CN102930266A - Method for locating Mark points on PCB (printed circuit board) by utilizing outline gravity center method - Google Patents
Method for locating Mark points on PCB (printed circuit board) by utilizing outline gravity center method Download PDFInfo
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- CN102930266A CN102930266A CN2012103691873A CN201210369187A CN102930266A CN 102930266 A CN102930266 A CN 102930266A CN 2012103691873 A CN2012103691873 A CN 2012103691873A CN 201210369187 A CN201210369187 A CN 201210369187A CN 102930266 A CN102930266 A CN 102930266A
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Abstract
The invention discloses a method for locating Mark points on a PCB (printed circuit board) by utilizing an outline gravity center method. The method is characterized by comprising the following steps: on the basis of taking a Mark point extracted in initial programming as a datum point, taking the outline gravity center of the Mark point of the board to be detected, comparing the outline gravity center of the Mark point with the gravity center of the datum point, and performing PCB compensation by virtue of offset between the two gravity centers. The method is used for performing the PCB compensation by extracting the outline gravity center of the Mark point on the PCB and utilizing the offset between the gravity centers of the datum Mark point and the Mark point to be detected. The gravity centers are obtained by binary images and are easy and feasible to obtain. The algorithm is independent from the shapes of the Mark points, is not influenced by the intensity of illumination, achieves sub-pixel-level precision, and is high in compensation precision.
Description
Technical field
The present invention relates to PCB welding field of visual inspection, particularly about a kind of method of ordering with profile gravity model appoach location pcb board Mark, so that in the location, when proofreading and correct pcb board, can effectively improve compensation precision.
Background technology
Along with the development of computer digital image treatment technology and Dynamic Non-Destruction Measurement, detect with recognition technology day by day towards intellectuality, high reliability, high-speed automated online detection future development now.Computer vision technique and reliability engineering are two large technical foundation of modern measure.Machine vision in the industrial detection field by the application of success, wherein namely comprised the automatic detection to PCB (printed circuit board), realization is to the automatic location of circuit board and the correction of benchmark, aborning accurate arrangement components and parts there is important effect, this is because when the components and parts of welding on the pcb board, owing to put pcb board at every turn, the position of plate is offset easily, so just can not weld standard during solder pad.Can to weld standard when welding in order making, must to take certain measure that pcb board is accurately located.
In the pcb board design phase, the deviser can make the mark point usually as positioning datum, and accurately position relationship has been arranged, and just can carry out the basis for follow-up effective detection.The Mark point of PCB is that PCB is applied to location recognition point on the automatic placement machine in the board design, also is gauge point or unique point.
The ultimate principle of vision-based detection pcb board is: after image is processed, judge the position of sign according to the statistics of pixel, then identification point and the standard setting point that detects compared, if find error then compensated the bearing accuracy of raising pcb board.
The existing image processing method that pcb board is detected automatically is the images match method.But this method can only the processed pixels level other, can not process sub-pixel other.And the method is subjected to the impact of ambient light photograph, when external light source changes greatly, and the situation that the method can occur reporting by mistake.
Summary of the invention
For the problems referred to above, the purpose of this invention is to provide a kind of method of ordering with profile gravity model appoach location pcb board Mark.Use the method can improve the positional accuracy of pcb board, improve welding precision.
For achieving the above object, the present invention takes following technical scheme: a kind of method of ordering with profile gravity model appoach location pcb board Mark, feature is: take the Mark point that extracts when the initial programming as reference point, Mark point contouring center of gravity with drafting board to be checked, compare with the reference point center of gravity, utilize the skew between the center of gravity to carry out the pcb board compensation.
