CN102974703A - Experimental apparatus for simulating cooling system of mold - Google Patents
Experimental apparatus for simulating cooling system of mold Download PDFInfo
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- CN102974703A CN102974703A CN2012104977312A CN201210497731A CN102974703A CN 102974703 A CN102974703 A CN 102974703A CN 2012104977312 A CN2012104977312 A CN 2012104977312A CN 201210497731 A CN201210497731 A CN 201210497731A CN 102974703 A CN102974703 A CN 102974703A
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- cooling system
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- guide plate
- cooling
- metal dust
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Abstract
The invention discloses an experimental apparatus for simulating a cooling system of a mold, which is characterized in that the cooling system is made into an independent module and then inserted into the mold; metal powder is filled in the mold by utilizing the fluidity of the metal powder, so that one mold changes a plurality of cooling systems as needed, then the problems of the cooling systems of a hot stamping mold and an injection mold are discovered and researched, and accuracy of simulation and analogue results of the cooling system of the mold is verified.
Description
Technical field
Patent of the present invention relates to a kind of experimental provision of simulating mold cooling system, especially is applicable to the cooling system of hot stamping die and injection mold.
Background technology
Automotive light weight technology is promoting the fast development of super-high strength steel hot technology.Hot stamping die is the core component in the drop stamping production line, and its effect is in the hot forming process, finishes high-temperature steel plate and is shaped and Quenching Treatment, and therefore need to process cooling pipe in mould improves cooling velocity, finishes the martensite transfor mation of heat-punch member.Therefore the cooling of mold temperature and dwell time take the time more than 1/2 in the production process in the industrial production, improve cooling velocity and be the effective means of enhancing productivity and reducing production costs.In addition, be subjected to the restriction of mould structure and heat-punch member shape, cooling pipe can not be evenly arranged in the mould, thereby causes quenching velocity inhomogeneous, affect heat-punch member forming accuracy and performance, therefore be badly in need of carrying out mold cools down pipeline and the research of cooling velocity optimal design.
In the injection mold, it is calculated that 95% of molten plastic heat is taken away by cooling system, inject time, dwell time and cool time account for more than 3/4 of whole injection cycle, thereby cooling system is determining injection molded efficient.And good cooling system can realize that molten plastic evenly cools off, and reduces the buckling deformation of injection-molded item, improves dimensional accuracy, improves surface quality, improves combination property, thereby also extremely important to the research of injection mould cooling system.
Development along with computer technology, the researcher can change arbitrarily the cooling system parameter by the CAD modeling, carry out the aspect researchs such as temperature field, flow velocity of cooling system by CAE, the research paper of the analog simulation aspect of many hot stamping dies and injection mould cooling system therefore occurred.Yet in the reality, because the Mould Machining somewhat expensive, the cooling system parameter is more, and is complex-shaped, is difficult for the difficult problems such as processing, so it is less to carry out the research of mold cooling system experiment.Yet theoretical research need to be tested to prove, and only have experiment could verify analog simulation result's accuracy, so the experimental study of mold cooling system also need be caught up with theoretical paces.
Summary of the invention
In order to carry out the experimental study of mold cooling system, overcome the deficiency that a mold can only be processed a cover or less cooling system, patent of the present invention provides a kind of experimental provision of simulating mold cooling system, and this device is any conversion cooling system as required.
Patent of the present invention solves the technical scheme that its technical problem adopts: process base plate according to die face, in base plate thickness remains on more among a small circle (about 10mm), at base plate both sides resting guide, be assembled into a housing, cooling pipe, guide plate, spacer are dressed up cooling system by the demand der group, cooling system is inserted in the housing, insert metal dust, utilize the flowability of metal dust, enclosure interior is enriched, the housing seal of again metal dust being enriched is assembled into the hot stamping die or the injection mold that contain cooling system.
When changing cooling system, open housing, remove metal dust, take out and the dismounting cooling system, re-assembly as requested new cooling system, new cooling system is inserted in the housing, insert metal dust, utilize the flowability of metal dust, enclosure interior is enriched, the housing seal of again metal dust being enriched is assembled into the hot stamping die or the injection mold that contain new cooling system.
According to demand, change guide plate, spacer or cooling pipe, can realize that a secondary mould changes multiple cooling system as required, and then find and problem that the research cooling system occurs the accuracy of checking cooling system emulation and analog result.
Description of drawings
Below in conjunction with accompanying drawing patent of the present invention is further specified.
Fig. 1 is the axonometric drawing of patent of the present invention.
Fig. 2 is the front view of patent of invention.
Fig. 3 is the guide plate axonometric drawing.
Fig. 4 is the spacer axonometric drawing.
Fig. 5 is cooling system.
1. base plates among the figure, 2. cooling pipe, 3. spacer, 4. guide plate, 5. metal dust, 6. cover plate, 7. side plate.
The specific embodiment
Further specify content of the present invention and the specific embodiment thereof below in conjunction with the accompanying drawing example illustrated.
In Fig. 1 example, base plate (1) is hot die steel H13, thickness 10mm, cooling pipe material ordinary carbon steel pipe Φ 10 * 2mm, spacer is the thick rubber of 10mm, metal dust be 0.5~10 μ m for finely divided iron powder, guide plate, cover plate and side plate are the thick ordinary carbon steel plate of 10mm, the horizontal and longitudinal hole in its centering guide hole is apart from 15mm.The design of Cooling System parameter is: apart from die top 15mm, and pitch of holes 15mm, aperture 8mm.Design elements is finished the cooling system that meets the demands as requested.
