CN102917303A - Microphone packaged by plastic casing - Google Patents
Microphone packaged by plastic casing Download PDFInfo
- Publication number
- CN102917303A CN102917303A CN2012104244951A CN201210424495A CN102917303A CN 102917303 A CN102917303 A CN 102917303A CN 2012104244951 A CN2012104244951 A CN 2012104244951A CN 201210424495 A CN201210424495 A CN 201210424495A CN 102917303 A CN102917303 A CN 102917303A
- Authority
- CN
- China
- Prior art keywords
- terminal
- plastic housing
- pcb board
- microphone
- chip
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims abstract description 31
- 229910052802 copper Inorganic materials 0.000 claims abstract description 31
- 239000010949 copper Substances 0.000 claims abstract description 31
- 229910000679 solder Inorganic materials 0.000 claims description 16
- 241000218202 Coptis Species 0.000 claims description 12
- 235000002991 Coptis groenlandica Nutrition 0.000 claims description 12
- 238000000465 moulding Methods 0.000 claims description 9
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 claims description 6
- MSNOMDLPLDYDME-UHFFFAOYSA-N gold nickel Chemical compound [Ni].[Au] MSNOMDLPLDYDME-UHFFFAOYSA-N 0.000 claims description 6
- 238000005192 partition Methods 0.000 claims description 5
- 238000007747 plating Methods 0.000 claims description 4
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 claims description 3
- 238000002955 isolation Methods 0.000 claims description 3
- 229910052759 nickel Inorganic materials 0.000 claims description 3
- 239000000741 silica gel Substances 0.000 claims description 3
- 229910002027 silica gel Inorganic materials 0.000 claims description 3
- 238000005516 engineering process Methods 0.000 abstract description 3
- 238000003466 welding Methods 0.000 abstract description 3
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 abstract 2
- 230000004907 flux Effects 0.000 abstract 1
- 238000005538 encapsulation Methods 0.000 description 8
- 238000000034 method Methods 0.000 description 7
- 238000004891 communication Methods 0.000 description 4
- 238000004806 packaging method and process Methods 0.000 description 4
- 239000002184 metal Substances 0.000 description 3
- 229910052751 metal Inorganic materials 0.000 description 3
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 description 2
- 238000010009 beating Methods 0.000 description 2
- 238000010586 diagram Methods 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 238000004519 manufacturing process Methods 0.000 description 2
- 238000012856 packing Methods 0.000 description 2
- 238000010992 reflux Methods 0.000 description 2
- 229910001369 Brass Inorganic materials 0.000 description 1
- 241001657258 Pachycare flavogriseum Species 0.000 description 1
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 1
- 230000000712 assembly Effects 0.000 description 1
- 238000000429 assembly Methods 0.000 description 1
- 230000005540 biological transmission Effects 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- 239000010951 brass Substances 0.000 description 1
- 230000007812 deficiency Effects 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 239000011159 matrix material Substances 0.000 description 1
- 238000012536 packaging technology Methods 0.000 description 1
- 238000012545 processing Methods 0.000 description 1
- 238000011160 research Methods 0.000 description 1
- 238000007650 screen-printing Methods 0.000 description 1
- 238000007789 sealing Methods 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
- 229910052710 silicon Inorganic materials 0.000 description 1
- 239000010703 silicon Substances 0.000 description 1
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Abstract
The invention provides a microphone packaged by a plastic casing, which comprises a PCB (Printed Circuit Board), the plastic casing, an MEMS (Micro Electro Mechanical System) device, an ASIC (Application Specific Integrated Circuit) chip and a copper casing, wherein the MEMS device and the application specific integrated circuit chip are mounted in the plastic casing and connected by a gold wire; a terminal is arranged at the edge of the plastic casing; the ASIC chip is communicated with the terminal by a gold wire; the plastic casing is pressed and fitted into the copper casing to form an assembly body, and then the whole assembly body is mounted on the PCB to form an acoustic cavity; a sound hole of the plastic casing is over against a sound hole in the copper casing; the MEMS device is over against the sound holes; the terminal of the plastic casing is connected with a welding spot on the PCB; and the end face of the copper casing is connected with a welding flux on the PCB. The microphone has the advantages that the signal-to-noise ratio of the microphone is increased by allowing an acoustic signal to enter an acoustic cavity body from an MEMS back cavity, an SMT (Surface Mount Technology) face-to-face sound (front sound inlet) can be realized, and the whole back sound inlet can be turned to the whole front sound inlet of the microphone.