Get the Mark dot profile center of gravity of drafting board to be checked, and the concrete grammar that compares, compensates with benchmark Mark point is as follows:
1) take lower pcb board to be detected with camera and contain the image that Mark is ordered, be presented on the computer display screen, the sectional drawing control that then carries with tin soldering robot intercepts in current visual field and contains the area image that Mark is ordered;
2) tin soldering robot carries out binary conversion treatment to the Mark point area image of intercepting, obtains binary image;
3) binary image is extracted the real profile that Mark is ordered;
4) real profile of extracting is asked center of gravity;
5) according to 1)～4) step, extracting in addition, at least one detects the center of gravity of Mark dot profile:
6) extract and to have got well all and detect after Mark dot profile centers of gravity, the center of gravity that benchmark Mark order and detect the profile center of gravity that Mark order and compare is utilized the side-play amount that compares to carry out pcb board and is compensated.
Step 2) image binaryzation described in is processed, gray-scale value with the pixel on the image only is set to 0 or 255 exactly, a Gray-scale value is set in the tin soldering robot software for calculation, when the gray-scale value of pixel in the Mark dot image of intercepting during more than or equal to Gray-scale value, these pixels are judged as Mark point pixel, and its gray-scale value represents with 255; When the gray-scale value of pixel in the Mark dot image of intercepting during less than Gray-scale value, these pixels are judged as Mark point pixel in addition, and gray-scale value represents with 0.
Step 3) described in binary image is extracted the real profile that Mark is ordered, the method of extracting has: according to the sum of pixel in the Mark point zone, obtain the area of profile, obtain the radius of profile according to area,, girth, rectangular degree, circularity, excentricity, breadth length ratio, characterize profile with these.
The real profile of step 4) Mark being ordered asks the method for center of gravity to be: the X that has a few, the Y coordinate of profile are added up respectively and averaged, and the average coordinates value is center of gravity.
Step 6) utilizes the center of gravity that benchmark Mark orders in and detect skew between the center of gravity that Mark order and carry out the method for pcb board compensation and be: the position (can get a plurality of somes comparisons) of ordering according to the Mark of the Mark point of benchmark and detection, obtain horizontal vertical skew and the anglec of rotation take benchmark Mark point as reference point, and obtain the rotation offset of pcb board according to this anglec of rotation, and then except carrying out to be rotated compensation to pcb board level, the vertical shift compensation to pcb board.
The present invention is owing to take above technical scheme, and it has the following advantages:
1, this method is by extracting the profile center of gravity that Mark is ordered on the pcb board, utilizing the skew between benchmark Mark point and the detection Mark point center of gravity to carry out the pcb board compensation.The shape that algorithm is ordered with Mark is irrelevant, and be not subjected to the impact of illumination power, precision is in the sub-pix rank, compensation precision is higher, just the precision of compensation has relation with the industrial camera that uses, when the pixel dimension of camera more hour, the precision of compensation is higher, when the pixel dimension of camera was larger, the precision of compensation was lower.
2, in this method, intercept two even a plurality of Mark point calculating center of gravity separately, then compare with benchmark Mark point, a plurality of points can calculate the anglec of rotation of pcb board accurately, thereby can accurately compensate.If only demand one, can only determine the side-play amount of " X-axis " horizontal direction and " Y-axis " vertical direction.
3, the advantage of binaryzation is to obtain clearly image outline, so this method utilizes the binaryzation method that truncated picture is processed, utilizes to obtain the center of gravity that profile extracts this profile; Ask the method for center of gravity also fairly simple, the institute with profile adds up a little and is averaging coordinate figure exactly.
4, in the binary conversion treatment result, the parameter that can characterize real profile has: the rectangular degree of the area of profile, the girth of profile, profile, the circularity of profile, the excentricity of profile and the breadth length ratio of profile, can find the profile of really wanting by these conditions.
Skew when welding after compensating, can not occur and weld inaccurate in the pcb board that 5, compensates by centre-of gravity shift because of the position of pcb board.
Description of drawings
Fig. 1 is the image (gray-scale map) with camera intercepting Mark point region;
Fig. 2 is the image (artwork master) after the binary conversion treatment.
Embodiment
Below in conjunction with accompanying drawing the present invention program is described in detail.
