CN102934533A - Device for assembling electric components on a printed circuit - Google Patents
Device for assembling electric components on a printed circuit Download PDFInfo
- Publication number
- CN102934533A CN102934533A CN2011800271027A CN201180027102A CN102934533A CN 102934533 A CN102934533 A CN 102934533A CN 2011800271027 A CN2011800271027 A CN 2011800271027A CN 201180027102 A CN201180027102 A CN 201180027102A CN 102934533 A CN102934533 A CN 102934533A
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- China
- Prior art keywords
- connection member
- metallic bond
- bond connection
- end part
- insulated support
- Prior art date
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Classifications
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B60—VEHICLES IN GENERAL
- B60H—ARRANGEMENTS OF HEATING, COOLING, VENTILATING OR OTHER AIR-TREATING DEVICES SPECIALLY ADAPTED FOR PASSENGER OR GOODS SPACES OF VEHICLES
- B60H1/00—Heating, cooling or ventilating [HVAC] devices
- B60H1/00457—Ventilation unit, e.g. combined with a radiator
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F25—REFRIGERATION OR COOLING; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS; MANUFACTURE OR STORAGE OF ICE; LIQUEFACTION SOLIDIFICATION OF GASES
- F25B—REFRIGERATION MACHINES, PLANTS OR SYSTEMS; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS
- F25B5/00—Compression machines, plants or systems, with several evaporator circuits, e.g. for varying refrigerating capacity
- F25B5/04—Compression machines, plants or systems, with several evaporator circuits, e.g. for varying refrigerating capacity arranged in series
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F25—REFRIGERATION OR COOLING; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS; MANUFACTURE OR STORAGE OF ICE; LIQUEFACTION SOLIDIFICATION OF GASES
- F25B—REFRIGERATION MACHINES, PLANTS OR SYSTEMS; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS
- F25B6/00—Compression machines, plants or systems, with several condenser circuits
- F25B6/04—Compression machines, plants or systems, with several condenser circuits arranged in series
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/02—Arrangements of circuit components or wiring on supporting structure
- H05K7/10—Plug-in assemblages of components, e.g. IC sockets
- H05K7/1015—Plug-in assemblages of components, e.g. IC sockets having exterior leads
- H05K7/103—Plug-in assemblages of components, e.g. IC sockets having exterior leads co-operating by sliding, e.g. DIP carriers
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F25—REFRIGERATION OR COOLING; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS; MANUFACTURE OR STORAGE OF ICE; LIQUEFACTION SOLIDIFICATION OF GASES
- F25B—REFRIGERATION MACHINES, PLANTS OR SYSTEMS; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS
- F25B2400/00—General features or devices for refrigeration machines, plants or systems, combined heating and refrigeration systems or heat-pump systems, i.e. not limited to a particular subgroup of F25B
- F25B2400/04—Refrigeration circuit bypassing means
- F25B2400/0409—Refrigeration circuit bypassing means for the evaporator
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F25—REFRIGERATION OR COOLING; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS; MANUFACTURE OR STORAGE OF ICE; LIQUEFACTION SOLIDIFICATION OF GASES
- F25B—REFRIGERATION MACHINES, PLANTS OR SYSTEMS; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS
- F25B2400/00—General features or devices for refrigeration machines, plants or systems, combined heating and refrigeration systems or heat-pump systems, i.e. not limited to a particular subgroup of F25B
- F25B2400/04—Refrigeration circuit bypassing means
- F25B2400/0411—Refrigeration circuit bypassing means for the expansion valve or capillary tube
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F25—REFRIGERATION OR COOLING; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS; MANUFACTURE OR STORAGE OF ICE; LIQUEFACTION SOLIDIFICATION OF GASES
- F25B—REFRIGERATION MACHINES, PLANTS OR SYSTEMS; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS
- F25B2500/00—Problems to be solved
- F25B2500/18—Optimization, e.g. high integration of refrigeration components
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/18—Printed circuits structurally associated with non-printed electric components
- H05K1/181—Printed circuits structurally associated with non-printed electric components associated with surface mounted components
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/04—Assemblies of printed circuits
- H05K2201/049—PCB for one component, e.g. for mounting onto mother PCB
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/09—Shape and layout
- H05K2201/09009—Substrate related
- H05K2201/09118—Moulded substrate
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10007—Types of components
- H05K2201/10015—Non-printed capacitor
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10613—Details of electrical connections of non-printed components, e.g. special leads
