CN102931124A - 高密度薄膜混合集成电路的集成方法 - Google Patents
高密度薄膜混合集成电路的集成方法 Download PDFInfo
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- CN102931124A CN102931124A CN2012104928157A CN201210492815A CN102931124A CN 102931124 A CN102931124 A CN 102931124A CN 2012104928157 A CN2012104928157 A CN 2012104928157A CN 201210492815 A CN201210492815 A CN 201210492815A CN 102931124 A CN102931124 A CN 102931124A
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CN102931124A true CN102931124A (zh) | 2013-02-13 |
CN102931124B CN102931124B (zh) | 2015-11-18 |
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Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
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CN104485324A (zh) * | 2014-12-15 | 2015-04-01 | 贵州振华风光半导体有限公司 | 无引线球脚表贴式微波薄膜混合集成电路及其集成方法 |
Citations (6)
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---|---|---|---|---|
US5295045A (en) * | 1990-11-14 | 1994-03-15 | Hitachi, Ltd. | Plastic-molded-type semiconductor device and producing method therefor |
US5397747A (en) * | 1993-08-19 | 1995-03-14 | International Business Machines Corporation | Vertical chip mount memory package and method |
US20080174012A1 (en) * | 2007-01-23 | 2008-07-24 | Seiko Epson Corporation | Semiconductor device manufacturing method, semiconductor device, and wiring board |
CN101673693A (zh) * | 2009-09-22 | 2010-03-17 | 贵州振华风光半导体有限公司 | 高可靠厚膜混合集成电路键合***及其制造方法 |
CN102522412A (zh) * | 2011-12-28 | 2012-06-27 | 贵州振华风光半导体有限公司 | 高集成高可靠工作温度可控薄膜混合集成电路的集成方法 |
CN202443971U (zh) * | 2011-12-28 | 2012-09-19 | 贵州振华风光半导体有限公司 | 高集成高可靠工作温度可控薄膜混合集成电路 |
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Patent Citations (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5295045A (en) * | 1990-11-14 | 1994-03-15 | Hitachi, Ltd. | Plastic-molded-type semiconductor device and producing method therefor |
US5397747A (en) * | 1993-08-19 | 1995-03-14 | International Business Machines Corporation | Vertical chip mount memory package and method |
US20080174012A1 (en) * | 2007-01-23 | 2008-07-24 | Seiko Epson Corporation | Semiconductor device manufacturing method, semiconductor device, and wiring board |
CN101673693A (zh) * | 2009-09-22 | 2010-03-17 | 贵州振华风光半导体有限公司 | 高可靠厚膜混合集成电路键合***及其制造方法 |
CN102522412A (zh) * | 2011-12-28 | 2012-06-27 | 贵州振华风光半导体有限公司 | 高集成高可靠工作温度可控薄膜混合集成电路的集成方法 |
CN202443971U (zh) * | 2011-12-28 | 2012-09-19 | 贵州振华风光半导体有限公司 | 高集成高可靠工作温度可控薄膜混合集成电路 |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN104485324A (zh) * | 2014-12-15 | 2015-04-01 | 贵州振华风光半导体有限公司 | 无引线球脚表贴式微波薄膜混合集成电路及其集成方法 |
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Inventor after: Yang Chenggang Inventor after: Su Guidong Inventor after: Wang Xuan Inventor before: Yang Chenggang Inventor before: Su Guidong |
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Address after: 550018 Guizhou Province, Guiyang city new North Avenue No. 238 Patentee after: Guizhou Zhenhua Fengguang Semiconductor Co.,Ltd. Address before: 550018 Guizhou Province, Guiyang city new North Avenue No. 238 Patentee before: GUIZHOU ZHENHUA FENGGUANG SEMICONDUCTOR Co.,Ltd. |