CN102958288A - Printed circuit board drilling method - Google Patents
Printed circuit board drilling method Download PDFInfo
- Publication number
- CN102958288A CN102958288A CN2011102412572A CN201110241257A CN102958288A CN 102958288 A CN102958288 A CN 102958288A CN 2011102412572 A CN2011102412572 A CN 2011102412572A CN 201110241257 A CN201110241257 A CN 201110241257A CN 102958288 A CN102958288 A CN 102958288A
- Authority
- CN
- China
- Prior art keywords
- hole
- circuit board
- printed circuit
- copper
- layer
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Images
Landscapes
- Printing Elements For Providing Electric Connections Between Printed Circuits (AREA)
- Production Of Multi-Layered Print Wiring Board (AREA)
Abstract
The invention discloses a printed circuit board drilling method. A printed circuit board comprises a top plate, a bottom plate and a core plate. The printed circuit board drilling method includes mechanically drilling through holes at different positions of the core plate, subjecting the through holes to copper depositing and electroplating; subjecting the through holes subjected to copper depositing and electroplating to resin hole plugging treatment; plating copper on resin; binding the top plate and the bottom plate on the upper surface and the lower surface of the core plate, arranging external copper layers on the outer surfaces of the top plate and the bottom plate; and drilling blind holes at positions, corresponding to the through holes, on the external copper layers of the top plate and the bottom plate, subjecting the blind holes to copper depositing and electroplating so that the external copper layers are conductive with the copper layers of the through holes, wherein the bottoms of the blind holes extend to the copper layers on the through holes. Thus, the through holes at different positions on the circuit board are communicated, multilayer circuit connection is formed, and drilling blind holes with high thickness and diameter ratio is omitted.
Description
Technical field
The present invention relates to printed circuit board (PCB) (PCB, Printed Circuit Board) processing method technical field, more particularly, relate to a kind of printed circuit board drilling method.
Background technology
The integrated level of printed circuit board (PCB) is to embody an important indicator of properties of product, in order to improve the integrated level of printed circuit board (PCB), multilayer board occurred.Please refer to Fig. 1, for the cabling of giving multilayer circuit board provides more space, make it have best electric property, on the surface of the top layer L1 of printed circuit board (PCB) and bottom L4, usually be provided with blind hole A, B, perhaps run through the whole circuit board through hole C of (namely running through successively L1, L2, L3 and L4 layer).This blind hole C or through hole A, B can be used for top layer wiring and are connected connection with internal layer circuit.
After the boring method of traditional printing circuit board normally presses printed circuit board first, use the mode of laser drill or machine drilling to hole at printed circuit board (PCB), then, in this hole, carry out electroless copper and electro-coppering, carry out again at last figure processing.This processing method, general processing thickness and smaller blind hole or the through hole in aperture of being fit to, and for thickness and larger blind hole or the through hole of aperture ratio, then there are problems: for example, adopt the conventional borehole method when processing high thickness to diameter ratio hole, there is the unmanageable problem of drilling depth, the defective product rejection that easily causes of drilling depth.In addition, the too dark operations such as follow-up change gold, change tin of also can giving of boring are brought difficulty.
Summary of the invention
Technical problem to be solved by this invention is to provide a kind of printed circuit board drilling method, and it can overcome the various defectives that prior art is bored the high thickness to diameter ratio hole.
For solving the problems of the technologies described above, one of technical scheme of the present invention is: a kind of printed circuit board drilling method is provided, and described printed circuit board (PCB) comprises top plate, bottom plate and one deck central layer at least, may further comprise the steps:
1), adopts the mode of machine drilling to drill through the hole at the central layer diverse location, and described through hole is done heavy copper, electroplating processes;
2), the filling holes with resin processing is carried out in the through hole of the heavy copper of described process, electroplating processes;
3), copper facing on resin;
4), more described top plate, bottom plate are bonded in respectively the upper and lower surface of described central layer, the outer surface of described top plate and bottom plate is provided with outside copper layer;
5), adopt the mode of laser drill to be drilled with blind hole in the position of the corresponding described through hole of outside copper layer of described top plate and backplane level, the bottom of described blind hole extends to the copper layer on the described through hole;
6), described blind hole is done heavy copper, electroplating processes, make the copper layer conducting on described outside copper layer and the described through hole.