The present invention adopts profile gravity model appoach location pcb board, so-called profile gravity model appoach is exactly to take the lead in extracting the profile center of gravity that drafting board Mark to be checked is ordered, and utilizes the skew between benchmark Mark point (benchmark Mark point refers to the Mark point that we extract in programming) and the detection Mark point center of gravity to carry out the pcb board compensation.Concrete operation step is as follows:
1, takes the lower PCB image that Mark is ordered that contains with camera, be presented on the computer display screen and (be called the FOV visual field, FOV refers to the current captured actual area of camera), then the sectional drawing control that carries with tin soldering robot intercepts in current visual field and contains the area image that Mark is ordered, as shown in Figure 1.
2, tin soldering robot carries out binary conversion treatment to the Mark point area image of intercepting, obtains binary image, i.e. black and white design sketch, as shown in Figure 2.
Image binaryzation is processed, gray-scale value with the pixel on the image only is set to 0 or 255 exactly, a Gray-scale value is set in the software for calculation that tin soldering robot carries, when the gray-scale value of pixel in the Mark dot image of intercepting during more than or equal to Gray-scale value, these pixels are judged as and belong to certain objects, its gray-scale value represents with 255, is about to these pixels and is set to white; When the gray-scale value of pixel in the Mark dot image of intercepting during less than Gray-scale value, these pixels are excluded beyond object area, and gray-scale value is 0, is about to these pixels and is set to black, the object area of expression background or exception.
3, binary image is extracted the real profile that Mark is ordered.The real profile of extracting refers to: that annulus of white pixel point and black pixel point intersection among Fig. 2.
In the binary conversion treatment result, the parameter that can characterize real profile comprises: the rectangular degree of the area of profile, the girth of profile, profile, the circularity of profile, the excentricity of profile and the breadth length ratio of profile, find us really to want the profile that finds by these conditions.Annotate: in the figure of binary conversion treatment, the zone of white pixel point is Mark point zone, and the zone of black pixel point is non-Mark point zone.According to the sum of pixel in the Mark point zone, can obtain the area of profile.Obtain after the area of profile, just can obtain the radius of profile, known that radius just can obtain the circularity of the rectangular degree of the girth of profile, profile, profile, the excentricity of profile and the breadth length ratio of profile.
4, according to user's request, select above-mentioned a certain profile characteristic manner, as: select the area of profile, the area by profile filters out some unwanted profiles, thereby can realize extracting interested profile, and extracts the center of gravity of this profile.
Ask the method for center of gravity to be to the real profile that Mark is ordered: the institute of profile is added up a little and is averaging coordinate figure, and the average coordinates value is center of gravity.
5, according to the step of 1-4, obtain the center of gravity of another one Mark dot profile and (ask the benefit of the profile center of gravity that two Mark order to be: can compensate the rotation of pcb board; If only demand a Mark point, can only determine the side-play amount of " X-axis " horizontal direction and " Y-axis " vertical direction.That is to say that to ask a Mark point good, but can affect compensation precision that cause welding inaccurate, institute is in the hope of two Mark points).
6, extract and to have got well after the center of gravity, utilize the center of gravity that benchmark Mark order and detect skew between the center of gravity that Mark orders and carry out pcb board and compensate.
The method of compensation is: the position of ordering according to the Mark of the Mark point of two benchmark and two detections (or a plurality of Mark point also can), obtain horizontal vertical skew and the anglec of rotation take benchmark Mark point as reference point, and obtain the rotation offset of pcb board according to this anglec of rotation, and then except carrying out to be rotated compensation to pcb board level, the vertical shift compensation to pcb board.
Emphasis of the present invention is the mark point that finds drafting board to be checked, then compares with benchmark mark point, calculates relatively afterwards side-play amount.The shape that algorithm is ordered with Mark is irrelevant, and precision is in the sub-pix rank, and compensation precision is higher.Just the precision of compensation has relation with the industrial camera that uses, when the pixel dimension of camera more hour, the precision of compensation is higher, when the pixel dimension of camera was larger, the precision of compensation was lower.
