CN102931115B - Wafer in-situ detection device and water bracket as well as wafer in-site detection method - Google Patents
Wafer in-situ detection device and water bracket as well as wafer in-site detection method Download PDFInfo
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- 238000011065 in-situ storage Methods 0.000 title abstract 7
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- 230000008901 benefit Effects 0.000 abstract description 11
- 238000004519 manufacturing process Methods 0.000 abstract description 10
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Abstract
The invention discloses a wafer in-situ detection device, a water bracket with the wafer in-situ detection device and a method for carrying out wafer in-situ detection by using the wafer in-situ detection device. The wafer in-situ detection device comprises a pressure medium source, multiple detection holes, a pressure detector and a controller, wherein the pressure medium source is used for providing a medium with a predetermined pressure, each detection hole is connected with the pressure medium source through a pipeline, the multiple detection holes are connected in parallel, the pressure detector is arranged on the pipeline and is positioned between the pressure medium source and the multiple detection holes so as to detect the pressure in the pipelines, and the controller is connected with the pressure detector so as to judge whether a wafer is in place according to the pressure detection value of the pressure detector. The wafer in-situ detection device provided by the invention has the advantages of high reliability and accuracy, simple structure, low manufacturing cost and the like.
Description
Technical field
The present invention relates to technical field of semiconductors, in particular to a kind of wafer at level detecting apparatus, there is this wafer in the wafer bracket of level detecting apparatus and utilize this wafer to carry out the method for wafer detection in place at level detecting apparatus.
Background technology
In the production process of large scale integrated circuit, wafer is at various IC(integrated circuit) transmission between each station in equipment be equipment normally run basic.And whether wafer is present in certain station, it is the prerequisite ensureing that wafer can accurately transmit.At present, various IC equipment all relies on various manipulator to transmit wafer, and whether wafer is on a certain station, is all to rely on manipulator to judge, station itself does not have wafer measuring ability in place.
Summary of the invention
The present invention one of is intended to solve the problems of the technologies described above at least to a certain extent or at least provides a kind of useful business to select.For this reason, one object of the present invention is to propose a kind of wafer with advantages such as reliability is high, accuracy is high, structure is simple, low cost of manufactures at level detecting apparatus.
Another object of the present invention is that proposition is a kind of and utilizes described wafer to carry out the method for wafer detection in place at level detecting apparatus.
Another object of the present invention is that proposition is a kind of and has the wafer bracket of described wafer at level detecting apparatus.
To achieve these goals, embodiment according to a first aspect of the present invention proposes a kind of wafer at level detecting apparatus, and described wafer comprises at level detecting apparatus: pressure medium source, and described pressure medium source has the medium of predetermined pressure for providing; Multiple detect aperture, each described detect aperture is all connected with described pressure medium source by pipeline, and wherein said multiple detect aperture is in parallel; Pressure detector, described pressure detector to be located on described pipeline and to detect the pressure in described pipeline between described pressure medium source and described multiple detect aperture; And controller, described controller is connected with described pressure detector to judge that whether wafer is in place according to the detected pressure value of described pressure detector.
Wafer according to the embodiment of the present invention is used for by setting the described pressure medium source providing the medium with predetermined pressure (malleation) to multiple described detect aperture at level detecting apparatus, thus can prevent extraneous liquid and particle from entering in described pipeline and multiple described detect aperture in the process of carrying out wafer detection in place, do not have external factor thus to affect described pressure detector and detect the pressure in described pipeline, can detect that whether wafer is in place reliably, exactly like this.And because the liquid in the external world and particle can not enter in described pipeline and multiple described detect aperture, therefore described wafer does not need to arrange filter at level detecting apparatus.Therefore, at level detecting apparatus, there is the advantages such as reliability is high, accuracy is high, structure is simple, low cost of manufacture according to the wafer of the embodiment of the present invention.
In addition, following additional technical characteristic can also be had according to the wafer of the embodiment of the present invention at level detecting apparatus:
According to one embodiment of present invention, described medium is gas or liquid.
According to one embodiment of present invention, described wafer also comprises pressure-reducing valve at level detecting apparatus, and described pressure-reducing valve to be located on described pipeline and between described pressure medium source and described pressure detector.By arranging described pressure-reducing valve, the pressure of the medium in described pipeline can be decreased to predetermined pressure, described wafer can be made thus to detect more reliably, exactly at level detecting apparatus, and whether wafer is in place.
