CN102887713A - Low-thermal conductivity silicon carbide-mullite brick and preparation method thereof - Google Patents

Low-thermal conductivity silicon carbide-mullite brick and preparation method thereof Download PDF

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CN102887713A
CN102887713A CN2011102026869A CN201110202686A CN102887713A CN 102887713 A CN102887713 A CN 102887713A CN 2011102026869 A CN2011102026869 A CN 2011102026869A CN 201110202686 A CN201110202686 A CN 201110202686A CN 102887713 A CN102887713 A CN 102887713A
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mullite brick
low
thermal conductivity
silicon carbide
heat conductivity
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CN102887713B (en
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杨建军
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ZHENGZHOU HUITE REFRACTORY MATERIALS CO Ltd
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ZHENGZHOU HUITE REFRACTORY MATERIALS CO Ltd
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Abstract

The invention relates to a refractory brick and especially relates to a low-thermal conductivity silicon carbide-mullite brick. The low-thermal conductivity silicon carbide-mullite brick comprises 80% of first-grade bauxite, 10% of silicon carbide particles and 10% of a composite micro-powder binding agent. The low-thermal conductivity silicon carbide-mullite brick is prepared by molding the first-grade bauxite, the silicon carbide particles and the composite micro-powder binding agent under high pressure and carrying out low-temperature calcination. The preparation method comprises raw material treatment in a raw material treating workshop, proportioning, mixing, molding, drying, calcination, examination and packaging. The low-thermal conductivity silicon carbide-mullite brick has high temperature resistance, oxidation resistance, wear resistance, high mechanical strength, high rigidity and corrosion resistance. The preparation method reduces thermal conductivity, improves thermal efficiency and improves thermal shock properties of the low-thermal conductivity silicon carbide-mullite brick.

