CN102984889B - 用于装配印刷电路板的方法、印刷电路板和散热片 - Google Patents
用于装配印刷电路板的方法、印刷电路板和散热片 Download PDFInfo
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Abstract
本发明涉及一种用于装配印刷电路板(1)的方法,所述印刷电路板(1)具有至少一个在一侧或两侧被敷铜的或者配备有印制导线的覆层(2),其中在安装步骤中将至少一个刚性的法兰嵌件(4)***到印刷电路板(1)中的或分配给印刷电路板(1)的部件中的所分配的凹处(5,6)中并且其中在接着的施加步骤中将半导体部件的至少一个半导体裸芯片(7)施加到所***的法兰嵌件(4)上。
Description
技术领域
本发明涉及用于装配印刷电路板的方法、印刷电路板和散热片。
背景技术
当今印刷电路板经常由玻璃纤维增强的、时效硬化的环氧树脂板的多个尤其是刚性的覆层组成,这些环氧树脂板在一侧或两侧被敷铜或者配备有印制导线。印刷电路板被装配有半导体部件、连接元件、用于导热的元件等等。在该意义上,“装配”概念当前可以宽泛地解释。
已知,给印刷电路板装配分立的半导体部件,这些半导体部件具有带有接触引脚的外壳。在外壳中,存在至少一个半导体裸芯片(半导体晶片(Halbleiter-Die)),其与接触引脚电连接,例如接合。
在设计印刷电路板情况下不断升高的微型化进程中,也已知的是,在施加步骤中将无外壳的半导体裸芯片直接施加在印刷电路板上。这样的半导体裸芯片(Halbleiter-Nacktchip)被称为“裸片(bare die)”。在这种直接安装情况下,在施加步骤之后通常是接合步骤,在接合步骤中使半导体裸芯片与印刷电路板电接触。
在已知的方法(US 6,809,935B1,在那里图1),半导体裸芯片被直接施加在印刷电路板的金属基板上,该金属基板为印刷电路板提供平面的散热片。因此虽然保证了由半导体部件产生的热的良好的导出。但是有问题的是,基板和半导体裸芯片的热膨胀系数彼此是不同的,这必须通过在基板和半导体裸芯片之间布置的粘合剂层来平衡。这长期导致半导体裸芯片的不期望的由温度引起的机械负荷。
发明内容
本发明所基于的问题是,这样改进已知的用于装配印刷电路板的方法,使得能够实现在半导体裸芯片的由温度引起的机械负荷小的情况下最佳的导热。
上述问题通过按照如下所述的方法来解决。具体地,本发明提供一种用于装配印刷电路板的方法,所述印刷电路板具有至少一个在一侧或两侧被敷铜的或者配备有印制导线的覆层,其中在安装步骤中将至少一个刚性的法兰嵌件***到印刷电路板中的或印刷电路板半成品中的所分配的凹处中,其中给所述印刷电路板的散热片分配法兰嵌件并且使该法兰嵌件与散热片的法兰侧导热区段导热接触,而且所述散热片的法兰侧导热区段被板状地构成,其特征在于,在所述安装步骤之前,所述散热片的法兰侧导热区段在压配合中被压入到所述印刷电路板中的凹处中,在所述安装步骤中将所述法兰嵌件***到所述法兰侧导热区段中的凹处中,或者在所述安装步骤中将所述法兰嵌件***到所述散热片的法兰侧导热区段中的凹处中并然后将所述法兰侧导热区段连同所述法兰嵌件一起压入到所述印刷电路板中的所分配的凹处中,以及在接着的施加步骤中将半导体部件的至少一个半导体裸芯片施加到所***的法兰嵌件上。
基本的是以下原则上的思考:对印刷电路板或印刷电路板半成品首先装备至少一个法兰嵌件并且紧接着才将至少一个半导体裸芯片施加到所***的法兰嵌件中。
详细地建议:在安装步骤中将至少一个刚性法兰嵌件***到印刷电路板中或印刷电路板半成品中的所分配的凹处中并且在接着的施加步骤中将半导体部件的至少一个半导体裸芯片施加到已经***的法兰嵌件上。
