CN102965702A - Method for improving uniformity of thickness of nickel electroplating layer - Google Patents
Method for improving uniformity of thickness of nickel electroplating layer Download PDFInfo
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- CN102965702A CN102965702A CN2012105178942A CN201210517894A CN102965702A CN 102965702 A CN102965702 A CN 102965702A CN 2012105178942 A CN2012105178942 A CN 2012105178942A CN 201210517894 A CN201210517894 A CN 201210517894A CN 102965702 A CN102965702 A CN 102965702A
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Abstract
The invention provides a method for improving the uniformity of the thickness of a nickel electroplating layer. The method solves the problem that the nickel electroplating layer is thin in the middle and thick in the edge due to the fringe effect of electroplating in the nickel electroplating process. The method for improving the uniformity of the thickness of the nickel electroplating layer comprises the following steps of: step (a). carrying out sand blasting on the surface of an alloy matrix; (b) carrying out oil removal on the surface of the alloy matrix; step (c). carrying out first washing on the surface of the alloy matrix; step (d) carrying out second washing on the surface of the alloy matrix; step (e) activating the surface of the alloy matrix; step (f) carrying out third washing on the surface of the alloy matrix; and step (g) carrying out nickel electroplating on the surface of the alloy matrix. According to the method for improving the uniformity of the thickness of the nickel electroplating layer, the uniformity of the thickness of the nickel electroplating layer on the surface of the alloy matrix is improved by adding the sand blasting working procedure before nickel electroplating.
Description
Technical field
The present invention relates to field of electroplating, particularly a kind of method of improving the electroless nickel layer thickness evenness.
Background technology
The homogeneity of plated metal layer thickness is one of important indicator of weighing electroplating quality.In the electronickelling process, because " fringing effect " of electroplating can cause electroless nickel layer intermediate thin, problem that the edge is thick, in order to reach preferably transmission performance, microwave integrated circuit need to be electroplated the equally distributed electroless nickel layer of a layer thickness, and in microwave integrated circuit electronickelling process, do not improve the measure of electroplating fringing effect as not adopting, can cause the microwave integrated circuit edge thickness blocked up, and the microwave integrated circuit middle portion is owing to electroplate " fringing effect ", thickness is not enough, cause product defective, reduce the qualification rate of product.
Figure 1 shows that existing electronickelling process flow sheet.Existing electronickelling technique may further comprise the steps: step (b), alloy matrix surface are carried out the oil removing operation; Step (c), alloy matrix surface are carried out the washing operation first time; Step (d), alloy matrix surface are carried out the washing operation second time; Step (e), the alloy matrix surface carries out activation act; Step (f), the alloy matrix surface is washed operation for the third time; Step (g), alloy matrix surface are carried out the electronickelling operation.
At present, for improving " fringing effect " in the electronickelling process, the main method that adopts has: add dispersion agent in conformal anode method, increase anode baffle method, the electronickelling solution.
The conformal anode method is according to the shape of being plated part, design a kind of anode corresponding with the shape of part, the distance of every bit of part and the distance of corresponding anode are equated, to realize the even distribution of electric field line, promote the even distribution of electroless nickel layer on alloy substrate.
Increasing the anode baffle method is in electroplating process, increases by a baffle plate between the anode of electroplating and negative electrode, with the electric field line of shielding side, realizes that electric field line evenly distributes, and promotes the even distribution of electroless nickel layer on alloy substrate.
The method of adding dispersion agent in the electronickelling solution is to increase dispersion agent in electronickelling, and it is local faster to make it be adsorbed on the electronickelling crystallization, to slow down these local nickel crystallization velocitys, promotes the even distribution of electroless nickel layer on alloy substrate.
Adopt the method for conformal anode, increase anode baffle, need to all will design corresponding anode, baffle plate to different parts, cause the cost of plating greatly to increase; The method of dispersion agent is added in employing in electroplate liquid, increased organic content in the electroless nickel layer, increases the risk of electroless nickel layer stress; Increase in addition organic additive and can increase the kind of electroplating rear cleaning water pollutant, may be to environment.
Summary of the invention
The present invention proposes a kind of method of improving the electroless nickel layer thickness evenness, solves in the electronickelling process because the thick problem in electroless nickel layer intermediate thin, edge that the fringing effect of electroplating causes.
