CN102983128A - LED and manufacturing method thereof - Google Patents
LED and manufacturing method thereof Download PDFInfo
- Publication number
- CN102983128A CN102983128A CN2012105439302A CN201210543930A CN102983128A CN 102983128 A CN102983128 A CN 102983128A CN 2012105439302 A CN2012105439302 A CN 2012105439302A CN 201210543930 A CN201210543930 A CN 201210543930A CN 102983128 A CN102983128 A CN 102983128A
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- China
- Prior art keywords
- led
- luminous tube
- led chip
- plate shape
- chip
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48135—Connecting between different semiconductor or solid-state bodies, i.e. chip-to-chip
- H01L2224/48137—Connecting between different semiconductor or solid-state bodies, i.e. chip-to-chip the bodies being arranged next to each other, e.g. on a common substrate
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48135—Connecting between different semiconductor or solid-state bodies, i.e. chip-to-chip
- H01L2224/48137—Connecting between different semiconductor or solid-state bodies, i.e. chip-to-chip the bodies being arranged next to each other, e.g. on a common substrate
- H01L2224/48139—Connecting between different semiconductor or solid-state bodies, i.e. chip-to-chip the bodies being arranged next to each other, e.g. on a common substrate with an intermediate bond, e.g. continuous wire daisy chain
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- Led Device Packages (AREA)
Abstract
The invention discloses an LED (light-emitting diode) and a manufacturing method of the LED. The LED comprises a semi-transparent or fully-transparent strip ceramic bracket, a plurality of LED chips mounted on the surface of the bracket, a bonding pad circuit arranged at one end of the bracket, and fluorescent powder resin coated on the surface of the bracket for encasing the LED chips, wherein the LED chips are connected by a metal wire to form a single string or a plurality of strings. The LED chips of the LED are glued on the strip ceramic bracket by silver glue. The LED achieves 360-degree sphere light emitting. The invention further discloses the corresponding manufacturing method of the LED.
Description
Technical field
The present invention relates to a kind of novel LED luminous tube and manufacture method thereof.
Background technology
Along with LED encapsulates to slimming and cost degradation future development, chip on board (COB) encapsulation technology is progressively risen.The common practice of current C OB encapsulation is that led chip is arranged on the aluminum base plate.The insulating barrier conductive coefficient of aluminum base plate is extremely low, and because the existence of insulating barrier so that it can't bear high-temperature soldering, has limited the optimization of encapsulating structure, is unfavorable for the LED heat radiation.The processing and manufacturing process of adding aluminium base is complicated, cost is high, and the thermal coefficient of expansion of aluminium and chip material differ larger, so prospect is not fine in the practical application.
On the other hand, most led light source in prior art field has two shortcomings: 1) the light rate of getting of led chip is low; 2) led light source is that single face is luminous.
In the prior art, the someone proposes to utilize 4 π luminous elements to carry out packaged light source, has improved to a certain extent light extraction efficiency.Yet this light source design does not fully solve heat dissipation problem, can't effectively reduce the led chip junction temperature, so that the light source light decay is large, the life-span is short, can't satisfy the long-life requirement of led light source.In addition, this light source complex manufacturing of the prior art can't reach production in enormous quantities, is difficult to guarantee the consistency of product colour temperature.
Summary of the invention
The present invention is intended to overcome traditional led light source (in particular for the led light source of room lighting), and light efficiency is low, poor heat radiation, aobviously refer to the multinomial defectives such as low.
The present invention uses translucent or the Heat Conduction Material of all-transparent, preferably, uses ceramic bar as the led chip support, carries out the encapsulation of COB mode.
According to a kind of LED luminous tube of the present invention, comprising: the strip-shaped bracket of translucent or all-transparent; At a plurality of led chips that described rack surface is installed, described led chip is connected and composed the form of single string or several and several strings by wire; And the pad circuit that is arranged on an end of described support; Be coated with phosphor gel fat to encase described led chip at described rack surface.
Manufacture method according to a kind of LED luminous tube of the present invention comprises: the plate shape substrates of translucent or all-transparent is provided, is shaped with a plurality of grooves on the described plate shape substrates, limit a plurality of bar areas; A plurality of led chip groups are installed on described plate shape substrates in bulk, a led chip group is installed in each bar area, each led chip group comprises a plurality of led chips; The a plurality of led chips in described each led chip group are connected to the form of single string or several and several strings with wire; An end setting and pad circuit corresponding to each led chip group at plate shape substrates; Coating fluorescent powder glue fat is to encase described led chip on each led chip group; Along described groove described plate shape substrates is separated into a plurality of strip-shaped bracket.