In conjunction with Fig. 1 example, this device specific embodiment is: base plate (1) and side plate (7) are welded into housing; In Fig. 5, cooling pipe (2), spacer (3) and guide plate (4) are assembled into cooling system S1, wherein spacer (3) and guide plate (4) are two, spacer (3) is in guide plate (4) inboard, cooling pipe passes spacer (3) and guide plate (4), and by guide plate (4) location; Again with cooling system S
1Be inserted in the housing, the added metal powder again with cover plate (6) sealing, forms and contains this cooling system S
1Mould.When changing cooling system, open first cover plate (6), take out cooling system S
1, the assembling mode of change cooling pipe and guide plate is changed spacer (3), is assembled into cooling system S
2, again with cooling system S
2Be inserted in the housing added metal powder; With cover plate (6) sealing, form and contain this cooling system S again
2Mould.Can be according to requirement of experiment runners (4), spacer (3) and cooling pipe, and be assembled into the cooling system S that satisfies requirement of experiment
S, can design base plate (1) and side plate (7) according to requirement of experiment, to satisfy the workpiece shape in the actual production.
Claims (4)
1. experimental provision of simulating mold cooling system, this device is by mould housing, guide plate, spacer, cooling pipe, metal dust and cover plate etc. are combined into mold integral, it is characterized in that: mould inside is filled by metal dust, cooling pipe is located by guide plate in mould, as required conversion cooling system parameter.
2. experimental provision according to claim 1 is characterized in that: fill metal dust in the mould housing.
3. experimental provision according to claim 1 is characterized in that: cooling system is changed cooling system and only need be changed guide plate or change cooling pipe position in guide plate by the guide plate positioning supports.
4. experimental provision according to claim 1 is characterized in that: utilize the spacer resistance to overflow from guide plate from metal dust.
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CN201210497731.2A CN102974703B (en) | 2012-11-29 | 2012-11-29 | Experimental apparatus for simulating cooling system of mold |
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CN201210497731.2A CN102974703B (en) | 2012-11-29 | 2012-11-29 | Experimental apparatus for simulating cooling system of mold |
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CN102974703A true CN102974703A (en) | 2013-03-20 |
CN102974703B CN102974703B (en) | 2015-03-18 |
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Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN103822775A (en) * | 2014-02-11 | 2014-05-28 | 机械科学研究总院先进制造技术研究中心 | Flexible apparatus capable of observing full-flow state of channel in component |
CN109047500A (en) * | 2018-08-22 | 2018-12-21 | 上海博汇模具有限公司 | A kind of hot forming soft mode structure and production method |
CN110788295A (en) * | 2019-11-08 | 2020-02-14 | 浙江大学 | Die casting die cooling process simulation testing machine |
Citations (4)
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JP2006168280A (en) * | 2004-12-17 | 2006-06-29 | Mitsubishi Heavy Industries Plastic Technology Co Ltd | Simulation device for injection molding and simulation method for injection molding |
US20080077369A1 (en) * | 2006-09-25 | 2008-03-27 | Coretech System Co., Ltd | Apparatus and method for simulating a mold cooling process for injection molding |
CN102259138A (en) * | 2011-05-03 | 2011-11-30 | 上海北特科技股份有限公司 | Thermal forming test die with cooling water path |
CN202256007U (en) * | 2011-09-28 | 2012-05-30 | 钢铁研究总院 | Multifunctional thermal forming test device |
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2012
- 2012-11-29 CN CN201210497731.2A patent/CN102974703B/en active Active
Patent Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2006168280A (en) * | 2004-12-17 | 2006-06-29 | Mitsubishi Heavy Industries Plastic Technology Co Ltd | Simulation device for injection molding and simulation method for injection molding |
US20080077369A1 (en) * | 2006-09-25 | 2008-03-27 | Coretech System Co., Ltd | Apparatus and method for simulating a mold cooling process for injection molding |
CN102259138A (en) * | 2011-05-03 | 2011-11-30 | 上海北特科技股份有限公司 | Thermal forming test die with cooling water path |
CN202256007U (en) * | 2011-09-28 | 2012-05-30 | 钢铁研究总院 | Multifunctional thermal forming test device |
Cited By (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN103822775A (en) * | 2014-02-11 | 2014-05-28 | 机械科学研究总院先进制造技术研究中心 | Flexible apparatus capable of observing full-flow state of channel in component |
CN103822775B (en) * | 2014-02-11 | 2016-08-31 | 机械科学研究总院先进制造技术研究中心 | A kind of flexible apparatus of Observable part inner flow passage whether flowing full |
CN109047500A (en) * | 2018-08-22 | 2018-12-21 | 上海博汇模具有限公司 | A kind of hot forming soft mode structure and production method |
CN110788295A (en) * | 2019-11-08 | 2020-02-14 | 浙江大学 | Die casting die cooling process simulation testing machine |
CN110788295B (en) * | 2019-11-08 | 2020-09-18 | 浙江大学 | Die casting die cooling process simulation testing machine |
WO2021088440A1 (en) * | 2019-11-08 | 2021-05-14 | 浙江大学 | Testing machine for simulating die-casting die cooling process |
US11752545B2 (en) | 2019-11-08 | 2023-09-12 | Zhejiang University | Testing machine for simulating die-casting die cooling process |
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