Description
Technical field
The present invention relates to a kind of encapsulating structure of silicon microphone, be limited to the encapsulation field of semiconductor MEMS microphone;
Background technology
The MEMS microphone is because excellent electric property and minimum volume more and more obtain approval and the attention in electroacoustics field.Compare with traditional E CM microphone, it is stable, consistent that the MEMS microphone has electrical functionality, and encapsulation volume is little, is convenient to the SMT(surface mount) etc. many merits, the MEMS microphone must be more and more extensive in the application of field of acoustics.The encapsulation of microphone is identical concept with the encapsulation of traditional meaning IC; but because the MEMS microphone is because the particularity of MEMS; its encapsulating structure must satisfy the protection of MEMS mechanism on the one hand; must satisfy on the other hand the Functional Requirement of MEMS; and it is in use to satisfying the shielding requirements to the RF signal; the encapsulation of the relative traditional IC of MEMS microphone package has again certain particularity like this; simultaneously for field of acoustics; the change of encapsulating structure directly has influence on the whole acoustical behavior of device, and the research of MEMS microphone packaging scheme is had very profound significance.
Common microphone has two kinds of packaged types, the most general a kind of be the packaged type of direct COB, the MEMS(MEMS (micro electro mechanical system)) with the ASIC(dedicated IC chip) by DIE BONDING(paster) be fixed on the pcb board, by WIRE BONDING(gold thread bonding) realize the conducting of ASIC and MEMS, ASIC and external communication, the outside adds crown cap and realizes electromagnetic shielding, this method for packing is realized the sound that advances of MEMS by beating acoustic holes at crown cap or beating the method for acoustic holes at PCB.Form two different series products according to the difference of advancing method for acoustic: the product that advances advances product with the back of the body, and two series products acoustic characteristics are different, and usage is different; Another takes three layers of mode that pcb board is overlapping, and three layers of pcb board become cavity by three stacked swagings, plates out metal covering on the second layer pcb board and forms shielding cavity, and this encapsulation shield effectiveness is poor, and the assembling difficulty is large, and the PCB difficulty of processing is large, and cost is high.Equally press in position difference with the metal cap method, also be divided into the sound that advances and advance the different product of the different acoustic characteristics of sound two classes from the back of the body.Because the microphone applications occasion is different, sometimes need to have sound to be transmitted to the acoustic characteristic of the operatic tunes from MEMS back of the body chamber, need again SMT paster face and sound hole at offside, so derive MEMS or ASIC on top plate the time, similar encapsulating structure by the metallic vias conducting on the PCB in intermediate layer, this proposes to be strict with to the volume production packaging technology: the uncontrollable solder joint distich of simple grain device that matrix is arranged, the pcb board bond strength interconnected with planar fashion is difficult to proof strength, causes device PSR decay serious because the PCB cabling is long simultaneously.
Summary of the invention
The present invention is directed to above deficiency, solve the face that mounts and sound hole at offside, sound advances to encapsulate the problem of body cavity from the conduction of MEMS bottom, a kind of plastic housing packaged microphone is provided, solved simultaneously encapsulate in the electromagnetic shielding problem.
According to technical scheme provided by the invention, described plastic housing packaged microphone, comprise pcb board, plastic housing, MEMS device, dedicated IC chip ASIC, copper shell, described plastic housing inside mounts MEMS device and dedicated IC chip, link to each other by gold thread, the plastic housing edge has terminal, and dedicated IC chip is by gold thread and terminal UNICOM; After plastic housing pressed fit into and forms assembly in the copper shell, whole assembly was mounted on and forms acoustic cavity on the pcb board; Sound hole on described plastic housing and the copper shell is over against, MEMS device over against described sound hole; The terminal of plastic housing is connected with solder joint on the pcb board, and the end face of copper shell is connected with scolder on the pcb board.
