CN102970834A - Method for fabricating circuit board metallized half hole - Google Patents
Method for fabricating circuit board metallized half hole Download PDFInfo
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- CN102970834A CN102970834A CN2011102578169A CN201110257816A CN102970834A CN 102970834 A CN102970834 A CN 102970834A CN 2011102578169 A CN2011102578169 A CN 2011102578169A CN 201110257816 A CN201110257816 A CN 201110257816A CN 102970834 A CN102970834 A CN 102970834A
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- circuit board
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- board
- half hole
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Abstract
The invention discloses a method for fabricating a circuit board metallized half hole. The method includes the following steps of (1) reversely fixing a circuit board, (2) secondarily drilling unit edge metallized half hole, (3) fixing the circuit board in the positive direction, (4) milling board edge metallized half hole and (5) finishing board milling, wherein the step (1) includes that a unit circuit board to be milled is reversely fixed on a drilling machine through a positioning nail; the step (2) includes that a drilling hole program is called, a drill bit is clockwise and rotatably cut into the hole wall to perform secondary drilling to the metallized half hole, and when the front side of a milling board is merely drilled, a milling cutter mills an inlet side; the step (3) includes that the circuit board is placed in the positive direction and fixed on a milling board machine; the step (4) includes that a milling board program is called, and the milling cutter clockwise mills to form a unit edge; and the step (5) includes that the milling board action is finished, the circuit board is milled to small units, and thereby the metallized half hole is formed. According to the method for fabricating the circuit board metallized half hole, burr peak is effectively avoided, processes of tinning and removing the burr peak by an alkaline etching solution are not required, the fabricating process of the circuit board is shortened, the fabricating cost is lowered, and the production efficiency is improved.
Description
Technical field
The present invention relates to wiring board and make the field, particularly the manufacture method of a kind of wiring board unit limit metallized semi-pore.
Background technology
In wiring board is made industry, usually there is product at edges of boards the design of metallized semi-pore to be arranged, this type of design is milled plate technique when making according to tradition, has the remaining problem of burr.When milling metallized semi-pore, when milling cutter enters metallized semi-pore in the hole of entrance side copper sheet be in the state that does not stress and support, this side opening wall copper sheet will with the rotation of milling cutter, be rolled into the formation burr peak hole in when milling plate; And the hole opposite side, because there is hole wall to support, there is not the burr peak in copper sheet by mill off.In order to prevent from milling plate, the copper sheet of milling cutter entrance side is involved in and forms the burr peak in the hole, and those skilled in the art have made a lot of effort.At present, comparatively general element sides metallized semi-pore manufacture method adopts exactly and mills plate behind the graphic plating tin and alkaline etching liquid is removed the burr peak, namely by electrotinning before milling plate, protects the copper that is not milled; Remove the capillary copper thorn peak that exposes through milling plate with alkaline etching liquid after milling plate.But this kind method is not easy control, and on the one hand, because the needs that technique is made, zinc-plated thickness probably be 0.2mil, mill again plate after zinc-plated to be easy to cause the tin face to abrade, and the also bad control of zinc-plated thickness; On the other hand, can cause during alkali etching that to reveal sheet material unusual, and need to control appropriately to the time of alkali etching after zinc-plated, if the time of placement is oversize, just may causes and take off tin not to the utmost.In addition, because increased zinc-plated operation, and need to be equipped with alkaline etching liquid, improved the cost of manufacture of wiring board, prolonged the Production Time of wiring board.
Summary of the invention
The present invention seeks to provides a kind of without burr peak problem in order to overcome the deficiencies in the prior art, and makes flow process weak point, the manufacture method of the producing circuit board metallized semi-holes that cost is low.