More specifically, in step 1) after, more described through hole is done electroplating processes, further increase the thickness of copper layer.
More specifically, in step 2) after, the part that described resin is exceeded copper layer in the described through hole polishes processing.
More specifically, described polishing process to adopt machinery to finish except glue or ceramic brush board mode.
More specifically, in step 3) in, the thickness of copper layer is greater than 10 microns on the described resin.
More specifically, described central layer is provided with the internal layer location hole of at least two described lead to the hole site of indication.
More specifically, the quantity of described internal layer location hole is four, and distinguishes the position setting of four jiaos of corresponding described central layers.
For solving the problems of the technologies described above, two of technical scheme of the present invention is: a kind of printed circuit board drilling method is provided, and described printed circuit board (PCB) comprises top plate, bottom plate and one deck central layer at least, may further comprise the steps:
1), adopts the mode of machine drilling to drill through the hole at the central layer diverse location, and described through hole is done heavy copper, electroplating processes;
2), the processing of electric conducting material consent is carried out in the through hole of the heavy copper of described process, electroplating processes;
3), more described top plate, bottom plate are bonded in respectively the upper and lower surface of described central layer, the outer surface of described top plate and bottom plate is provided with outside copper layer;
4), adopt the mode of laser drill to be drilled with blind hole in the position of the corresponding described through hole of outside copper layer of described top plate and backplane level, the bottom of described blind hole extends to the copper layer on the described through hole;
5), described blind hole is done heavy copper, electroplating processes, make described outside copper layer and described through hole conducting.
Like this, owing to first drilling through the hole at the central layer diverse location, be drilled with blind hole in the position of the corresponding described through hole of outside copper layer of described top plate and backplane level again, the bottom of described blind hole extends to the copper layer on the described through hole.Thereby the through hole that is positioned at the circuit board diverse location is communicated with, and then forms the multilayer line connection, and needn't be drilled with the high thickness to diameter ratio blind hole that is difficult to reach technological requirement.Not only reduce technology difficulty, also improved the quality of product.
Description of drawings
The structural representation of the printed circuit board (PCB) of holing with high thickness to diameter ratio in Fig. 1 prior art;
Fig. 2 is the embodiment of the invention one step 3) central layer cross-sectional schematic after copper facing on the resin;
Fig. 3 is the embodiment of the invention two steps 5) and step 6) cross-sectional schematic after doing heavy copper, electroplating processes at drilling blind hole on top plate and the bottom plate and to described blind hole.
Embodiment
In order to make technical problem to be solved by this invention, technical scheme and beneficial effect clearer, below in conjunction with drawings and Examples, the present invention is further elaborated.Should be appreciated that specific embodiment described herein only in order to explain the present invention, is not intended to limit the present invention.
Please refer to Fig. 2 and Fig. 3, in embodiments of the invention one, described printed circuit board (PCB) comprises top plate 1, bottom plate 3 and central layer 2.The course of processing roughly comprises following five steps:
The first step drills through hole H1, H2 at central layer 2 diverse locations first, and described through hole H1, H2 adopt the mode of machine drilling to form.Then described through hole H1, H2 are done heavy copper, electroplating processes, make the hole lead to the upper chemical copper of deposition in H1, the H2.In order further to increase the thickness of copper layer, after processing through heavy copper, more described through hole H1, H2 are done electroplating processes.At last, etching copper layer 21 on central layer 2.
