CN102891089B - Encapsulating method of intelligent card - Google Patents
Encapsulating method of intelligent card Download PDFInfo
- Publication number
- CN102891089B CN102891089B CN201210382016.4A CN201210382016A CN102891089B CN 102891089 B CN102891089 B CN 102891089B CN 201210382016 A CN201210382016 A CN 201210382016A CN 102891089 B CN102891089 B CN 102891089B
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- row
- chip
- carrier band
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- slide glass
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Abstract
The invention relates to an encapsulating method of a nine-core intelligent card, and the method comprises the following steps of adhering high-temperature bond on the lower surface of a carrier of a chip; utilizing a punching device to simultaneously punch a plurality of carriers with chips from a carrier belt; utilizing a plurality of rows of suckers which are installed on a first grabbing device to grab the punched carriers; placing the grabbed multiple rows of carriers into correspondently arranged multiple loading discs, and acquiring a needed carrier arrangement; utilizing a plurality of rows of suckers which are installed on a second grabbing device to grab the carriers which are regularly arranged and to place the carriers into an encapsulating bracket; and simultaneously placing a plurality of card substrates with chip grooves below a thermal sealing device, and utilizing sealing heads to simultaneously thermally seal and bond the multiple rows of carriers onto the card substrates with the chip grooves. According to the encapsulating method, more than 36 chips can be simultaneously produced, so that the material can be maximally utilized, and the production efficiency can be greatly improved.
Description
Technical field
The present invention relates to a kind of method for packing of smart card, particularly relate to a kind of method for packing of nine core smart cards, belong to the technical field of chip package.
Background technology
Smart card with chip is applied to the every field in life at present.SIM smart card for mobile communication is example, the SIM card sheet that market is sold comprises Ka Ji and chip, its chips to be generally just attached on slide glass and by chip carrier package in the size of Ka Jinei, Ka Ji and chip and specification by international standard and national standard concrete regulation.Therefore, in the prior art, the equipment of production of intelligent card and method all design for the smart card size with international standard and national standard.Such as, chip is wherein all die-cut from the double carrier band of standard acquisition, is then encapsulated on the draw-in groove of card base.
In addition, in the production process of existing smart card, by the restriction of prior art standard and technology inertia, an only encapsulation chip on a usual card base, namely first on card base, the groove for packaged chip is cut out in milling, then one by one by chip package in groove.Because usual card base is made up of PVC plastic, therefore on a card base, only an encapsulation chip can cause the huge waste of material and the severe contamination to environment.Meanwhile, in process of production, production efficiency will be caused by chip package one by one in groove extremely low, a sheet smart card can only be produced at every turn.
Therefore, need the method for packing that a kind of smart card is provided in prior art, the production efficiency of smart card can be improved, and reduce waste and the pollution on the environment of material.
Summary of the invention
The invention provides a kind of method for packing of smart card, especially a kind of method for packing of nine core smart cards, it can encapsulate nearly 36 chips simultaneously, thus farthest make use of material and drastically increase production efficiency.Because the card base size of smart card has unified standard, so farthest encapsulate 9 chips can reach the object at utmost utilizing card matrix material, cut the waste on a card base with same size.In addition, according to the method for packing of nine core smart cards of the present invention, can simultaneously packaged chip on 4 card bases, thus 36 sheet smart cards can be produced simultaneously, improve production efficiency.
According to a first aspect of the invention, provide a kind of method for packing of smart card, comprise the following steps:
(1) on the lower surface of carrier band, paste high temperature adhesives glue, carrier band comprises the multiple slide glasses being loaded with chip;
(2) utilize blanking units to be gone out from carrier band by multiple slide glass simultaneously;
(3) sucker in a row that the first capture apparatus is installed is utilized to capture the multiple slide glasses after going out;
(4) the multiple slide glasses captured are put into multiple loading traies of corresponding arrangement, formed and arrange slide glass more;
(5) utilize many rows sucker that the second capture apparatus is installed to capture from multiple loading tray and arrange slide glass more, and put it in encapsulation bracket; And
(6) utilize the high temperature adhesives glue on encapsulation header heating slide glass, make in the chip groove of many row's slide glass bondings of heat-seal simultaneously card base thereunder.
Preferably, wherein, the first capture apparatus comprises at least two row's suckers, and its spacing between row and row can regulate; Spacing between the row of loading tray is corresponding with the trestle column of the sucker of the first capture apparatus, and the spacing between the row of loading tray can regulate.