- H05K2201/10954—Other details of electrical connections
- H05K2201/10962—Component not directly connected to the PCB
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
- H05K3/20—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern by affixing prefabricated conductor pattern
- H05K3/202—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern by affixing prefabricated conductor pattern using self-supporting metal foil pattern
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
- H05K3/341—Surface mounted components
- H05K3/3421—Leaded components
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Physics & Mathematics (AREA)
- Mechanical Engineering (AREA)
- Thermal Sciences (AREA)
- Manufacturing & Machinery (AREA)
- General Engineering & Computer Science (AREA)
- Electric Connection Of Electric Components To Printed Circuits (AREA)
- Structure Of Printed Boards (AREA)
Abstract
The invention relates to a device for assembling electric components on a printed circuit board, wherein said device is provided in the form of an intermediate module (2) arranged between said board (C), which is coated with a metal solder layer (CM), and said components (CC, B,...) which are to be mounted thereon, and wherein said intermediate module (2) includes: a plurality of metal linking members (3), one side of which is mounted on said board (C) by means of remelting the solder metal layer (CM), and the other side of which, remote from the board, is suitable for receiving said components; and an insulating bracket (4) combining said metal linking members (3) separately from one another.
Description
Technical field
The present invention relates to for the device that electric component or like is assembled on printed circuit board (PCB) or the card, such as, in a special but non-exclusive application, intention is used for the controller of the motor of a kind of heating for motor vehicles, heating ventilation and air-conditioning system, and the described system that is equipped with such apparatus for assembling.
Background technology
In order arbitrarily to regulate the air flow rate that is brought into motor vehicle interiors, common heating, heating ventilation and air-conditioning (HVAC) system, except obtaining at aspects such as heating, coolings the heat exchanger of desired effects, also comprise electric notor, blower wheel is installed on the axle of electric notor and by term " fan that motor drives " expression, its driver that passes through is controlled by " controller " via the rotary speed of the selection of the specific button on the instrument board, described controller is the form of electronic printing circuit board, and various assembling parts are on this electronic printing circuit board.
At present, the assembling of contact (lug plate, pin etc.) that therefore is surface mounted in the electric component on the plate is by following execution:
-pass through solder reflow process, it comprises that the plate that makes surface-coated in advance that the metal welding bed of material (soldering paste) be arranged enters reflow soldering furnace with the contact of the parts that are positioned at from the teeth outwards selected position, so that so that metal level is melted on the contact, and subsequently, after cooling, realize parts assembling onboard, or
-by the fluctuation welding procedure, particularly when wanting assembled part dimension larger, for example, electrolytic capacitor, input filter coil or inductor and be used for power supply and be used for the connector of motor of the fan of motor driving.This technique comprises to be passed through the ripple of metal soldering paste along associated plate surface (contact of parts is bonded thereto in advance), described metal soldering paste is attached to described plate by capillarity with the contact of parts.
Although technical the grasp, because health and the increasing situation of environment reason are in the time of must using unleaded metal alloy (usually based on tin), the fluctuation welding procedure becomes and more is difficult to implement when in addition.
This is because do not have lead in the metal alloy, and as compromise, band is served defective, comprises and falls significantly low-alloyed wettability, obtains " deposition " on the surface so that scolder is tending towards being difficult to whole between contact and plate.Therefore, obtained parts imperfect welding onboard, this can cause the fault of breaking of electron plate and its parts or system's motor afterwards, and last expensive especially plate-element maintenance or replacing operation.
Summary of the invention
The object of the invention is to solve these defectives, and for this reason, relate to for the device of assembling parts on printed circuit board (PCB) or card, such as printed circuit board (PCB) or the card of the electric notor controller of the heating of vehicle, heating ventilation and air-conditioning system, described plate is coated with the metal welding bed of material.