Second step carries out filling holes with resin to the through hole of the heavy copper of described process and electroplating processes and processes, and makes and fills up resin 4 in through hole H1, the H2; The part that subsequently described resin 4 is exceeded copper layer in the described through hole polishes processing.In the present embodiment, described polishing process to adopt machinery to finish except glue or ceramic brush board mode.
In the 3rd step, please refer to Fig. 2, copper facing on the above-mentioned resin that is polished; The thickness of copper layer is greater than 10 microns on the described resin 4.
The 4th goes on foot, and described top plate 1, bottom plate 3 is bonded in respectively the upper and lower surface of described central layer 2, and the outer surface of described top plate 1 and bottom plate 3 is provided with outside copper layer 11,31;
The 5th step please refer to Fig. 3, was drilled with blind hole M1 in the position of the outside copper layer 11 corresponding described through hole H1 of described top plate 1, and the bottom of described blind hole M1 extends to the upper copper layer of described through hole H1.Simultaneously, be drilled with blind hole M2 in the position of the outside copper layer 31 corresponding described through hole of described backplane level 3, the bottom of described blind hole M2 extends to the copper layer on the described through hole H2.Described blind hole M1, M2 all adopt the mode of laser drill to form.Then, described blind hole M1, M2 are done heavy copper process, make the copper layer conducting on described outside copper layer and described through hole H1, the H2.Certainly, follow-up can also be to this blind hole M1, M2 filling resin or electric conducting material.
Described through hole H1, H2 adopt the machine drilling mode, and described blind hole M1, M2 adopt the laser drill mode most important to guaranteeing drilling quality.This be because:
If then there is the demanding defective of aligning accuracy in the inside and outside two-layer mode of all using laser drill.Because general laser blind hole diameter is for being designed to 3-8mil (mil), wherein diameter is that 4mil, 5mil blind hole are more common.The aperture is all smaller, because blind hole is positioned at different layers, realize the contraposition of laser blind hole between different layers again, and aligning accuracy requires high.If adopt the internal layer laser drill, and the up big and down small problem in hole then can appear in outer employing machine drilling, the bad control of contraposition also can face the large problem of the dark difficulty of control, if control is deeply improper, drill bit can directly get in the central layer, and the risk of destroying inner line figure is arranged.If the inside and outside two-layer mode of all using machine drilling namely uses the mode of machine drilling to get out respectively the hole of each core layer, the defective of circuit board warpage then can appear when structure is asymmetric between layers in the mode of lamination again.
For the position that guarantees blind hole M1, M2 can be accurately corresponding with through hole H1, H2, described central layer 2 is provided with the internal layer location hole (not shown) of at least two described lead to the hole site of indication.In this enforcement, the quantity of described internal layer location hole is four, and distinguishes the position setting of four jiaos of corresponding described central layers.Like this, before the 4th step, record through hole H1, H2 with respect to the coordinate of described internal layer location hole, when needs drilling blind hole M1, M2, according to above-mentioned coordinate information, can determine the position of through hole H1, H2.
Like this, because the present embodiment first drills through hole H1, H2 at central layer 2 diverse locations, be drilled with blind hole M1, M2 in the position of the corresponding described through hole of outside copper layer of described top plate 1 and backplane level 3 again, the bottom of described blind hole extends to the copper layer on the described through hole.Thereby the through hole that is positioned at the circuit board diverse location is communicated with, and then forms the multilayer line connection, and needn't be drilled with the high thickness to diameter ratio blind hole that is difficult to reach technological requirement.Not only reduce technology difficulty, also improved the quality of product.