According to one embodiment of present invention, described pressure-reducing valve is malleation pressure-reducing valve.
According to one embodiment of present invention, described wafer also comprises electromagnetically operated valve at level detecting apparatus, and described electromagnetically operated valve is located on described pipeline.Described medium can be saved thus, reduce the operating cost of described wafer at level detecting apparatus.And, by arranging described electromagnetically operated valve, the automaticity of described wafer at level detecting apparatus can also be improved widely.
According to one embodiment of present invention, described wafer also comprises muffler at level detecting apparatus, the noise that described muffler is connected for reducing described electromagnetically operated valve with described electromagnetically operated valve.By arranging described muffler, the noise produced when described electromagnetically operated valve runs can be reduced widely, thus the operational environment of staff can be improved widely.
According to one embodiment of present invention, described electromagnetically operated valve is two-bit triplet electromagnetically operated valve.
According to one embodiment of present invention, described pressure detector is pressure sensor.
Embodiment according to a second aspect of the present invention proposes a kind of method utilizing wafer described according to a first aspect of the present invention to carry out wafer detection in place at level detecting apparatus, and described method comprises: A) utilize described pressure medium source to provide the medium with predetermined pressure to described multiple detect aperture; B) upper surface wafer being placed on the body of wafer bracket make described wafer block multiple detect aperture at least partially, described controller is utilized to read the detected pressure value P1 of described pressure detector, take described wafer subsequently away, on the upper surface that the outer end of wherein said multiple detect aperture is positioned at the body of described the wafer bracket at interval and outer of the upper surface of the body of contiguous described wafer bracket; And C) on the upper surface of the body of described wafer bracket, transmit wafer, and utilize described controller to read the detected pressure value P of described pressure detector, when P is more than or equal to P1, in place on the upper surface that described wafer is positioned at the body of described wafer bracket.
Wafer according to the utilization according to a first aspect of the present invention of the embodiment of the present invention carries out wafer detection in place method at level detecting apparatus provides the medium with predetermined pressure by utilizing described pressure medium source to multiple described detect aperture, thus can prevent extraneous liquid and particle from entering in described pipeline and multiple described detect aperture in the process of carrying out wafer detection in place, do not have external factor thus to affect described pressure detector and detect the pressure in described pipeline, can detect that whether wafer is in place reliably, exactly like this.Therefore, have according to the method for the wafer of embodiment of the present invention detection in place that reliability is high, accuracy advantages of higher.
Embodiment according to a third aspect of the present invention proposes a kind of wafer bracket for wafer exchange device, and described wafer bracket comprises: body, is provided with breather line in described body; With wafer at level detecting apparatus, described wafer is that described according to a first aspect of the present invention wafer is at level detecting apparatus at level detecting apparatus, on the upper surface that the outer end of wherein said multiple detect aperture is positioned at described the body at interval and outer of the upper surface of contiguous described body, the inner of described multiple detect aperture is communicated with described breather line, and described pipeline is communicated with described breather line and described pressure medium source is communicated with described multiple detect aperture with described breather line by described pipeline.
Pass through to arrange wafer described according to a first aspect of the present invention at level detecting apparatus according to the wafer bracket for wafer exchange device of the embodiment of the present invention, thus can detect that whether wafer is in place reliably, exactly.And, by arranging described breather line and making the inner of multiple described detect aperture be communicated with described breather line, thus can only need to arrange a described pipeline be communicated with described breather line.And do not need to arrange the described pipeline that many difference are communicated with multiple described detect aperture accordingly.Therefore, described wafer bracket has that structure is simple, the advantage of low cost of manufacture.
Additional aspect of the present invention and advantage will part provide in the following description, and part will become obvious from the following description, or be recognized by practice of the present invention.
Accompanying drawing explanation
Above-mentioned and/or additional aspect of the present invention and advantage will become obvious and easy understand from accompanying drawing below combining to the description of embodiment, wherein:
Fig. 1 is the structural representation of the wafer bracket for wafer exchange device according to the embodiment of the present invention;
Fig. 2 is the partial structurtes schematic diagram of the wafer bracket for wafer exchange device according to the embodiment of the present invention;
Fig. 3 is the vertical view of the wafer bracket for wafer exchange device according to the embodiment of the present invention;
Fig. 4 is the stereogram of the wafer bracket for wafer exchange device according to the embodiment of the present invention;
Fig. 5 is according to the wafer of the embodiment of the present invention structural representation at level detecting apparatus;
Fig. 6 is according to the wafer of the embodiment of the present invention application schematic diagram at level detecting apparatus;
Fig. 7 is the structural representation of the wafer exchange device according to the embodiment of the present invention; With
Fig. 8 is according to the wafer of the embodiment of the present invention flow chart at position detecting method.
