CN102898994A - Epoxy potting adhesive - Google Patents
Epoxy potting adhesive Download PDFInfo
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- CN102898994A CN102898994A CN201210360008XA CN201210360008A CN102898994A CN 102898994 A CN102898994 A CN 102898994A CN 201210360008X A CN201210360008X A CN 201210360008XA CN 201210360008 A CN201210360008 A CN 201210360008A CN 102898994 A CN102898994 A CN 102898994A
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- epoxy
- agent
- bisphenol
- sealing gluing
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- Adhesives Or Adhesive Processes (AREA)
Abstract
An epoxy potting adhesive is composed of ingredients of, by mass, 150 parts to 200 parts of bisphenol A epoxy resins, 20 parts to 60 parts of polyamide curing agents, 10 parts to 20 parts of epoxy-propane butyl ether, 5 parts to 10 parts of sodium polyacrylate and 1 part to 3 parts of hydroquinone. According to the epoxy potting adhesive, the curing time is short, the proportion of reactive diluents is selected, the viscosity is stable, the strength is high, the adhesive is only decomposed at 350 DEG C in the air, and potting requirements are met.
Description
Technical field
The invention belongs to the sizing agent technical field, relate in particular to the agent of a kind of epoxy sealing gluing.
Background technology
Starting material and the prescription (unit: mass parts) be 100 parts of Resins, epoxy (E-51) of existing epoxy sealing gluing agent, 2.0 parts of N-(β-aminoethyl)-γ-aminopropyl trimethoxy siloxane coupling agent, Resorcinol is two to shrink sweet 20 parts, 2.5 parts of aerosils, 20 parts in half siloxanes solidifying agent, other auxiliary agents are an amount of, (2) preparation method: treatment of packing: the ethanol solution 10mL of the KH-792 of preparation 1%, and with 10g SiO
2Powder adds wherein.After dehydrated alcohol all volatilized, dry 30min was stand-by about 120 ℃.Each component of sizing agent is mixed in proportion, the degassed 30min of normal temperature is applied to the adherend surface in vacuum drying oven, solidifies under certain pressure, condition of cure is 80 ℃ * 2h+120 ℃ * 4h, presses 415.1 double shear methods test bonding property in the GJB 772A-1997 standard.The second-order transition temperature of this sizing agent is 139 ℃, and life-time service below 140 ℃ can be kept preferably adhesiveproperties.But joint sealant is being higher than under 200 ℃ of conditions after solidifying, and is easy to decompose, and is unsuitable for the special environments such as aerospace.
Summary of the invention
The technical problem that solves:The invention provides the agent of a kind of epoxy sealing gluing, set time is short, and keeps stable under hot conditions, can not decompose, and Application Areas is wide.
Technical scheme:The agent of a kind of epoxy sealing gluing consists of the following composition by mass parts: 150～200 parts of bisphenol A epoxide resins, 20～60 parts of polyamide curing agents, 10～20 parts of epoxy propane butyl ethers, 5～10 parts of sodium polyacrylates, 1～3 part of Resorcinol.
Preferred version is: consist of the following composition by mass parts: 200 parts of bisphenol A epoxide resins, 20 parts of polyamide curing agents, 20 parts of epoxy propane butyl ethers, 5 parts of sodium polyacrylates, 1 part of Resorcinol.
The technique scheme composition also comprises: 5 parts of ethoxyquinolines.
Beneficial effect:Epoxy sealing gluing agent provided by the invention is short set time, and the proportioning consumption of reactive thinner is through selecting, and viscosity is stable and intensity is higher, the glue sample in air 350 ℃ just decompose, satisfy the embedding requirement.
?
Embodiment
Embodiment 1:
The agent of a kind of epoxy sealing gluing consists of the following composition by mass parts: 150～200 parts of bisphenol A epoxide resins, 20～60 parts of polyamide curing agents, 10～20 parts of epoxy propane butyl ethers, 5～10 parts of sodium polyacrylates, 1～3 part of Resorcinol.Epoxy sealing gluing agent provided by the invention is short set time, and the proportioning consumption of reactive thinner is through selecting, and viscosity is stable and intensity is higher, the glue sample in air 350 ℃ just decompose, satisfy the embedding requirement.