这当然可以针对任意数量的法兰嵌件和半导体裸芯片来规定。但是,为了更好的一目了然性,在下面几乎从头到尾地谈及仅仅一个法兰嵌件和一个半导体裸芯片。于是这些实施相应地适用于所有其它法兰嵌件和半导体裸芯片。
由于半导体裸芯片现在被施加在嵌件、也即法兰嵌件上,因此可以通过选择合适的嵌件而在法兰嵌件和半导体裸芯片之间建立最佳的接触结构。详细地,法兰嵌件在其材料特性方面可以最佳地匹配于半导体裸芯片的材料特性。这尤其是涉及关于法兰嵌件和半导体裸芯片的热膨胀系数的匹配。
在安装步骤的简单可执行性意义上,这对于按照建议的解决方案是重要的,即刚性法兰嵌件本身可以被***。因此法兰嵌件例如不是涂层等等。
如上所表明地,法兰嵌件也可以被***到印刷电路板半成品中的所分配的凹处中。该印刷电路板半成品例如可以是由铜等制成的印刷电路板基板,该基板以还要阐述的方式是散热片的组成部分。在特别优选的扩展方案中,印刷电路板半成品在安装步骤之后并且在施加步骤之前才此外与印刷电路板连接。印刷电路板的装配在上述意义上因此介入到印刷电路板的制造过程中。
在特别优选的扩展方案中,给印刷电路板的散热片分配法兰嵌件,其中使该法兰嵌件与散热片的法兰侧导热区段导热地接触。通过法兰嵌件的可***性,可对法兰嵌件根据在半导体裸芯片的良好导热和小的由温度引起的机械负荷之间的最佳折衷来设计。
法兰嵌件的上述设计优选导致了法兰嵌件的热膨胀系数不同于法兰侧导热区段的热膨胀系数。
在按照特别优选的扩展方案中,法兰嵌件的热膨胀系数非常接近半导体裸芯片的热膨胀系数,这原则上导致半导体裸芯片的由温度引起的机械负荷的减小。
原则上,法兰嵌件和法兰侧导热区段可以被粘合入、焊接入等等到相应的凹处中。但是本发明也可以规定,***分别源出于用于产生压配合的压入。由此可以放弃针对法兰嵌件和/或法兰侧导热区段的附加固定措施。
本申请还要求保护具有至少一个在一侧或两侧被敷铜的或者配备有印制导线的优选刚性的覆层和具有用于导出由至少一个半导体部件产生的热的散热片的印刷电路板。所述散热片具有至少一个带有凹处的导热区段和被***到凹处中的刚性的法兰嵌件,半导体部件的至少一个半导体裸芯片能被施加到所述法兰嵌件上,其中所述法兰嵌件的热膨胀系数不同于所分配的法兰侧导热区段的热膨胀系数,其中所述散热片的法兰侧导热区段被板状地构成,并且所述法兰嵌件被装入到所述散热片的法兰侧导热区段中的凹处中,其特征在于,所述散热片的法兰侧导热区段在压配合中被压入到所述印刷电路板中的凹处中,所述法兰嵌件的热膨胀系数小于所述法兰侧导热区段的热膨胀系数。
按照该另外的教导基本的是以下思考:散热片具有用于刚性法兰嵌件的凹处,在该法兰嵌件上可以以上述方式施加半导体裸芯片,其中法兰嵌件的热膨胀系数不同于法兰侧导热区段的热膨胀系数。
通过散热片的按照建议的多部分性,尤其是通过法兰嵌件的可***性,如上阐述地可以产生法兰嵌件到相应的半导体裸芯片的最佳匹配。
本申请还要求保护用于导出由印刷电路板的至少一个半导体部件产生的热的散热片。所述散热片具有至少一个带有凹处的导热区段和***到凹处中的刚性的法兰嵌件,半导体部件的至少一个半导体裸芯片能被施加到所述法兰嵌件上,并且其中法兰嵌件的热膨胀系数不同于所分配的法兰侧导热区段的热膨胀系数,其中所述散热片的法兰侧导热区段被板状地构成,并且所述法兰嵌件被装入到所述散热片的法兰侧导热区段中的凹处中,其特征在于,所述散热片的法兰侧导热区段在压配合中被压入到所述印刷电路板中的凹处中,所述法兰嵌件的热膨胀系数小于所述法兰侧导热区段的热膨胀系数。
所要求保护的散热片相应于如上所述的印刷电路板的散热片,使得就此而言可以参照对以前所提到的教导的实施。
附图说明
