CN102941416B - Alloy brazing filler metal of brazing-flux-free brazing foamed aluminum core veneer and preparation method thereof - Google Patents

Alloy brazing filler metal of brazing-flux-free brazing foamed aluminum core veneer and preparation method thereof Download PDF

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CN102941416B
CN102941416B CN201210435596.9A CN201210435596A CN102941416B CN 102941416 B CN102941416 B CN 102941416B CN 201210435596 A CN201210435596 A CN 201210435596A CN 102941416 B CN102941416 B CN 102941416B
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魏鹏
王桂明
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WUHU VODOLF NEW MATERIALS CO Ltd
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Abstract

The invention discloses an alloy brazing filler metal of a brazing-flux-free brazing foamed aluminum core veneer and a preparation method of the alloy brazing filler metal, wherein the alloy brazing filler metal is an alloy material whose range of melting point is from 450 DEG C to 600 DEG C. Elements of Cu and Mg are added in an aluminum-silicon-based brazing flux to prepare the alloy material with better flowability and appropriate melting point as a brazing filler metal, the alloy brazing filler metal is good in flowability and low in melting point, the elements of Cu and Mg in a brazing filler metal body are dispersed towards a solid phase foamed aluminum end in the welding process and are wetted and spread out on the surface of a base metal to implement the connection of parts, no brazing flux is used in a matched way in the welding process, no vacuum or protection atmosphere condition is needed, a compact oxidation film is removed by using a mechanical/physical method in a matched way, and a compact welding line is formed during the welding to implement the high-strength welding of the foamed aluminum.