According to an aspect of the present invention, described LED luminous tube is preferably ceramic bar luminous tube, and wherein said support is made by pottery.Can be alternatively, support is made by translucent or the composition metal of all-transparent, heat conduction complex plastic, thermal conductive ceramic.
According to an aspect of the present invention, led chip can be bonded on the described support by elargol.
According to an aspect of the present invention, led chip be 6 luminous, thereby it is luminous to make whole LED luminous tube form 360 degree circles.
According to an aspect of the present invention, packaged a plurality of led chips can be the chip of identical illuminant colour; Or the chip of different colors.
According to an aspect of the present invention, alternatively, can be coated with at the back side of led chip support phosphor gel fat.
According to an aspect of the present invention, alternatively, can led chip all be installed on the two sides of led chip support.
The present invention has following one or more advantage thus: omnidirectional is luminous; Good heat dissipation, heat conduction is fast; Can control the phosphor gel amount, be convenient to colour temperature control; Be convenient to mass production; Can encapsulate the chip of different wave length, color rendering is good.
Description of drawings
Fig. 1 is the illuminating source packaging structure plane graph of LED pottery bar luminous tube according to an embodiment of the invention.
Fig. 2 a is the schematic diagram that the LED pottery bar luminous tube of PCB pad circuit is installed according to an embodiment of the invention, and Fig. 2 b is that the pottery of LED shown in Fig. 2 a bar luminous tube is along the sectional structure schematic diagram of A-A line.
Fig. 3 a is the schematic diagram that the LED pottery bar luminous tube of PCB pad circuit is installed according to an embodiment of the invention, and Fig. 3 b is that the pottery of LED shown in Fig. 3 a bar luminous tube is along the sectional structure schematic diagram of A-A line.
Fig. 4 is the illuminating source packaging structure end view of LED pottery bar luminous tube according to an embodiment of the invention.
Fig. 5 is the schematic plan view according to LED pottery bar luminous tube mass production processes of the present invention.
Fig. 6 is the flow chart according to LED pottery bar luminous tube mass production processes of the present invention.
The Reference numeral implication is as follows: the ceramic bar of 1 translucent or all-transparent, 2LED chip, 3 wire wires, 4 phosphor gel fat, 5PCB pad circuit, 6 brush silver soldering dish circuit, 7 elargol, 8 ceramic bar luminous tubes.
Embodiment
Below in conjunction with drawings and Examples the present invention is described in detail.
Fig. 1 is the illuminating source packaging structure plane graph of LED pottery bar luminous tube according to an embodiment of the invention.
As shown in Figure 1, a LED pottery bar luminous tube 8 includes a translucent or support of all-transparent.Support is preferably ceramic bar 1(for ease of discussing, and hereinafter support is embodied as ceramic bar 1).Pottery is equipped with the led chip 2 of single string or several and several strings on the bar 1, consists of the led chip group, all led chips by the elargol fixed bonding on ceramic bar 1; Link together with wire wire 3 between chip and the chip, each P-N knot of chip is connected with multiple different string and mode equidirectionally.After consisting of string and mode, described ceramic bar 1, led chip 2 and connecting line 4 thereof translucent or all-transparent become a naked LED light-emitting section.
Fig. 2 a is the schematic diagram that the LED pottery bar luminous tube of PCB pad circuit is installed according to an embodiment of the invention, and Fig. 2 b is (not yet marking among the figure) sectional structure schematic diagram along the A-A line of the pottery of LED shown in Fig. 2 a bar luminous tube.Fig. 3 a is the schematic diagram that the LED pottery bar luminous tube of PCB pad circuit is installed according to an embodiment of the invention, and Fig. 3 b is the sectional structure schematic diagram along the A-A line of the pottery of LED shown in Fig. 3 a bar luminous tube.
Referring to Fig. 2 a to Fig. 3 b, also be fixed with pad (omitting among Fig. 1) at ceramic bar 1 one ends.According to the present invention, pad can be PCB pad circuit 5(Fig. 2 a-Fig. 2 b of FR4 plate) or pad circuit 6(Fig. 3 a-Fig. 3 b of brush elargol).
Fig. 4 is the illuminating source packaging structure end view of LED pottery bar luminous tube according to an embodiment of the invention.In conjunction with reference to figure 1 and Fig. 4, in the present embodiment, on the surface of ceramic bar for example coating fluorescent powder glue fat 4 to encase led chip.Phosphor gel fat 4 is such as the mixture that can be AB silica gel, yellow fluorescent powder, red fluorescence powder, green powder etc., thereby excites blue light or red LED chip to send white light.