Technical scheme of the present invention is achieved in that
A kind of method of improving the electroless nickel layer thickness evenness comprises: step (a) to the alloy substrate surface sand-blasting, forms the different micron-sized pit of the uniform direction of one deck on the alloy substrate surface; Step (b) is carried out the oil removing operation to described alloy substrate surface; Step (c) is carried out the washing operation first time to described alloy substrate surface; Step (d) is carried out the washing operation second time to described alloy substrate surface; Step (e) is carried out activation act to described alloy substrate surface; Step (f) is washed operation for the third time to described alloy substrate surface; Step (g) is carried out the electronickelling operation to described alloy substrate surface.
Alternatively, form the different micron-sized pit of the uniform direction of one deck on alloy collective surface and can use dry type sandblast machine or efficiency wet type sand blasting machine.
Alternatively, the sand-blasting abrasive that uses in the step of described alloy substrate surface sand-blasting is quartz sand, granulated glass sphere or Cortex walnut.
The granularity of the sand-blasting abrasive that uses in the step of described alloy substrate surface sand-blasting alternatively, is the 70-500 order.
Alternatively, the pressure of sandblast is the 0.15-0.3 MPa in the step of described alloy substrate surface sand-blasting.
Alternatively, the spray gun and the angle between the alloy substrate that use in the step of described alloy substrate surface sand-blasting are the 15-75 degree.
Alternatively, the time of sandblast is 5-180 second in the step of described alloy substrate surface sand-blasting.
The invention has the beneficial effects as follows:
(1) before electronickelling, increases the sandblast operation, improved the homogeneity of electroless nickel layer at the alloy substrate surface thickness;
(2) can change the composition of electroless nickel layer, can not increase organic content in the electroless nickel layer, reduce the risk that electroless nickel layer produces stress, can not produce the objectionable impurities of contaminate environment;
(3) cost in the reduction electroplating process.
Description of drawings
In order to be illustrated more clearly in the embodiment of the invention or technical scheme of the prior art, the below will do to introduce simply to the accompanying drawing of required use in embodiment or the description of the Prior Art, apparently, accompanying drawing in the following describes only is some embodiments of the present invention, for those of ordinary skills, under the prerequisite of not paying creative work, can also obtain according to these accompanying drawings other accompanying drawing.
Fig. 1 is existing electronickelling process flow sheet;
Fig. 2 is a kind of schema that improves the method for electroless nickel layer thickness evenness of the present invention;
Fig. 3 is a kind of synoptic diagram that uses blasting craft alloy matrix to carry out sandblast embodiment of the present invention;
Fig. 4 is through sandblast, oil removing, for the first time washing, for the second time washing, activation, the water-washing step rear surface is with the synoptic diagram of the alloy substrate of the different uniform micron order pit of direction and cleaning, activation for the third time;
Fig. 5 is the synoptic diagram of the equally distributed electroless nickel layer of a layer thickness of alloy substrate after the electronickelling step and surface coverage.
Embodiment
Below in conjunction with the accompanying drawing in the embodiment of the invention, the technical scheme in the embodiment of the invention is clearly and completely described, obviously, described embodiment only is the present invention's part embodiment, rather than whole embodiment.Based on the embodiment among the present invention, those of ordinary skills belong to the scope of protection of the invention not making the every other embodiment that obtains under the creative work prerequisite.
As shown in Figure 2, a kind of method of improving the electroless nickel layer thickness evenness of the present invention may further comprise the steps: step (a) to the alloy substrate surface sand-blasting, forms the different micron-sized pit of the uniform direction of one deck on the alloy substrate surface; Step (b), alloy matrix surface are carried out the oil removing operation; Step (c), alloy matrix surface are carried out the washing operation first time; Step (d), alloy matrix surface are carried out the washing operation second time; Step (e), the alloy matrix surface carries out activation act; Step (f), the alloy matrix surface is washed operation for the third time; Step (g), alloy matrix surface are carried out the electronickelling operation.
In above-mentioned steps (a), step (b) and step (c) step (d) step (e) step (f) step (g), the alloy substrate material can be fine copper, brass alloys or bell metal.
