CN102962762A - Bearing disk component for wafer grinding - Google Patents
Bearing disk component for wafer grinding Download PDFInfo
- Publication number
- CN102962762A CN102962762A CN2012105246687A CN201210524668A CN102962762A CN 102962762 A CN102962762 A CN 102962762A CN 2012105246687 A CN2012105246687 A CN 2012105246687A CN 201210524668 A CN201210524668 A CN 201210524668A CN 102962762 A CN102962762 A CN 102962762A
- Authority
- CN
- China
- Prior art keywords
- wafer
- vacuum
- hole
- carrier assembly
- plummer
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Images
Landscapes
- Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
Abstract
The invention discloses a bearing disk component for wafer grinding. The bearing disk component comprises a bearing system and a peripheral suction system, wherein the bearing system comprises a bearing platform and at least one accommodating space; the bearing platform is provided with an upper surface; the supper surface is a plane and contacts with one surface of a wafer; the at least one accommodating space is concavely arranged at the middle part of the bearing platform and is provided with a bottom part; height difference exists between the bottom part and the upper surface of the bearing platform and is more than the maximal height of a plurality of convex blocks on the surface of the wafer; the peripheral suction system comprises at least one vacuum through hole; the at least one vacuum through hole is formed at the periphery of the bearing platform and is connected with the upper surface of the bearing platform; and the vacuum through hole is used for providing vacuum to suck the surface of the wafer.
Description
Technical field
The invention relates to a kind of grinding wafer carrier assembly, particularly grind adhesive tape and reusable grinding wafer carrier assembly relevant for a kind of the replacement.
Background technology
At present, multiple-layer metallization manufacture process (multi-level metallization process), the dielectric layer (dielectrics) that this inline line layer of metal that utilizes plural layer and dielectric constant are lower is alternate with each other to be stacked and the active lip-deep various semiconductor elements of semiconductor wafer are connected in series each other and finish the loop framework of whole stacking, be widely used on the wafer manufacture process of ultra-large type IC (very large scaleintegration, VLSI).
Yet, in general wafer production process, these metallic circuits and semiconductor element can make the surface of IC present rugged precipitous pattern (severe topography), increase follow-up depositing or during design transfer (pattern transfer) preparation method, produce prominent outstanding (overhang), hole (void) being arranged or focus on and be difficult for and the shortcoming such as etching is difficult.So, after entering the method for semiconductor manufacturing of deep-sub-micrometer, just need cmp (the Chemical mechanicalpolishing that uses the planarization effect better, CMP) technique is ground the active surface with the planarization semiconductor wafer, to guarantee the yield of follow-up manufacturing process.On the other hand, in order to meet the trend toward miniaturization of semiconductor packaging structure, semiconductor wafer also need reduce thickness as much as possible, namely also need in addition to semiconductor wafer one side (for example: passive surface) carry out the grinding thinning of a certain degree.
In the wafer reverse side grinding process, a surface of wafer, for example: active surface, usually be fixed on down on the carrier, thinning is then ground up and with a milling tool in the back side of wafer.At this moment, be pre-formed projection (bumps) on the active surface of wafer, in order to protect the active lip-deep projection of wafer, so the covering property of wafer upper protruding block is one of essential condition.At present general prior art is to coat projection with protection projection and the active surface of wafer by use wafer pad pasting adhesive tape before grinding wafer, and respectively for the wafer pad pasting adhesive tape of different wafer specifications to select to be suitable for.Can yet along with the thickness of wafer is more and more thinner, the covered effect of projection be also important day by day all the more, so when designing suitable wafer pad pasting adhesive tape thickness and tending to determine homogenising or thinning wafer, avoid wafer to produce and break or cracked problem.In addition, wafer pad pasting adhesive tape be because can't reclaiming use, so also can promote consumables cost and cause the increase of processing step.
So, be necessary to provide a kind of the replacement to grind adhesive tape and reusable grinding wafer carrier assembly, to solve the existing problem of prior art.
Summary of the invention
In view of this, the invention provides a kind of grinding wafer carrier assembly, projection coats the problem of security during with the existing grinding crystal wafer of the solution prior art back side.
Main purpose of the present invention is to provide a kind of grinding wafer carrier assembly, and it can replace existing wafer pad pasting adhesive tape, and the thickness that solves adhesive tape is difficult for selecting and cause easily the problem of wafer fragmentation when grinding.
Secondary objective of the present invention is to provide a kind of grinding wafer carrier assembly, and it can have reusable effect, can save prior art and use the consumables cost of wafer pad pasting adhesive tape and extra processing step.