According to the present invention, device has the form of intermediate module, be arranged in described plate and intention and be installed between the described parts on the module, and described intermediate module comprises:
-a plurality of metallic bond connection members add on the described plate by the backflow of the metal welding bed of material in a side, and can receive at the opposite side away from this plate described parts; With
-insulated support makes up described metallic bond connection member in mode separated from one another.
Therefore, by means of be surface mounted to the intermediate module that also " greatly " parts is installed on the printed circuit board (PCB) together by reflux technique, this device overcome particularly with the fluctuation welding procedure during the relevant defective of the low wettability of the lead-free alloy that uses, this is not the problem of solder reflow process.In addition, be added on the plate then during homogeneous is by reflow soldering and usually carried out simultaneously by the installation of the miscellaneous part of reflow soldering assembling as the intermediate module of the interface between plate and the associated components, therefore do not relate to the increase of plate manufacturing cost.Module assembled onboard after, large parts (such as, in advantageous applications, be used for plate or motor power supply, be used for capacitor and the coil of input filter) be added to the suitable metallic bond connection member of device.
In accordance with a first feature of the invention, each has the lug plate shape of bending described metallic bond connection member, described lug plate shape has first end part and the second end part, described first end partly has the load-bearing surface that contacts for described plate, and described the second end partly is used for being fixed to described insulated support.
Described first and second end sections of metallic bond connection member are parallel to each other setovers by the inclination middle body.Therefore insulated support is parallel to plate and close plate, in order to minimize its size.Advantageously, this linkage members structure vacate on the plate and module under the space so that there installing component or other objects.
According to another characteristic of the invention, described insulated support forms framework, and described metallic bond connection member is emerged at the periphery place of described framework.In addition, described linkage members is outwards outstanding from framework.In other words, these linkage members extend beyond periphery along the direction that is arranged essentially parallel to the general plane of insulated support.
According to another feature of the present invention, described metallic bond connection member is partly located to extend by contact terminal at the second end, and the electric component intention that be installed on the intermediate module cooperates with described contact terminal.
Described metallic bond connection member is made with copper or copper alloy, and described insulated support is made with nonconducting heat resistant plastic material or similar material.
Advantageously, described insulated support coats and is molded on the described metallic bond connection member, the first end part of described metallic bond connection member is outwards outstanding from strutting piece, and the second end is partly embedded in the described insulated support, and described insulated support limits the Side direction receiving groove.
Again advantageously, described contact terminal has rectangular cross section, and each metallic bond connection member comprises for the terminal that connects the corresponding contact will be installed in the parts on the described intermediate module and/or is used for installing by power two separated from one another and parallel terminals of the corresponding connecting contact of emerging from parts to be installed.
Another theme of the present invention is control module or the controller with fan that the motor of motor and blower wheel drives, the heating, ventilation and/or the air-conditioning system that are used for motor vehicles, comprise printed circuit board (PCB) or card, described plate is coated with metal welding bed of material CM, aforesaid for assembling parts onboard or the device at plate place be installed in described controller or control module.
Description of drawings
In necessary part, accompanying drawing will provide the present invention how effective good understanding, and will help to limit better the present invention.On these figure, the identical similar object of Reference numeral indication.
Exemplary embodiment according to intermediate module apparatus for assembling of the present invention is shown to Fig. 1 perspectivity, before it is installed on the printed circuit board (PCB) of heating, heating ventilation and air-conditioning system of vehicle.
Fig. 2 is the vertical view of the metallic bond connection member of module.
Apparatus for assembling based on module is shown to Fig. 3 perspectivity, is fixed to printed circuit board (PCB) and bearing electric parts.
Fig. 4 is the contact lug plate of capacitor and the amplification that links and the local perspectivity detail drawing of the terminal of the suitable metallic bond connection member of module.
Embodiment
In exemplary embodiment shown in Figure 1, apparatus for assembling 1 of the present invention is limited by the middle standalone module 2 of fulfiling the interface responsibility, as seeing about Fig. 3 afterwards, standalone module 2 is between printed circuit board (PCB) or card C and electric component CC, B in the middle of described, and described electric component CC, B will be connected to specific location onboard by installing 1.Therefore be understood that, this module is different from plate or printed circuit, and described module is added on the described plate by solder reflow process.