Description

Solder alloy of a kind of solder without soldering acid foamed aluminium central layer and preparation method thereof
Technical field
The present invention relates to foamed aluminium material manufacture field, is exactly solder alloy of a kind of solder without soldering acid foamed aluminium central layer and preparation method thereof.
Background technology
Foamed aluminium material is a kind of high-tech new material developing out in recent years, it has sound absorption, sound insulation, heat insulation, many premium properties such as electromagnetic shielding, vibration reduction and cushioning, also has the intrinsic fire prevention of metallic aluminium, protection against the tide, the performance such as nontoxic, tasteless, anti-corrosion, anti-aging simultaneously.
Owing to adopting a small amount of metal to achieve structural material multifunction, opened up the new way of Problems Existing in the numerous high-tech sector of solution, foamed aluminium has demonstrated wide application prospect, become U.S., day, English, in, the forward position focus material of De Deng state 21 century.The external research to foamed aluminium is comparatively deep at present, is now successfully applied to the fields such as automobile, building, packaging, lathe.
As foamed aluminium material purposes the most extensively product be foam aluminum sandwich, be a kind of high porosity, grand hole porous material, and light, firm, heat-resisting, attractive in appearance.Be mainly used in sound-absorbing, sound insulation, damping, fire prevention, buffering, energy absorption, electromagnetic shielding, increase gas-liquid contact face, filtration etc.Foam aluminum sandwich application prospect is extensive, unless but possess practical interconnection technique, otherwise be impossible realize the production in enormous quantities of foam aluminium sandwich board member and application.More existing well-known techniques can be used for producing foamed aluminium central layer composite, as gluing, rolling-coated, welding etc., but all there are some problems.The foam aluminum sandwich that adhesion process is produced is high temperature resistant poor with corrosion resistance, and the environment for use of product has certain limitation.The Foamed aluminium component size of powder metallurgy foaming rolling-coated preparation has larger restriction, and this method is mainly used in sandwich for hole-closing structure, is rarely used in the preparation of open celled foam aluminum sandwich panel.At present about the solder technology of foamed aluminium is still immature, Hafer etc. and Pogibenko adopt the fusion welding method of Laser Welding after have studied and insert AlSi12 solder between foamed aluminium mother metal end face to be welded, under high energy Source, foam aluminum pore structure is caved in a large number and is caused molten bath and appearance of weld difficulty.In addition, thickness of slab is also comparatively responsive to laser power requirements.There is the diffusion welding (DW) of lower contained condition, and during supersonic welding, its welding joint mechanical property is poor, does not still possess practical condition.
Compared with the soldering of entity aluminium, the existence of a large amount of hole in foam aluminum sandwich surface is solder wetting and spread bad main cause in foamed aluminium soldering, and the diversified pore structure (aperture, hole shape and porosity etc.) of foamed aluminium produces a very large impact welding process and property of welded joint.In addition, dense oxidation film in brazing process in foam aluminum pore structure is also the key factor causing welding performance difference, the existence of oxide layer hinders the combination of parent metal and solder, the method of traditional removal pellumina uses in fluoride flux fused salt to flood, corrosion failure dense oxidation film, must carry out after dip brazing cleaning and heat, remove the residual salt of corrosivity, but for this loose structure of foamed aluminium central layer, cleaning is difficult to carry out, and causes the heavy corrosion of foamed aluminium central layer after soldering.
On choice of solder, when low-melting tinbase and zinc-base soldering, foamed aluminum-core surface is made up of thinner cell edge and cell wall, welding point stretch and shear strength lower.The silica-based solder of the aluminium that fusing point is high, easily causes again foam aluminum pore structure to be caved in a large number causing molten bath and appearance of weld difficulty or lack of fusion.After using the brazing fluxes such as fluoride to process in addition, because of the existence of foamed aluminum-core loose structure, not easy cleaning, causes the heavy corrosion of foamed aluminium central layer.The existing method for welding of foamed aluminium and solder is anti-corrosion at joint, all there are problems in antifatigue, appearance of weld and joint mechanical property etc., this greatly limits the application at high-tech and civil area of foam aluminum sandwich preparation in large size and foamed aluminium, therefore, research is applicable to the solder of the solder without soldering acid of foamed aluminum-core loose structure, has great importance.
Summary of the invention
Technical problem to be solved by this invention provides for above-mentioned prior art not need with the use of brazing flux; need not vacuum or protective atmosphere condition, solder alloy of the solder without soldering acid foamed aluminium central layer of the high-intensity welding of foamed aluminium and preparation method thereof can be realized.
Above-mentioned purpose is realized by following scheme:
The invention provides the formula and production technology thereof of preparing the solder alloy used in foamed aluminium welding process.
the present invention solves the problems of the technologies described above adopted technical scheme:designed by alloy composition, Cu is added in the silica-based solder of aluminium, Mg element, preparation has good mobility, the alloy material of suitable fusing point is as solder, this solder alloy utilizes the Cu in solder melt in welding process, Mg alloying element spreads to solid-phase foam aluminium end, with the interaction of Al element in mother metal, these processes cause the solder near linkage interface and the molten of mother metal to fall, promote the wetting of surface alumina oxide, make partial oxidation aluminium film destroy, solder liquefaction and mother metal melt due to capillary effect act on foamed aluminium cell wall skin covering of the surface under spread, and film density is less than solder melt and floats on the surface, the fragmentation of accelerated oxidation film is also removed in scraping subsequently and extrusion process, liquid solder is at mother metal moistened surface simultaneously, sprawl the connection realized between part.