According to a second aspect of the invention, provide a kind of method for packing of nine core smart cards, comprise the following steps:
(1) utilize the punching on high temperature adhesives adhesive tape of the first blanking units, on the size in hole and double carrier band, the size of chip part matches, and make when double carrier band is arranged on high temperature adhesives adhesive tape, chip part can be exposed from hole;
(2) make the high temperature adhesives adhesive tape after punching together with double carrier band disposed thereon through heater, utilize heater transient heating high temperature adhesives adhesive tape, make it be pasted onto the lower surface of carrier band;
(3) by base stock stripping off device, the base stock of adhesive tape is peeled off;
(4) utilize the second blanking units to be gone out from double carrier band by the slide glass being loaded with chip, go out 2 × 12 slide glasses at every turn;
(5) the double vacuum cup on the first capture apparatus is utilized to capture slide glass;
(6) slide glass of crawl is put into 4 × 12 loading traies that loading platform is arranged;
(7) utilize the second capture apparatus from loading platform, capture 3 × 12 slide glasses simultaneously, put it in encapsulation bracket;
(8) make 4 standard card bases in place in the below of encapsulation bracket simultaneously, have 3 × 3 chip grooves often opening on standard card base;
(9) drive the encapsulation header of heat-seal device, 3 × 12 slide glasses are encapsulated on 4 card bases simultaneously.
Preferably, wherein, the spacing between row and row of the sucker of the first capture apparatus can regulate; Spacing between the row of loading tray is corresponding with the trestle column of the sucker of the first capture apparatus, and the spacing between the row of loading tray can regulate.
According to the method for packing of nine core smart cards of the present invention, not only farthest make use of the size of standard card base, and achieve the technique effect simultaneously producing 36 sheet smart cards, drastically increase the production efficiency of smart card and reduce the waste of material.
Accompanying drawing explanation
Fig. 1 is the schematic flow sheet according to Intelligent card package method of the present invention.
Fig. 2 is the schematic flow sheet of nine core Intelligent card package methods according to the preferred embodiment of the present invention.
Fig. 3 is the schematic diagram of the standard carrier band used in method for packing of the present invention.
Fig. 4 is the schematic diagram of the loading platform used in method for packing of the present invention.
Fig. 5 is the layout schematic diagram of the encapsulation header of the heat-seal device used in method for packing of the present invention.
Embodiment
For making the object, technical solutions and advantages of the present invention clearly understand, hereinafter will be described in detail to embodiments of the invention by reference to the accompanying drawings.It should be noted that, when not conflicting, the embodiment in the application and the feature in embodiment can combination in any mutually.
See Fig. 1, which show the schematic flow sheet according to Intelligent card package method of the present invention.According to the method for packing of smart card of the present invention, mainly comprise the following steps:
(1) on the lower surface of carrier band, paste high temperature adhesives glue, carrier band comprises the multiple slide glasses being loaded with chip.Its chips can from the double carrier band of standard, high temperature adhesives adhesive tape can be such as that silicone oil paper (is similar to normally used double faced adhesive tape, comprise glue and base stock, wherein glue is pasted onto on base stock, during use, need by base stock peel off thus by the position of glue at needs), this kind of adhesive glue such as can produce bond effect higher than when 150 DEG C at high temperature, and does not have bond effect when normal temperature.The schematic diagram of the double carrier band 1 of the standard that illustrated in Fig. 3, the double carrier band of this standard is carrier band general in this area, has size and the arrangement of standard.
(2) utilize blanking units to be gone out from carrier band by multiple slide glass simultaneously.
(3) sucker in a row that the first capture apparatus is installed is utilized to capture the multiple slide glasses after going out.Preferably, the spacing between row and row of the sucker the first capture apparatus installed can regulate as required.
(4) the multiple slide glasses captured are put into multiple loading traies of corresponding arrangement, formed and arrange slide glass more.Preferably, the spacing between the row of wherein loading tray is corresponding with the trestle column of sucker, arrange between spacing can regulate as required, thus obtain the arrangement needing the chip of specification.
(5) utilize many rows sucker that the second capture apparatus is installed to capture from described multiple loading tray and arrange slide glass more, and put it in encapsulation bracket.
(6) utilize the high temperature adhesives glue on encapsulation header heating slide glass, the slide glass heat-seal simultaneously encapsulated in bracket is bonded in the chip groove of the card base below slide glass, obtains the smart card of finished product.