For reaching aforementioned purpose of the present invention, one embodiment of the invention provides a kind of grinding wafer carrier assembly, wherein said carrier assembly comprises: a bearing system and a peripheral sticking system, described bearing system comprises: a plummer and at least one accommodation space.Described plummer has a upper surface, and described upper surface is a plane, contacts with a surface of a wafer.Described accommodation space is arranged with the mid portion in described plummer, and the upper surface that wherein said accommodation space has a bottom and described plummer has a difference in height, and described difference in height is greater than the maximum height of lip-deep a plurality of projections of described wafer.Described peripheral sticking system comprises: at least one vacuum through hole, be arranged at the periphery of described carrying platform, and the upper surface of described vacuum through hole and described plummer is connected, and described vacuum through hole is to provide the surface of the described wafer of vacuum hold.
Compared with prior art, grinding wafer of the present invention carrier assembly so not only can replace the function of wafer pad pasting adhesive tape, can also reuse, and saves the cost of wafer pad pasting adhesive tape.
For foregoing of the present invention can be become apparent, preferred embodiment cited below particularly, and cooperate appended graphicly, be described in detail below:
Description of drawings
Figure 1A is the profile that one embodiment of the invention grinding wafer is used the carrier assembly.
Figure 1B is the top view that one embodiment of the invention grinding wafer is used the carrier assembly.
Fig. 2 A is the profile that another embodiment of the present invention grinding wafer is used the carrier assembly.
Fig. 2 B is the top view that another embodiment of the present invention grinding wafer is used the carrier assembly.
Fig. 3 A is the profile that further embodiment of this invention grinding wafer is used the carrier assembly.
Fig. 3 B is the top view that further embodiment of this invention grinding wafer is used the carrier assembly.
Fig. 4 A-4B is the step that the present invention one implements using method.
Fig. 5 A-5B is the step of another enforcement using method of the present invention.
Fig. 6 A-6B is the step of the another enforcement using method of the present invention.
The specific embodiment
Below the explanation of each embodiment be with reference to additional graphic, can be in order to the specific embodiment of implementing in order to illustration the present invention.Moreover, the direction term that the present invention mentions, such as " on ", D score, " top ", " end ", 'fornt', 'back', " left side ", " right side ", " interior ", " outward ", " side ", " on every side ", " central authorities ", " level ", " laterally ", " vertically ", " vertically ", " axially ", " radially ", " the superiors " or " orlop " etc., only be the direction with reference to annexed drawings.Therefore, the direction term of use is in order to explanation and understands the present invention, but not in order to limit the present invention.
Please refer to shown in Figure 1A, the 1B, the grinding wafer of one embodiment of the invention mainly comprises a bearing system 1 and a peripheral sticking system 2 with the carrier assembly.Described bearing system 1 comprises: a plummer 10 and at least one accommodation space 11.Described plummer 10 has a upper surface 101, and described upper surface 101 is a plane, contacts with a surface of a wafer 30 (being shown in Fig. 4 A).Described accommodation space 11 is arranged with in the mid portion of described plummer 10, according to an embodiment of the present invention, described accommodation space has a bottom 111, the a plurality of projections 31 (be shown in Fig. 4 A) of described accommodation space 11 on can an active surface (lower surface) of accommodating described wafer 30, the bottom 111 of wherein said accommodation space 11 has a difference in height with the upper surface 101 of described plummer 10, described difference in height is greater than the maximum height of lip-deep a plurality of projections 31 of described wafer 30, and for example difference in height is 1.05 to 1.5 times of maximum height of described a plurality of projection 31.Described peripheral sticking system 2 comprises: at least one vacuum through hole 21 is arranged at the periphery of described plummer 10, with a circular periphery position on active surface that the described wafer 30 of vacuum hold (being shown in Fig. 4 A) is provided.
Please refer to shown in Figure 1A, the 1B, described bearing system 1 comprises a supports main shaft 12 in addition, described supports main shaft 12 is arranged at the bottom of described plummer 10, is mainly used to the described plummer 10 of fixing, in the present invention, it can not arrange for a rotatable supports main shaft or a fixed main shaft yet, if it is a rotatable supports main shaft, can be used to fixing and rotate described plummer 10, and then rotate described wafer 30.