下面借助仅仅描绘实施例的附图阐述本发明。在附图中:
图1以横截面示出了按照建议的印刷电路板的区段,
图2以透视分解图示出了按照图1的印刷电路板的区段,
图3以横截面示出了在另外的实施方式中的按照建议的印刷电路板,以及
图4以横截面示出了在另外的实施方式中的按照建议的印刷电路板。
具体实施方式
按照建议的方法用于装配印刷电路板1,该印刷电路板在三个实施方式中在图1和2、在图3和在图4中示出。该印刷电路板1可以在很大程度上任意地构成,其中设置至少一个在一侧或两侧被敷铜的或者配备有印制导线的、优选刚性的覆层2。原则上,印刷电路板1也可以被构成为部分或甚至完全柔性的。在所示的实施例中,印刷电路板1在上侧配备有铜层3,这同样不应理解为限制性的。
图1、3和4示出了在装配状态中的相应的印刷电路板1。可以看出刚性法兰嵌件4,其被***到印刷电路板1中的所分配的凹处5中或者被***到被分配给印刷电路板1的、还要阐述的印刷电路板半成品11、18中的所分配的凹处6中。法兰嵌件可以被构成为一部分组成的或多部分组成的。在法兰嵌件4上施加半导体部件8的半导体裸芯片7。
对于按照建议的方法基本的是,首先在安装步骤中一次地***刚性法兰嵌件4,并且在接着的施加步骤中才将半导体部件8的半导体裸芯片7施加到***的法兰嵌件4上。
接着施加步骤是接合步骤,在该接合步骤中电接触该半导体裸芯片7。该接合步骤对于按照建议的解决方案不再重要,并且因此不进一步阐述。
为了阐明,可以指出的是,“半导体部件”概念是指功能部件,该功能部件从被施加的和接合的半导体裸芯片7得到。
半导体裸芯片7到法兰嵌件4上的施加优选借助粘合剂层9来进行,对于该粘合剂层的实现从现有技术中已知很多可能性。
对于在安装步骤中法兰嵌件4应当被***到印刷电路板半成品11、18中的所分配的凹处中的情况,优选规定,印刷电路板半成品11、18在安装步骤之后和在施加步骤之前此外与印刷电路板1连接。“印刷电路板半成品”指印刷电路板1的任意部分,其此外还与印刷电路板1连接。在此例如可以是还要阐述的法兰侧导热区段11,该法兰侧导热区段必要时本身可被***到印刷电路板半成品中,或者可以是印刷电路板1的同样还要阐述的基板18。
在两个在附图中所示的实施例中,法兰嵌件4被分配给印刷电路板1的散热片10,其中法兰嵌件4与法兰侧导热区段11导热接触。在此,法兰侧导热区段11本身可以被构成为刚性嵌件,如下面描述的。
在图1中所示的扩展方案中,得到两个优选的装配变型方案。
在第一装配变型方案中,还在安装步骤之前将散热片10的法兰侧导热区段11***到印刷电路板1中的凹处12中,其中在接着的安装步骤中将法兰嵌件4***到导热区段11中的凹处6中。在另一优选的方法变型方案中,法兰嵌件4在安装步骤中被***到散热片10的法兰侧导热区段11中的凹处6中,其中之后将法兰侧导热区段11连同法兰嵌件4一起***到印刷电路板1中的所分配的凹处12中。在优选的变型方案中,规定,在安装步骤之后和在将法兰侧导热区段11连同法兰嵌件4一起***到印刷电路板1中的所分配的凹处12中之前执行施加步骤。
为了阐明,可以指出的是,上述的两种装配变型方案原则上也可应用于此外还与印刷电路板1连接的印刷电路板半成品。
特别重要的是法兰嵌件4的材料设计。这里,首要的是,法兰嵌件4的热膨胀系数不同于法兰侧导热区段11的热膨胀系数,使得与半导体裸芯片7的相应的匹配是可能的。通过这种匹配经常得到,法兰嵌件4的热膨胀系数小于法兰侧导热区段11的热膨胀系数。这样,优选的是,法兰嵌件4的热膨胀系数小于法兰侧导热区段11的热膨胀系数的90%、尤其是小于80%。法兰嵌件4的由温度引起的膨胀因此小于法兰侧导热区段11的由温度引起的膨胀。