In addition, in embodiments of the invention two, replace the resin material consent with electric conducting material, described electric conducting material can be conductive copper paste, conductive silver paste etc.Like this, do not needed as embodiment one on resin copper facing.The embodiment of embodiment two is as follows:
The first step adopts the mode of machine drilling to drill through the hole at the central layer diverse location, and described through hole is done heavy copper, electroplating processes;
Second step carries out the electric conducting material consent to the through hole of the heavy copper of described process, electroplating processes and processes;
The 3rd goes on foot, and more described top plate, bottom plate is bonded in respectively the upper and lower surface of described central layer, and the outer surface of described top plate and bottom plate is provided with outside copper layer;
The 4th step, adopt the mode of laser drill to be drilled with blind hole in the position of the corresponding described through hole of outside copper layer of described top plate and backplane level, the bottom of described blind hole extends to the copper layer on the described through hole;
The 5th step, described blind hole is done heavy copper, electroplating processes, make described outside copper layer and described through hole conducting.
Embodiment two can reach equally and reduce technology difficulty, improves the effect of product quality.
The above only is preferred embodiment of the present invention, not in order to limiting the present invention, all any modifications of doing within the spirit and principles in the present invention, is equal to and replaces and improvement etc., all should be included within protection scope of the present invention.
Claims (8)
1. printed circuit board drilling method, described printed circuit board (PCB) comprise top plate, bottom plate and one deck central layer at least, may further comprise the steps:
1), adopts the mode of machine drilling to drill through the hole at the central layer diverse location, and described through hole is done heavy copper, electroplating processes;
2), the filling holes with resin processing is carried out in the through hole of the heavy copper of described process, electroplating processes;
3), copper facing on the resin of through hole, form the copper layer on the through hole;
4), more described top plate, bottom plate are bonded in respectively the upper and lower surface of described central layer, the outer surface of described top plate and bottom plate is provided with outside copper layer;
5), adopt the mode of laser drill to be drilled with blind hole in the position of the corresponding described through hole of outside copper layer of described top plate and backplane level, the bottom of described blind hole extends to the copper layer on the described through hole;
6), described blind hole is done heavy copper, electroplating processes, make the copper layer conducting on described outside copper layer and the described through hole.
2. printed circuit board drilling method as claimed in claim 1 is characterized in that: in step 1) after, more described through hole is done electroplating processes, further increase the thickness of copper layer.
3. printed circuit board drilling method as claimed in claim 1 is characterized in that: in step 2) after, the part that described resin is exceeded copper layer in the described through hole polishes processing.
4. printed circuit board drilling method as claimed in claim 3 is characterized in that: described polish to process adopt machinery to finish except glue or ceramic brush board mode.
5. printed circuit board drilling method as claimed in claim 1 is characterized in that: in step 3) in, the thickness of copper layer is greater than 10 microns on the described resin.
6. printed circuit board drilling method as claimed in claim 1 is characterized in that: described central layer is provided with the internal layer location holes of at least two described lead to the hole site of indication.
7. printed circuit board drilling method as claimed in claim 6, it is characterized in that: the quantity of described internal layer location hole is four, and the position of four jiaos of corresponding described central layers arranges respectively.