The described pcb board back side has pad, and the scolder and the pad that are positioned at the pcb board outer ring link.
Described terminal adopts die-cut the forming of whole piece copper strips, and the terminal after the moulding comprises: the first terminal face, the second terminal surface, the 3rd terminal surface, described the first terminal face adopt the nickel gold to electroplate, with the gold thread UNICOM of the pad on the dedicated IC chip; The 3rd terminal surface also adopts nickel gold to electroplate, as with pcb board on UNICOM's carrier of solder joint; The second terminal surface is only made Nickel Plating Treatment, as the isolation strip.
Described plastic housing is reserved with partition grooves at place, terminal top, and the terminal of the plastic housing after the moulding cuts off from partition grooves, and the inwall of the copper shell after terminal top and the assembling leaves the gap.
When packing the copper shell into, described plastic housing is coated with layer of silica gel around in the sound hole.
Advantage of the present invention is: the present invention has satisfied acoustic signal and has entered the acoustics cavity from MEMS back of the body chamber and make an uproar than the requirement that improves to improve microphone, and can satisfy sound from the face-to-face requirement of (what is called is just being advanced sound) of SMT, realized that the whole back of the body advances sound (MEMS carries on the back the chamber) and turns the requirement that whole microphone is just advancing sound (use the PCB support plate and need not perforate).Solved simultaneously electromagnetic shielding problem in the encapsulation, guaranteed packaging body intensity, the accurate connection of more convenient PCB solder joint and MEMS input/output signal also reduces packaging cost, improves the volume production rate of finished products.
Description of drawings
Fig. 1 is plastic housing encapsulating structure generalized section.
Fig. 2 is the plastic housing structural representation.
Fig. 3 is PCB solder joint connection diagram.
Fig. 4 is the metal shell schematic diagram.
Embodiment
The invention will be further described below in conjunction with drawings and Examples.
The present invention is with simple and reliable plastic packaging body carrying microphone ASIC and MEMS, realize the communication of ASIC and MEMS signal by the gold thread bonding, the input of the signal of telecommunication is passed through solder reflow UNICOM with output by the golden finger on the terminal and specific PCB, realizes the function of product.
As shown in Figure 1, the present invention includes: pcb board 1, plastic housing 2, MEMS device 3, dedicated IC chip 6, copper shell 7; Press fit into copper shell 7 after the method forming of plastic housing 2 and terminal 10 employing insert-moldings (insert molding) and form assemblies, assembly is mounted on and forms acoustic cavity 9 on the pcb board 1; Assembly adopts traditional paster and gold thread bonding technology to mount MEMS device 3 and dedicated IC chip 6 in acoustic cavity 9 before sticking pcb board 1, link to each other by gold thread 5, realize the UNICOM of dedicated IC chip 6 and MEMS device 3 signals, dedicated IC chip 6 signals are by gold thread 5 and terminal 10 UNICOMs; The copper face of copper shell 7 is mounted on the scolder 14 of pcb board 1, forms sealing by refluxing; The UNICOM of 6 solder joints 15 and 6 corresponding realization signals of golden finger of plastic housing upper terminal 10 on the pcb board 1.
As shown in Figure 2, plastic housing 2 terminals 10 adopt die-cut the forming of whole piece copper strips, terminal 10 after the moulding adopts pre-molding(preforming) method, cast acoustic cavity, and fixing golden finger, terminal 10 is comprised of three parts: the first terminal face 11, the second terminal surface 16, the 3rd terminal surface 12, every part has difference in functionality.The first terminal face 11, plating adopt the nickel gold to electroplate, and form wire bonging pad, and the pad on the ASIC 6 is by mode gold thread and the first terminal face 11 UNICOMs of hot ultrasonic bonding, input and output electrical signal; The 3rd terminal surface 12 also adopts nickel gold to electroplate, as with UNICOM's carrier of PCB solder joint 15; The second terminal surface 16 parts are only made Nickel Plating Treatment, the characteristic of utilizing scolding tin to shrink along golden face, as the isolation strip, the scolder when avoiding the SMT pressure-acting on the second terminal surface 16 can overflow to the first terminal face 11 when refluxing with this, the solder joint that causes scolding tin embrittlement wire bonging to form.