Embodiment
Be described below in detail embodiments of the invention, the example of described embodiment is shown in the drawings, and wherein same or similar label represents same or similar element or has element that is identical or similar functions from start to finish.Be exemplary below by the embodiment be described with reference to the drawings, be intended to for explaining the present invention, and can not limitation of the present invention be interpreted as.
In describing the invention, it will be appreciated that, term " " center ", " longitudinal direction ", " transverse direction ", " length ", " width ", " thickness ", " on ", D score, " front ", " afterwards ", " left side ", " right side ", " vertically ", " level ", " top ", " end " " interior ", " outward ", " clockwise ", orientation or the position relationship of the instruction such as " counterclockwise " are based on orientation shown in the drawings or position relationship, only the present invention for convenience of description and simplified characterization, instead of indicate or imply that the device of indication or element must have specific orientation, with specific azimuth configuration and operation, therefore limitation of the present invention can not be interpreted as.
In addition, term " first ", " second " only for describing object, and can not be interpreted as instruction or hint relative importance or imply the quantity indicating indicated technical characteristic.Thus, be limited with " first ", the feature of " second " can express or impliedly comprise one or more these features.In describing the invention, the implication of " multiple " is two or more, unless otherwise expressly limited specifically.
In the present invention, unless otherwise clearly defined and limited, the term such as term " installation ", " being connected ", " connection ", " fixing " should be interpreted broadly, and such as, can be fixedly connected with, also can be removably connect, or connect integratedly; Can be mechanical connection, also can be electrical connection; Can be directly be connected, also indirectly can be connected by intermediary, can be the connection of two element internals.For the ordinary skill in the art, above-mentioned term concrete meaning in the present invention can be understood as the case may be.
In the present invention, unless otherwise clearly defined and limited, fisrt feature second feature it " on " or D score can comprise the first and second features and directly contact, also can comprise the first and second features and not be directly contact but by the other characterisation contact between them.And, fisrt feature second feature " on ", " top " and " above " comprise fisrt feature directly over second feature and oblique upper, or only represent that fisrt feature level height is higher than second feature.Fisrt feature second feature " under ", " below " and " below " comprise fisrt feature immediately below second feature and tiltedly below, or only represent that fisrt feature level height is less than second feature.
Describe according to the wafer of the embodiment of the present invention at level detecting apparatus 530 referring to Fig. 5.As shown in Figure 5, pressure medium source 532, multiple detect aperture 531, pressure detector 534 and controller (not shown) is comprised according to the wafer of the embodiment of the present invention at level detecting apparatus 530.
Pressure medium source 532 has the medium of predetermined pressure for providing.Each detect aperture 531 is all connected with pressure medium source 532 by pipeline 533, and wherein multiple detect aperture 531 is in parallel.Pressure detector 534 to be located on pipeline 533 and the pressure of pressure detector 534 between pressure medium source 532 and multiple detect aperture 531 so that in signal piping 533.Described controller is connected with pressure detector 534 to judge that whether wafer 20 is in place according to the detected pressure value of pressure detector 534.
Referring to Fig. 1-3 and Fig. 5, the wafer bracket 500 for wafer exchange device 10 according to the embodiment of the present invention is described.As illustrated in figures 1-3 and 5, body 510 and wafer is comprised at level detecting apparatus 530 according to the wafer bracket 500 for wafer exchange device 10 of the embodiment of the present invention.
Breather line 520 is provided with in body 510.The outer end 5312 of multiple detect aperture 531 is positioned on the upper surface 511 of body 510 at interval, and the outer of the upper surface 511 of outer end 5312 adjacent body 510 of multiple detect aperture 531, the inner 5311 of multiple detect aperture 531 is communicated with breather line 520.Pipeline 533 is communicated with breather line 520 and pressure medium source 532 is communicated with multiple detect aperture 531 with breather line 520 by pipeline 533.In other words, each detection pore 531 is communicated with pressure medium source 532, and each detection pore 531 is connected with pressure medium source 532, and multiple detection pore 531 is in parallel.Because breather line 520 and multiple detect aperture 531 are located in body 510, therefore breather line 520 and multiple detect aperture 531 can not leak described medium.