In the present embodiment, described bearing system 1 comprises in addition: a filling liquid supply pipe 13 and a fill fluid 14, described filling liquid supply pipe 13 are arranged in the described plummer 10, are connected with described accommodation space 11.Described fill fluid 14 enters described accommodation space 11 by described filling liquid supply pipe 13 can or can discharge described accommodation space 11 with described wafer 30 close contacts after described wafer 30 thinnings.Described fill fluid 14 can be deionized water or any not with the fill fluid of active lip-deep a plurality of projection 31 chemically reactives of described wafer 30.Described bearing system 1 comprises in addition: a valve body 15, be arranged on the appropriate location on the described filling liquid supply pipe 13, and reflux to prevent the fill fluid 14 in the described accommodation space 11.
Shown in Figure 1B, the vacuum through hole 21 of described peripheral sticking system 2 can be a kind of in the rectangular through-hole of the column through hole of a continuous annular through hole, several annular arrangements or several radial arrangement.And the vacuum through hole 21 of described peripheral sticking system 2 is hollow pipeline, but the caulked spare of porous ceramic material also can be selected to embed in its inside, the bulk density of its porous ceramic film material is about between 0.80 to 0.90 g every cubic centimeter (g/cm3), its pore volume is about between 0.50 to 0.60 cubic centimeter every g (cm3/g), its aperture size is about between 30 to 50 nanometers (nm), and compression strength is up to 80 MPas (MPa), but is not limited to this.The caulked spare of described porous ceramic film material one end is when being subjected to vacuum action, pull of vacuum can be by described porous ceramic film material the micropore of caulked spare inside arrive its other end, but the caulked spare of described porous ceramic film material itself can not produce the compression on any volume.
Please refer to shown in Fig. 2 A, the 2B, the grinding wafer of another embodiment of the present invention mainly comprises a bearing system 1 and a peripheral sticking system 2 with the carrier assembly.Described bearing system 1 comprises: a plummer 10 and at least one accommodation space 11.Described plummer 10 has a upper surface 101, and described upper surface 101 is a plane, contacts with a surface of a wafer 30 (being shown in Fig. 4 A).Described accommodation space 11 is arranged with in the mid portion of described plummer 10, according to an embodiment of the present invention, described accommodation space has a bottom 111, the a plurality of projections 31 (be shown in Fig. 4 A) of described accommodation space 11 on can an active surface (lower surface) of accommodating described wafer 30, the bottom 111 of wherein said accommodation space 11 has a difference in height with the upper surface 101 of described plummer 10, described difference in height is greater than the maximum height of lip-deep a plurality of projections 31 of described wafer 30, and for example difference in height is 1.05 to 1.5 times of maximum height of described a plurality of projection 31.Described peripheral sticking system 2 comprises: at least one vacuum through hole 21 is arranged at the periphery of described plummer 10, with a circular periphery position on active surface that the described wafer 30 of vacuum hold (being shown in Fig. 4 A) is provided.
Shown in Fig. 2 A, 2B, described bearing system 1 also comprises a supports main shaft 12 in addition, described supports main shaft 12 is arranged at the bottom of described plummer 10, is mainly used to the described plummer 10 of fixing, in the present invention, it can not arrange for a rotatable supports main shaft or a fixed main shaft yet, if it is a rotatable supports main shaft, can be used to fixing and rotate described plummer 10, and then rotate described wafer 30.
In the present embodiment, described bearing system 1 comprises in addition: a concrete dynamic modulus is filled loading material 16 and a vacuum lead 17.Described concrete dynamic modulus is filled loading material 16 and is contained in the described accommodation space 11.17 pairs of described concrete dynamic modulus of described vacuum lead are filled loading material 16 and are vacuumized, make the described concrete dynamic modulus that has been evacuated fill loading material 16 ' (being shown in Fig. 5 B) reduction volume and raising density, with the projection 31 (being shown in Fig. 5 A) of firmly grasping described wafer 30 (being shown in Fig. 5 A), according to one embodiment of the invention, bottom 111 parts that described plummer 10 is arranged in described accommodation space 11 can independently be separated running (figure does not indicate) with the peripheral part of described plummer 10, when described concrete dynamic modulus is filled loading material 16 reduction volume, described concrete dynamic modulus is filled the upper surface of loading material 16 and can there be a drop in the upper surface 101 of described plummer 10, at this moment, the bottom of described plummer 10 can make it rise, so that described concrete dynamic modulus is filled the upper surface of loading material 16 and the upper surface 101 of described plummer 10 is a copline.Described concrete dynamic modulus filling loading material 16 can be at least a flexible material in concrete dynamic modulus sponge material, concrete dynamic modulus rubber (rubber) material, concrete dynamic modulus silica gel (silicon) material, Teflon (teflon) or the latex (latex) etc.Described concrete dynamic modulus is filled loading material 16 when being evacuated, and because its material has the deflection deformation characteristic, so its internal capillary will dwindle, and causes reducing on the whole volume and improves density.
