CN102955215A - Lens module and manufacturing method thereof - Google Patents
Lens module and manufacturing method thereof Download PDFInfo
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- CN102955215A CN102955215A CN2011102444094A CN201110244409A CN102955215A CN 102955215 A CN102955215 A CN 102955215A CN 2011102444094 A CN2011102444094 A CN 2011102444094A CN 201110244409 A CN201110244409 A CN 201110244409A CN 102955215 A CN102955215 A CN 102955215A
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- distance piece
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- camera lens
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Abstract
The invention discloses a lens module and a manufacturing method thereof. The lens module is applicable to wafer (disc) process and used with an image sensor. The lens module comprises a substrate, a lens and a distance piece, the lens is arranged on one of surfaces of the substrate and used for converging light rays, and the distance piece is arranged on the substrate relative to the periphery of the lens and used for preventing light rays from penetrating through the substrate from the periphery of the lens. The substrate and the lens are made of light permeable materials, and the distance piece is made of lightproof materials and used for isolating stray light from outside to promote sensing efficacy of the image sensor.
Description
Technical field
The present invention relates to a kind of camera lens module and manufacture method thereof, particularly a kind of wafer (disk) level technique that is applicable to, and camera lens module and the manufacture method thereof used in order to the image sensor of arranging in pairs or groups.
Background technology
The camera lens module that generally is applied to portable electric device mainly comprises an image sensor, and an eyeglass seat (lens holder) that covers at image sensor.The eyeglass seat has a rotatable eyeglass cylinder (lens barrel), and the eyeglass cylinder also has a lens set.When lens set images in image sensor, can rotate to change distance between lens set and the image sensor by the relative eyeglass seat of eyeglass cylinder, and then make light focusing on image sensor.Yet, can be in the set-up mode of eyeglass seat internal rotating owing to the eyeglass cylinder in this camera lens module, so that the eyeglass seat occupies certain space in camera lens module, and then the volume of camera lens module can't be reduced, and be not suitable on the portable electric device of day by day stressing lightweight and miniaturization.
Therefore, a kind of wafer-level lens module (wafer level lens module) appears in the market, for example the U.S. announces patent the 7th, 564, No. 496 disclosed wafer-level lens modules of Patent Case, it comprises an image-pickup assembly (image capturing element) and sequentially storehouse is also bonded to each other in distance piece (spacer), cover plate (cover plate) and the lensed lens substrate of tool (lens substrate) of image capture element top.Distance piece also has a hole, in order to allow the light can be via lens imaging on image sensor.Wherein, distance piece, cover plate and lens substrate all are comprised of glass material, it mainly is for fear of in the manufacture process of wafer-level lens module, between distance piece and cover plate or the lens substrate, produce fracture because of the matching error (mismatch) of thermal expansivity (coefficient of thermal expansion, CTE).Simultaneously, because the element of this camera lens module all adopts the integrated circuit technology manufacturing, therefore, make it have less volume compared to the conventional lenses module, and can be applicable on the miniaturized electronics such as mobile phone.
Yet, in above-mentioned wafer-level lens module, because distance piece is to adopt the glass with light transmitting property to form, therefore on making, can't produce in a large number fast.And, in the subsequent technique of wafer-level lens module, must increase in addition the periphery that the shading elements such as a light shield (sunshade) or cover frame (housing) are coated on distance piece, cover plate and lens substrate; Or, periphery at distance piece, cover plate and lens substrate applies one deck opaque, the parasitic light that produces in order to isolate external environment is passed to the image capture element to avoid these parasitic lights, and image sensing usefulness and the quality of image of image capture element.
So, except the volume that causes the wafer-level lens module increases, and increase simultaneously complexity and the degree of difficulty that the wafer-level lens module is made, and cause making the problem that production cost rises.
Summary of the invention
In view of above problem, the object of the present invention is to provide a kind of camera lens module and manufacture method thereof, use to improve in the existing wafer-level lens module shading element must additionally be installed, cause the volume of wafer-level lens module can't reduce and the complexity when manufacturing and degree of difficulty increase, and then cause the problem that production cost rises of making.
The present invention discloses a kind of camera lens module, is applicable to wafer scale technique, and this camera lens module uses in order to the image sensor of arranging in pairs or groups, so that light suitably converges at image sensor by camera lens module.In the middle of wafer scale technique, can suitably add the distance piece of non-printing opacity, converge light with the collocation lens.In order to reach this purpose, lens are arranged at the surface of a substrate, and distance piece is with respect to lens, be arranged at lens around, converge light with blocker lens not, wherein substrate and lens are made by light transmissive material, distance piece is made by non-light transmissive material.