For this reason, intermediate module 2 comprises metallic bond connection member 3 and insulated support 4, described metallic bond connection member 3 is provided for the path of the electric current between ad-hoc location and the electric component to be installed, and described insulated support 4 keeps together metallic bond connection member 3 and be separated from each other by this way.In this embodiment, module 2 has the basically smooth parallelepiped shape that is provided by insulated support 4, and it limits rectangular frame.Linkage members 3 is arranged on the peripheral 4A place of framework, has in this example six linkage members: two long limit 4B from framework are medially emerged, and four minor face 4C from framework are emerged in couples.Certainly, can imagine the linkage members 3 of varying number and the other shape of strutting piece 4 according to required particular characteristics.
More particularly, metallic bond connection member 3 is made by conducting metal, such as copper or copper alloy, and preferably zinc-plated.On the structure, each linkage members 3 is rendered as the form that is stretched flat lug plate 3A of bending, it has rectangular cross section and has first end part 3B and the second end part 3C, and described first end part 3B and the second end part 3C link by inclination middle body 3D in the mode and being parallel to each other of biasing.The first flat end part 3B forms planes carry surface 3E, be used for contacting with printed circuit board (PCB), and the group of these load-bearing surfaces 3E of member is comprised in the same level, in order to be applied in admirably on the metal welding bed of material CM of plate, so that thereon soldered by reflux technique according to the present invention.The second flat end part 3C provides the maintenance of each linkage members 3 with the framework of strutting piece 4, and will after see, with being electrically connected of parts.
For this reason, strutting piece 4 electric insulations and make with plastic material, described plastic material can be supported the heat distribution (thermal profile) of reflow soldering, the lip-deep device 1 that is installed in plate must be by described reflow soldering.Plastic material or heat-resisting, that is, as long as temperature less than 260 ℃ (maximum temperatures with reflow soldering of pb-free solder layer CM) with regard to mechanically stable.Module 2 is for example by the insulated support 4 molded acquisition of coating with the second end part 3C of metallic bond connection member 3, thereby metallic bond connection member 3 is as illustrated in fig. 1 and 2, vertically outstanding from side 4B, the 4C of the framework that forms insulated support.
In Fig. 1,3 and 4, especially find out, the second end part 3C of member, after coating is molded, be placed among the groove 4D, described groove 4D is manufactured on wherein when strutting piece is manufactured, and with regard to four linkage members of emerging from minor face 4C, described groove 4D can be groove not, or with regard to two linkage members of emerging from the long limit 4B of framework, described groove 4D can be groove.These groups smooth or the second end part 3C that is stretched flat are in the same level, and first are stretched flat end sections 3B and setover abreast, and amount of bias is affected by the inclination middle body 3D of member.Therefore, insulated support 4 rises with respect to the 3B of first, and therefore, away from and be parallel to plate C.Therefore plate C receives other common parts under module.
In addition, the second end part 3C of linkage members 3 all extends by contact terminal 3F, and electric component to be installed cooperates with described contact terminal 3F.Illustrate such as Fig. 1 and 2, in this example, these terminals 3F is the flat type with rectangular cross section, but they are can be entirely different or distinguish over each other.In applicant's example, be positioned on the minor face 4C of frame structure insulated support 4 linkage element 3 each terminal 3F is equipped with, described terminal 3F is emerged from it with respect to this terminal of the second end part 3C(by rotating along the direction opposite with first end part 3B) vertically bending, namely with respect to the rectangular frame of insulated support and vertically bending.Terminal 3F begins at the sidepiece of the sensing insulated support inboard of the second end part 3C.
The terminal 3F that is arranged in two linkage members 3 on the minor face 4C on Fig. 2 left side forms power supply terminal (for example 12 volts) and earth terminal, complementary terminal (the contact of power supply, not shown) be connected on the described terminal, the terminal 3F that is arranged in two linkage members 3 on Fig. 2 the right relates to power supply terminal and earth terminal, and the terminal (not shown) of the fan that drives from the motor of system is connected on the described terminal.In order to receive complementary splicing ear from power supply with from the fan that motor drives, insulated support 4 has two rectangular base 4E at its top, and described rectangular base 4E is around the associated terminal 3F of linkage members.Therefore observe, insulated support 4 has middle body at the minor face 4C place of insulated support, and this middle body intention receives the power supply terminal 3F on the electric component that will be added and any side that is arranged in this middle body.