Claims (6)
1. method of ordering with profile gravity model appoach location pcb board Mark, it is characterized in that: be as reference point take the Mark point that extracts when the initial programming, with the Mark point contouring center of gravity of drafting board to be checked, compare with the reference point center of gravity, utilize the skew between the center of gravity to carry out the pcb board compensation.
2. the profile gravity model appoach of using according to claim 1 is located the method that pcb board Mark is ordered, and it is characterized in that: get the Mark dot profile center of gravity of drafting board to be checked, and the concrete grammar that compares, compensates with benchmark Mark point is as follows:
1) take lower pcb board to be detected with camera and contain the image that Mark is ordered, be presented on the computer display screen, the sectional drawing control that then carries with tin soldering robot intercepts in current visual field and contains the area image that Mark is ordered;
2) tin soldering robot carries out binary conversion treatment to the Mark point area image of intercepting, obtains binary image;
3) binary image is extracted the real profile that Mark is ordered;
4) real profile of extracting is asked center of gravity;
5) according to 1)～4) step, extracting in addition, at least one detects the center of gravity of Mark dot profile;
6) extract and to have got well all and detect after Mark dot profile centers of gravity, the center of gravity that benchmark Mark order and detect the profile center of gravity that Mark order and compare is utilized the side-play amount that compares to carry out pcb board and is compensated.
3. the profile gravity model appoach of using according to claim 2 is located the method that pcb board Mark is ordered, it is characterized in that: step 2) described in image binaryzation process, gray-scale value with the pixel on the image only is set to 0 or 255 exactly, a Gray-scale value is set in the tin soldering robot software for calculation, when the gray-scale value of pixel in the Mark dot image of intercepting during more than or equal to Gray-scale value, these pixels are judged as Mark point pixel, and its gray-scale value represents with 255; When the gray-scale value of pixel in the Mark dot image of intercepting during less than Gray-scale value, these pixels are judged as Mark point pixel in addition, and gray-scale value represents with 0.
4. the profile gravity model appoach of using according to claim 2 is located the method that pcb board Mark is ordered, it is characterized in that: step 3) described in binary image is extracted the real profile that Mark is ordered, the method of extracting has: according to the sum of pixel in the Mark point zone, obtain the area of profile, obtain the radius of profile according to area,, girth, rectangular degree, circularity, excentricity, breadth length ratio, characterize profile with these.
5. the profile gravity model appoach of using according to claim 2 is located the method that pcb board Mark is ordered, it is characterized in that: step 4) in real profile that Mark is ordered ask the method for center of gravity to be: the institute of profile is added up a little is averaging coordinate figure, and the average coordinates value is center of gravity.
6. the profile gravity model appoach of using according to claim 2 is located the method that pcb board Mark is ordered, it is characterized in that: step 6) in utilize the center of gravity that benchmark Mark orders and detect skew between the center of gravity that Mark order and carry out the method for pcb board compensation and be: the position of ordering according at least one benchmark Mark point and at least one detection Mark, obtain horizontal vertical skew and the anglec of rotation take benchmark Mark point as reference point, and obtain the rotation offset of pcb board according to this anglec of rotation, and then except carrying out level to pcb board, outside the vertical shift compensation, can also be rotated compensation to pcb board.
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| CN104732207A (en) * | 2015-03-12 | 2015-06-24 | 广东工业大学 | High-precision and high anti-interference positioning method and device for Mark point of PCB |
| CN105427278A (en) * | 2015-10-29 | 2016-03-23 | 广州视源电子科技股份有限公司 | PCB positioning point determining method and system |
| CN105466951A (en) * | 2014-09-12 | 2016-04-06 | 江苏明富自动化科技股份有限公司 | Automatic optical detection apparatus and detection method thereof |
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| CN107578431A (en) * | 2017-07-31 | 2018-01-12 | 深圳市海思科自动化技术有限公司 | A kind of Mark points visual identity method |
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