease of better implementing the encapsulating structure of the light-emitting diode that the embodiment of the invention provides, the embodiment of the invention also provides a kind of method for packing of light-emitting diode of the encapsulating structure based on above-mentioned light-emitting diode.Wherein identical in the implication of noun and the above-mentioned encapsulating structure, the specific implementation details can be with reference to the explanation among the encapsulating structure embodiment.
The embodiment of the invention also provides a kind of method for packing of light-emitting diode, is applied to the encapsulating structure of the described light-emitting diode of above-described embodiment, reduces the wiring difficulty when being used for the high-resolution display application, has reduced simultaneously the requirement to the pcb board number of plies and precision.Please refer to Figure 10, Figure 10 is the schematic flow sheet of the method for packing of this light-emitting diode, and the method comprises:
Wherein, can comprise R, G, three kinds of light-emitting diode chip for backlight unit of B in the described LED chip;
In some embodiments, the negative electrode of described R, G, B light-emitting diode chip for backlight unit is connected with the driving chip respectively, anode is connected together, and link to each other with described supply module, be that R, G, three kinds of light-emitting diode chip for backlight unit common anodes of B utmost point connect, can between the negative electrode of light-emitting diode chip for backlight unit and described driving chip, be provided with for the flow through resistance of electric current of this light-emitting diode chip for backlight unit of control, the concrete resistance of resistance can arrange according to the practical application needs, can not arrange, present embodiment is not done concrete restriction to this yet.
In some embodiments, the anode of described R, G, B light-emitting diode chip for backlight unit is connected with the driving chip respectively, and negative electrode is connected together, and links to each other with described ground wire, and namely R, G, three kinds of light-emitting diode chip for backlight unit common cathodes of B connect; Wherein, the driving chip can adopt has special dividing potential drop function-driven chip, can provide optimal voltage for each light-emitting diode chip for backlight unit in the LED chip, so that each light-emitting diode chip for backlight unit reaches energy-conservation purpose.
In some embodiments, the anode of described R, G, B light-emitting diode chip for backlight unit is connected with the driving chip respectively, and negative electrode is connected together, and links to each other with described ground wire, and namely R, G, three kinds of light-emitting diode chip for backlight unit common cathodes of B connect; Wherein, drive chip for not having special dividing potential drop function-driven chip, supply module comprises and corresponds to respectively three input voltages that R, G, B light-emitting diode chip for backlight unit are powered, and described three input voltages can be the optimal voltage of R, G, B light-emitting diode chip for backlight unit, so that each light-emitting diode chip for backlight unit reaches energy-conservation purpose.
Need to prove that in the general work situation, the optimal voltage of R light-emitting diode chip for backlight unit can be 2.0 to 2.8 volts, the optimal voltage of G light-emitting diode chip for backlight unit and B light-emitting diode chip for backlight unit can be 3.0 to 3.5 volts; What expect easily in addition is, the light-emitting diode chip for backlight unit of different brands, model is under different application scenarioss, its concrete optimal voltage can be not identical to some extent, hundred million light, 1010 packaged chips for example, its R light-emitting diode chip for backlight unit optimal voltage is 2.0 volts, G light-emitting diode chip for backlight unit and the suitableeest voltage of B light-emitting diode chip for backlight unit are 3.3 volts, but can not be as limitation of the invention.
The method for packing of the light-emitting diode that the embodiment of the invention provides, with N LED chip with drive chip package in same components and parts, being connected in the encapsulation components and parts between the two finished, traditional light-emitting diode chip for backlight unit and the wire that is connected that drives chip chamber have been reduced, and both are positioned at same plane, the wire of encapsulation components and parts inside connects more simple, thereby reduces the wiring difficulty when the high-resolution display application, and has reduced the requirement to the pcb board number of plies and precision; And can adopt the mode of common cathode connection for each light-emitting diode chip for backlight unit provides optimal voltage simultaneously, make this scheme more energy-conservation.
The those skilled in the art can be well understood to, be the convenience described and succinct, specific works process and embodiment in the method for packing step of foregoing description can with reference to the corresponding process among the aforementioned encapsulating structure embodiment, not repeat them here.
One of ordinary skill in the art will appreciate that: all or part of step that realizes said method embodiment can be finished by the relevant hardware of program command, aforesaid program can be stored in the computer read/write memory medium, comprise that some instructions are with so that a computer equipment (can be personal computer, server, the perhaps network equipment etc.) carry out all or part of step of the described method of each embodiment of the present invention.And aforesaid storage medium comprises: USB flash disk, portable hard drive, read-only memory (ROM, Read-OnlyMemory), the various media that can be program code stored such as random access memory (RAM, Random Access Memory), magnetic disc or CD.
More than encapsulating structure and the method for packing of a kind of light-emitting diode provided by the present invention is described in detail, for one of ordinary skill in the art, thought according to the embodiment of the invention, all will change in specific embodiments and applications, in sum, this description should not be construed as limitation of the present invention.
Claims (7)
1. the encapsulating structure of a light-emitting diode is characterized in that, comprising:
The encapsulation components and parts, the data/address bus of supply module, ground wire and the data information of electric energy is provided for described encapsulating structure; Wherein, described encapsulation components and parts comprise N LED chip and the driving chip that a described N LED chip is controlled, and a described N LED chip is connected with described driving chip, and described N is positive integer.
2. encapsulating structure according to claim 1 is characterized in that, comprising:
Comprise R, G, three kinds of light-emitting diode chip for backlight unit of B in the described LED chip,
The negative electrode of described R, G, B light-emitting diode chip for backlight unit is connected with the driving chip respectively, and anode is connected together, and links to each other with described supply module.