See Fig. 2, which show the schematic flow sheet of nine core Intelligent card package methods according to the preferred embodiment of the present invention.According to the method for packing of nine core smart cards of the present invention, mainly comprise the following steps:
(1) utilize the punching on high temperature adhesives adhesive tape of the first blanking units, on the size in hole and double carrier band, the size of chip part matches, and exposes from hole to enable chip.
(2) the double carrier band 1 being loaded with chip together with the high temperature adhesives adhesive tape after punching through heater, wherein high temperature adhesives adhesive tape in the below of double carrier band and chip expose from the hole of adhesive tape, utilize heater transient heating high temperature adhesives adhesive tape, make it be pasted onto the lower surface of carrier band.
(3) by base stock stripping off device, the base stock of adhesive tape is peeled off, thus by glue on the lower surface of carrier band.
(4) slide glass utilizing the second blanking units the back side to be stained with glue is gone out from carrier band, can go out the slide glass that 2 × 12 are loaded with chip at every turn.
(5) utilize the double vacuum cup on the first capture apparatus to capture slide glass, the spacing between the double vacuum cup wherein on the first capture apparatus can adjust.
(6) slide glass of crawl is put on loading platform.Preferably, as shown in Figure 4, loading platform is provided with 4 × 12 loading traies 2.Loading tray 2 is divided into four pieces of regions to arrange, is distributed with 4 × 3 loading traies in every block region, so arranges and can meet encapsulation 4 card bases thus the object realizing simultaneously producing 36 smart cards simultaneously.Preferably, the spacing between adjacent area is adjustable, and the spacing respectively equipped in the same area between charging tray is also adjustable.Thus, utilize the first capture apparatus of the present invention and loading tray can realize the object of the spacing adjusting chip as required, farthest improve the quantity of the chip simultaneously encapsulated.Preferably, in this step, grab chips is at twice needed 4 × 12 loading traies could to be piled.
(7) utilize the second capture apparatus to capture 3 × 12 chips wherein simultaneously, put it in encapsulation bracket.Preferably, if 4 × 12 loading traies are piled, so after operation, loading tray 2 also remaining 1 arranges chip, like this in the next operation cycle, only needing recycling first capture apparatus to capture a chip (double) can proceed next step.
(8) make 4 standard card bases in place in the below of encapsulation bracket simultaneously, have 3 × 3 chip grooves often opening on standard card base.
(9) drive the encapsulation header 3 of heat-seal device, 3 × 12 chips are encapsulated on 4 card bases simultaneously.During encapsulation, the glue that slide glass lower surface bonds melts by heat again that utilize heat-seal device to produce, and is securely adhered on card base.So far, the encapsulation process of nine core smart cards completes.As shown in Figure 5, which show the layout schematic diagram of the encapsulation header 3 of heat-seal device, wherein in package board 4, be furnished with 3 × 12 encapsulation header, with while heat-seal 3 × 12 chips.
According to Intelligent card package method of the present invention, especially according to the method for packing of nine core smart cards wherein, 3 × 12 smart cards can be obtained simultaneously, under the restriction of prior art standard and technical conditions, farthest improve the quantity of the smart card simultaneously produced, thus improve the production efficiency of smart card.Further, the spacing between the row of the wherein sucker of the first capture apparatus and the spacing between the row of loading tray can regulate the constraint breaching prior art condition as required, have greatly adapted to the demand of automated production smart card, have improve production efficiency.
Although the execution mode disclosed by the present invention is as above, the execution mode that described content just adopts for the ease of understanding the present invention, and be not used to limit the present invention.Technical staff in any the technical field of the invention; under the prerequisite not departing from the spirit and scope disclosed by the present invention; any amendment and change can be done what implement in form and in details; but scope of patent protection of the present invention, the scope that still must define with appending claims is as the criterion.
Claims (4)
1. a method for packing for smart card, is characterized in that, comprises the following steps:
(1) on the lower surface of carrier band, paste high temperature adhesives glue, described carrier band comprises the multiple slide glasses being loaded with chip;
(2) utilize blanking units to be gone out from carrier band by multiple slide glass simultaneously;
(3) sucker in a row that the first capture apparatus is installed is utilized to capture the multiple slide glasses after going out;
(4) multiple slide glasses of described crawl are put into multiple loading traies of corresponding arrangement, formed and arrange slide glass more;
(5) utilize many rows sucker that the second capture apparatus is installed to capture from described multiple loading tray and arrange slide glass more, and put it in encapsulation bracket; And
(6) utilize the high temperature adhesives glue on encapsulation header heating slide glass, make in the chip groove of described many row's slide glass bondings of heat-seal simultaneously card base thereunder;
Wherein, described first capture apparatus comprises at least two row's suckers, and the spacing between row and row of described at least two row's suckers can regulate.