8. printed circuit board drilling method, described printed circuit board (PCB) comprise top plate, bottom plate and one deck central layer at least, may further comprise the steps:
1), adopts the mode of machine drilling to drill through the hole at the central layer diverse location, and described through hole is done heavy copper, electroplating processes;
2), the processing of electric conducting material consent is carried out in the through hole of the heavy copper of described process, electroplating processes;
3), more described top plate, bottom plate are bonded in respectively the upper and lower surface of described central layer, the outer surface of described top plate and bottom plate is provided with outside copper layer;
4), adopt the mode of laser drill to be drilled with blind hole in the position of the corresponding described through hole of outside copper layer of described top plate and backplane level, the bottom of described blind hole extends to the copper layer on the described through hole;
5), described blind hole is done heavy copper, electroplating processes, make described outside copper layer and described through hole conducting.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201110241257.2A CN102958288B (en) | 2011-08-21 | 2011-08-21 | Printed circuit board drilling method |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201110241257.2A CN102958288B (en) | 2011-08-21 | 2011-08-21 | Printed circuit board drilling method |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN102958288A true CN102958288A (en) | 2013-03-06 |
| CN102958288B CN102958288B (en) | 2015-04-29 |
Family
ID=47766299
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201110241257.2A Active CN102958288B (en) | 2011-08-21 | 2011-08-21 | Printed circuit board drilling method |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN102958288B (en) |
Cited By (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104185385A (en) * | 2014-08-21 | 2014-12-03 | 江苏迪飞达电子有限公司 | Method for machining micro buried hole board |
| CN104602452A (en) * | 2013-10-31 | 2015-05-06 | 北大方正集团有限公司 | Manufacturing method of circuit board |
| CN105451429A (en) * | 2014-08-29 | 2016-03-30 | 深南电路有限公司 | Circuit board machining method and circuit board |
| CN107820361A (en) * | 2017-10-11 | 2018-03-20 | 肇庆高新区国专科技有限公司 | A kind of preparation method of ceramic base circuit board |
| CN112739016A (en) * | 2020-12-10 | 2021-04-30 | 惠州市特创电子科技股份有限公司 | Stacked hole circuit board and preparation method thereof |
| CN113141709A (en) * | 2021-02-26 | 2021-07-20 | 江苏博敏电子有限公司 | Equipment self-checking method for blind hole position offset of circuit board |
| CN113873786A (en) * | 2020-06-30 | 2021-12-31 | 深南电路股份有限公司 | Circuit board processing method and circuit board |
Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1348330A (en) * | 2001-10-19 | 2002-05-08 | 全懋精密科技股份有限公司 | Manufacture of thin core board for multiple-layer circuit board |
| US20060049913A1 (en) * | 2004-09-01 | 2006-03-09 | Samsung Electro-Mechanics Co., Ltd. | Printed circuit board including embedded resistor and method of fabricating the same |
| CN101296583A (en) * | 2008-04-24 | 2008-10-29 | 苏州市惠利华电子有限公司 | Method for processing printed circuit board |
| CN101977486A (en) * | 2010-10-29 | 2011-02-16 | 东莞红板多层线路板有限公司 | Method for manufacturing via stubs of circuit board |
| CN102159040A (en) * | 2011-03-28 | 2011-08-17 | 冠锋电子科技(梅州)有限公司 | Method for drilling hole on four-layered circuit board |
-
2011
- 2011-08-21 CN CN201110241257.2A patent/CN102958288B/en active Active
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1348330A (en) * | 2001-10-19 | 2002-05-08 | 全懋精密科技股份有限公司 | Manufacture of thin core board for multiple-layer circuit board |
| US20060049913A1 (en) * | 2004-09-01 | 2006-03-09 | Samsung Electro-Mechanics Co., Ltd. | Printed circuit board including embedded resistor and method of fabricating the same |
| CN101296583A (en) * | 2008-04-24 | 2008-10-29 | 苏州市惠利华电子有限公司 | Method for processing printed circuit board |
| CN101977486A (en) * | 2010-10-29 | 2011-02-16 | 东莞红板多层线路板有限公司 | Method for manufacturing via stubs of circuit board |
| CN102159040A (en) * | 2011-03-28 | 2011-08-17 | 冠锋电子科技(梅州)有限公司 | Method for drilling hole on four-layered circuit board |