Shown in Fig. 2 B, the vacuum through hole 21 of described peripheral sticking system 2 can be a kind of in the rectangular through-hole of the column through hole of a continuous annular through hole, several annular arrangements or several radial arrangement.And the vacuum through hole 21 of described peripheral sticking system 2 is hollow pipeline, but the caulked spare of porous ceramic material also can be selected to embed in its inside, the bulk density of its porous ceramic film material is about between 0.80 to 0.90 g every cubic centimeter (g/cm3), its pore volume is about between 0.50 to 0.60 cubic centimeter every g (cm3/g), its aperture size is about between 30 to 50 nanometers (nm), and compression strength is up to 80 MPas (MPa), but is not limited to this.The caulked spare of described porous ceramic film material is when being subjected to vacuum action, and its material itself can not produce the compression on any volume.
Please refer to shown in Fig. 3 A, the 3B, the grinding wafer of further embodiment of this invention mainly comprises a bearing system 1 and a peripheral sticking system 2 with the carrier assembly.Described bearing system 1 comprises: a plummer 10 and at least one accommodation space 11.Described plummer 10 has a upper surface 101, and described upper surface 101 is a plane, contacts with a surface of a wafer 30 (being shown in Fig. 4 A).Described accommodation space 11 is arranged with in the mid portion of described plummer 10, the upper surface 101 that wherein said accommodation space 11 has a bottom 111 and described plummer 10 has a difference in height, and described difference in height is greater than the maximum height of lip-deep a plurality of projections 31 (being shown in Fig. 4 A) of described wafer 30, active lip-deep a plurality of projections 31 that can accommodating described wafer 30.Described peripheral sticking system 2 comprises: at least one vacuum through hole 21 is arranged at the periphery of described plummer 10, with a circular periphery position on active surface that the described wafer 30 of vacuum hold (being shown in Fig. 4 A) is provided.With aforementioned two embodiment, also can establish in addition a supports main shaft 12, its application and effect repeat no more in this.
In the present embodiment, described bearing system 1 comprises in addition: concrete dynamic modulus carrying grid 18 and a vacuum lead 17.Described concrete dynamic modulus carrying grid 18 is contained in the described accommodation space 11, have a plurality of projections 31 (being shown in Fig. 6 A) that a plurality of spaces 181 can accommodating described wafer 30 (being shown in Fig. 6 A), wherein, distance between the visual described a plurality of projections 31 of spacing between the described carrying grid 18 adjusts, and for example can be positioned at the position of Cutting Road.17 pairs of described concrete dynamic modulus carrying grids 18 of described vacuum lead vacuumize, and make active lip-deep a plurality of intended wafer cutting positions of the described wafer 30 of described concrete dynamic modulus carrying grid 18 stickings.The material of described concrete dynamic modulus carrying grid 18 is porous ceramic material, the bulk density of its porous ceramic film material is about between 0.80 to 0.90 g every cubic centimeter (g/cm3), its pore volume is about between 0.50 to 0.60 cubic centimeter every g (cm3/g), its aperture size is about between 30 to 50 nanometers (nm), and compression strength is up to 80 MPas (MPa), but is not limited to this.One end of described concrete dynamic modulus carrying grid 18 is when being subjected to vacuum action, and pull of vacuum can arrive its other end by the micropore of described concrete dynamic modulus carrying grid 18 inside, but the compression that described concrete dynamic modulus carrying grid 18 itself can not produce on any volume.
Shown in Fig. 3 B, the vacuum through hole 21 of described peripheral sticking system 2 is wherein a kind of of rectangular through-hole of the column through hole of a continuous annular through hole, several annular arrangements or several radial arrangement.And the vacuum through hole 21 of described peripheral sticking system 2 is hollow pipeline, but the caulked spare of porous ceramic material also can be selected to embed in its inside, the bulk density of its porous ceramic film material is about between 0.80 to 0.90 g every cubic centimeter (g/cm3), its pore volume is about between 0.50 to 0.60 cubic centimeter every g (cm3/g), its aperture size is about between 30 to 50 nanometers (nm), and compression strength is up to 80 MPas (MPa), but is not limited to this.The caulked spare of described porous ceramic film material is when being subjected to vacuum action, and its material itself can not produce the compression on any volume.