3. encapsulating structure according to claim 2 is characterized in that, comprising:
Be provided with between the negative electrode of described R light-emitting diode chip for backlight unit and the described driving chip for flow through first resistance of electric current of R light-emitting diode chip for backlight unit of control, be provided with between the negative electrode of described G light-emitting diode chip for backlight unit and the described driving chip for flow through second resistance of electric current of G light-emitting diode chip for backlight unit of control, be provided with between the negative electrode of described B light-emitting diode chip for backlight unit and the described driving chip for flow through the 3rd resistance of electric current of B light-emitting diode chip for backlight unit of control.
4. encapsulating structure according to claim 1 is characterized in that, comprising:
Comprise R, G, three kinds of light-emitting diode chip for backlight unit of B in the described LED chip,
The anode of described R, G, B light-emitting diode chip for backlight unit is connected with the driving chip respectively, and negative electrode is connected together, and links to each other with described ground wire.
5. encapsulating structure according to claim 4 is characterized in that, comprising:
Described supply module comprises the first input voltage, the second input voltage and the 3rd input voltage, described the first input voltage is described R light-emitting diode chip for backlight unit power supply, described the second input voltage is described G light-emitting diode chip for backlight unit power supply, and described the 3rd input voltage is described B light-emitting diode chip for backlight unit power supply.
6. encapsulating structure according to claim 5 is characterized in that, comprising:
If described encapsulating structure comprises that three drive chip, then described the first input voltage, the second input voltage and the 3rd input voltage drive with described three that chip is corresponding to link to each other respectively, and the anode of described R, G, B light-emitting diode chip for backlight unit is corresponding continuous with described three driving chips respectively.
7. the method for packing of a light-emitting diode is applied to the encapsulating structure of each described light-emitting diode of claim 1 to 6, it is characterized in that, comprising:
Be encapsulated in one with N LED chip by described driving chip controls and encapsulate in the components and parts driving chip, described N is positive integer;
Utilize wire that described encapsulation components and parts and supply module, data/address bus and ground wire are linked together.
Priority Applications (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2012105331868A CN103000622A (en) | 2012-12-11 | 2012-12-11 | Structure and method for packaging light-emitting diodes |
| PCT/CN2013/089076 WO2014090157A1 (en) | 2012-12-11 | 2013-12-11 | Encapsulation structure and encapsulation method for light-emitting diode |
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| Application Number | Priority Date | Filing Date | Title |
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| CN2012105331868A CN103000622A (en) | 2012-12-11 | 2012-12-11 | Structure and method for packaging light-emitting diodes |
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| CN103000622A true CN103000622A (en) | 2013-03-27 |
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| CN2012105331868A Pending CN103000622A (en) | 2012-12-11 | 2012-12-11 | Structure and method for packaging light-emitting diodes |
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| CN (1) | CN103000622A (en) |
| WO (1) | WO2014090157A1 (en) |
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| CN103594464A (en) * | 2013-11-25 | 2014-02-19 | 广东威创视讯科技股份有限公司 | COB packaging structure of light-emitting diode |
| WO2014090157A1 (en) * | 2012-12-11 | 2014-06-19 | 广东威创视讯科技股份有限公司 | Encapsulation structure and encapsulation method for light-emitting diode |
| CN112447692A (en) * | 2019-08-27 | 2021-03-05 | 明阳半导体股份有限公司 | Light emitting diode device with driving mechanism |
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| CN201306688Y (en) * | 2008-10-17 | 2009-09-09 | 上海金建电子有限公司 | Encapsulation structure of full-color LED provided with driving mechanism |
| CN101877350A (en) * | 2010-04-20 | 2010-11-03 | 蒋伟东 | Integrated chip unit |
| CN102297358A (en) * | 2010-06-24 | 2011-12-28 | 乔红瑗 | Light-emitting diode chip in hybrid packaging with drive circuit and display device |
| US20120187856A1 (en) * | 2010-07-23 | 2012-07-26 | Hsien-Jung Huang | Package structure of full-color led integrated with driving mechanism and current limiting elements |
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| CN103000622A (en) * | 2012-12-11 | 2013-03-27 | 广东威创视讯科技股份有限公司 | Structure and method for packaging light-emitting diodes |
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- 2012-12-11 CN CN2012105331868A patent/CN103000622A/en active Pending
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| CN201306688Y (en) * | 2008-10-17 | 2009-09-09 | 上海金建电子有限公司 | Encapsulation structure of full-color LED provided with driving mechanism |
| CN101877350A (en) * | 2010-04-20 | 2010-11-03 | 蒋伟东 | Integrated chip unit |
| CN102297358A (en) * | 2010-06-24 | 2011-12-28 | 乔红瑗 | Light-emitting diode chip in hybrid packaging with drive circuit and display device |
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| WO2014090157A1 (en) * | 2012-12-11 | 2014-06-19 | 广东威创视讯科技股份有限公司 | Encapsulation structure and encapsulation method for light-emitting diode |
| CN103594464A (en) * | 2013-11-25 | 2014-02-19 | 广东威创视讯科技股份有限公司 | COB packaging structure of light-emitting diode |
| CN112447692A (en) * | 2019-08-27 | 2021-03-05 | 明阳半导体股份有限公司 | Light emitting diode device with driving mechanism |
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| WO2014090157A1 (en) | 2014-06-19 |
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Application publication date: 20130327 |