The method utilizing and carry out wafer detection in place according to the wafer of the embodiment of the present invention at level detecting apparatus 530 is described referring to Fig. 8.As shown in Figure 8, described method comprises:
A) pressure medium source 532 is utilized to provide the medium with predetermined pressure to multiple detect aperture 531;
B) wafer 20 is placed on the upper surface 511 of body 510 of wafer bracket 500, and make wafer 20 block multiple detect aperture 531 (namely block the outer end 5312 at least partially of multiple detect aperture 531) at least partially, described controller is utilized to read the detected pressure value P1 of pressure detector 534, take wafer 20 subsequently away, wherein the outer end of multiple detect aperture 531 be positioned at the body 510 of wafer bracket 500 at interval upper surface 511 on and the outer of the upper surface 511 of the body 510 of the outer end 5312 adjacent wafer bracket 500 of multiple detect aperture 531; With
C) on the upper surface 511 of the body 510 of wafer bracket 500, wafer 20 is transmitted, and utilize described controller to read the detected pressure value P of pressure detector 534, when P is more than or equal to P1, in place on the upper surface 511 that wafer 20 is positioned at the body 510 of wafer bracket 500.
Wherein, wafer 20 is in place refers to that wafer 20 is placed on the upper surface 511 of the body 510 of wafer bracket 500, and aligns with the outer of the upper surface 511 of the body 510 of wafer bracket 500 in the outer of wafer 20.
In other words, when utilizing wafer to carry out wafer detection in place at level detecting apparatus 530, pressure medium source 532 can be first utilized to provide the medium with predetermined pressure to multiple detect aperture 531.When multiple detect aperture 531 does not cover wafer 20, multiple detect aperture 531 is in open state, and described medium can be flowed away by multiple detect aperture 531, and the pressure of the described medium now in pipeline 533 is smaller.When on the upper surface 511 wafer 20 being placed on body 510 and when making wafer 20 block the outer end 5312 at least partially of multiple detect aperture 531, the pressure (i.e. detected pressure value P1) of the described medium in pipeline 533 can raise.The outer of the upper surface 511 of outer end 5312 adjacent body 510 of multiple detect aperture 531, therefore when wafer 20 blocks the outer end 5312 of multiple detect aperture 531, can think to align with the outer of the upper surface 511 of body 510 in the outer of wafer 20, namely wafer 20 is in place.
If in place on the upper surface 511 that wafer 20 is positioned at body 510, wafer 20 will block the outer end 5312 of multiple detect aperture 531.Like this after transmit wafer 20 on the upper surface 511 of body 510, if when the detected pressure value P of pressure detector 534 is more than or equal to detected pressure value P1, just can detect that wafer 20 is in place.That is, the pressure of what pressure detector 534 detected is medium in pipeline 533.
Wafer according to the embodiment of the present invention is used for by setting the pressure medium source 532 providing the medium with predetermined pressure (malleation) to multiple detect aperture 531 at level detecting apparatus 530, thus can prevent extraneous liquid and particle from entering in pipeline 533 and multiple detect aperture 531 in the process of carrying out wafer detection in place, the pressure that not having external factor thus affects in pressure detector 534 pairs of pipelines 533 detects, and can detect that whether wafer 20 is in place so reliably, exactly.And because the liquid in the external world and particle can not enter in pipeline 533 and multiple detect aperture 531, therefore wafer does not need to arrange filter at level detecting apparatus 530.Therefore, at level detecting apparatus 530, there is the advantages such as reliability is high, accuracy is high, structure is simple, low cost of manufacture according to the wafer of the embodiment of the present invention.
The method utilizing wafer to carry out wafer detection in place at level detecting apparatus 530 according to the embodiment of the present invention provides the medium with predetermined pressure by utilizing pressure medium source 532 to multiple detect aperture 531, thus can prevent extraneous liquid and particle from entering in pipeline 533 and multiple detect aperture 531 in the process of carrying out wafer detection in place, the pressure that not having external factor thus affects in pressure detector 534 pairs of pipelines 533 detects, and can detect that whether wafer 20 is in place so reliably, exactly.Therefore, have according to the method for the wafer of embodiment of the present invention detection in place that reliability is high, accuracy advantages of higher.