Cited By (11)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104602452A (en) * | 2013-10-31 | 2015-05-06 | 北大方正集团有限公司 | Manufacturing method of circuit board |
| CN104185385A (en) * | 2014-08-21 | 2014-12-03 | 江苏迪飞达电子有限公司 | Method for machining micro buried hole board |
| CN105451429A (en) * | 2014-08-29 | 2016-03-30 | 深南电路有限公司 | Circuit board machining method and circuit board |
| CN105451429B (en) * | 2014-08-29 | 2018-06-26 | 深南电路有限公司 | The processing method and circuit board of a kind of circuit board |
| CN107820361A (en) * | 2017-10-11 | 2018-03-20 | 肇庆高新区国专科技有限公司 | A kind of preparation method of ceramic base circuit board |
| CN107820361B (en) * | 2017-10-11 | 2020-07-24 | 龙南骏亚电子科技有限公司 | Preparation method of ceramic-based circuit board |
| CN113873786A (en) * | 2020-06-30 | 2021-12-31 | 深南电路股份有限公司 | Circuit board processing method and circuit board |
| CN113873786B (en) * | 2020-06-30 | 2023-12-29 | 深南电路股份有限公司 | Circuit board processing method and circuit board |
| CN112739016A (en) * | 2020-12-10 | 2021-04-30 | 惠州市特创电子科技股份有限公司 | Stacked hole circuit board and preparation method thereof |
| CN112739016B (en) * | 2020-12-10 | 2023-03-14 | 惠州市特创电子科技股份有限公司 | Stacked hole circuit board and preparation method thereof |
| CN113141709A (en) * | 2021-02-26 | 2021-07-20 | 江苏博敏电子有限公司 | Equipment self-checking method for blind hole position offset of circuit board |
Also Published As
| Publication number | Publication date |
|---|---|
| CN102958288B (en) | 2015-04-29 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN102958288B (en) | Printed circuit board drilling method | |
| CN102438413B (en) | Second-order ladder groove bottom graphical printed board and processing method thereof | |
| CN101772279B (en) | Method for manufacturing PCB plate with blind holes | |
| CN102159040A (en) | Method for drilling hole on four-layered circuit board | |
| KR20190120295A (en) | Method of manufacturing recessed HDI substrate | |
| CN102045949A (en) | Method for making rigid/flexible combined printed circuit board | |
| CN104349609A (en) | Printed circuit board and manufacturing method thereof | |
| CN103874327B (en) | Copper-clad plate and manufacturing method thereof | |
| CN104540338A (en) | Manufacturing method of high-alignment HDI (High Density Interconnection) product | |
| US20160219713A1 (en) | Electronic component embedded printed circuit board and method of manufacturing the same | |
| CN106231821B (en) | A kind of four layers of pcb board manufacture craft | |
| CN104582330B (en) | The production method of the ATE plates of buried blind via structure | |
| CN110602900A (en) | Multilayer and multistage HDI plate manufacturing method and device | |
| CN102244973A (en) | Printed circuit board with blind hole structure and manufacturing method thereof | |
| CN111148355B (en) | Method for improving bonding force between copper layer and resin in back drilling area and PCB | |
| CN112867286A (en) | Preparation method of embedded large copper plate back plate | |
| CN112752439A (en) | Method for manufacturing high-density interconnection circuit board | |
| CN108235602A (en) | The processing method that second order buries copper billet circuit board | |
| CN104661436A (en) | Printed circuit board blind slot processing method | |
| CN112739011A (en) | Manufacturing method of three-layer blind hole printed board | |
| CN108882560A (en) | A kind of processing method and golden finger wiring board of golden finger | |
| US20150075845A1 (en) | Printed circuit board and method of manufacturing the same | |
| CN108617097B (en) | Manufacturing method of printed circuit board and printed circuit board | |
| US10555420B1 (en) | Circuit board and method for manufacturing the same | |
| US9443743B1 (en) | Method for directly attaching dielectric to circuit board with embedded electronic devices |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C06 | Publication | ||
| PB01 | Publication | ||
| C10 | Entry into substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| CP01 | Change in the name or title of a patent holder |
Address after: 518000 Nanshan District, Guangdong, overseas Chinese town, No. East Road, No. 99 Patentee after: SHENZHEN SHENNAN CIRCUIT CO., LTD. Address before: 518000 Nanshan District, Guangdong, overseas Chinese town, No. East Road, No. 99 Patentee before: Shenzhen Shennan Circuits Co., Ltd. |
|
| CP01 | Change in the name or title of a patent holder |