Please refer in the using method step of the embodiment shown in Fig. 4 A, the accommodation space 11 of described bearing system 1 mainly is the described a plurality of projections 31 on accommodating a plurality of wafer, before grinding described wafer 30, open first and utilize described valve body 15, so that described fill fluid 14 enters described accommodation space 11 by described filling liquid supply pipe 13, when described accommodation space 11 is filled, close again the above valve body 15, in order to avoid described fill fluid 14 refluxes.Because described fill fluid 14 can not play any reaction without there being viscose glue with described wafer 30 surfaces yet, therefore can not produce the problem of polluting wafer or cull after the wafer thinning processing procedure finishes, and can wrap active lip-deep a plurality of projections 31 that protect described wafer 30, described a plurality of projection 31 can not produced with the upper surface 101 of described plummer 10 slide or friction and cause cracked or break.Simultaneously, in order to fix the described wafer 30 on the described plummer 10, by the air in the vacuum through hole 21 of described peripheral sticking system 2 is evacuated, around the described wafer 30 of sticking, reach effect fixing and that support.Can select to embed the caulked spares of porous ceramic material in the vacuum through hole 21 of described peripheral sticking system 2, purpose also is in order to vacuumize, make it that effect of sticking be arranged, simultaneously can prevent that also foreign matter from entering in the vacuum pipe, in addition, described wafer 30 reduces because the factor of large tracts of land and slimming can produce mechanical strength itself, therefore produce described wafer 30 umbilicate buckling problems, wherein said fill fluid 14 can support described wafer 30 as strengthening, and can solve described wafer 30 buckling problems and have the effect that promotes described wafer 30 planarizations.
Please refer to shown in Fig. 4 B, after described wafer 30 has fixed, see through again a slurry supply 50 that grinds supply system 5 and supply a slurry 51, drip to an abradant surface (being the back side, upper surface) of described wafer 30, and through a plurality of milling zones on the grinding head 4, and see through relatively rotating of described grinding head 4 and described plummer 10, reach the effect of described wafer 30 grinding back surfaces.When process of lapping finishes, open again described valve body 15, so that described fill fluid 14 is discharged accommodation space by described filling liquid supply pipe 13.Described fill fluid 14 can reclaim to be reused, to be used for wafer back of the body mill operation next time.
Please refer in the using method step of another embodiment shown in Fig. 5 A, the accommodation space 11 of described bearing system 1 mainly is the described a plurality of projections 31 on accommodating a plurality of wafer, and by being contained in the described concrete dynamic modulus filling loading material 16 in the described accommodation space 11, before grinding described wafer 30, utilizing first 17 pairs of described concrete dynamic modulus of described vacuum lead to fill loading material 16 vacuumizes, make the described concrete dynamic modulus that has been evacuated fill loading material 16 ' (being shown in Fig. 5 B) reduction volume and raising density, to firmly grasp active lip-deep a plurality of projections 31 of described wafer 30, to reach fixing effect, in addition, described wafer 30 reduces because the factor of large tracts of land and slimming can produce mechanical strength itself, therefore produce described wafer 30 umbilicate buckling problems, wherein said concrete dynamic modulus is filled loading material 16 can support described wafer 30 as strengthening, can solve described wafer 30 buckling problems and have the effect that promotes described wafer 30 planarizations, moreover, described concrete dynamic modulus fill loading material 16 not can with described wafer 30 surface reactions also without there being viscose glue, so the wafer thinning processing procedure can not produce the problem of the described wafer 30 of pollution or cull after finishing.By the air in the vacuum through hole 21 of described peripheral sticking system 2 is evacuated, can assist with around the described wafer 30 of sticking again, can reach equally effect fixing and that support.Can select to embed the caulked spares of porous ceramic material in the vacuum through hole 21 of described peripheral sticking system 2, purpose also is in order to vacuumize, to make its effect that sticking is arranged, can preventing that also foreign matter from entering in the vacuum pipe simultaneously.
Please refer to shown in Fig. 5 B, after described wafer 30 has fixed, see through again a slurry supply 50 that grinds supply system 5 and supply a slurry 51, drip to an abradant surface (back side) of described wafer 30, and through a plurality of milling zones on the grinding head 4, and see through relatively rotating of described grinding head 4 and described plummer 10, reach the effect of described wafer 30 grinding back surfaces.Described concrete dynamic modulus filling loading material 16 can reclaim to be reused, to be used for wafer back of the body mill operation next time.If fill loading material 16 because vacuumize repeatedly when described concrete dynamic modulus, when producing volume relaxation (in the time of namely can't restoring to original volume) or having too much foreign matter to fill in the micropore hole, also can change in order to use easily.