概念“热膨胀系数”这里确切地涉及可在法兰嵌件4和半导体裸芯片7之间产生基于温度的机械负荷的热膨胀。在将半导体裸芯片7平面地放置在法兰嵌件4上的情况下,热膨胀系数相应地涉及沿着在法兰嵌件4和半导体裸芯片7之间的接触面的热膨胀。
在特别优选的扩展方案中,法兰嵌件4的热膨胀系数根据所施加的半导体裸芯片7的热膨胀系数来设计。于是优选法兰嵌件4具有热膨胀系数,该热膨胀系数与所施加的半导体裸芯片7的热膨胀系数的偏差小于10%、优选小于5%、进一步优选小于2%。
原则上,法兰嵌件4可以被粘合入、焊接入等等到相应的凹处5、6中。同样的适用于将法兰侧导热区段11固定在所分配的凹处12中。但是这里并且优选的是,为了产生压配合,法兰嵌件4的***源出于将法兰嵌件4压入到相应的凹处5、6中。代替地或附加地,可以规定,为了产生压配合将法兰侧导热区段11压入到所分配的凹处12中。
在压入法兰嵌件4或法兰侧导热区段11时,优选形成由力配合和形状配合组成的混合,其结果保证法兰嵌件4或法兰侧导热区段11的固定配合。
原则上也可以设想法兰嵌件4或法兰侧导热区段11的其它方式的固定。在法兰嵌件4或法兰侧导热区段11的所有固定变型方案中基本的是,法兰侧导热区段11的热膨胀不或者仅仅小规模地以机械方式传递到半导体裸芯片7。
在产生用于法兰嵌件4或用于法兰侧导热区段11的压配合的情况下,所涉及的组件的机械稳定性尤其重要,其中良好的导热性和(只要法兰嵌件4被涉及言)匹配的热膨胀系数同时不可以被忽视。这表明,通过如下方式能够实现好的结果,即散热片10的法兰侧导热区段11和/或法兰嵌件4由金属材料组成。这里尤其是成本低的铜适合于法兰侧导热区段10。
在所示的和就此而言优选的实施例中,法兰嵌件4和法兰侧导热区段11分别被构造为一件式的。这又在上面提及的产生压配合方面是有利的。
为了阐明,可以指出的是,概念“凹处”可以被理解为缺口或者理解为槽状凹口。这涉及在印刷电路板1中的凹处5、12和在法兰侧导热区段11中的凹处6。
对于法兰侧导热区段11的构成可以设想许多结构性变型方案。这里并且优选地,将法兰侧导热区段11基本上板状地构成。在此,在导热区段11中的凹处6基本上槽状地来构造。这可以从按照图2的示图中得出。
从按照图2的示图也可以得出,法兰侧导热区段11具有基本上锯齿形的外部轮廓13,而印刷电路板1中的所分配的凹处12具有基本上平滑的内部轮廓14。但是也可以设想,凹处12具有同样基本上锯齿形的内部轮廓14。代替该锯齿形的轮廓,既可以在外部轮廓13也可以在内部轮廓14中也应用波浪形的轮廓。
法兰侧导热区段11基本上相应于已知的板状的导热区段,其也作为槽壁金属化后压接铜块(press fit coin)而已知。
这里并且优选地,法兰嵌件4也基本上板状地来构成,其中法兰嵌件4又具有基本锯齿形的外部轮廓15。所分配的内部轮廓16又直地来构成。这里也可设想,内部轮廓16锯齿形地来构成。此外,可设想,代替锯齿形的轮廓应用波浪形的轮廓。
最后,图2示出,法兰嵌件4在其上侧具有槽状凹处17,在其中可***半导体裸芯片7。
当应当产生所涉及的组件的压配合时,上述的锯齿形或波浪形的轮廓是特别有利的。
在两个在附图中所示的实施变型方案中感兴趣的是如下事实,板状散热片10提供印刷电路板1的基板18,该基板这里并且优选具有大于0.5mm的厚度。基板18在优选的扩展方案中由铜组成。
这里并且优选地,用于法兰嵌件4的凹处5(图3)和/或用于散热片10的法兰侧导热区段11的凹处12设置在基板18中。在特别优选的扩展方案中,这里如上所提及地设置压配合,使得保证在基板18和法兰侧导热区段11之间的良好的热传导。在图3中所示的以及就此而言优选的实施方式中,法兰侧导热区段11由基板19构成,使得法兰嵌件4直接***到基板18中的凹处5中。这样的基板18可以是上面提及的半成品,该半成品在安装步骤之后才此外与印刷电路板1连接。在此,应用通常的压制过程,在压制过程中将印刷电路板1的各个覆层2与优选由铜组成的基板18挤压。