Description

A kind of low heat conductivity siliceous mullite brick and preparation method thereof
Technical field
The present invention relates to a kind of refractory materials, relate in particular to a kind of low heat conductivity siliceous mullite brick and preparation method thereof.
Background technology
The siliceous mullite brick that uses on the cement kiln now is owing to having added silicon carbide and having required product should possess low void content and higher compressive strength for the erosion-resisting characteristics that guarantees product and wear resisting property, therefore the actual thermal conductivity of siliceous mullite brick is all more than 2.5W/ (mK), calculation formula (seeing appendix) according to thermal conductivity, rule of thumb siliceous mullite brick uses the medial temperature at position to be about 1350 ℃ in cement kiln, and kiln external surface temperature is about 200 ℃, caused great thermosteresis, increase the consumption of fuel, reduced production efficiency.
Summary of the invention
Technical purpose of the present invention is for the deficiencies in the prior art, and a kind of have high-wearing feature, the siliceous mullite brick that reduces thermal conductivity and the method for preparation thereof are provided.
The technical scheme that realizes the technology of the present invention purpose is: a kind of low heat conductivity siliceous mullite brick, comprise 80% one-level bauxitic clay, 10% silicon-carbide particle and 10% composite micro-powder wedding agent, described one-level bauxitic clay, add silicon-carbide particle and composite micro-powder wedding agent low-firing behind high-pressure molding.
As the further optimization to upper technical scheme, the temperature of described low-firing is 100 ℃.
As the further optimization to upper technical scheme, described one-level bauxitic clay grog includes Al2O3 〉=70%, body close 〉=2.75g/cm3, described silicon-carbide particle comprises SiC 〉=97%, and described composite micro-powder additive comprises Al2O3 〉=80%, fineness≤5 μ mm.
Further optimization as to upper technical scheme also includes the Guangxi white clay, and described Guangxi white clay contains Al2O3 〉=33%, LOI≤15%.
Only add silicon-carbide particle in siliceous mullite brick because the reason of oxidation and cost fails to be widely used always at cement kiln, in the present invention, silicon carbide only adds with particle form, in the wear resisting property that has guaranteed siliceous mullite brick, greatly reduce thermal conductivity, the thermal conductivity of siliceous mullite brick has been reduced to below the 2.0W/ (mK), the external skin temperature of kiln is controlled at about 100 ℃, has greatly reduced thermal losses, has improved thermo-efficiency.
Owing to not using carbide fine powder on the impact of siliceous mullite brick thermal shock performance, in the present invention, by adding the combined binder of micro powder grade, utilize the short burning effect in the micro mist performance to cause product in sintering process, to form tiny crack with different thermal expansivity, offset the thermal stresses that material in use produces, improved the thermal shock performance of material.
A kind of preparation method of low heat conductivity siliceous mullite brick may further comprise the steps:
A.) one-level bauxitic clay, silicon-carbide particle are mixed in proportion;
B.) choose experienced; All kinds of raw materials are also sent in the batch bin behind crushing and screening respectively and are stored after through artificial selection;
C.) the broken pulverizing;
D.) deironing;
E.) screening is returned to c. with the oversize that sieves gained) step cycle, the minus mesh of screening gained enters next step;
F.) batching, and add the composite micro-powder wedding agent;
G.) mixing;
H.) high-pressure molding; Compound after mixing is by 630t and the compression moulding of 400t friction press, and the adobe after the moulding is by manually piling up on drying cart, and the adobe that code is good is dry to dry kiln through track.
I.) low-firing;
J.) finish.
As the further optimization to upper technical scheme, described h.) the high-pressure molding stage is by 630t and the compression moulding of 400t friction press.
As the further optimization to upper technical scheme, described i.) the low-firing stage adopts 100 ℃ firing temperature.
As the further optimization to upper technical scheme, the blending ratio of described one-level bauxitic clay and described silicon-carbide particle is 10: 1.
Compared with prior art, the beneficial effect main manifestations of a kind of low heat conductivity siliceous mullite brick of the present invention and preparation method thereof is: have high temperature resistant, anti-oxidant, wear-resistant, physical strength is high, hardness is high, corrosion-resistant; Reduce thermal conductivity, improve thermo-efficiency, also improve the thermal shock performance of material simultaneously.
Description of drawings
Figure 1 shows that the preparation method's of a kind of low heat conductivity siliceous mullite brick of the present invention schematic flow sheet.
Embodiment
As one of most preferred embodiment of the preparation method of a kind of low heat conductivity siliceous mullite brick of the present invention, referring to accompanying drawing 1, a kind of low heat conductivity siliceous mullite brick, comprise 80% one-level bauxitic clay, 10% silicon-carbide particle and 10% composite micro-powder wedding agent, the one-level bauxitic clay, add silicon-carbide particle and composite micro-powder wedding agent low-firing behind high-pressure molding.
The temperature of low-firing is 100 ℃.
Only add silicon-carbide particle in siliceous mullite brick because the reason of oxidation and cost fails to be widely used always at cement kiln, in embodiments of the present invention, silicon carbide only adds with particle form, in the wear resisting property that has guaranteed siliceous mullite brick, greatly reduce thermal conductivity, the thermal conductivity of siliceous mullite brick has been reduced to below the 2.0W/ (mK), the external skin temperature of kiln is controlled at about 100 ℃, has greatly reduced thermal losses, has improved thermo-efficiency.
Owing to not using carbide fine powder on the impact of siliceous mullite brick thermal shock performance, in embodiments of the present invention, by adding the combined binder of micro powder grade, utilize the short burning effect in the micro mist performance to cause product in sintering process, to form tiny crack with different thermal expansivity, offset the thermal stresses that material in use produces, improved the thermal shock performance of material.
One-level bauxitic clay grog includes Al2O3 〉=70%, body close 〉=2.75g/cm3, described silicon-carbide particle comprises SiC 〉=97%, and described composite micro-powder additive comprises Al2O3 〉=80%, fineness≤5 μ mm.
Also include the Guangxi white clay, described Guangxi white clay contains Al2O3 〉=33%, LOI≤15%.
A kind of preparation method of low heat conductivity siliceous mullite brick may further comprise the steps:
A.) one-level bauxitic clay, silicon-carbide particle are mixed in proportion;
B.) choose experienced; All kinds of raw materials are also sent in the batch bin behind crushing and screening respectively and are stored after through artificial selection;
C.) the broken pulverizing;
D.) deironing;
E.) screening is returned to c. with the oversize that sieves gained) step cycle, the minus mesh of screening gained enters next step;
F.) batching, and add the composite micro-powder wedding agent;
G.) mixing;
H.) high-pressure molding; Compound after mixing is by 630t and the compression moulding of 400t friction press, and the adobe after the moulding is by manually piling up on drying cart, and the adobe that code is good is dry to dry kiln through track.
I.) adopt 100 ℃ firing temperature low-firing;
J.) finish.
The blending ratio of one-level bauxitic clay and described silicon-carbide particle is 10: 1.
According to aforesaid method, the siliceous mullite brick physical and chemical index such as the following table that make:
Figure BSA00000540799500051
Heat conduction fundamental equation (heat transfer equation):
The planomural that homogeneous material consists of, and t 1>t 2
Facts have proved: object is directly proportional with heat transfer area A with the heat Q of heat exchange pattern transmission in the unit time, with the temperature head (t of wall both sides 1-t 2) be directly proportional, and be inversely proportional to wall thickness δ,
That is: Q ∝ A δ ( t 1 - t 2 ) ,
Introduce scale-up factor λ, then: Q = λ A δ ( t 1 - t 2 ) ,
Following formula is called heat transfer equation, or is called Fourier's law.
Following formula is rewritten into following form:
Figure BSA00000540799500063
In the formula: Δ t=t 1-t 2, be the impellent of conduction process.
Figure BSA00000540799500064
Thermal conduction resistance for the individual layer planomural.
Thermal conductivity (thermal conductivity):
λ = Qδ A ( t 1 - t 2 ) W/ (mK) or W/ (m ℃).
The meaning of thermal conductivity is: when the area of partition is 1m 2, thickness is 1m, when the temperature head of wall both sides is 1K, within the unit time with heat that heat exchange pattern was transmitted.
Obviously, the thermal conductivity λ value is larger, and then the capacity of heat transmission of material is stronger.
The thermal conductivity of various materials is used determination of experimental method usually.In general, the thermal conductivity of metal is maximum, and non-metal solid is taken second place, liquid less, and the minimum of gas.
In sum, after those of ordinary skill in the art reads file of the present invention, need not the replacement that scheme between other various corresponding conversion scheme or the various embodiments of the present invention is made in creative brainwork according to technical scheme of the present invention and technical conceive, all belong to the scope of expansion that the present invention protects.