Please refer in the using method step of the another embodiment shown in Fig. 6 A, the accommodation space 11 of described bearing system 1 is put into first described concrete dynamic modulus carrying grid 18, described concrete dynamic modulus carrying grid 18 just can support a plurality of intended wafer cutting positions on the described wafer 30, after putting described wafer 30, so that active lip-deep a plurality of projections 31 of described wafer 30 are contained in a plurality of spaces 181 of described concrete dynamic modulus carrying grid 18.At this moment, before process of lapping, utilize first 17 pairs of described concrete dynamic modulus carrying grids 18 of described vacuum lead to vacuumize, make pull of vacuum hold the active surface part that described wafer 30 does not have projection 31 by described concrete dynamic modulus carrying grid 18, to reach the effect of fixing described wafer 30, in addition, described wafer 30 reduces because the factor of large tracts of land and slimming can produce mechanical strength itself, therefore produce described wafer 30 umbilicate buckling problems, wherein said concrete dynamic modulus carrying grid 18 can support described wafer 3 as strengthening, can solve described wafer 3 buckling problems and have the effect that promotes described wafer 3 planarizations, moreover, described concrete dynamic modulus carrying grid 18 not can with described wafer 3 surface reactions also without there being viscose glue, so the wafer thinning processing procedure can not produce the problem of the described wafer 3 of pollution or cull after finishing.By the air in the vacuum through hole 21 of described peripheral sticking system 2 is evacuated, can assist with around the described wafer 30 of sticking again, can reach equally effect fixing and that support.Can select to embed the caulked spares of porous ceramic material in the vacuum through hole 21 of described peripheral sticking system 2, purpose also is in order to vacuumize, to make its effect that sticking is arranged, can preventing that also foreign matter from entering in the vacuum pipe simultaneously.
Please refer to shown in Fig. 6 B, after described wafer 30 has fixed, see through again a slurry supply 50 that grinds supply system 5 and supply a slurry 51, drip to an abradant surface (back side) of described wafer 30, and through a plurality of milling zones on the grinding head 4, and see through relatively rotating of described grinding head 4 and described plummer 10, reach the effect of described wafer 30 grinding back surfaces.Described concrete dynamic modulus carrying grid 18 can reclaim to be reused, to be used for wafer back of the body mill operation next time.If when described concrete dynamic modulus carrying grid 18 because vacuumize repeatedly, when producing foreign matter and clogging the micropore hole and affect pull of vacuum and conduct, also can change in order to use easily.
As mentioned above; compared to existing grinding wafer carrier assembly; need to see through wafer pad pasting adhesive tape to coat a plurality of projections 31 on described wafer 30 active surfaces; so that can reach the effect of the active surface of protection and projection 31 in the grinding crystal wafer backside processes; the described grinding wafer that the present invention proposes not only can reach in the grinding crystal wafer backside processes effect of protection with the carrier assembly; also can save simultaneously the cost that uses adhesive tape; and the technique of saving adhesive tape pad pasting and calibration, so can possess reusable advantage in order to replace to have the mode of using wafer pad pasting adhesive tape now and provide.
The present invention is described by above-mentioned related embodiment, yet above-described embodiment is only for implementing example of the present invention.Must be pointed out that published embodiment does not limit the scope of the invention.On the contrary, being contained in the spirit of claims and modification and impartial setting of scope is included in the scope of the present invention.
Claims (10)
1. grinding wafer carrier assembly, it is characterized in that: described carrier assembly comprises:
One bearing system comprises:
One plummer has a upper surface, and described upper surface is a plane, contacts with a surface of a wafer; And
At least one accommodation space is arranged with the mid portion in described plummer, and the upper surface that wherein said accommodation space has a bottom and described plummer has a difference in height, and described difference in height is greater than the maximum height of lip-deep a plurality of projections of described wafer; And
One peripheral sticking system comprises:
At least one vacuum through hole is arranged at the periphery of described plummer, and the upper surface of described vacuum through hole and described plummer is connected, and described vacuum through hole is to provide the surface of the described wafer of vacuum hold.
2. grinding wafer as claimed in claim 1 carrier assembly, it is characterized in that: described bearing system comprises in addition:
One filling liquid supply pipe is arranged in the described plummer, is connected with the bottom of described accommodation space; And
One fill fluid enters or discharges described accommodation space by described filling liquid supply pipe.
3. grinding wafer as claimed in claim 2 carrier assembly, it is characterized in that: described fill fluid is deionized water.
4. grinding wafer as claimed in claim 2 carrier assembly, it is characterized in that: described bearing system comprises in addition:
One valve body is arranged on the described filling liquid supply pipe, refluxes to prevent the fill fluid in the described accommodation space.