在特别优选的扩展方案中,按照图4是:所***的法兰嵌件4不伸出板状的法兰侧导热区段11,该法兰侧导热区段11这里构成上述的基板18。在印刷电路板1的各个覆层2、2’与提供基板18的半成品的上述挤压时,这是有利的。因此,也可以这样实现挤压,使得在挤压之后在基板18的两侧上布置印刷电路板1的至少一个覆层2、2’。在图4中所示的印刷电路板1情况下也在基板18的两侧设置上面提及的铜层3,3’。
原则上,就此而言可以规定,法兰嵌件4至少在一侧上与基板18齐平地端接(abschließen),这同样在图4中示出。
按照另外的独立的教导,要求保护印刷电路板1本身和散热片10本身。可以参照对于阐述印刷电路板1和散热片10是合适的所有实施。
借助按照建议的教导,如所阐述地可以在良好的导热和半导体裸芯片7的小机械负荷之间实现最佳的折衷。
还可以指出,按照建议的印刷电路板1可以装备有多个法兰嵌件4,它们优选尤其在其热膨胀系数方面具有不同的材料参数。
也可以设想的是,按照建议的散热片10具有多个法兰嵌件4,可以分别将相应的半导体部件的半导体裸芯片7施加到所述法兰嵌件4上。存在于散热片10上的半导体裸芯片7可以彼此电接触,使得散热片10本身已经提供电功能模块。散热片10因此可以***到上级印刷电路板1上或中。
对于所有上述变型方案,可以阐明地指出,法兰嵌件4不必正好容纳一个半导体裸芯片7。相反,可以设想,法兰嵌件4承载多个这样的半导体裸芯片7。
Claims (18)
1.用于装配印刷电路板(1)的方法,所述印刷电路板(1)具有至少一个在一侧或两侧被敷铜的或者配备有印制导线的覆层(2),其中在安装步骤中将至少一个刚性的法兰嵌件(4)***到印刷电路板半成品中的所分配的凹处(5,6)中,其中所述印刷电路板半成品是所述印刷电路板(1)的散热片(10)的法兰侧导热区段(11)或所述印刷电路板(1)的基板(18),其中给所述印刷电路板(1)的散热片(10)分配法兰嵌件(4)并且使该法兰嵌件与所述散热片(10)的法兰侧导热区段(11)导热接触,而且所述散热片(10)的法兰侧导热区段(11)被板状地构成,其中所述法兰嵌件(4)的热膨胀系数不同于所述法兰侧导热区段(11)的热膨胀系数,
其特征在于,
在所述安装步骤之前,所述散热片(10)的法兰侧导热区段(11)在压配合中被压入到所述印刷电路板(1)中的凹处(12)中,
在所述安装步骤中将所述法兰嵌件(4)***到所述法兰侧导热区段(11)中的凹处(6)中,或者在所述安装步骤中将所述法兰嵌件(4)***到所述散热片(10)的法兰侧导热区段(11)中的凹处(6)中并然后将所述法兰侧导热区段(11)连同所述法兰嵌件(4)一起压入到所述印刷电路板(1)中的所分配的凹处(12)中,
在接着的施加步骤中将半导体部件的至少一个半导体裸芯片施加到所***的法兰嵌件(4)上,以及
所述法兰嵌件(4)的热膨胀系数小于所述法兰侧导热区段(11)的热膨胀系数。
2.根据权利要求1所述的方法,其特征在于,印刷电路板半成品在安装步骤之后和在施加步骤之前此外与印刷电路板(1)连接。
3.根据权利要求1所述的方法,其特征在于,所述法兰嵌件(4)的热膨胀系数小于所述法兰侧导热区段(11)的热膨胀系数的90%。
4.根据权利要求1至3之一所述的方法,其特征在于,法兰嵌件(4)具有热膨胀系数,该热膨胀系数与所施加的半导体裸芯片(7)的热膨胀系数的偏差小于10%。