For achieving the above object, the technical solution used in the present invention is: a kind of manufacture method of producing circuit board metallized semi-holes comprises following steps:
1. reverse fixing circuit board: will finish the unit line plate to be milled that front operation is made, and put plate by traditional front and be adjusted into reverse side and put plate, and by locating pin wiring board is fixed on the drilling machine;
2. two bore the element sides metallized semi-pore: transfer drilling program, drill bit clockwise direction rotary cutting enters hole wall, and metallized semi-pore is carried out two brills, and the milling cutter entrance side when only boring positive facing cut plate of holing;
3. forward fixing circuit board: change wiring board into front and put plate, be fixed on the plate-milling machine;
4. mill the edges of boards metallized semi-pore: transfer routing program, milling cutter mills out element sides in the direction of the clock;
5. milling plate finishes: finish and mill the plate action, wiring board mills into junior unit, and metallized semi-pore forms.
Because the utilization of technique scheme, the present invention compared with prior art has following advantages:
The manufacture method of a kind of producing circuit board metallized semi-holes of the present invention program, when two bore the element sides metallized semi-pore, when the drill bit dextrorotation is turned into hole wall, because plate is put in traditional front to be adjusted into reverse side and to put plate, so that there is support-side the milling cutter porch, copper sheet can't be rolled into and form the burr peak in the hole, and the while is also cut removal fully with the burr peak of milling cutter entrance side in the hole, has effectively solved burr peak problem.And the manufacture method of the present invention program's producing circuit board metallized semi-holes does not need zinc-plated and alkaline etching liquid is removed burr peak operation, has shortened wiring board and has made flow process, has reduced cost of manufacture, has improved production efficiency.
Embodiment
The manufacture method of a kind of producing circuit board metallized semi-holes of the present invention comprises following steps:
1. reverse fixing circuit board: will finish the unit line plate to be milled that front operation is made, and put plate by traditional front and be adjusted into reverse side and put plate, and by locating pin wiring board is fixed on the drilling machine;
2. two bore the element sides metallized semi-pore: transfer drilling program, drill bit clockwise direction rotary cutting enters hole wall, and metallized semi-pore is carried out two brills, and the milling cutter entrance side when only boring positive facing cut plate of holing, and the burr peak of milling cutter entrance side is namely excised fully;
3. forward fixing circuit board: change wiring board into front and put plate, be fixed on the plate-milling machine;
4. mill the edges of boards metallized semi-pore: transfer routing program, milling cutter mills out element sides in the direction of the clock, because two brills are removed the burr peak of milling cutter entrance side fully, this mills plate only needs mill off entrance side hole wall base material to get final product, and milling cutter is capable when entering to opposite side, and the stressed smooth cutting of burr peak is finished;
5. milling plate finishes: finish and mill the plate action, wiring board mills into junior unit, and metallized semi-pore forms.
Because the utilization of technique scheme, the present invention compared with prior art has following advantages:
The manufacture method of a kind of producing circuit board metallized semi-holes of the present invention, when two bore the element sides metallized semi-pore, when the drill bit dextrorotation is turned into hole wall, because plate is put in traditional front to be adjusted into reverse side and to put plate, so that there is support-side the milling cutter porch, copper sheet can't be rolled into and form the burr peak in the hole, and the while is also cut removal fully with the burr peak of milling cutter entrance side in the hole, has effectively solved burr peak problem.And the manufacture method of the present invention program's producing circuit board metallized semi-holes does not need zinc-plated and alkaline etching liquid is removed burr peak operation, has shortened wiring board and has made flow process, has reduced cost of manufacture, has improved production efficiency.
Above-described embodiment only is explanation technical conceive of the present invention and characteristics; its purpose is to allow the personage that is familiar with technique can understand content of the present invention and is implemented; can not limit protection scope of the present invention with this; all equivalences that Spirit Essence is done according to the present invention change or modify, and all should be encompassed in protection scope of the present invention.