The linkage members 3 that is positioned at the center of top of Fig. 2 comprises in pairs vertically arranged four link terminal 3F, two roughly directions that are parallel to this linkage members 3 in them, thus these two terminal 3F are facing to two terminal 3F of the linkage members 3 at the bottom center place that is positioned at Fig. 2.
Equally, in addition two the terminal 3F of linkage members 3 that are arranged in the center of top place of Fig. 2 are arranged as and align with the terminal 3F of the linkage members 3 that is positioned at Fig. 2 top left place and towards them.This layout of terminal 3F is provided for installing:
-first component is installed in the linkage members 3 at the top left place of Fig. 2 with in same figure between the linkage members 3 at center of top place, and
-second component is installed in the linkage members 3 at the center of top place of Fig. 2 with in same figure between the linkage members 3 at bottom center place.
As shown in Figure 4, the lug plate P that forms the contact of capacitor or electrochemical capacitor CC is fixed by clamping action, described clamping action obtains by two smooth terminal 3F, described two smooth terminal 3F each intervals and parallel to each other, and emerge from the second end part 3C of the metallic bond connection member of the long limit 4B that is positioned at frame structure insulated support 4.These terminals 3F aligns with the second end part 3C, is parallel to the plane of strutting piece, thereby the lug plate P of cylinder form is inserted between two respective parallel terminals of linkage members 3 by power.
Contact lug plate (not shown) for the coil B shown in the part among fixing Fig. 3 also is same, described contact lug plate is inserted between the paired parallel terminal 3F that faces mutually by power, described terminal 3F is emerged from two adjacent link members 3,3 one of described two adjacent link members are on minor face 4C, another is seen as better in Fig. 2 on long limit 4B.
As shown in Figure 3, before the intermediate module 2 that parts is installed to apparatus for assembling 1, the load-bearing surface 3E of the first end part 3B of metallic bond connection member 4 is positioned at the pre-position on the plate C, and metal welding bed of material CM is positioned at described position.The metal welding bed of material obviously is used for linking common parts (not shown), is used for the huger parts of apparatus for assembling 1 except intention.
Be passed in the reflow soldering (not shown) by the apparatus for assembling 1 that makes printed circuit board (PCB) C and be surface mounted on it, the heat of reflow soldering is so that layer CM fusing (soldering paste) provides welding, after cooling, the first end part 3B of the metallic bond connection member of module 2 is attached on the plate C via load-bearing surface, as common parts are set directly on the plate C.Because reflow soldering does not relate to the wettability problem that produces by the fluctuation welding, apparatus for assembling 1 is fixed to plate admirably, described plate provides plate by metallic bond connection member 3 and will be installed in conductivity between the parts on the module, especially at these copper or copper alloy member by zinc-plated so that when compatible with unleaded reflux technique (tin that for example, has the sublayer of nickel).
After from reflow soldering, taking out and after cooling, the connector (not shown), the connector of the fan that drives such as power supply and motor is inserted into the respective bases 4E of intermediate module 2 and is connected to suitable parallel contact terminal 3F.Subsequently, the lug plate P of the coil B of large parts and electrolytic capacitor CC is introduced into by power and clamps by corresponding parallel terminal 3F.This operation can be carried out under the help of particular tool (not shown), and is formed in the bar of insulated support 4 in order to help this operation near the hole of these terminals.Can be envisioned for for other modes that lug plate are fixed to terminal, such as, especially, link by laser.
Claims (11)
1. one kind is used for electric component or like are assembled in device on printed circuit board (PCB) or the card, it is characterized in that, it has the form of intermediate module (2), described intermediate module be arranged in described plate (C) and intention be installed in described parts on the module (2) (CC, B ...) between, and be, described intermediate module (2) comprising:
-a plurality of metallic bond connection members (3), it can be added to by reflux technique on the described plate (C) in a side, and can receive at the opposite side away from this plate described parts; With
-insulated support (4) makes up described metallic bond connection member (3) in mode separated from one another.