The present invention also discloses a kind of manufacture method of camera lens module, to produce as aforesaid camera lens module.Described manufacture method is mainly after forming a plurality of camera lens modules, just cuts, and to form the camera lens module of a plurality of separation, just can simplify complexity and degree of difficulty that the wafer-level lens module is made.
Effect of the present invention is, non-light transmission features by distance piece, make camera lens module when being applied to image acquisition module, can directly come from extraneous parasitic light with the distance piece isolation, and the setting of omitting the shading element such as cover frame or light shield in the existing camera lens module, can further reduce the volume of camera lens module and image acquisition module, and have simultaneously the manufacturing course of simplifying camera lens module and the manufacture cost and other advantages that reduces camera lens module.
Describe the present invention below in conjunction with the drawings and specific embodiments, but not as a limitation of the invention.
Description of drawings
Fig. 1 is the diagrammatic cross-section of the image acquisition module of first embodiment of the invention,
Fig. 2 is the manufacturing flow chart of the camera lens module of first embodiment of the invention,
Fig. 3 is the decomposing schematic representation of the camera lens module of first embodiment of the invention,
Fig. 4 is the combination synoptic diagram of the single lens module of first embodiment of the invention,
Fig. 5 is the diagrammatic cross-section of the single lens module of first embodiment of the invention,
Fig. 6 is the diagrammatic cross-section of the single lens module of second embodiment of the invention,
Fig. 7 is the manufacturing flow chart of the camera lens module of second embodiment of the invention.
Wherein, Reference numeral
10 image acquisition modules
110 circuit boards
120 image sensors
20 camera lens modules
210 substrates
211 first surfaces
212 second surfaces
213 lens
220,220 ' distance piece
221 through holes
230,230 ' adhesion layer
Embodiment
The disclosed camera lens module of the present invention and manufacture method thereof are applicable in the wafer scale technique, and made camera lens module in the use, are to be disposed in the image acquisition module, and an image sensor uses in order to arrange in pairs or groups.Should be noted, the accompanying drawing of instructions is to be auxiliary literal, make and it will be appreciated by those skilled in the art that how to use the present invention, therefore accompanying drawing only shows essential feature of the present invention, and the size of each element also is to highlight essential features of the present invention with relative size relationship in the accompanying drawing, may be different with the size of actual product, be not to limit the scope of application of the present invention.
Fig. 1 illustrates the cross-sectional schematic of image acquisition module of the present invention, in the disclosed image acquisition module 10 of first embodiment of the invention, include a circuit board 110, an image sensor 120 and a camera lens module 20, image sensor 120 electrically is arranged on the circuit board 110, camera lens module 20 is arranged on the circuit board 110, and is positioned at the same side of circuit board 110 with image sensor 120.
Should be noted that the light that the present invention can be suitable for except visible light, also comprises invisible light, so the alleged light transmissive material of the present invention, refers to the material that can allow visible light and/or invisible light penetrate.Can launch in the application of light at some, invisible light has the sightless characteristic of human eye, concerning the user, more can not injure eyes.
Fig. 1 to Fig. 5 illustrates respectively the various synoptic diagram of camera lens module manufacturing flow chart of the present invention and camera lens module.Fig. 2 is the manufacturing flow chart of the camera lens module of first embodiment of the invention, Fig. 3 is the decomposing schematic representation of the camera lens module of first embodiment of the invention, Fig. 4 is the combination synoptic diagram of the single lens module of first embodiment of the invention, and Fig. 5 is the cross-sectional schematic of the single lens module of first embodiment of the invention.Manufacturing process and the element characteristics of camera lens module below are described in the lump, and element numbers please contrast the sign of each accompanying drawing, wherein the identical identical element of element numbers representative.
In the manufacturing of camera lens module 20, a substrate 210 (S101) at first is provided, substrate 210 is comprised of light transmissive material, for example is glass.Substrate 210 has a relative first surface 211 and a second surface 212, and arranged spaced has a plurality of lens 213 on substrate 210.A plurality of lens 213 are disposed at first surface 211 and/or the second surface 212 of substrate 210, and in response to different demands, in the present embodiment, lens 213 can be with the form configuration of convex lens or concavees lens.In the disclosed camera lens module 20 of the first embodiment, lens 213 be with the form arranged spaced of convex lens in the first surface 211 of substrate 210 as illustrating, but not as limit.