5.根据权利要求1至3之一所述的方法,其特征在于,为了产生压配合,法兰嵌件(4)和/或法兰侧导热区段(11)的***源出于法兰嵌件(4)和/或法兰侧导热区段(11)的压入。
6.印刷电路板,具有至少一个在一侧或两侧被敷铜的或者配备有印制导线的覆层(2)和具有用于将由至少一个半导体部件(8)所产生的热导出的散热片(10),其中该散热片(10)具有至少一个带有凹处(6)的导热区段(11)和被***到凹处(6)中的刚性的法兰嵌件(4),半导体部件(8)的至少一个半导体裸芯片(7)能被施加到所述法兰嵌件(4)上,其中所述法兰嵌件(4)的热膨胀系数不同于所分配的法兰侧导热区段(11)的热膨胀系数,
其中所述散热片(10)的法兰侧导热区段(11)被板状地构成,并且所述法兰嵌件(4)被装入到所述散热片(10)的法兰侧导热区段(11)中的凹处(6)中,
其特征在于,
所述散热片(10)的法兰侧导热区段(11)在压配合中被压入到所述印刷电路板(1)中的凹处(12)中,
所述法兰嵌件(4)的热膨胀系数小于所述法兰侧导热区段(11)的热膨胀系数。
7.根据权利要求6所述的印刷电路板,其特征在于,所述法兰嵌件(4)的热膨胀系数小于所述法兰侧导热区段(11)的热膨胀系数的90%。
8.根据权利要求6所述的印刷电路板,其特征在于,所述法兰嵌件(4)在压配合中被压入到所述散热片(10)的法兰侧导热区段(11)中的凹处(6)中。
9.按照权利要求6至8之一的印刷电路板,其特征在于,散热片(10)的法兰侧导热区段(11)和/或法兰嵌件(4)由金属材料组成。
10.按照权利要求6至8之一的印刷电路板,其特征在于,所***的法兰嵌件(4)不伸出板状的法兰侧导热区段(11)。
11.按照权利要求6至8之一的印刷电路板,其特征在于,所述法兰侧导热区段(11)具有锯齿形或波浪形的外部轮廓(13),和/或在所述印刷电路板(1)中的被分配给法兰侧导热区段(11)的凹处(12)具有锯齿形或波浪形的内部轮廓(14)。
12.按照权利要求6至8之一的印刷电路板,其特征在于,所述散热片(10)提供印刷电路板(1)的基板(18),并且在所述基板(18)中设置用于法兰嵌件(4)的凹处(6)和/或用于散热片(10)的法兰侧导热区段(11)的凹处(12)。
13.按照权利要求6至8之一的印刷电路板,其特征在于,所述法兰侧导热区段(11)由基板(18)构成。
14.用于将由印刷电路板(1)的至少一个半导体部件(8)产生的热导出的散热片,其中散热片(10)具有至少一个带有凹处(6)的导热区段(11)和***到凹处(6)中的刚性的法兰嵌件(4),半导体部件(8)的至少一个半导体裸芯片(7)能被施加到所述法兰嵌件(4)上,并且其中法兰嵌件(4)的热膨胀系数不同于所分配的法兰侧导热区段(11)的热膨胀系数,
其中所述散热片(10)的法兰侧导热区段(11)被板状地构成,并且所述法兰嵌件(4)被装入到所述散热片(10)的法兰侧导热区段(11)中的凹处(6)中,
其特征在于,
所述散热片(10)的法兰侧导热区段(11)在压配合中被压入到所述印刷电路板(1)中的凹处(12)中,
所述法兰嵌件(4)的热膨胀系数小于所述法兰侧导热区段(11)的热膨胀系数。
15.根据权利要求14所述的散热片,其特征在于,所述法兰嵌件(4)的热膨胀系数小于所述法兰侧导热区段(11)的热膨胀系数的90%。
16.按照权利要求14所述的散热片,其特征在于,法兰嵌件(4)在压配合中被压入到法兰侧导热区段(11)中的凹处(6)中。
17.按照权利要求14至16之一所述的散热片,其特征在于,所***的法兰嵌件(4)不伸出板状的法兰侧导热区段(11)。
18.按照权利要求14至16之一所述的散热片,其特征在于,法兰侧导热区段(11)具有锯齿形或波浪形的外部轮廓(13)。