According to the wafer bracket 500 for wafer exchange device 10 of the embodiment of the present invention by arranging wafer at level detecting apparatus 530, thus can detect that whether wafer 20 is in place reliably, exactly.And, by arranging breather line 520 and making the inner 5311 of multiple detect aperture 531 be communicated with breather line 520, thus can only need to arrange a pipeline 533 be communicated with breather line 520.And do not need to arrange the pipeline 533 that many difference are communicated with multiple detect aperture 531 accordingly.Therefore, wafer bracket 500 has that structure is simple, the advantage of low cost of manufacture.
Particularly, described medium can be gas or liquid.Pressure medium source 532 can be the container storing Compressed Gas.Pressure medium source 532 can be also the container storing liquid, and utilizes pump to provide liquid (such as water) to multiple detect aperture 531.
As shown in Figure 5, in some embodiments of the invention, wafer can also comprise pressure-reducing valve 535 at level detecting apparatus 530, and pressure-reducing valve 535 can be located on pipeline 533 and pressure-reducing valve 535 can between pressure medium source 532 and pressure detector 534.By arranging pressure-reducing valve 535, the pressure of the medium in pipeline 533 can be decreased to predetermined pressure, wafer can be made thus to detect that whether wafer 20 is in place more reliably, exactly at level detecting apparatus 530.Advantageously, pressure-reducing valve 535 can be malleation pressure-reducing valve.
In examples more of the present invention, as shown in Figure 5, wafer can also comprise electromagnetically operated valve 536 at level detecting apparatus 530, and electromagnetically operated valve 536 can be located on pipeline 533.By arranging electromagnetically operated valve 536 on pipeline 533, thus can control piper 533 connected sum disconnect.Specifically, when utilizing wafer to carry out wafer detection in place at level detecting apparatus 530, electromagnetically operated valve 536 can be opened so that connecting pipeline 533.When not needing to carry out wafer detection in place, can shut electromagnetic valve 536 to disconnect pipeline 533.Described medium can be saved thus, reduce the operating cost of wafer at level detecting apparatus 530.And, by arranging electromagnetically operated valve 536, the automaticity of wafer at level detecting apparatus 530 can also be improved widely.Particularly, electromagnetically operated valve 536 can between pressure medium source 532 and multiple detect aperture 531.
As shown in Figure 5, in an example of the present invention, wafer can also comprise muffler 537 at level detecting apparatus 530, the noise that muffler 537 can be connected for reducing electromagnetically operated valve 536 with electromagnetically operated valve 536.By arranging muffler 537, the noise produced when electromagnetically operated valve 536 runs can be reduced widely, thus the operational environment of staff can be improved widely.Advantageously, muffler 537 can be micropunch muffler.Advantageously, electromagnetically operated valve 536 can be two-bit triplet electromagnetically operated valve.Pressure detector 534 can be pressure sensor.
As shown in Figure 3 and Figure 4, in some embodiments of the invention, body 510 can comprise central part 512, multiple arc sections 513 and multiple linking arm 515.
Multiple arc sections 513 can be arranged around central part 512 at interval, and the outer of the upper surface 514 of multiple arc sections 513 can be positioned at circumferentially same, the diameter of wherein said circumference can with the equal diameters of wafer 20.In other words, when on the upper surface 511 that wafer 20 is placed on body 510, can align with the outer of the upper surface 514 of multiple arc sections 513 in the outer of wafer 20, namely can align with the outer of the upper surface 511 of body 510 in the outer of wafer 20.Each linking arm 515 can extend along the radial direction of described circumference, and wherein the first end of multiple linking arm 515 can be distinguished and is connected with multiple arc sections 513 accordingly, and the second end of each linking arm 515 can be connected with central part 512.That is, the quantity of linking arm 515 can be equal with the quantity of arc sections 513, and the first end of a linking arm 515 can be connected with an arc sections 513.