Preferably, in the step (a), the formation method of the micron-sized pit that uniform direction is different is specially: adopt dry type sandblast machine or efficiency wet type sand blasting machine that copper alloy matrix is carried out sandblast 5-180 second.The sand-blasting abrasive that uses in the step of alloy substrate surface sand-blasting is quartz sand, in granulated glass sphere or the Cortex walnut any one, the granularity of sand-blasting abrasive is the 70-500 order, the pressure of sandblast is the 0.15-0.3 MPa, angle between nozzle and the alloy substrate is the 15-75 degree, spray gun is uniform motion on alloy substrate, through after the sandblast, form the different micron-sized pit of the uniform direction of one deck on the alloy substrate surface, the nickle atom that forms in electroplating process is by spreading the pit that preferentially enters on the alloy substrate surface, enter the alloy substrate lattice and form crystal, because micron-sized pit is in the distribution of alloy substrate surface uniform, electroless nickel layer can be in the growth of alloy substrate surface uniform, improved " fringing effect " of electronickelling, promoted the even distribution of electroless nickel layer on the alloy substrate surface.
Of the present invention a kind of schema that improves the method for electroless nickel layer thickness evenness based among Fig. 2 is described in further detail the present invention below in conjunction with specific embodiment.
In the present embodiment, adopt the dry type sandblast machine to use 320 purpose quartz sands alloy matrix under the pressure of 0.2 MPa to carry out sandblast, and then carry out oil removing, for the first time washing, wash, activate, wash for the third time, use for the second time nickel sulfamic acid solution to carry out electronickelling to operate.
As shown in Figure 3-Figure 5, at first, provide an alloy substrate 30, material is H59 copper.
Then, form the different micron-sized pit 40 of the uniform direction of one deck on the alloy substrate surface, the method that the different micron-sized pit of this uniform direction forms, specifically comprise: adopt dry type sandblast machine 20, use 320 purpose quartz sands under the pressure of 0.2 MPa, make spray gun 60 and alloy substrate 30 present the angle of 45 degree, spray gun 60 is along alloy substrate 30 uniform motion, sand-blasting abrasive 50 is ejected into above the alloy substrate 30 by spray gun 60, the burr above the alloy substrate 30 and processing crackle 80 are removed in shear action by sand-blasting abrasive 50, form the different pit 40 of the uniform direction of one deck on alloy substrate 30 surfaces.
Next, carry out the oil removing operation, specifically comprise: the alloy substrate 30 after the sandblast is put into degreasing fluid, and followed ultrasonic cleaning 1 minute, by degreasing fluid quartz sand particle and the greasy dirt of alloy substrate remained on surface are removed.
Next, carry out the first washing operation, specifically comprise: alloy substrate 30 bodies after the oil removing are put into the tank that fills deionized water, remove by most of degreasing fluid that deionized water carries alloy substrate 30 surfaces.
Next, carry out the washing operation second time, specifically comprise: the alloy substrate 30 after the oil removing is put into the tank that fills deionized water, remove by the residual degreasing fluid that deionized water carries the alloy substrate surface, obtain the alloy substrate 30 of surface cleaning.
After alloy substrate 30 carries out washing for the first time, for the second time, carry out activation act, specifically comprise: alloy substrate 30 is put into the trough that fills activated solution, by the hydrogen ion that comprises in the activated solution the thin oxide film that alloy substrate 30 surfaces form is disposed.
After alloy substrate 30 carries out activation act, carry out washing work for the third time, specifically comprise: the alloy substrate 30 after will activating is put into the tank that fills deionized water, remove by hydrogen ion and metal ion that deionized water carries the alloy substrate surface, obtain the alloy substrate 30 of the activation of surface cleaning.
After alloy substrate has carried out for the third time washing, use electronickelling solution alloy matrix to carry out the electronickelling operation, specifically comprise: in 55 degrees centigrade of nickel sulfamic acid solutions, use the current density of every square decimeter of 1 peace and follow movable cathode and state alloy matrix 30 that nickel sulfamic acid solution filters was electroplated 10 minutes.Can obtain the electroless nickel layer 90 that even thickness distributes.
Particularly, the sand-blasting abrasive that uses in the step of alloy substrate surface sand-blasting is in quartz sand, granulated glass sphere or the Cortex walnut any one, and the granularity of sand-blasting abrasive is the 70-500 order, and the pressure of sandblast is the 0.15-0.3 MPa.Through after the sandblast, form the different micron-sized pit of the uniform direction of one deck on the alloy substrate surface, the nickle atom that forms in electroplating process is by spreading the pit that preferentially enters on the alloy substrate surface, enter the alloy substrate lattice and form crystal, because micron-sized pit is in the distribution of alloy substrate surface uniform, electroless nickel layer can improve " fringing effect " of electronickelling in the growth of alloy substrate surface uniform, has promoted the even distribution of electroless nickel layer on the alloy substrate surface.