Claims (1)
1. the manufacture method of a producing circuit board metallized semi-holes comprises following steps:
1. reverse fixing circuit board: will finish the unit line plate to be milled that front operation is made, and put plate by traditional front and be adjusted into reverse side and put plate, and by locating pin wiring board is fixed on the drilling machine;
2. two bore the element sides metallized semi-pore: transfer drilling program, drill bit clockwise direction rotary cutting enters hole wall, and metallized semi-pore is carried out two brills, and the milling cutter entrance side when only boring positive facing cut plate of holing;
3. forward fixing circuit board: change wiring board into front and put plate, be fixed on the plate-milling machine;
4. mill the edges of boards metallized semi-pore: transfer routing program, milling cutter mills out element sides in the direction of the clock;
5. milling plate finishes: finish and mill the plate action, wiring board mills into junior unit, and metallized semi-pore forms.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2011102578169A CN102970834A (en) | 2011-09-02 | 2011-09-02 | Method for fabricating circuit board metallized half hole |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2011102578169A CN102970834A (en) | 2011-09-02 | 2011-09-02 | Method for fabricating circuit board metallized half hole |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN102970834A true CN102970834A (en) | 2013-03-13 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN2011102578169A Pending CN102970834A (en) | 2011-09-02 | 2011-09-02 | Method for fabricating circuit board metallized half hole |
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| CN (1) | CN102970834A (en) |
Cited By (12)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103962649A (en) * | 2014-05-15 | 2014-08-06 | 深圳市景旺电子股份有限公司 | PCB manufacturing method for modifying crooked short grooves and PCB |
| CN104378921A (en) * | 2014-11-14 | 2015-02-25 | 无锡科思电子科技有限公司 | Manufacturing method for gold-plated circuit board |
| CN104936386A (en) * | 2015-05-20 | 2015-09-23 | 东莞市五株电子科技有限公司 | Printed circuit board half metalized hole making method |
| CN106211595A (en) * | 2016-08-30 | 2016-12-07 | 乐凯特科技铜陵有限公司 | A kind of printed circuit board processing method |
| CN106304639A (en) * | 2016-08-26 | 2017-01-04 | 广东冠锋科技股份有限公司 | A kind of method that high frequency Teflon circuit board removes edges of boards burr |
| CN106550553A (en) * | 2016-10-27 | 2017-03-29 | 惠州中京电子科技有限公司 | A kind of manufacture method of the double parallel bore metallized semi-pore of wiring board |
| CN107175360A (en) * | 2016-03-10 | 2017-09-19 | 无锡深南电路有限公司 | Milling machine and milling machine spindle operation control system |
| CN107580419A (en) * | 2017-09-19 | 2018-01-12 | 珠海精毅电路有限公司 | A kind of preparation method of printed substrate metallized semi-pore |
| CN108200726A (en) * | 2018-02-08 | 2018-06-22 | 深圳市昶东鑫线路板有限公司 | Wiring board 0.3mm metallized semi-pore processing technologys |
| CN109905980A (en) * | 2019-04-19 | 2019-06-18 | 高德（江苏）电子科技有限公司 | A kind of small copper facing hole side reservation half bore design technology |
| CN110602878A (en) * | 2019-08-15 | 2019-12-20 | 鹤山市中富兴业电路有限公司 | Direct forming method for metallized semi-hole |
| CN113498262A (en) * | 2020-04-02 | 2021-10-12 | 竞华电子(深圳)有限公司 | Half-hole processing method of circuit board |
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| JPH07183658A (en) * | 1993-12-22 | 1995-07-21 | Toppan Printing Co Ltd | Forming method for side through hole of printed circuit board |
| JPH1051137A (en) * | 1996-07-30 | 1998-02-20 | Nec Toyama Ltd | Method for manufacturing printed wiring board |