Claims (8)

1. low heat conductivity siliceous mullite brick, it is characterized in that, comprise 70%~90% one-level bauxitic clay, 5%~15% silicon-carbide particle and 5%~15% composite micro-powder wedding agent, described one-level bauxitic clay, add silicon-carbide particle and composite micro-powder wedding agent low-firing behind high-pressure molding.
2. a kind of low heat conductivity siliceous mullite brick according to claim 1 is characterized in that, the temperature of described low-firing is 90 ℃~110 ℃.
3. a kind of low heat conductivity siliceous mullite brick according to claim 1, it is characterized in that, described one-level bauxitic clay grog includes Al2O3 〉=70%, body close 〉=2.75g/cm3, described silicon-carbide particle comprises SiC 〉=97%, and described composite micro-powder additive comprises Al2O3 〉=80%, fineness≤5 μ mm.
4. a kind of low heat conductivity siliceous mullite brick according to claim 1 is characterized in that, also includes the Guangxi white clay, and described Guangxi white clay contains Al2O3 〉=33%, LOI≤15%.
5. the preparation method of a low heat conductivity siliceous mullite brick is characterized in that may further comprise the steps:
A.) one-level bauxitic clay, silicon-carbide particle are mixed in proportion;
B.) choose experienced;
C.) the broken pulverizing;
D.) deironing;
E.) screening is returned to c. with the oversize that sieves gained) step cycle, the minus mesh of screening gained enters next step;
F.) batching, and add the composite micro-powder wedding agent;
G.) mixing;
H.) high-pressure molding;
I.) low-firing;
J.) finish.
6. the preparation method of described low heat conductivity siliceous mullite brick according to claim 5 is characterized in that described h.) the high-pressure molding stage is by 630t and the compression moulding of 400t friction press.
7. the preparation method of described low heat conductivity siliceous mullite brick according to claim 5 is characterized in that described i.) the low-firing stage adopts 100 ℃ firing temperature.
8. the preparation method of described low heat conductivity siliceous mullite brick according to claim 5 is characterized in that, the blending ratio of described one-level bauxitic clay and described silicon-carbide particle is 10: 1.
CN201110202686.9A 2011-07-20 2011-07-20 A kind of low heat conductivity siliceous mullite brick and preparation method thereof Expired - Fee Related CN102887713B (en)

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Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN103234346A (en) * 2013-05-10 2013-08-07 郑州瑞泰耐火科技有限公司 Low-heat-conduction multi-layer mullite brick and preparation method thereof
CN103755363A (en) * 2013-12-27 2014-04-30 郑州汇特耐火材料有限公司 Lightweight siliceous mullite composite brick and preparation method thereof
CN109851332A (en) * 2019-01-22 2019-06-07 浙江圣奥耐火材料有限公司 A kind of low thermally conductive high wear-resistant brick of tertiary-air pipe and its processing technology
CN112759349A (en) * 2021-01-27 2021-05-07 巩义市宏宇耐火材料有限公司 Aluminum silicon carbide grouting material

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN1847190A (en) * 2006-04-27 2006-10-18 鞍山市耘路耐火材料厂 Alumina brick
CN101838150A (en) * 2010-04-01 2010-09-22 范圣良 Siliceous mullite brick

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN1847190A (en) * 2006-04-27 2006-10-18 鞍山市耘路耐火材料厂 Alumina brick
CN101838150A (en) * 2010-04-01 2010-09-22 范圣良 Siliceous mullite brick

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN103234346A (en) * 2013-05-10 2013-08-07 郑州瑞泰耐火科技有限公司 Low-heat-conduction multi-layer mullite brick and preparation method thereof
CN103755363A (en) * 2013-12-27 2014-04-30 郑州汇特耐火材料有限公司 Lightweight siliceous mullite composite brick and preparation method thereof
CN109851332A (en) * 2019-01-22 2019-06-07 浙江圣奥耐火材料有限公司 A kind of low thermally conductive high wear-resistant brick of tertiary-air pipe and its processing technology
CN112759349A (en) * 2021-01-27 2021-05-07 巩义市宏宇耐火材料有限公司 Aluminum silicon carbide grouting material

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