Particularly, arc sections 513 can be three and linking arm 515 also can be three, wherein the outer of the upper surface 514 of three arc sections 513 can equally spaced be distributed in described in circumferentially.The center of circle of described circumference can with the direction of arrow of the center of the upper surface 516 of central part 512 in above-below direction A(Fig. 1) on overlap.Multiple detect aperture 531 can equally spaced be distributed on the upper surface 511 of body 510.The quantity of detect aperture 531 can be equal with the quantity of arc sections 513, and a detect aperture 531 can be located on the upper surface 514 of an arc sections 513.Particularly, detect aperture 531 can be three.
As depicted in figs. 1 and 2, in examples more of the present invention, breather line 520 can be multiple, in other words the inner 521 of multiple breather line 520 can intersect at central part 512(, the inner 521 of multiple breather line 520 can communicate with each other), each breather line 520 can extend along the radial direction of described circumference, and wherein the inner 5311 of multiple detect aperture 531 can be communicated with multiple breather line 520 respectively accordingly.In other words, the quantity of detect aperture 531 can be equal with the quantity of breather line 520, and the inner 5311 of a detect aperture 531 can be communicated with a breather line 520.By arranging multiple breather line 520 communicated with each other, the inner 5311 of multiple detect aperture 531 can be made to be communicated with breather line 520 more easily, thus the manufacture difficulty of wafer bracket 500 can be reduced widely.
In an example of the present invention, as depicted in figs. 1 and 2, wafer bracket 500 can also comprise multiple closeouts 540.Wherein, through multiple arc sections 513 accordingly can be distinguished in the outer end 522 of multiple breather line 520.In other words, the quantity of breather line 520 can be equal with the quantity of arc sections 513, and the outer end 522 of a breather line 520 can a through arc sections 513.The outer end 522 that multiple closeouts 540 can be located at multiple breather line 520 respectively is accordingly interior so that the multiple breather line 520 of shutoff.That is, the quantity of closeouts 540 can be equal with the quantity of breather line 520, and closeouts 540 can be located at a breather line 520 outer end 522 in so that this breather line 520 of shutoff.
By arranging the breather line 520 of through arc sections 513, thus breather line 520 can be formed more easily in body 510, namely can reduce the manufacture difficulty of wafer bracket 500 widely.By arranging multiple closeouts 540, the outer end 522 of multiple breather line 520 can be blocked, thus extraneous air can be avoided to enter in multiple breather line 520 from the outer end 522 of multiple breather line 520, and and then enter in pipeline 533, cause the accuracy of wafer on-position measure to decline widely.
Particularly, the outer end 522 of multiple breather line 520 can be formed with internal thread, and multiple closeouts 540 can be formed with external screw thread, multiple closeouts 540 can distinguish accordingly threaded engagement in the outer end 522 of multiple breather line 520.Advantageously, each closeouts 540 can be provided with circumferential recess, can accommodate sealing ring in described circumferential recess, and closeouts 540 can be made like this to block the outer end 522 of multiple breather line 520 better.
As shown in Figure 1 and Figure 4, in some embodiments of the invention, wafer bracket 500 can also comprise connector 550, and central part 512 can be provided with accommodation hole, connector 550 can be located in described accommodation hole hermetically, wherein connector 550 can be provided with the first circumferential recess 551, and the inner 521 of multiple breather line 520 can be communicated with the first circumferential recess 551.By being provided with the connector 550 of the first circumferential recess 551, and the inner 521 of multiple breather line 520 is communicated with the first circumferential recess 551, thus the inner 521 of multiple breather line 520 can be made to be communicated with each other by the first circumferential recess 551.Compared with intersecting at central part 512 with the inner 521 of multiple breather line 520, by arranging connector 550, the inner 521 of multiple breather line 520 can be made to communicate with each other more easily, thus the manufacture difficulty of wafer bracket 500 can be reduced widely.
Because the upper surface of wafer bracket 500 is for placing wafer 20, therefore described accommodation hole can be located on the lower surface of wafer bracket 500.Advantageously, connector 550 can also be provided with the second circumferential recess, described second circumferential recess can be positioned at the below of the first circumferential recess 551, and described second circumferential recess can be spaced apart with the first circumferential recess 551, can accommodate sealing ring 560 in wherein said second circumferential recess.By arranging described second circumferential recess in the below of the first circumferential recess 551 and arrange sealing ring 560 in described second circumferential recess, thus extraneous air can be avoided to enter in multiple breather line 520 from the first circumferential recess 551, and and then enter in pipeline 533, cause the accuracy of wafer on-position measure to decline widely.Connector 550 can also be provided with the 3rd circumferential recess, described 3rd circumferential recess can be positioned at the top of the first circumferential recess 551, and described 3rd circumferential recess can be spaced apart with the first circumferential recess 551, in wherein said 3rd circumferential recess, sealing ring 560 can be accommodated.