In the present embodiment, owing to used transparent or semitransparent ceramic bar 1, penetrate so that the light that send led chip 2 bottoms can see through ceramic bar 1, that is, realized that 6 omnidirectionals of led chip 2 are luminous.Accordingly, it is luminous that whole ceramic bar 1 forms 360 degree circles, greatly improves the led chip light emission rate, makes the light efficiency of this kind light source reach higher.Simultaneously, because pottery has good heat conductivity, improved the heat dispersion of led chip.
In the present embodiment, as shown in Figure 4, for example use elargol 7 with the chip fixed bonding on ceramic bar 1.Because silver has good heat conductivity, therefore can further improve the heat dispersion of led chip.
In the present embodiment, can encapsulate at ceramic bar 1 the plurality of LEDs chip of identical wavelength or different wave length (different colors), so color rendering is good.
In the present embodiment, except the coating fluorescent powder glue fat 4 of (one side of led chip being installed) in the front of ceramic bar 1, also can be at the back side of ceramic bar 1 also coating fluorescent powder glue fat.Therefore, the glue amount of phosphor gel fat is controlled, and then is conducive to colour temperature control.
Fig. 5 is the schematic plan view according to LED pottery bar luminous tube mass production processes of the present invention.Referring to Fig. 5, LED pottery bar of the present invention is convenient to mass production.Can (make in advance groove) on the ceramic substrate of monoblock, adopt full-automatic sealed in unit to carry out a glue, die bond, bonding wire, be coated with a series of COB encapsulation processs such as fluorescent material, test, guarantee effectively that thus phosphor gel fat even thickness is consistent, colour temperature is consistent.After above-mentioned operation is finished, a plurality of ceramic bars are delineated and be separated into to ceramic substrate.
Fig. 6 is the flow chart according to LED pottery bar luminous tube mass production processes of the present invention.Referring to Fig. 5 and Fig. 6, in step 610, provide the flaky pottery substrate of translucent or all-transparent, on this flaky pottery substrate, be shaped with a plurality of grooves 54, groove 54 limits a plurality of bar areas; In step 620, a plurality of led chip groups are installed on described ceramic substrate in bulk, a led chip group is installed in each bar area, each led chip group comprises a plurality of led chips 52; In step 630, a plurality of led chips 52 in each led chip group are connected to the form of single string or several and several strings with wire 53; In step 640, at an end of flaky pottery substrate a plurality of pad circuit 51(PCB pad circuit are set, or brush silver soldering dish circuit), each pad circuit 51 corresponding led chip group; In step 650, coating fluorescent powder glue fat 4 is to encase led chip 52 on each led chip group; In step 660, along groove described ceramic substrate is separated (for example, breaking into two with one's hands) and be a plurality of ceramic bars.Alternatively, before step 660, can test first.As required, also can after step 660, test again.
In above scheme, used transparent or semitransparent ceramic material to make the support of led chip.Yet according to principle of the present invention, the present invention should be contained any transparent or semitransparent, and has the led chip support that the other materials of excellent radiating effect is made.For example, the support among Fig. 11 can be that composition metal, heat conduction complex plastic or thermal conductive ceramic are made.
In above scheme, in the one side of support led chip is installed.As a kind of optional modification to this scheme, can led chip all be installed on the two sides of support.
Industrial applicability
According to being used for making LED candle bulb, ball bubble, lighting etc. after the LED luminous tube encapsulation of the present invention.
Each case study on implementation that the scope of protection of present invention is not limited to introduce herein, all various forms of conversion and replacement of doing based on the present patent application claim scope and description are all in the protection range of patent of the present invention.
Claims (10)
1. LED luminous tube comprises:
The support (1) of translucent or all-transparent;
At a plurality of led chips (2) that described rack surface is installed, described led chip is connected and composed the form of single string or several and several strings by wire;
Be arranged on the pad circuit of an end of described support; And
Be coated in the phosphor gel fat (4) of described rack surface, be used for encasing described a plurality of led chip.
2. LED luminous tube as claimed in claim 1 is characterized in that, described support is the strip ceramics bracket.
3. LED luminous tube as claimed in claim 1 is characterized in that, described support is made by translucent or the composition metal of all-transparent, heat conduction complex plastic or thermal conductive ceramic.
4. LED luminous tube as claimed in claim 1 is characterized in that, described a plurality of led chips are bonded on the described support by elargol (8).