As shown in Figure 3, be printed with the gold-plated copper face of a lap welding material 14(on the pcb board 1) and 15(6 golden finger of PCB solder joint), scolder 14 is used for being connected with copper shell 7, and PCB solder joint 15 is used for being connected with the 3rd terminal surface 12 of plastic housing 2 terminals 10.
Plastic-sealed body 2 of the present invention places in as shown in Figure 4 copper shell 7 chambeies, to reach the shielding action of anti-electromagnetic interference.Have hole 4 on the copper shell 7, with sound hole on the plastic housing 2 over against so that the sound wave transmission enters MEMS device 3 back of the body chambeies, apply 50um silica gel in the sound hole around 4 when plastic housing 2 is packed copper shell 7 into, to reach the effect of acoustical seal.Copper shell 7 adopts die-cut the forming of brass of 0.2mm, such as Fig. 4, and the conducting that links of the method that its copper face adopts SMT and pcb board 1 corresponding district scolder 14, one side plays the acoustic seal effect, and the scolder 14 of pcb board outer ring links with PCB back side pad 8 and communicates with GND in addition.
15 signal communication of solder joint on the pcb board 1 of the present invention, the electroacoustics signal can be attached to PCB front solder joint 15 by the 3rd terminal surface 12 on the plastic housing terminal 10, by the wiring of pcb board 1 inner section electroacoustic signal is passed again and receive PCB back pad 8, pad 8 disposable mode of silk screen printing of taking when SMT in PCB back brushes out, and realizes the UNICOM of electroacoustics signal and the communication of mainboard.
The present invention has satisfied acoustic signal and has entered the acoustics cavity from MEMS device 3 back of the body chambeies and make an uproar than the requirement that improves to improve microphone, and can satisfy sound from the face-to-face requirement of (what is called is just being advanced sound) of SMT, realized that the whole back of the body advances sound (MEMS carries on the back the chamber) and turns the requirement that whole microphone is just advancing sound.
Claims (5)
1. plastic housing packaged microphone, comprise pcb board (1), plastic housing (2), MEMS device (3), dedicated IC chip (6), copper shell (7), it is characterized in that: described plastic housing (2) inside mounts MEMS device (3) and dedicated IC chip (6), link to each other by gold thread (5), plastic housing (2) edge has terminal (10), and dedicated IC chip (6) is by gold thread (5) and terminal (10) UNICOM; After plastic housing (2) pressed fit into and forms assembly in the copper shell (7), whole assembly was mounted on the upper acoustic cavity (9) that forms of pcb board (1); Sound hole (4) on described plastic housing (2) and the copper shell (7) is over against, MEMS device (3) over against described sound hole (4); The terminal (10) of plastic housing (2) is connected with solder joint (15) on the pcb board (1), and the end face of copper shell (7) is connected with scolder (14) on the pcb board (1).
2. plastic housing packaged microphone as claimed in claim 1 is characterized in that, described pcb board (1) back side has pad (8), and the scolder (14) that is positioned at pcb board (1) outer ring links with pad (8).
3. plastic housing packaged microphone as claimed in claim 1, it is characterized in that, described terminal (10) adopts die-cut the forming of whole piece copper strips, terminal after the moulding (10) comprising: the first terminal face (11), the second terminal surface (16), the 3rd terminal surface (12), described the first terminal face (11) adopts the nickel gold to electroplate, with the pad gold thread UNICOM on the dedicated IC chip (6); The 3rd terminal surface (12) also adopts nickel gold to electroplate, as with pcb board (1) on UNICOM's carrier of solder joint (15); The second terminal surface (16) is only made Nickel Plating Treatment, as the isolation strip.
4. plastic housing packaged microphone as claimed in claim 1, it is characterized in that, described plastic housing (2) is reserved with partition grooves (13) at place, terminal (10) top, the terminal of the plastic housing after the moulding (10) cuts off from partition grooves (13), and the inwall of the copper shell (7) after terminal (10) top and the assembling leaves the gap.