2. method for packing according to claim 1, is characterized in that, the spacing between the row of described loading tray is corresponding with the trestle column of the sucker of described first capture apparatus, and the spacing between the row of described loading tray can regulate.
3. a method for packing for nine core smart cards, is characterized in that, comprise the following steps:
(1) utilize the punching on high temperature adhesives adhesive tape of the first blanking units, on the size in hole and double carrier band, the size of chip part matches, and make when double carrier band is arranged on high temperature adhesives adhesive tape, chip part can be exposed from described hole;
(2) make the high temperature adhesives adhesive tape after punching together with double carrier band disposed thereon through heater, utilize high temperature adhesives adhesive tape described in described heater transient heating, make it be pasted onto the lower surface of described carrier band;
(3) by base stock stripping off device, the base stock of adhesive tape is peeled off;
(4) utilize the second blanking units to be gone out from described double carrier band by the slide glass being loaded with chip, go out 2 × 12 slide glasses at every turn;
(5) the double vacuum cup on the first capture apparatus is utilized to capture slide glass;
(6) slide glass of crawl is put into 4 × 12 loading traies that loading platform is arranged;
(7) utilize the second capture apparatus to capture 3 × 12 slide glasses from described loading platform simultaneously, put it in encapsulation bracket;
(8) make 4 standard card bases in place in the below of described encapsulation bracket simultaneously, have 3 × 3 chip grooves often opening on standard card base;
(9) drive the encapsulation header of heat-seal device, 3 × 12 slide glasses are encapsulated on 4 card bases simultaneously;
Wherein, the spacing between row and row of the sucker of described first capture apparatus can regulate.
4. method for packing according to claim 3, is characterized in that, the spacing between the row of described loading tray is corresponding with the trestle column of the described sucker of described first capture apparatus, and the spacing between the row of described loading tray can regulate.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201210382016.4A CN102891089B (en) | 2012-10-11 | 2012-10-11 | Encapsulating method of intelligent card |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201210382016.4A CN102891089B (en) | 2012-10-11 | 2012-10-11 | Encapsulating method of intelligent card |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN102891089A CN102891089A (en) | 2013-01-23 |
| CN102891089B true CN102891089B (en) | 2015-01-14 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201210382016.4A Expired - Fee Related CN102891089B (en) | 2012-10-11 | 2012-10-11 | Encapsulating method of intelligent card |
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Families Citing this family (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104636793A (en) * | 2013-11-06 | 2015-05-20 | 上海蓝沛新材料科技股份有限公司 | Intelligent card and method for manufacturing same |
| CN105069499B (en) * | 2015-07-20 | 2018-03-30 | 北京世纪光信科技有限公司 | A kind of system of processing for being used to produce the card base for being loaded with pasting card |
| CN109326543A (en) * | 2018-11-13 | 2019-02-12 | 江苏澳芯微电子有限公司 | Chip packaging device |
Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN201601118U (en) * | 2009-12-23 | 2010-10-06 | 刘义清 | IC filling device |
| CN201663150U (en) * | 2010-02-03 | 2010-12-01 | 刘义清 | Multi-core packaging machine |
| CN102169551A (en) * | 2011-01-27 | 2011-08-31 | 东莞锐发智能卡科技有限公司 | SIM (Subscriber Identity Module) card production method and equipment |
| CN102201326A (en) * | 2011-03-10 | 2011-09-28 | 上海连正元机电科技有限公司 | Wireless communication small card embedding device and manufacturing method thereof |
Family Cites Families (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6205745B1 (en) * | 1998-05-27 | 2001-03-27 | Lucent Technologies Inc. | High speed flip-chip dispensing |
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2012
- 2012-10-11 CN CN201210382016.4A patent/CN102891089B/en not_active Expired - Fee Related
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN201601118U (en) * | 2009-12-23 | 2010-10-06 | 刘义清 | IC filling device |
| CN201663150U (en) * | 2010-02-03 | 2010-12-01 | 刘义清 | Multi-core packaging machine |
| CN102169551A (en) * | 2011-01-27 | 2011-08-31 | 东莞锐发智能卡科技有限公司 | SIM (Subscriber Identity Module) card production method and equipment |
| CN102201326A (en) * | 2011-03-10 | 2011-09-28 | 上海连正元机电科技有限公司 | Wireless communication small card embedding device and manufacturing method thereof |
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| CN102891089A (en) | 2013-01-23 |
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