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US20140326856A1 (en) * | 2013-05-06 | 2014-11-06 | Omnivision Technologies, Inc. | Integrated circuit stack with low profile contacts |
JP2016015432A (ja) * | 2014-07-03 | 2016-01-28 | イビデン株式会社 | 回路基板及びその製造方法 |
JP2016119798A (ja) * | 2014-12-22 | 2016-06-30 | 株式会社オートネットワーク技術研究所 | 回路構成体及び電気接続箱 |
TWI624957B (zh) * | 2015-08-19 | 2018-05-21 | 乾坤科技股份有限公司 | 光電模組及其製造方法 |
CN105934095B (zh) * | 2016-06-28 | 2019-02-05 | Oppo广东移动通信有限公司 | Pcb板及具有其的移动终端 |
KR102565119B1 (ko) * | 2016-08-25 | 2023-08-08 | 삼성전기주식회사 | 전자 소자 내장 기판과 그 제조 방법 및 전자 소자 모듈 |
DE102017205453B3 (de) | 2017-03-30 | 2018-07-12 | Continental Automotive Gmbh | Verfahren zum Bestücken einer Leiterplatte und Bestückungsvorrichtung |
CN110139462B (zh) * | 2018-02-09 | 2024-06-07 | 深南电路股份有限公司 | 一种印刷电路板及其制作方法和电子装置 |
CN109037161A (zh) * | 2018-06-15 | 2018-12-18 | 华为技术有限公司 | 一种法兰和半导体功率器件 |
JP7479893B2 (ja) * | 2020-03-27 | 2024-05-09 | 京セラ株式会社 | 電子部品搭載用基板、電子装置および電子モジュール |
TWI724898B (zh) * | 2020-05-14 | 2021-04-11 | 欣興電子股份有限公司 | 銅板結構、具埋入式銅塊的電路板及其製作方法 |
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DE202010016256U1 (de) * | 2010-12-07 | 2012-03-19 | Schoeller-Electronics Gmbh | Leiterplatte |
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EP0124029B1 (de) * | 1983-04-29 | 1987-07-29 | Siemens Aktiengesellschaft | Ein elektrisches Bauteil tragendes, gut kühlbares Schaltungsmodul |
CN1284746A (zh) * | 1999-07-02 | 2001-02-21 | 国际商业机器公司 | 电子元件用的电子封装及其制造方法 |
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