| CN101720173A (en) * | 2009-11-20 | 2010-06-02 | 深南电路有限公司 | Method for processing PCB |
| CN101951736A (en) * | 2010-09-17 | 2011-01-19 | 深圳市集锦线路板科技有限公司 | Process for producing circuit board metallized semi-holes |
| CN101977481A (en) * | 2010-10-29 | 2011-02-16 | 东莞红板多层线路板有限公司 | Method for removing semi-metalized hole flash by back drilling |
| CN102036492A (en) * | 2010-12-28 | 2011-04-27 | 东莞生益电子有限公司 | Drilling method for printed circuit board (PCB) |
-
2011
- 2011-09-02 CN CN2011102578169A patent/CN102970834A/en active Pending
Patent Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH07183658A (en) * | 1993-12-22 | 1995-07-21 | Toppan Printing Co Ltd | Forming method for side through hole of printed circuit board |
| JPH1051137A (en) * | 1996-07-30 | 1998-02-20 | Nec Toyama Ltd | Method for manufacturing printed wiring board |
| CN101720173A (en) * | 2009-11-20 | 2010-06-02 | 深南电路有限公司 | Method for processing PCB |
| CN101951736A (en) * | 2010-09-17 | 2011-01-19 | 深圳市集锦线路板科技有限公司 | Process for producing circuit board metallized semi-holes |
| CN101977481A (en) * | 2010-10-29 | 2011-02-16 | 东莞红板多层线路板有限公司 | Method for removing semi-metalized hole flash by back drilling |
| CN102036492A (en) * | 2010-12-28 | 2011-04-27 | 东莞生益电子有限公司 | Drilling method for printed circuit board (PCB) |
Cited By (17)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103962649A (en) * | 2014-05-15 | 2014-08-06 | 深圳市景旺电子股份有限公司 | PCB manufacturing method for modifying crooked short grooves and PCB |
| CN104378921A (en) * | 2014-11-14 | 2015-02-25 | 无锡科思电子科技有限公司 | Manufacturing method for gold-plated circuit board |
| CN104378921B (en) * | 2014-11-14 | 2018-01-02 | 深圳市翔宇电路有限公司 | A kind of preparation method of Au-plated board |
| CN104936386A (en) * | 2015-05-20 | 2015-09-23 | 东莞市五株电子科技有限公司 | Printed circuit board half metalized hole making method |
| CN107175360A (en) * | 2016-03-10 | 2017-09-19 | 无锡深南电路有限公司 | Milling machine and milling machine spindle operation control system |
| CN107175360B (en) * | 2016-03-10 | 2019-07-26 | 无锡深南电路有限公司 | Milling machine and milling machine spindle operation control system |
| CN106304639A (en) * | 2016-08-26 | 2017-01-04 | 广东冠锋科技股份有限公司 | A kind of method that high frequency Teflon circuit board removes edges of boards burr |
| CN106304639B (en) * | 2016-08-26 | 2018-12-07 | 广东冠锋科技股份有限公司 | A kind of method that high frequency Teflon circuit board removes edges of boards burr |
| CN106211595A (en) * | 2016-08-30 | 2016-12-07 | 乐凯特科技铜陵有限公司 | A kind of printed circuit board processing method |
| CN106550553B (en) * | 2016-10-27 | 2019-03-22 | 惠州中京电子科技有限公司 | A kind of production method of the double parallel bore metallized semi-pore of wiring board |
| CN106550553A (en) * | 2016-10-27 | 2017-03-29 | 惠州中京电子科技有限公司 | A kind of manufacture method of the double parallel bore metallized semi-pore of wiring board |
| CN107580419A (en) * | 2017-09-19 | 2018-01-12 | 珠海精毅电路有限公司 | A kind of preparation method of printed substrate metallized semi-pore |
| CN108200726A (en) * | 2018-02-08 | 2018-06-22 | 深圳市昶东鑫线路板有限公司 | Wiring board 0.3mm metallized semi-pore processing technologys |
| CN109905980A (en) * | 2019-04-19 | 2019-06-18 | 高德（江苏）电子科技有限公司 | A kind of small copper facing hole side reservation half bore design technology |
| CN109905980B (en) * | 2019-04-19 | 2021-07-20 | 高德（江苏）电子科技有限公司 | Design process for retaining half-hole on side edge of micro copper-plated hole |
| CN110602878A (en) * | 2019-08-15 | 2019-12-20 | 鹤山市中富兴业电路有限公司 | Direct forming method for metallized semi-hole |
| CN113498262A (en) * | 2020-04-02 | 2021-10-12 | 竞华电子(深圳)有限公司 | Half-hole processing method of circuit board |
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Application publication date: 20130313 |