A kind of method of improving the electroless nickel layer thickness evenness of the present invention, before electronickelling, increase the sandblast operation, improved the homogeneity of electroless nickel layer at the alloy substrate surface thickness, can change the composition of electroless nickel layer, can not increase organic content in the electroless nickel layer, reduce the risk that electroless nickel layer produces stress, can not produce the objectionable impurities of contaminate environment, greatly reduce the cost in the electroplating process.
The above only is preferred embodiment of the present invention, and is in order to limit the present invention, within the spirit and principles in the present invention not all, any modification of doing, is equal to replacement, improvement etc., all should be included within protection scope of the present invention.
Claims (7)
1. a method of improving the electroless nickel layer thickness evenness is characterized in that, comprising:
Step (a) to the alloy substrate surface sand-blasting, forms the different micron-sized pit of the uniform direction of one deck on the alloy substrate surface;
Step (b) is carried out the oil removing operation to described alloy substrate surface;
Step (c) is carried out the washing operation first time to described alloy substrate surface;
Step (d) is carried out the washing operation second time to described alloy substrate surface;
Step (e) is carried out activation act to described alloy substrate surface;
Step (f) is washed operation for the third time to described alloy substrate surface;
Step (g) is carried out the electronickelling operation to described alloy substrate surface.
2. the method for claim 1 is characterized in that, uses dry type blasting method or wet sand blast method in the step of described alloy substrate surface sand-blasting.
3. method as claimed in claim 2 is characterized in that, the sand-blasting abrasive that uses in the step of described alloy substrate surface sand-blasting is quartz sand, granulated glass sphere or Cortex walnut.
4. method as claimed in claim 2 is characterized in that, the granularity of the sand-blasting abrasive that uses in the step of described alloy substrate surface sand-blasting is the 70-500 order.
5. method as claimed in claim 2 is characterized in that, the pressure of sandblast is the 0.15-0.3 MPa in the step of described alloy substrate surface sand-blasting.
6. method as claimed in claim 2 is characterized in that, the spray gun and the angle between the alloy substrate that use in the step of described alloy substrate surface sand-blasting are the 15-75 degree.
7. method as claimed in claim 2 is characterized in that, the time of sandblast is 5-180 second in the step of described alloy substrate surface sand-blasting.
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| CN201210517894.2A CN102965702B (en) | 2012-12-06 | 2012-12-06 | Method for improving uniformity of thickness of nickel electroplating layer |
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| CN201210517894.2A CN102965702B (en) | 2012-12-06 | 2012-12-06 | Method for improving uniformity of thickness of nickel electroplating layer |
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Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
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| CN108070896A (en) * | 2018-01-17 | 2018-05-25 | 南京海创表面处理技术有限公司 | Cast magnesium alloy product surface processing equipment and its technique |
| CN109628965A (en) * | 2019-01-30 | 2019-04-16 | 云谷（固安）科技有限公司 | Metal works cleaning process |
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| CN1098447A (en) * | 1994-06-18 | 1995-02-08 | 东北大学 | The preparation method of electroplating diamond grinding apparatus |
| JP2003089062A (en) * | 2001-09-12 | 2003-03-25 | Seiei Jo | Surface treatment method for magnesium alloy |
| CN101022160A (en) * | 2007-03-16 | 2007-08-22 | 埃梯梯科能（厦门）电子科技有限公司 | Electrode material with nickel or nickel alloy as coating and producing method thereof |
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Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN108070896A (en) * | 2018-01-17 | 2018-05-25 | 南京海创表面处理技术有限公司 | Cast magnesium alloy product surface processing equipment and its technique |
| CN108070896B (en) * | 2018-01-17 | 2024-03-19 | 南京海创表面处理技术有限公司 | Surface treatment equipment and process for cast magnesium alloy product |
| CN109628965A (en) * | 2019-01-30 | 2019-04-16 | 云谷（固安）科技有限公司 | Metal works cleaning process |
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Granted publication date: 20170208 Termination date: 20191206 |