2. device as claimed in claim 1, wherein, each has the lug plate shape (3A) of bending described metallic bond connection member (3), described lug plate shape has first end part (3B) and the second end part (3C), described first end part (3B) has for the load-bearing surface (3E) that contacts with described plate, and described the second end part (3C) is used for being fixed to described insulated support (4).
3. such as last the described device of claim, wherein, described first and second end sections (3B, 3C) of metallic bond connection member (3) are parallel to each other setovers by inclination middle body (3D).
4. such as each the described device in the aforementioned claims 1 to 3, wherein, described insulated support (4) forms framework, and described metallic bond connection member (3) is located to emerge at the periphery (4A) of described framework.
5. device as claimed in claim 4, wherein, described linkage members (3) is outwards outstanding from framework.
6. such as each the described device in the aforementioned claim, wherein, described metallic bond connection member (3) is located to extend by terminal (3F) in the second end part (3C), and the electric component that be installed on the intermediate module (2) is used for cooperating with described terminal (3F).
7. such as each the described device in the aforementioned claim, wherein, described metallic bond connection member (3) is made with copper or copper alloy.
8. such as each the described device in the aforementioned claim, wherein, described insulated support (4) is made with heat resistant plastic material or similar material.
9. such as last the described device of claim, wherein, described insulated support (4) coats and is molded on the described metallic bond connection member (3), the first end part (3B) of described metallic bond connection member is outwards outstanding from strutting piece (4), the second end part (3C) is embedded in the described insulated support (4), and described insulated support (4) limits Side direction receiving groove (4D).
10. device as claimed in claim 6, wherein, described terminal (3F) has rectangular cross section, and each metallic bond connection member (3) comprises for the terminal that connects the corresponding contact will be installed in the parts on the described intermediate module (2) and/or is used for installing by power two separated from one another and parallel terminals of the corresponding connecting contact of emerging from parts to be installed.
11. the controller of the fan that the motor with motor and blower wheel drives, the heating, ventilation and/or the air-conditioning system that are used for motor vehicles, comprise printed circuit board (PCB) or card, described printed circuit board (PCB) is coated with the metal welding bed of material (CM), it is characterized in that, it is equipped with such as each apparatus for assembling that limits (1) in the aforementioned claim.
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
FR1001299 | 2010-03-30 | ||
FR10/01299 | 2010-03-30 | ||
PCT/EP2011/001384 WO2011120644A1 (en) | 2010-03-30 | 2011-03-21 | Device for assembling electric components on a printed circuit |
Publications (2)
Publication Number | Publication Date |
---|---|
CN102934533A true CN102934533A (en) | 2013-02-13 |
CN102934533B CN102934533B (en) | 2016-11-23 |
Family
ID=42712744
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
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CN201180027102.7A Active CN102934533B (en) | 2010-03-30 | 2011-03-21 | For electric component is assembled device on a printed circuit |
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CN102963237A (en) * | 2012-11-28 | 2013-03-13 | 芜湖博耐尔汽车电气***有限公司 | Circuit board fixing mechanism for automobile air conditioner control panel |
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CN2785259Y (en) * | 2005-03-23 | 2006-05-31 | 比亚迪股份有限公司 | Controller for air-conditioning system of vehicles |
CN101123235A (en) * | 2006-08-07 | 2008-02-13 | 南茂科技股份有限公司 | Semiconductor encapsulation structure for improving crystal shift upon pressing and its using lead frame |
US20080291653A1 (en) * | 2007-05-24 | 2008-11-27 | Sailor Steven L | Stand-off mounting apparatus for discrete electrical components |
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US6604950B2 (en) * | 2001-04-26 | 2003-08-12 | Teledyne Technologies Incorporated | Low pitch, high density connector |
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CN2785259Y (en) * | 2005-03-23 | 2006-05-31 | 比亚迪股份有限公司 | Controller for air-conditioning system of vehicles |
CN101123235A (en) * | 2006-08-07 | 2008-02-13 | 南茂科技股份有限公司 | Semiconductor encapsulation structure for improving crystal shift upon pressing and its using lead frame |
US20080291653A1 (en) * | 2007-05-24 | 2008-11-27 | Sailor Steven L | Stand-off mounting apparatus for discrete electrical components |
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CN102934533B (en) | 2016-11-23 |
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