As shown in Figure 1, in some embodiments of the invention, wafer bracket 500 can also comprise hydraulic quick coupler 570, and wherein the first end of hydraulic quick coupler 570 can be communicated with breather line 520, and the second end of hydraulic quick coupler 570 can be communicated with pipeline 533.In other words, pipeline 533 can be communicated with breather line 520 by hydraulic quick coupler 570.When breather line 520 is multiple, the first end of hydraulic quick coupler 570 can be communicated with any one in multiple breather line 520.By arranging hydraulic quick coupler 570, pipeline 533 can be made to be communicated with breather line 520 more easily, rapidly.Like this, multiple detect aperture 531, (multiple) breather line 520, hydraulic quick coupler 570 can be communicated with pipeline 533.
Wafer according to the embodiment of the present invention may be used for any one known wafer bracket at level detecting apparatus 530.Such as, as shown in Figure 6, multiple detect aperture 531 can be located in wafer bracket 500 ', and multiple detect aperture 531 can be communicated with pipeline 533 by hydraulic quick coupler 570.Such pipeline 533 can comprise first paragraph and multiple second segment, wherein said multiple second segment can be communicated with multiple detect aperture 531 by multiple hydraulic quick coupler 570 respectively accordingly, and namely a described second segment can be communicated with a detect aperture 531 by a hydraulic quick coupler 570.Each described second segment can also be communicated with described first paragraph, and described first paragraph can be communicated with pressure medium source 532, thus realize each detect aperture 531 and be communicated with pressure medium source 532, each detect aperture 531 is connected with pressure medium source 532, and multiple detect aperture 531 is in parallel.
Present invention also offers a kind of wafer exchange device.Referring to Fig. 7, the wafer exchange device 10 according to the embodiment of the present invention is described.As shown in Figure 7, pedestal 100, lifting frame 200, first lifter 300, contraposition ring 400, wafer bracket and the second lifter 600 is comprised according to the wafer exchange device 10 of the embodiment of the present invention.
First lifter 300 is arranged on pedestal 100, and the first lifter 300 is connected to be elevated lifting frame 200 with lifting frame 200.Contraposition ring 400 is arranged on the top of lifting frame 200.Described wafer bracket is located at the top of contraposition ring 400, and wherein said wafer bracket is the wafer bracket 500 according to above-described embodiment.Second lifter 600 is arranged on contraposition ring 400, and the second lifter 600 is connected to be elevated wafer bracket 500 with wafer bracket 500.
According to the wafer exchange device 10 of the embodiment of the present invention by arranging wafer bracket 500, thus can accurately judge that whether wafer 20 is in place according to the detected pressure value of pressure detector 534.
Wafer according to the embodiment of the present invention has the advantages such as reliability is high, accuracy is high, structure is simple, low cost of manufacture at level detecting apparatus 530.
In the description of this specification, specific features, structure, material or feature that the description of reference term " embodiment ", " some embodiments ", " example ", " concrete example " or " some examples " etc. means to describe in conjunction with this embodiment or example are contained at least one embodiment of the present invention or example.In this manual, identical embodiment or example are not necessarily referred to the schematic representation of above-mentioned term.And the specific features of description, structure, material or feature can combine in an appropriate manner in any one or more embodiment or example.
Although illustrate and describe embodiments of the invention above, be understandable that, above-described embodiment is exemplary, can not be interpreted as limitation of the present invention, those of ordinary skill in the art can change above-described embodiment within the scope of the invention when not departing from principle of the present invention and aim, revising, replacing and modification.
Claims (9)
1. wafer is at a level detecting apparatus, it is characterized in that, comprising:
Pressure medium source, described pressure medium source has the medium of predetermined normal pressure for providing, described medium is liquid;
Multiple detect aperture, each described detect aperture is all connected with described pressure medium source by pipeline, and wherein said multiple detect aperture is in parallel;
Pressure detector, described pressure detector to be located on described pipeline and to detect the pressure in described pipeline between described pressure medium source and described multiple detect aperture; With
Controller, described controller is connected with described pressure detector to judge that whether wafer is in place according to the detected pressure value of described pressure detector.