Then, form a distance piece 220 in the second surface (S102) of substrate, this distance piece 220 is made by non-light transmissive material, for example be the black high temp resistance plastics, be arranged on this second surface 212, these distance piece 220 relative these lens 213, be arranged at these lens around, converge this light not stop these lens.And, distance piece 220 have fusing point be higher than Celsius 200 the degree (℃) and matched coefficients of thermal expansion in the characteristic of substrate 210 thermal expansivity.For example when the composition material of substrate 210 is glass, the thermal expansivity of distance piece 220 is not more than 100ppm/ ℃ (1,000,000// degree centigrade), such as being 100ppm/ ℃, 60ppm/ ℃ or 30ppm/ ℃ etc.; Or thermalexpansioncoefficientα 1 is lower than 50ppm/ ℃ and thermalexpansioncoefficientα 2 and is lower than 100ppm/ ℃ etc., to avoid in the use procedure of camera lens module 20, matching error because of thermal expansivity between substrate 210 and the distance piece 220 produces stress, cause the situation that distance piece 220 ruptures on substrate 210 to occur.
Therefore, the composition material of above-mentioned distance piece 220 has the characteristic of low thermal coefficient of expansion, to cooperate the thermal expansivity of this substrate, the stress that attenuating produces because of the matching error of thermal expansivity, preferably, the composition material of this distance piece has low thermal coefficient of expansion, it can be but be not limited to liquid crystal polymer (the liquid crystalline polymer that thermal expansivity is less than about 30ppm/ ℃, LCP), thermalexpansioncoefficientα l and α 2 are lower than respectively epoxy molding compound (the epoxy molding compound of 20ppm/ ℃ and 60ppm/ ℃, EMC) or thermal expansivity be less than about 47ppm/ ℃ the non-light transmissive materials such as polyetheretherketone (polyaryletherketone, PEEK).
Then, form an adhesion layer 230 on a side of distance piece 220 (S103), the composition material of adhesion layer 230 can be but be not limited to thermoset resin (thermoset) or ultraviolet optical cement (ultraviolet glue).Then, second surface 212 with substrate 210 is arranged on the adhesion layer 230, or be attached to the second surface 212 (S104) of substrate 210 with adhesion layer 230, make distance piece 220 be incorporated into the second surface 212 of substrate 210, and with a plurality of through holes 221 corresponding to a plurality of lens 213.Therefore, making the relative position between distance piece 220 and the lens 213, is to be surrounded on lens 213 mode on every side to be arranged on the second surface 212.Afterwards, cut substrate 210 (S105) along the gap between a plurality of lens 213, to form a plurality of camera lens modules 20.Wherein, as shown in Figure 5, each camera lens module 20 has a substrate 210, a distance piece 220 and at least one lens 213, lens 213 are arranged at the first surface 211 of substrate 210, distance piece 220 is incorporated into the second surface 212 of substrate 210 by adhesion layer 230, and distance piece 220 with through hole 221 corresponding to lens 213, and the relative position on second surface 212, be surrounded on lens 213 around.
Although the first above-mentioned embodiment makes distance piece 220 via the mode of ejection formation first, and then via adhesion layer 230 distance piece 220 is bonding on the second surface 212.But the above embodiments are not the combination that limits distance piece 220 and substrate 210.In the embodiment of part, also can directly make distance piece 220 contact and be fixed on the second surface.For example, can be printed on the second surface 212 via the material of the mode of printing with distance piece 220, and in the time of printing, form these through holes 221.Follow the again material of cured printed on second surface 212, to form distance piece 220.Again for example, make distance piece 220 contact and the method that is fixed on the second surface 212 also can be to adopt lithography technique that distance piece 220 is formed on the second surface.
Please again consult Fig. 1, therefore, when camera lens module 20 is applied to image acquisition module 10, can be by another adhesion layer 230 ' distance piece 220 is incorporated on the circuit board 110, camera lens module 20 is supported on the circuit board 110 with distance piece 220, and be sheathed on image sensor 120 with through hole 221, make to produce spacing between lens 213 and the image sensor 120 and be suspended in image sensor 120 tops, and vertically corresponding to image sensor 120.At this moment, because image sensor 120 is subject to the encirclement of camera lens module 20, and be placed between substrate 210 and the distance piece 220 in the formed accommodation space, make the light that comes from external environment be passed to image sensor 120 via lens 213 and through hole 221, and can be isolated from outside the camera lens module 20 by other parasitic light that distance piece 220 will come from external environment, therefore can avoid image sensor 120 to be subject to the impact of parasitic light and reduce usefulness and the quality of image sensing.
