CN102962904A - Three-position multi-line cutting table - Google Patents
Three-position multi-line cutting table Download PDFInfo
- Publication number
- CN102962904A CN102962904A CN2012104972662A CN201210497266A CN102962904A CN 102962904 A CN102962904 A CN 102962904A CN 2012104972662 A CN2012104972662 A CN 2012104972662A CN 201210497266 A CN201210497266 A CN 201210497266A CN 102962904 A CN102962904 A CN 102962904A
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- CN
- China
- Prior art keywords
- workbench
- work station
- cutting work
- holding screw
- flitch
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000007921 spray Substances 0.000 claims description 9
- 229910000831 Steel Inorganic materials 0.000 claims description 8
- 239000004570 mortar (masonry) Substances 0.000 claims description 8
- 239000010959 steel Substances 0.000 claims description 8
- 238000009413 insulation Methods 0.000 claims description 7
- 238000003780 insertion Methods 0.000 claims description 3
- 230000037431 insertion Effects 0.000 claims description 3
- 238000004519 manufacturing process Methods 0.000 abstract description 6
- 238000012423 maintenance Methods 0.000 abstract description 2
- 229910021421 monocrystalline silicon Inorganic materials 0.000 description 6
- 238000000034 method Methods 0.000 description 5
- 239000004677 Nylon Substances 0.000 description 4
- 238000005516 engineering process Methods 0.000 description 4
- 229920001778 nylon Polymers 0.000 description 4
- 238000010586 diagram Methods 0.000 description 3
- 238000012545 processing Methods 0.000 description 3
- 239000004065 semiconductor Substances 0.000 description 2
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 1
- 239000013078 crystal Substances 0.000 description 1
- 239000002178 crystalline material Substances 0.000 description 1
- 238000011161 development Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 229910052710 silicon Inorganic materials 0.000 description 1
- 239000010703 silicon Substances 0.000 description 1
Images
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- Processing Of Stones Or Stones Resemblance Materials (AREA)
- Mechanical Treatment Of Semiconductor (AREA)
Abstract
Description
Claims (8)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN201210497266.2A CN102962904B (en) | 2012-11-28 | 2012-11-28 | A kind of three station multi-wire saw workbench |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN201210497266.2A CN102962904B (en) | 2012-11-28 | 2012-11-28 | A kind of three station multi-wire saw workbench |
Publications (2)
Publication Number | Publication Date |
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CN102962904A true CN102962904A (en) | 2013-03-13 |
CN102962904B CN102962904B (en) | 2015-08-05 |
Family
ID=47793486
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CN201210497266.2A Active CN102962904B (en) | 2012-11-28 | 2012-11-28 | A kind of three station multi-wire saw workbench |
Country Status (1)
Country | Link |
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CN (1) | CN102962904B (en) |
Citations (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN102211362A (en) * | 2011-04-11 | 2011-10-12 | 黄禹宁 | Three-roller multi-wire cutting machine |
CN202016131U (en) * | 2011-04-11 | 2011-10-26 | 黄禹宁 | Three-roller multi-wire cutting machine |
CN102398314A (en) * | 2010-09-17 | 2012-04-04 | 上海日进机床有限公司 | Diamond cutting line slicing machine |
CN102555091A (en) * | 2012-02-29 | 2012-07-11 | 无锡斯达新能源科技有限公司 | Multi-station sapphire single-wire swinging cutting machine |
CN203046012U (en) * | 2012-11-28 | 2013-07-10 | 天津市环欧半导体材料技术有限公司 | Three-position multi-line cutting working platform |
JP5424251B2 (en) * | 2009-11-20 | 2014-02-26 | コマツNtc株式会社 | Thin wafer processing method |
-
2012
- 2012-11-28 CN CN201210497266.2A patent/CN102962904B/en active Active
Patent Citations (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP5424251B2 (en) * | 2009-11-20 | 2014-02-26 | コマツNtc株式会社 | Thin wafer processing method |
CN102398314A (en) * | 2010-09-17 | 2012-04-04 | 上海日进机床有限公司 | Diamond cutting line slicing machine |
CN102211362A (en) * | 2011-04-11 | 2011-10-12 | 黄禹宁 | Three-roller multi-wire cutting machine |
CN202016131U (en) * | 2011-04-11 | 2011-10-26 | 黄禹宁 | Three-roller multi-wire cutting machine |
CN102555091A (en) * | 2012-02-29 | 2012-07-11 | 无锡斯达新能源科技有限公司 | Multi-station sapphire single-wire swinging cutting machine |
CN203046012U (en) * | 2012-11-28 | 2013-07-10 | 天津市环欧半导体材料技术有限公司 | Three-position multi-line cutting working platform |
Also Published As
Publication number | Publication date |
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CN102962904B (en) | 2015-08-05 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
C06 | Publication | ||
PB01 | Publication | ||
C10 | Entry into substantive examination | ||
SE01 | Entry into force of request for substantive examination | ||
C14 | Grant of patent or utility model | ||
GR01 | Patent grant | ||
TR01 | Transfer of patent right | ||
TR01 | Transfer of patent right |
Effective date of registration: 20181224 Address after: 300384 Tianjin Binhai New Area high tech Zone Huayuan Industrial Area (outside the ring) Hai Tai Road 12 Patentee after: TIANJIN ZHONGHUAN ADVANCED MATERIAL TECHNOLOGY Co.,Ltd. Address before: 300384 Tianjin Binhai New Area high tech Zone Huayuan Industrial Park (outside the ring) Hai Tai Road 12 Patentee before: TIANJIN HUANOU SEMICONDUCTOR MATERIAL TECHNOLOGY Co.,Ltd. |
|
TR01 | Transfer of patent right | ||
TR01 | Transfer of patent right |
Effective date of registration: 20191225 Address after: 214200 Dongfen Avenue, Yixing Economic and Technological Development Zone, Wuxi City, Jiangsu Province Co-patentee after: TIANJIN ZHONGHUAN ADVANCED MATERIAL TECHNOLOGY Co.,Ltd. Patentee after: Zhonghuan leading semiconductor materials Co.,Ltd. Address before: 300384 in Tianjin Binhai high tech Zone Huayuan Industrial Zone (outer ring) Haitai Road No. 12 Patentee before: TIANJIN ZHONGHUAN ADVANCED MATERIAL TECHNOLOGY Co.,Ltd. |
|
CP03 | Change of name, title or address | ||
CP03 | Change of name, title or address |
Address after: 214200 Dongjia Avenue, Yixing Economic and Technological Development Zone, Wuxi City, Jiangsu Province Patentee after: Zhonghuan Leading Semiconductor Technology Co.,Ltd. Country or region after: China Patentee after: TIANJIN ZHONGHUAN ADVANCED MATERIAL TECHNOLOGY Co.,Ltd. Address before: 214200 Dongjia Avenue, Yixing Economic and Technological Development Zone, Wuxi City, Jiangsu Province Patentee before: Zhonghuan leading semiconductor materials Co.,Ltd. Country or region before: China Patentee before: TIANJIN ZHONGHUAN ADVANCED MATERIAL TECHNOLOGY Co.,Ltd. |