Embodiment 2:
The agent of epoxy sealing gluing consists of the following composition by mass parts: 200 parts of bisphenol A epoxide resins, 20 parts of polyamide curing agents, 20 parts of epoxy propane butyl ethers, 5 parts of sodium polyacrylates, 1 part of Resorcinol.Also comprise: 5 parts of ethoxyquinolines.Epoxy sealing gluing agent provided by the invention is short set time, and the proportioning consumption of reactive thinner is through selecting, and viscosity is stable and intensity is higher, the glue sample in air 350 ℃ just decompose, satisfy the embedding requirement.The ethoxyquinoline that adds has improved the stability of sizing agent, with the polyamide curing agent synergy, can be used in the harsh specials of environment such as aerospace.
Claims (3)
1. epoxy sealing gluing agent, it is characterized in that consisting of the following composition by mass parts: 150～200 parts of bisphenol A epoxide resins, 20～60 parts of polyamide curing agents, 10～20 parts of epoxy propane butyl ethers, 5～10 parts of sodium polyacrylates, 1～3 part of Resorcinol.
2. epoxy sealing gluing according to claim 1 agent is characterized in that consisting of the following composition by mass parts: 200 parts of bisphenol A epoxide resins, 20 parts of polyamide curing agents, 20 parts of epoxy propane butyl ethers, 5 parts of sodium polyacrylates, 1 part of Resorcinol.
3. epoxy sealing gluing according to claim 1 agent is characterized in that also comprising by mass parts: 5 parts of ethoxyquinolines.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201210360008XA CN102898994A (en) | 2012-09-25 | 2012-09-25 | Epoxy potting adhesive |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201210360008XA CN102898994A (en) | 2012-09-25 | 2012-09-25 | Epoxy potting adhesive |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN102898994A true CN102898994A (en) | 2013-01-30 |
Family
ID=47571490
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201210360008XA Pending CN102898994A (en) | 2012-09-25 | 2012-09-25 | Epoxy potting adhesive |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN102898994A (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104128972A (en) * | 2014-07-22 | 2014-11-05 | 浙江裕华木业有限公司 | Method for manufacturing parquet slicing decoration veneers |
| CN107384278A (en) * | 2017-07-26 | 2017-11-24 | 合肥同佑电子科技有限公司 | A kind of mildew-proof flame retarded electron pouring sealant and preparation method thereof |
| CN108822781A (en) * | 2018-04-16 | 2018-11-16 | 杭州电子科技大学 | A kind of macromolecule binding material |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2009025991A1 (en) * | 2007-08-17 | 2009-02-26 | Dow Global Technologies, Inc. | Two part crash durable epoxy adhesives |
| CN102093832A (en) * | 2010-12-03 | 2011-06-15 | 烟台德邦科技有限公司 | High impact-resistant epoxy resin filling adhesive and preparation method thereof |
| CN102604578A (en) * | 2012-04-09 | 2012-07-25 | 湖南宏禹水利水电岩土工程有限公司 | Grouting material for reinforcing underwater concrete crack |
-
2012
- 2012-09-25 CN CN201210360008XA patent/CN102898994A/en active Pending
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2009025991A1 (en) * | 2007-08-17 | 2009-02-26 | Dow Global Technologies, Inc. | Two part crash durable epoxy adhesives |
| CN102093832A (en) * | 2010-12-03 | 2011-06-15 | 烟台德邦科技有限公司 | High impact-resistant epoxy resin filling adhesive and preparation method thereof |
| CN102604578A (en) * | 2012-04-09 | 2012-07-25 | 湖南宏禹水利水电岩土工程有限公司 | Grouting material for reinforcing underwater concrete crack |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104128972A (en) * | 2014-07-22 | 2014-11-05 | 浙江裕华木业有限公司 | Method for manufacturing parquet slicing decoration veneers |
| CN107384278A (en) * | 2017-07-26 | 2017-11-24 | 合肥同佑电子科技有限公司 | A kind of mildew-proof flame retarded electron pouring sealant and preparation method thereof |
| CN108822781A (en) * | 2018-04-16 | 2018-11-16 | 杭州电子科技大学 | A kind of macromolecule binding material |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C06 | Publication | ||
| PB01 | Publication | ||
| C10 | Entry into substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| C12 | Rejection of a patent application after its publication | ||
| RJ01 | Rejection of invention patent application after publication |
Application publication date: 20130130 |