See also Fig. 6 and Fig. 7, be the disclosed camera lens module 20 of second embodiment of the invention, the difference between itself and the first embodiment be this camera lens module 20 have two distance pieces 220,220 '.It is in the manufacture process of camera lens module 20, after the step that substrate 210 is provided, provide two distance pieces 220,220 '.Then, form respectively adhesion layer 230 in two distance pieces 220,220 ' a side on, or form respectively adhesion layer 230 on the first surface 211 and second surface 212 of substrate 210, with by adhesion layer 230 respectively with two distance pieces 220,220 ' be attached to first surface 211 and the second surface 212 of substrate 210, make two distance pieces 220,220 ' be incorporated on the substrate 210 and consist of camera lens module 20.In addition, two distance pieces 220,220 ' set-up mode, in addition can such as the first embodiment after the step that substrate 210 is provided (S201), provide two distance pieces 220,220 ' (S202).Then, form an adhesion layer 230 on a distance piece 220 wherein (S203), and this distance piece 220 is arranged at the second surface 212 (S204) of substrate 210 by adhesion layer 230.Afterwards, (S207) is front in the step that cuts substrate 210, form an adhesion layer 230 in another distance piece 220 ' upper (S205), and by adhesion layer 230 with on the first surface 211 of another distance piece 220 ' be arranged at substrate 210 (S206), this only is that the set-up mode of two distance pieces 220,220 ' on camera lens module 20 is different, but is not to limit the present invention.
As aforementioned description for distance piece 220 being incorporated into second surface 212, above-mentioned the second embodiment be not limit distance piece 220 ' with the combination of substrate 210.Similarly, distance piece 220 ' also can contact and is fixed on the first surface 211 via printing or lithography technique.
Based on above-mentioned structure, because the setting that has simultaneously distance piece at first surface and the second surface of substrate, therefore when camera lens module is applied to image acquisition module, can be simultaneously will come from extraneous parasitic light by two distance pieces and be isolated from outside the camera lens module, and further promote sensing usefulness and the quality of image sensor.
Comprehensive above stated specification, effect of the present invention is as can be known, non-light transmission features by the camera lens module spacers, make camera lens module when being applied to image acquisition module, can be directly with the extraneous parasitic light of distance piece isolation, and omit the setting that has the shading element such as outer cover or light shield in the camera lens module now, can further reduce the volume of camera lens module and image acquisition module.And, composition material by distance piece has the characteristics such as high-melting-point and low thermal coefficient of expansion simultaneously, can avoid between distance piece and the substrate when image acquisition module carries out reflow (reflow) technique, because the matching error of thermal expansivity produces fracture, the situation of damaging occurs.
Simultaneously, in the manufacturing of camera lens module, adopt glass material as the set-up mode of distance piece compared to existing camera lens module, the disclosed camera lens module of the present invention is except omitting as the arranging of the shading elements such as outer cover or light shield, can form distance piece by the mode of ejection formation in addition, and have the manufacturing course of simplifying camera lens module and the manufacture cost and other advantages that reduces camera lens module.And image sensor can be but be not limited to golden oxygen compensated semiconductor's image sensor (CMOS image sensor, CIS), for example also can be optocoupler components (Charge Coupled Device) image sensor.Camera lens module then can be selected the finished product that can cooperate with wafer process or be integrated in the manufacture process and form, and therefore is not limited to the wafer-level lens module.
It should be noted that in addition aforementioned distance piece also can pass through technique, directly be formed on the substrate will in conjunction with first surface and/or second surface on, and need not other adhesion material.For example by on first surface and/or second surface, directly printing above-mentioned non-light transmissive material, after solidifying, it namely on the first surface of substrate and/or second surface, forms distance piece, so that aforesaid distance piece directly contacts with first surface and/or second surface, and be fixed on first surface and/or the second surface, similarly technology is known by knowing semiconductor process techniques person, does not add at this and gives unnecessary details.
Certainly; the present invention also can have other various embodiments; in the situation that does not deviate from spirit of the present invention and essence thereof; those of ordinary skill in the art work as can make according to the present invention various corresponding changes and distortion, but these corresponding changes and distortion all should belong to the protection domain of the appended claim of the present invention.
Claims (11)
1. a camera lens module is applicable to wafer scale technique, and this camera lens module uses in order to the image sensor of arranging in pairs or groups, and, it is characterized in that this camera lens module includes so that light suitably converges at this image sensor by this camera lens module:
One substrate has a relative first surface and a second surface;
One lens are arranged on this first surface and this second surface surface wherein, in order to converge this light; And
One distance piece is arranged on this second surface, and this distance piece is these lens relatively, be arranged at these lens around, converge this light not stop these lens;
Wherein this substrate and this lens are made by light transmissive material, and this distance piece is made by non-light transmissive material.