5. plastic housing packaged microphone as claimed in claim 1 is characterized in that, is coated with layer of silica gel on every side in sound hole (4) when described plastic housing (2) is packed copper shell (7) into.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201210424495.1A CN102917303B (en) | 2012-10-30 | 2012-10-30 | Microphone packaged by plastic casing |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201210424495.1A CN102917303B (en) | 2012-10-30 | 2012-10-30 | Microphone packaged by plastic casing |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN102917303A true CN102917303A (en) | 2013-02-06 |
| CN102917303B CN102917303B (en) | 2015-03-18 |
Family
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201210424495.1A Active CN102917303B (en) | 2012-10-30 | 2012-10-30 | Microphone packaged by plastic casing |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN102917303B (en) |
Cited By (13)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105163256A (en) * | 2015-09-29 | 2015-12-16 | 歌尔声学股份有限公司 | MEMS device of flexible on structure |
| CN106604190A (en) * | 2017-01-13 | 2017-04-26 | 无锡红光微电子股份有限公司 | MEMS microphone encapsulation structure |
| CN107004664A (en) * | 2014-12-09 | 2017-08-01 | 追踪有限公司 | The electronic component and the method for manufacture electronic component that can simply manufacture |
| CN108055604A (en) * | 2017-12-07 | 2018-05-18 | 钰太芯微电子科技（上海）有限公司 | A kind of microphone structure and electronic equipment for carrying on the back chamber enhancing |
| CN108336044A (en) * | 2018-01-25 | 2018-07-27 | 周元忠 | A kind of bipolar integrated circuit chip based on channel medium isolation |
| CN108788357A (en) * | 2017-05-05 | 2018-11-13 | 盾安美斯泰克股份有限公司 | For preventing solder from flowing into the method and structure of MEMS pressure ports |
| CN109379650A (en) * | 2018-10-18 | 2019-02-22 | 深圳康佳电子科技有限公司 | A kind of microphone shock-damping structure and microphone apparatus |
| CN109476476A (en) * | 2016-05-20 | 2019-03-15 | 应美盛公司 | Integration packaging comprising MEMS acoustic sensor and pressure sensor |
| CN109704270A (en) * | 2018-12-29 | 2019-05-03 | 武汉耐普登科技有限公司 | Handware, micro-electro-mechanical sensors encapsulating structure and manufacturing method |
| CN110769357A (en) * | 2019-10-30 | 2020-02-07 | 通用微(深圳)科技有限公司 | Microphone packaging structure adopting lead frame plastic shell |
| CN112055292A (en) * | 2019-06-06 | 2020-12-08 | 鑫创科技股份有限公司 | Packaging structure and packaging method of micro-electro-mechanical system microphone |
| CN113891198A (en) * | 2020-07-03 | 2022-01-04 | 加高电子股份有限公司 | Microphone structure |
| CN114136433A (en) * | 2021-12-02 | 2022-03-04 | 中国兵器工业集团第二一四研究所苏州研发中心 | Pulse sound wave signal detection system based on MEMS microphone array |
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| CN201550275U (en) * | 2009-09-28 | 2010-08-11 | 瑞声声学科技(常州)有限公司 | Mems microphone |
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2012
- 2012-10-30 CN CN201210424495.1A patent/CN102917303B/en active Active
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| CN101132655A (en) * | 2006-08-24 | 2008-02-27 | 美律实业股份有限公司 | Micro-electromechanical microphone packaging structure and method thereof |
| CN201165468Y (en) * | 2008-03-03 | 2008-12-17 | 歌尔声学股份有限公司 | MEMS microphone encapsulation structure |
| CN101415138A (en) * | 2008-11-14 | 2009-04-22 | 瑞声声学科技(深圳)有限公司 | Encapsulation structure for MEMS transducer |
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Cited By (16)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US11245977B2 (en) | 2014-12-09 | 2022-02-08 | Snaptrack, Inc. | Electric component with sensitive component structures and method for producing an electric component with sensitive component structures |