2. wafer according to claim 1 is at level detecting apparatus, it is characterized in that, also comprises pressure-reducing valve, and described pressure-reducing valve to be located on described pipeline and between described pressure medium source and described pressure detector.
3. wafer according to claim 2 is at level detecting apparatus, it is characterized in that, described pressure-reducing valve is malleation pressure-reducing valve.
4. wafer according to claim 1 is at level detecting apparatus, it is characterized in that, also comprises electromagnetically operated valve, and described electromagnetically operated valve is located on described pipeline.
5. wafer according to claim 4 is at level detecting apparatus, it is characterized in that, also comprises muffler, the noise that described muffler is connected for reducing described electromagnetically operated valve with described electromagnetically operated valve.
6. wafer according to claim 5 is at level detecting apparatus, it is characterized in that, described electromagnetically operated valve is two-bit triplet electromagnetically operated valve.
7. wafer according to claim 1 is at level detecting apparatus, it is characterized in that, described pressure detector is pressure sensor.
8. utilize the wafer according to any one of claim 1-7 to carry out a method for wafer detection in place at level detecting apparatus, it is characterized in that, comprising:
A) described pressure medium source is utilized to provide the medium with predetermined pressure to described multiple detect aperture;
B) upper surface wafer being placed on the body of wafer bracket make described wafer block multiple detect aperture at least partially, described controller is utilized to read the detected pressure value P1 of described pressure detector, take described wafer subsequently away, on the upper surface that the outer end of wherein said multiple detect aperture is positioned at the body of described the wafer bracket at interval and outer of the upper surface of the body of contiguous described wafer bracket; With
C) on the upper surface of the body of described wafer bracket, transmit wafer, and utilize described controller to read the detected pressure value P of described pressure detector, when P is more than or equal to P1, in place on the upper surface that described wafer is positioned at the body of described wafer bracket.
9. for a wafer bracket for wafer exchange device, it is characterized in that, comprising:
Body, is provided with breather line in described body; With
Wafer is at level detecting apparatus, described wafer at level detecting apparatus for the wafer according to any one of claim 1-7 is at level detecting apparatus, on the upper surface that the outer end of wherein said multiple detect aperture is positioned at described the body at interval and outer of the upper surface of contiguous described body, the inner of described multiple detect aperture is communicated with described breather line, and described pipeline is communicated with described breather line and described pressure medium source is communicated with described multiple detect aperture with described breather line by described pipeline.
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| CN107546145B (en) * | 2017-08-18 | 2020-12-29 | 清华大学 | Wafer in-situ detection device, wafer bracket and wafer in-situ detection method |
| CN114905408A (en) * | 2022-05-09 | 2022-08-16 | 北京烁科精微电子装备有限公司 | Wafer temporary storage device and chemical mechanical polishing equipment |
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| CN201259887Y (en) * | 2008-08-21 | 2009-06-17 | 中国电子科技集团公司第四十五研究所 | Detection device for chip loss |
| CN101545764A (en) * | 2009-04-22 | 2009-09-30 | 大连现代辅机开发制造有限公司 | Method and device for workpiece seating checking |
| CN102496587A (en) * | 2011-11-25 | 2012-06-13 | 清华大学 | Wafer in-situ detecting device and wafer in-situ detecting method |
| CN102496595A (en) * | 2011-11-25 | 2012-06-13 | 清华大学 | Wafer bracket, wafer exchange device and wafer on-site detection method |
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| JP2003315196A (en) * | 2002-04-25 | 2003-11-06 | Denso Corp | Manufacturing method of pressure sensor, and measuring device for use in the manufacturing method |
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| CN201259887Y (en) * | 2008-08-21 | 2009-06-17 | 中国电子科技集团公司第四十五研究所 | Detection device for chip loss |
| CN101545764A (en) * | 2009-04-22 | 2009-09-30 | 大连现代辅机开发制造有限公司 | Method and device for workpiece seating checking |
| CN102496587A (en) * | 2011-11-25 | 2012-06-13 | 清华大学 | Wafer in-situ detecting device and wafer in-situ detecting method |
| CN102496595A (en) * | 2011-11-25 | 2012-06-13 | 清华大学 | Wafer bracket, wafer exchange device and wafer on-site detection method |
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