5. grinding wafer as claimed in claim 1 carrier assembly, it is characterized in that: described bearing system comprises in addition:
One concrete dynamic modulus is filled loading material, is contained in the described accommodation space; And
One vacuum lead, bottom and the described plummer of being located at described accommodation space are connected, and fill loading material with described concrete dynamic modulus and contact.
6. grinding wafer as claimed in claim 5 carrier assembly is characterized in that: it is concrete dynamic modulus sponge material or concrete dynamic modulus elastomeric material that described concrete dynamic modulus is filled loading material.
7. grinding wafer as claimed in claim 1 carrier assembly, it is characterized in that: described bearing system comprises in addition:
One concrete dynamic modulus carrying grid is contained in the described accommodation space, has a plurality of projections that a plurality of spaces can accommodating described wafer; And
One vacuum lead vacuumizes described concrete dynamic modulus carrying grid, is connected with the upper surface of described plummer.
8. grinding wafer as claimed in claim 7 carrier assembly is characterized in that: the material of described concrete dynamic modulus carrying grid is porous ceramic material.
9. grinding wafer as claimed in claim 1 carrier assembly is characterized in that: the vacuum through hole of described peripheral sticking system is the column through hole of a continuous annular through hole, several annular arrangements or the rectangular through-hole of several radial arrangement.
10. such as claim 1 or 9 described grinding wafer carrier assemblies, it is characterized in that: the caulked spare that comprises in addition porous ceramic material in the vacuum through hole of described peripheral sticking system.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2012105246687A CN102962762A (en) | 2012-12-07 | 2012-12-07 | Bearing disk component for wafer grinding |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2012105246687A CN102962762A (en) | 2012-12-07 | 2012-12-07 | Bearing disk component for wafer grinding |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN102962762A true CN102962762A (en) | 2013-03-13 |
Family
ID=47793351
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN2012105246687A Pending CN102962762A (en) | 2012-12-07 | 2012-12-07 | Bearing disk component for wafer grinding |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN102962762A (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103692338A (en) * | 2013-12-31 | 2014-04-02 | 镇江市港南电子有限公司 | Grinding miller |
| CN113211306A (en) * | 2021-05-28 | 2021-08-06 | 福建晶安光电有限公司 | Ceramic carrier disc for polishing semiconductor wafer |
Citations (13)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1464534A (en) * | 2002-06-19 | 2003-12-31 | 联华电子股份有限公司 | Wafer carrier assembly for a chemical mechanical polishing apparatus and a polishing method using the same |
| CN1475330A (en) * | 2002-08-15 | 2004-02-18 | 三芳化学工业股份有限公司 | Production method of polishing material |
| JP2005019779A (en) * | 2003-06-27 | 2005-01-20 | Tokyo Seimitsu Co Ltd | Wafer delivery device |
| CN1868040A (en) * | 2003-10-16 | 2006-11-22 | 琳得科株式会社 | Surface-protecting sheet and semiconductor wafer lapping method |
| CN1898791A (en) * | 2003-12-31 | 2007-01-17 | 英特尔公司 | Support system for semiconductor wafers and methods thereof |
| KR20070077971A (en) * | 2006-01-25 | 2007-07-30 | 삼성전자주식회사 | Wafer loader and method for loading/unloading semiconductor wafer using the same |
| CN101150059A (en) * | 2007-10-31 | 2008-03-26 | 日月光半导体制造股份有限公司 | Wafer thinning method |
| CN101202240A (en) * | 2006-12-13 | 2008-06-18 | 恩益禧电子股份有限公司 | Semiconductor manufacturing apparatus and semiconductor manufacturing method |
| JP2008177562A (en) * | 2007-12-28 | 2008-07-31 | Matsushita Electric Ind Co Ltd | Wafer cassette device |
| US20080214094A1 (en) * | 2007-02-15 | 2008-09-04 | Takeo Katoh | Method for manufacturing silicon wafer |
| JP2009248234A (en) * | 2008-04-04 | 2009-10-29 | Nikon Corp | Holding device and polishing device |
| CN101677055A (en) * | 2008-09-18 | 2010-03-24 | 高宏明 | Wafer grinding process |
| JP2010165962A (en) * | 2009-01-19 | 2010-07-29 | Takatori Corp | Support table of wafer |
-
2012
- 2012-12-07 CN CN2012105246687A patent/CN102962762A/en active Pending