| CN107004664A (en) * | 2014-12-09 | 2017-08-01 | 追踪有限公司 | The electronic component and the method for manufacture electronic component that can simply manufacture |
| CN105163256A (en) * | 2015-09-29 | 2015-12-16 | 歌尔声学股份有限公司 | MEMS device of flexible on structure |
| CN109476476A (en) * | 2016-05-20 | 2019-03-15 | 应美盛公司 | Integration packaging comprising MEMS acoustic sensor and pressure sensor |
| CN109476476B (en) * | 2016-05-20 | 2023-04-25 | 应美盛公司 | Integrated package containing MEMS acoustic sensor and pressure sensor |
| CN106604190A (en) * | 2017-01-13 | 2017-04-26 | 无锡红光微电子股份有限公司 | MEMS microphone encapsulation structure |
| CN108788357A (en) * | 2017-05-05 | 2018-11-13 | 盾安美斯泰克股份有限公司 | For preventing solder from flowing into the method and structure of MEMS pressure ports |
| CN108055604A (en) * | 2017-12-07 | 2018-05-18 | 钰太芯微电子科技（上海）有限公司 | A kind of microphone structure and electronic equipment for carrying on the back chamber enhancing |
| CN108336044A (en) * | 2018-01-25 | 2018-07-27 | 周元忠 | A kind of bipolar integrated circuit chip based on channel medium isolation |
| CN108336044B (en) * | 2018-01-25 | 2019-10-08 | 山西宇翔信息技术有限公司 | A kind of bipolar integrated circuit chip based on channel medium isolation |
| CN109379650A (en) * | 2018-10-18 | 2019-02-22 | 深圳康佳电子科技有限公司 | A kind of microphone shock-damping structure and microphone apparatus |
| CN109704270A (en) * | 2018-12-29 | 2019-05-03 | 武汉耐普登科技有限公司 | Handware, micro-electro-mechanical sensors encapsulating structure and manufacturing method |
| CN112055292A (en) * | 2019-06-06 | 2020-12-08 | 鑫创科技股份有限公司 | Packaging structure and packaging method of micro-electro-mechanical system microphone |
| CN110769357A (en) * | 2019-10-30 | 2020-02-07 | 通用微(深圳)科技有限公司 | Microphone packaging structure adopting lead frame plastic shell |
| CN113891198A (en) * | 2020-07-03 | 2022-01-04 | 加高电子股份有限公司 | Microphone structure |
| CN114136433A (en) * | 2021-12-02 | 2022-03-04 | 中国兵器工业集团第二一四研究所苏州研发中心 | Pulse sound wave signal detection system based on MEMS microphone array |
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|---|---|
| CN102917303B (en) | 2015-03-18 |
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| C53 | Correction of patent of invention or patent application | ||
| CB03 | Change of inventor or designer information |
Inventor after: Wang Yunlong Inventor after: Wu Guanghua Inventor after: Liu Jinfeng Inventor after: Zhu Cuifang Inventor before: Wang Yunlong Inventor before: Liu Jinfeng Inventor before: Zhu Cuifang |
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| COR | Change of bibliographic data |
Free format text: CORRECT: INVENTOR; FROM: WANG YUNLONG LIU JINFENG ZHU CUIFANG TO: WANG YUNLONG WU GUANGHUA LIU JINFENG ZHU CUIFANG |
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| C14 | Grant of patent or utility model | ||
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Denomination of invention: Microphone packaged by plastic casing Effective date of registration: 20160526 Granted publication date: 20150318 Pledgee: Wuxi Industrial Development Group Pledgor: Wuxi Xinao Micro Sensor Technology Co.,Ltd. Registration number: 2016320000007 |
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Effective date of registration: 20231226 Address after: 214000 No. 15, Xinzhou Road, Xinwu District, Wuxi City, Jiangsu Province Patentee after: Jinri Technology (Wuxi) Co.,Ltd. Address before: No.1 YONGGU Road, Binhu District, Wuxi City, Jiangsu Province Patentee before: Wuxi Xinao Micro Sensor Technology Co.,Ltd. |