2. camera lens module according to claim 1 is characterized in that, the composition material of this distance piece is selected from liquid crystal polymer, epoxy molding compound or polyetherketone.
3. camera lens module according to claim 1 is characterized in that, the thermal expansivity of this distance piece and the thermal expansivity of this substrate are not more than 100ppm/ ℃.
4. camera lens module according to claim 1 is characterized in that, also comprises another distance piece, is arranged on this first surface of this substrate, and relative these lens of this two distance piece, be arranged at these lens around, converge this light not stop these lens.
5. camera lens module according to claim 1 is characterized in that, also comprises an adhesion layer, and between this distance piece and this substrate, this distance piece is incorporated on this substrate by this adhesion layer.
6. the manufacture method of a camera lens module is applicable to wafer scale technique, and this camera lens module uses in order to the image sensor of arranging in pairs or groups, and, it is characterized in that this manufacture method may further comprise the steps so that light suitably converges at this image sensor by this camera lens module:
One substrate is provided, and a first surface or a second surface of this substrate are provided with a plurality of lens;
One first distance piece is set in this second surface of this substrate, this first distance piece is these a plurality of lens relatively, be arranged at these a plurality of lens around; And
Cut this substrate forming a plurality of camera lens modules, and each this camera lens module have at least one lens.
7. the manufacture method of camera lens module according to claim 6 is characterized in that, cut the step of this substrate before, also include and one second distance piece be set in the step of this first surface of this substrate.
8. the manufacture method of camera lens module according to claim 7 is characterized in that, the step that the second distance piece is set also includes:
This second distance piece is incorporated into this first surface of this substrate by an adhesion layer.
9. the manufacture method of camera lens module according to claim 7 is characterized in that, the step that this second distance piece is set also includes:
Make this second distance piece directly contact and be fixed in this first surface of this substrate.
10. the manufacture method of camera lens module according to claim 7 is characterized in that, the step that this first distance piece is set also includes:
Make this first distance piece directly contact and be fixed in this second surface of this substrate.
11. the manufacture method of camera lens module according to claim 6 is characterized in that, the step that the first distance piece is set also includes:
This first distance piece is incorporated into this second surface of this substrate by an adhesion layer.
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| Application Number | Priority Date | Filing Date | Title |
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| CN2011102444094A CN102955215A (en) | 2011-08-22 | 2011-08-22 | Lens module and manufacturing method thereof |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2011102444094A CN102955215A (en) | 2011-08-22 | 2011-08-22 | Lens module and manufacturing method thereof |
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| CN102955215A true CN102955215A (en) | 2013-03-06 |
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| CN2011102444094A Pending CN102955215A (en) | 2011-08-22 | 2011-08-22 | Lens module and manufacturing method thereof |
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Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106997885A (en) * | 2016-01-22 | 2017-08-01 | 豪威科技股份有限公司 | Open channels combination dam device and its manufacture method |
| CN110086963A (en) * | 2018-01-25 | 2019-08-02 | 台湾东电化股份有限公司 | Camera system |
| CN114076999A (en) * | 2020-08-21 | 2022-02-22 | 宁波舜宇光电信息有限公司 | Periscopic camera module |
Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101315453A (en) * | 2007-05-28 | 2008-12-03 | 乙太精密有限公司 | Collection type lens group and production method thereof |
| CN102123238A (en) * | 2010-01-11 | 2011-07-13 | 奇景光电股份有限公司 | Image capture module and lens module |
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2011
- 2011-08-22 CN CN2011102444094A patent/CN102955215A/en active Pending
Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101315453A (en) * | 2007-05-28 | 2008-12-03 | 乙太精密有限公司 | Collection type lens group and production method thereof |
| CN102123238A (en) * | 2010-01-11 | 2011-07-13 | 奇景光电股份有限公司 | Image capture module and lens module |
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106997885A (en) * | 2016-01-22 | 2017-08-01 | 豪威科技股份有限公司 | Open channels combination dam device and its manufacture method |
| CN110086963A (en) * | 2018-01-25 | 2019-08-02 | 台湾东电化股份有限公司 | Camera system |
| CN110086963B (en) * | 2018-01-25 | 2022-03-29 | 台湾东电化股份有限公司 | Image pickup system |
| CN114076999A (en) * | 2020-08-21 | 2022-02-22 | 宁波舜宇光电信息有限公司 | Periscopic camera module |
| CN114076999B (en) * | 2020-08-21 | 2023-08-11 | 宁波舜宇光电信息有限公司 | Periscope type camera shooting module |
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Application publication date: 20130306 |