beneficial effect of the present invention: in the silica-based solder of aluminium, add Cu, Mg element, preparation has good mobility, the alloy material of suitable fusing point is as solder, this solder alloy fusing point is low, good fluidity, the Cu in solder melt is utilized in welding process, Mg alloying element spreads to solid-phase foam aluminium end, at mother metal moistened surface, sprawl the connection realized between part, do not need with the use of brazing flux in this welding process, need not vacuum or protective atmosphere condition, dense oxidation film is removed by cooperative mechanical/physical method, and form fine and close weld seam when welding, realize the high-intensity welding of foamed aluminium.
Detailed description of the invention
Embodiment 1:
A kind of polybasic aluminum alloy material, it is Al-Si-Cu-Mg alloy, and wherein the mass percentage of the mass percentage of Si to be the mass percentage of 8%, Cu be 10%, Mg is the mass percentage of 10%, Al is 72%; Melting range 450-600 DEG C.Batching will use highly purified metal.(Al purity is not less than the silicon metal that 99.00%, Si uses 4mm, and the purity of Mg is not less than 99.50%, Cu purity and is not less than 99.70%).In appended claims
The preparation of above-mentioned Al-Si-Cu-Mg solder alloy:
1). the weighing of solder adopts photosensitive assay balance, and precision is not less than 0.001 gram.In order to ensure the accuracy of solder composition, control Aggregate Feeding Error during use below 0.005 gram, every stove preparation solder gross weight is 500 grams.The wherein quality 40 grams of Si, the mass percentage of Cu is 50 grams, and the mass percentage of Mg is 50 grams, and the mass percentage of Al is 360 grams.
2). shove charge: with high-purity CaO matter crucible; Vaccum sensitive stove cold conditions final vacuum≤10-2Pa.Process is, fills 360 grams of metallic aluminiums in CaO matter crucible, Si, Cu, Mg are placed in feeder; Vacuumize, in stove, vacuum will reach 10-2Pa: logical argon gas, makes furnace pressure be not less than 0.05 Mpa.
3). melting: open electric furnace, more than heating labor and materials to its melting range (850 DEG C); Treat that aluminium liquefaction is clear, add Si and Cu, Mg stirs aluminium liquid; Treat that aluminium alloy liquefaction is clear, stir aluminum alloy melt and vacuumize and make furnace pressure be not more than 0.009 MPa; Logical argon gas, makes furnace pressure be not less than 0.05 MPa, stirs titanium-aluminium alloy liquid; Treat that molten metal is melting down.
4). solidify: have a power failure cooling; Logical argon gas, make furnace pressure be not less than 0.08 MPa, open electric furnace, molten metal is poured in metal mold, then carries out water-cooled, obtains block solder.
It is qualified that the present invention can produce chemical analysis, and impurity content is low, and superior in quality as solder during a kind of foamed aluminium material solder without soldering acid, the welding being applied to large scale foamed aluminium board is shaping.
Embodiment 2:
A kind of polybasic aluminum alloy material, it is Al-Si-Cu-Mg alloy, Al-Si-Cu-Mg alloy, and wherein the mass percentage of the mass percentage of Si to be the mass percentage of 8%, Cu be 15%, Mg is the mass percentage of 10%, Al is 62%; Melting range 450-600 DEG C.Batching will use highly purified metal.(Al purity is not less than the silicon metal that 99.00%, Si uses 4mm, and the purity of Mg is not less than 99.50%, Cu purity and is not less than 99.70%).
The preparation of above-mentioned Al-Si-Cu-Mg solder alloy:
1). the weighing of solder adopts photosensitive assay balance, and precision is not less than 0.001 gram.In order to ensure the accuracy of solder composition, control Aggregate Feeding Error during use below 0.005 gram, every stove preparation solder gross weight is 500 grams.The wherein quality 40 grams of Si, the mass percentage of Cu is 75 grams, and the mass percentage of Mg is 50 grams, and the mass percentage of Al is 345 grams.
2). shove charge: with high-purity CaO matter crucible; Vaccum sensitive stove cold conditions final vacuum≤10-2Pa.Process is, fills 360 grams of metallic aluminiums in CaO matter crucible, Si, Cu, Mg are placed in feeder; Vacuumize, in stove, vacuum will reach 10 -2pa: logical argon gas, makes furnace pressure be not less than 0.05 Mpa.
3). melting: open electric furnace, more than heating labor and materials to its melting range (850); Treat that aluminium liquefaction is clear, add Si and Cu, Mg stirs aluminium liquid; Treat that aluminium alloy liquefaction is clear, stir aluminum alloy melt and vacuumize and make furnace pressure be not more than 0.009 MPa; Logical argon gas, makes furnace pressure be not less than 0.05 MPa, stirs titanium-aluminium alloy liquid; Treat that molten metal is melting down.
4). solidify: have a power failure cooling; Logical argon gas, makes furnace pressure be not less than 0.08 MPa, opens electric furnace, pour in metal mold, then carry out water-cooled, obtain block solder.
It is qualified that the present invention can produce chemical analysis, and impurity content is low, and superior in quality as solder during a kind of foamed aluminium material solder without soldering acid, the welding being applied to large scale foamed aluminium board is shaping.
Embodiment 3:
A kind of polybasic aluminum alloy material, it is Al-Si-Cu-Mg alloy, Al-Si-Cu-Mg alloy, Al-Si-Cu-Mg alloy, wherein the mass percentage of Si is the mass percentage of 10%, Cu is 10%, the mass percentage of Mg is the mass percentage of 10%, Al is 70%; Melting range 450-600 DEG C.Batching will use highly purified metal.(Al purity is not less than the silicon metal that 99.00%, Si uses 4mm, and the purity of Mg is not less than 99.50%, Cu purity and is not less than 99.70%).
The preparation of above-mentioned Al-Si-Cu-Mg solder alloy:
1). the weighing of solder adopts photosensitive assay balance, and precision is not less than 0.001 gram.In order to ensure the accuracy of solder composition, control Aggregate Feeding Error during use below 0.005 gram, every stove preparation solder gross weight is 500 grams.The wherein quality 50 grams of Si, the mass percentage of Cu is 50 grams, and the mass percentage of Mg is 50 grams, and the mass percentage of Al is 350 grams.
2). shove charge: with high-purity CaO matter crucible; Vaccum sensitive stove cold conditions final vacuum≤10-2Pa.Process is, fills 360 grams of metallic aluminiums in CaO matter crucible, Si, Cu, Mg are placed in feeder; Vacuumize, in stove, vacuum will reach 10 -2pa: logical argon gas, makes furnace pressure be not less than 0.05 Mpa.
3). melting: open electric furnace, more than heating labor and materials to its melting range (850); Treat that aluminium liquefaction is clear, add Si and Cu, Mg stirs aluminium liquid; Treat that aluminium alloy liquefaction is clear, stir aluminum alloy melt and vacuumize and make furnace pressure be not more than 0.009 MPa; Logical argon gas, makes furnace pressure be not less than 0.05 MPa, stirs titanium-aluminium alloy liquid; Treat that molten metal is melting down.
4). solidify: have a power failure cooling; Logical argon gas, makes furnace pressure be not less than 0.08 MPa, opens electric furnace, pour in metal mold, then carry out water-cooled, obtain block solder.
It is qualified that the present invention can produce chemical analysis, and impurity content is low, and superior in quality as solder during a kind of foamed aluminium material solder without soldering acid, the welding being applied to large scale foamed aluminium board is shaping.