5. LED luminous tube as claimed in claim 1 is characterized in that, described a plurality of led chips be 6 luminous, thereby it is luminous to make whole described LED luminous tube form 360 degree circles.
6. LED luminous tube as claimed in claim 1 is characterized in that, described a plurality of led chips are:
The chip of identical illuminant colour; Or
The chip of different colors.
7. LED luminous tube as claimed in claim 1 is characterized in that, is coated with phosphor gel fat at the back side of described support.
8. LED luminous tube as claimed in claim 1 is characterized in that, on the two sides of described support a plurality of led chips is installed all.
9. the manufacture method of a LED luminous tube comprises:
The plate shape substrates of translucent or all-transparent is provided, is shaped with a plurality of grooves on the described plate shape substrates, limit a plurality of bar areas;
A plurality of led chip groups are installed on described plate shape substrates in bulk, a led chip group is installed in each bar area, each led chip group comprises a plurality of led chips;
The a plurality of led chips in described each led chip group are connected to the form of single string or several and several strings with wire;
An end setting and pad circuit corresponding to each led chip group at plate shape substrates;
Coating fluorescent powder glue fat is to encase described led chip on each led chip group;
Along described groove described plate shape substrates is separated into a plurality of strip-shaped bracket.
10. the manufacture method of LED luminous tube as claimed in claim 9 is characterized in that, described plate shape substrates is ceramic substrate.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2012105439302A CN102983128A (en) | 2012-12-14 | 2012-12-14 | LED and manufacturing method thereof |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2012105439302A CN102983128A (en) | 2012-12-14 | 2012-12-14 | LED and manufacturing method thereof |
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| Publication Number | Publication Date |
|---|---|
| CN102983128A true CN102983128A (en) | 2013-03-20 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
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| CN2012105439302A Pending CN102983128A (en) | 2012-12-14 | 2012-12-14 | LED and manufacturing method thereof |
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103292173A (en) * | 2013-04-28 | 2013-09-11 | 杭州杭科光电股份有限公司 | 4 Pi luminous LED light source module |
Citations (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1218996A (en) * | 1997-11-27 | 1999-06-09 | 陈兴 | Multiple colour light emitting diode body |
| US20050207165A1 (en) * | 2001-08-09 | 2005-09-22 | Matsushita Electric Industrial Co., Ltd. | LED illumination apparatus and card-type LED illumination source |
| CN1828921A (en) * | 2005-01-21 | 2006-09-06 | 范朝阳 | Heterogeneous integrated high voltage DC/AC light emitter |
| US20090311810A1 (en) * | 2006-03-17 | 2009-12-17 | Industrial Technology Research Institute | Method of manufacturing bendable solid state lighting |
| CN101800270A (en) * | 2009-02-11 | 2010-08-11 | 亿光电子工业股份有限公司 | Light emitting diode device and packaging method therefore |
| CN202259395U (en) * | 2011-09-07 | 2012-05-30 | 王元成 | LED (light-emitting diode) light source |
| CN203179880U (en) * | 2012-12-14 | 2013-09-04 | 浙江名芯半导体科技有限公司 | LED tube |
-
2012
- 2012-12-14 CN CN2012105439302A patent/CN102983128A/en active Pending
Patent Citations (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1218996A (en) * | 1997-11-27 | 1999-06-09 | 陈兴 | Multiple colour light emitting diode body |
| US20050207165A1 (en) * | 2001-08-09 | 2005-09-22 | Matsushita Electric Industrial Co., Ltd. | LED illumination apparatus and card-type LED illumination source |
| CN1828921A (en) * | 2005-01-21 | 2006-09-06 | 范朝阳 | Heterogeneous integrated high voltage DC/AC light emitter |
| US20090311810A1 (en) * | 2006-03-17 | 2009-12-17 | Industrial Technology Research Institute | Method of manufacturing bendable solid state lighting |
| CN101800270A (en) * | 2009-02-11 | 2010-08-11 | 亿光电子工业股份有限公司 | Light emitting diode device and packaging method therefore |
| CN202259395U (en) * | 2011-09-07 | 2012-05-30 | 王元成 | LED (light-emitting diode) light source |
| CN203179880U (en) * | 2012-12-14 | 2013-09-04 | 浙江名芯半导体科技有限公司 | LED tube |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103292173A (en) * | 2013-04-28 | 2013-09-11 | 杭州杭科光电股份有限公司 | 4 Pi luminous LED light source module |
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Application publication date: 20130320 |