Patent Citations (13)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1464534A (en) * | 2002-06-19 | 2003-12-31 | 联华电子股份有限公司 | Wafer carrier assembly for a chemical mechanical polishing apparatus and a polishing method using the same |
| CN1475330A (en) * | 2002-08-15 | 2004-02-18 | 三芳化学工业股份有限公司 | Production method of polishing material |
| JP2005019779A (en) * | 2003-06-27 | 2005-01-20 | Tokyo Seimitsu Co Ltd | Wafer delivery device |
| CN1868040A (en) * | 2003-10-16 | 2006-11-22 | 琳得科株式会社 | Surface-protecting sheet and semiconductor wafer lapping method |
| CN1898791A (en) * | 2003-12-31 | 2007-01-17 | 英特尔公司 | Support system for semiconductor wafers and methods thereof |
| KR20070077971A (en) * | 2006-01-25 | 2007-07-30 | 삼성전자주식회사 | Wafer loader and method for loading/unloading semiconductor wafer using the same |
| CN101202240A (en) * | 2006-12-13 | 2008-06-18 | 恩益禧电子股份有限公司 | Semiconductor manufacturing apparatus and semiconductor manufacturing method |
| US20080214094A1 (en) * | 2007-02-15 | 2008-09-04 | Takeo Katoh | Method for manufacturing silicon wafer |
| CN101150059A (en) * | 2007-10-31 | 2008-03-26 | 日月光半导体制造股份有限公司 | Wafer thinning method |
| JP2008177562A (en) * | 2007-12-28 | 2008-07-31 | Matsushita Electric Ind Co Ltd | Wafer cassette device |
| JP2009248234A (en) * | 2008-04-04 | 2009-10-29 | Nikon Corp | Holding device and polishing device |
| CN101677055A (en) * | 2008-09-18 | 2010-03-24 | 高宏明 | Wafer grinding process |
| JP2010165962A (en) * | 2009-01-19 | 2010-07-29 | Takatori Corp | Support table of wafer |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103692338A (en) * | 2013-12-31 | 2014-04-02 | 镇江市港南电子有限公司 | Grinding miller |
| CN103692338B (en) * | 2013-12-31 | 2016-03-09 | 镇江市港南电子有限公司 | A kind of grinder |
| CN113211306A (en) * | 2021-05-28 | 2021-08-06 | 福建晶安光电有限公司 | Ceramic carrier disc for polishing semiconductor wafer |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN100562401C (en) | Polishing pad | |
| TWI509003B (en) | Conductive chemical mechanical planarization polishing pad | |
| KR101412874B1 (en) | Manufacture and method of making the same | |
| TW201700558A (en) | Polishing layer of polishing pad and method of forming the same and polishing method | |
| CN102848303A (en) | Processing method and processing device of semiconductor wafer, and semiconductor wafer | |
| CN107717719B (en) | Polishing head, CMP polishing apparatus, and method for manufacturing semiconductor integrated circuit device | |
| KR100552435B1 (en) | Planarization process to achieve improved uniformity across semiconductor wafers | |
| JP2005223322A (en) | Flexible membrane for polishing head, and polishing equipment | |
| US20190270180A1 (en) | Carrier head having abrasive structure on retainer ring | |
| CN102371532B (en) | Reworking method for chemical mechanical lapping process | |
| CN102962762A (en) | Bearing disk component for wafer grinding | |
| CN102246279B (en) | Carrier head membrane roughness to control polishing rate | |
| CN103273414A (en) | Chemical-mechanical polishing device and method thereof | |
| US8823079B2 (en) | Semiconductor device and method for manufacturing same | |
| CN101740378B (en) | Copper chemical mechanical polishing method | |
| US8858300B2 (en) | Applying different pressures through sub-pad to fixed abrasive CMP pad | |
| CN108145593A (en) | Wafer processing apparatus and its method of work | |
| CN104576350A (en) | Wafer thinning method | |
| CN115847281A (en) | Carrier and device for double-sided polishing of silicon wafer | |
| CN103128650A (en) | Chemical mechanical polishing method | |
| US20140349554A1 (en) | Polish pad, polish method, and method manufacturing polish pad | |
| CN107749397A (en) | A kind of wafer thining method | |
| CN101620985B (en) | Chip edge etching device and related chip planarization method | |
| US20170341201A1 (en) | Retainer ring for semiconductor manufacturing processes | |
| CN107910261A (en) | The method for planarizing surface of insulation fill stratum |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C06 | Publication | ||
| PB01 | Publication | ||
| C10 | Entry into substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| C02 | Deemed withdrawal of patent application after publication (patent law 2001) | ||
| WD01 | Invention patent application deemed withdrawn after publication |
Application publication date: 20130313 |