Claims (5)

1. a solder alloy for solder without soldering acid foamed aluminium central layer, is characterized in that: it is melting range at the Al-Si-Cu-Mg alloy material of 450-600 DEG C; The preparation method of this solder alloy, comprises the following steps:
(1) Al, Si, Cu, Mg is taken by mass percentage;
(2) use vaccum sensitive stove, first fill Al in CaO matter crucible, Si, Cu, Mg are placed in feeder, vacuumize, in vaccum sensitive stove, vacuum will reach 10 -2below Pa, logical argon gas, makes furnace pressure be not less than 0.05 MPa;
(3) open electric furnace, heating Al material is to more than 850 DEG C; Treat that aluminium liquefaction is clear, add Si and Cu, Mg, stir; Treat that aluminium alloy liquefaction is clear, stir aluminum alloy melt and vacuumize and make furnace pressure be not more than 0.009 MPa; Logical argon gas, makes furnace pressure be not less than 0.05 MPa, stirs titanium-aluminium alloy liquid; Treat that molten metal is melting down;
(4) stop heating, cooling, logical argon gas, make furnace pressure be not less than 0.08 MPa, open electric furnace, molten metal is poured in metal mold, then carries out water-cooled, obtains block solder.
2. the solder alloy of solder without soldering acid foamed aluminium central layer according to claim 1, is characterized in that: be one of following five kinds:
(1) Al-Si-Cu-Mg alloy, wherein the mass percentage of the mass percentage of Si to be the mass percentage of 8%, Cu be 10%, Mg is the mass percentage of 10%, Al is 72%;
(2) Al-Si-Cu-Mg alloy, wherein the mass percentage of the mass percentage of Si to be the mass percentage of 8%, Cu be 12%, Mg is the mass percentage of 10%, Al is 70%;
(3) Al-Si-Cu-Mg alloy, wherein the mass percentage of the mass percentage of Si to be the mass percentage of 10%, Cu be 10%, Mg is the mass percentage of 10%, Al is 70%;
(4) Al-Si-Cu-Mg alloy, wherein the mass percentage of the mass percentage of Si to be the mass percentage of 10%, Cu be 12%, Mg is the mass percentage of 10%, Al is 68%;
(5) Al-Si-Cu-Mg alloy, wherein the mass percentage of the mass percentage of Si to be the mass percentage of 10%, Cu be 15%, Mg is the mass percentage of 10%, Al is 65%.
3. the solder alloy of solder without soldering acid foamed aluminium central layer according to claim 1, is characterized in that: Al purity is not less than the silicon metal that 99.00%, Si uses 4mm, and the purity of Mg is not less than 99.50%, Cu purity and is not less than 99.70%.
4. the solder alloy of solder without soldering acid foamed aluminium central layer according to claim 1, is characterized in that: taking of step (1) Raw adopts photosensitive assay balance, and precision is not less than 0.001 gram, controls Aggregate Feeding Error during use below 0.005 gram.
5. the solder alloy of solder without soldering acid foamed aluminium central layer according to claim 1, is characterized in that: described CaO matter crucible is high-purity CaO matter crucible, described vaccum sensitive stove cold conditions final vacuum≤10 -2pa.
CN201210435596.9A 2012-11-05 2012-11-05 Alloy brazing filler metal of brazing-flux-free brazing foamed aluminum core veneer and preparation method thereof Active CN102941416B (en)

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CN107127468B (en) * 2017-05-05 2020-02-14 哈尔滨工业大学深圳研究生院 Preparation method of high-temperature interconnection welding spot based on foam copper
CN110756938B (en) * 2019-10-25 2021-07-23 安徽省新方尊自动化科技有限公司 Rapid brazing compounding process based on iron-based material induction heating
CN111979440A (en) * 2020-08-20 2020-11-24 安徽工业大学 Aluminum alloy component for preparing foamed aluminum by powder metallurgy method and foaming method
CN112359238B (en) * 2020-11-05 2021-10-01 佛山市飞成金属制品有限公司 Porous aluminum alloy preparation process and aluminum alloy super-heat-conduction plate

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Effective date of registration: 20190523

Address after: 334224 Room 304, 12 Blocks, Zhangjiali New District, Sizhou Town Copper Mine, Dexing City, Shangrao City, Jiangxi Province

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Address before: 241070 No. 11 Workshop of Small and Medium-sized Enterprises Pioneer Park, South District of Wuhu High-tech Industrial Development Zone, Anhui Province

Patentee before: Wuhu Vodolf New Materials Co., Ltd.