CN102883557B - Production process improvement method of flexible printed circuit board containing welding finger - Google Patents
Production process improvement method of flexible printed circuit board containing welding finger Download PDFInfo
- Publication number
- CN102883557B CN102883557B CN201210394016.6A CN201210394016A CN102883557B CN 102883557 B CN102883557 B CN 102883557B CN 201210394016 A CN201210394016 A CN 201210394016A CN 102883557 B CN102883557 B CN 102883557B
- Authority
- CN
- China
- Prior art keywords
- circuit
- finger
- flexible pcb
- welding
- welding finger
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
Landscapes
- Structure Of Printed Boards (AREA)
Abstract
The invention relates to the field of the manufacturing of a flexible printed circuit board (FPC). The invention relates to a production process improvement method of a FPC containing a welding finger, and the method comprises a manufacturing process as: A, blanking; B, drilling; C, sinking copper plating; D, exposing and aligning; E, circuit formation; F, circuit detection; G, surface treatment and electric energy test; H, appearance detection; and I, detection and packaging. The main improved flow is as follows: B, drilling, to be specific, drilling a semi-arc tin climbing hole, a circular hole and a mold positioning hole of a finger soldering pad together; D, exposing and aligning, to be specific, producing a dislocated mark in an area outside a circuit on a film negative, and realizing the aligning of the film negative of an exposed circuit by utilizing the socket Pin aligning; and F, circuit detection, to be specific, besides the detection of conventional items, detecting whether the dislocated mark on the FPC is aligned or not. The method is used for manufacturing the FPC of a welding finger with excellent quality.
Description
Technical field
The present invention relates to FPC(flexible PCB) manufacture field, the manufacturing process especially containing the flexible PCB of welding finger is improved.
Background technology
A wherein series products of flexible PCB (FPC) is the flexible PCB containing welding finger, each finger pad specifically on double-deck FPC there are two plated-through holes (PTH), one of them is full-round hole, be positioned at the centre of finger pad, another be the semi arch being positioned at finger pad end climb tin hole; By these 2 holes on finger pad, for this FPC soft board is welded in PCB hardboard.
General manufacturing process containing the flexible PCB welding finger is: sawing sheet → boring (product semi arch corresponding aperture and full-round hole are realized by boring, and mould location hole is realized by punching) → heavy copper facing → exposure aligning (manual alignment) → circuit formation → line inspection → surface treatment and electric performance test → profile measurement (whether detection welding finger has dislocation and whether product has the empty difference in size of semi arch) → test package.
Conventional manufacture method effectively management and control can not weld two-sided pad and the semi arch hole dimension of finger, Shortcomings and limitation, and part namely may be caused to weld finger pad dislocation bad phenomenon and semi arch hole quality bad phenomenon.
Summary of the invention
Therefore, the present invention proposes a kind of flexible PCB manufacturing process containing welding finger and improves one's methods, the generation overcoming above-mentioned bad phenomenon can be realized, effectively management and control can weld two-sided pad and the semi arch hole dimension of finger, thus ensure that this contains the good welds characteristic of the flexible PCB of welding finger.
The present invention specifically adopts following technical scheme:
Containing the flexible PCB manufacture craft modification method of welding finger, wherein, should comprise containing the flexible PCB manufacturing process of welding finger: A, sawing sheet → B, boring → C, heavy copper facing → D, exposure aligning → E, circuit formation → F, line inspection → G, surface treatment and electric performance test → H, profile measurement → I, test package.Main modified flow is: B, boring; D, exposure aligning; F, line is examined; Other flow process adopts common process.Concrete,
B, boring: it is all together by getting out that the semi arch of finger pad climbs tin hole, full-round hole and mould location hole;
D, exposure aligning: film egative film makes at circuit exterior domain and detects by dislocation mark, use cover PIN contraposition to realize exposing the film egative film contraposition of circuit;
F, line is examined: except inspection conventional project, and also the dislocation detected on flexible PCB identifies whether contraposition.
Of the present invention containing welding finger flexible PCB manufacture craft modification method can production welding performance good welding finger flexible PCB, the Advantageous Effects had is:
1) welding finger semi arch can be solved and rush inclined problem;
2) welding finger 2 problem of misalignment can be solved;
3) the welding finger welding PCB hardboard electrical property quality of FPC is guaranteed.
Accompanying drawing explanation
Fig. 1 is the folded composition of the flexible PCB containing welding finger;
Fig. 2 a is the front schematic view of the flexible PCB containing welding finger;
Fig. 2 b is the reverse side schematic diagram of the flexible PCB containing welding finger;
Fig. 3 is the schematic diagram of the bore operation containing the flexible PCB welding finger;
Fig. 4 is the schematic diagram of the detection dislocation mark containing the film egative film of the flexible PCB welding finger.
Embodiment
Now the present invention is further described with embodiment by reference to the accompanying drawings.
Consulting shown in Fig. 1 is a kind of structure of flexible PCB containing welding finger, is form a conductive metal layer 2 on a flexible insulating substrate 1; Generally, described conductive metal layer 2 also covers one deck welding resisting layer 3, and to protect conductive metal layer 2 not to be destroyed when welding, welding finger areas 4 arranges finger pad and holes and realize.
What Fig. 2 a and Fig. 2 b showed respectively is the obverse and reverse containing the flexible PCB that welding is pointed.As seen from the figure: each finger pad on this double-deck FPC all has two plated-through holes (PTH), one of them is full-round hole, be positioned at the centre of finger pad, another be the semi arch being positioned at finger pad end climb tin hole.The qualified flexible PCB containing welding finger is that the finger pad locations of requirement obverse and reverse wants completely corresponding, can not occur upper and lower mistake, and two plated-through holes, especially the size of climbing tin hole of semi arch will meet normal size.
Applicant finds through practical studies, if 2 welding fingers exceed calculated value, then there will be poor short circuit phenomenon during welding, its theoretical calculation formula is: Double-side line egative film design dislocation extreme value (y)=adjacent 2 via pad distance value (d)-0.05mm of welding finger tips.
Containing the flexible PCB manufacture craft of welding finger, comprise following manufacturing process: A, sawing sheet → B, boring → C, heavy copper facing → D, exposure aligning → E, circuit formation → F, line inspection → G surface treatment and electric performance test → H, profile measurement → I, test package.Be described as follows:
A, sawing sheet: i.e. base material sawing sheet, this is Conventional process steps, therefore launches explanation no longer in detail;
B, boring: consult shown in Fig. 3, it is all together by getting out that the semi arch of finger pad climbs tin hole, full-round hole and mould location hole.Applicant finds, the mould location hole in existing technique is gone out by punching, instead of got out by boring, is difficult to like this ensure that the semi arch of contraposition climbs the quality in tin hole.Because the forming process that semi arch climbs tin hole is: get out the row full-round hole the same with via hole in finger pad edge position, then forming the hole of semi arch by blocking during die-cut profile, positioning again die-cut by mould location hole during die-cut profile.Therefore, it is first by boring that semi arch climbs tin hole, and carry out die-cut formation by mould location hole location again, mould location hole then carrys out punching by contraposition target center, therefore this 2 procedure certainly exists combined tolerances.If mould location hole together gets out by climbing tin hole with semi arch, so just there is not any combined tolerances, the semi arch that just can ensure to point pad better climbs the size in tin hole; In addition, the precision of bore operation is also higher than punching;
C, heavy copper facing: this is Conventional process steps, therefore launches explanation no longer in detail;
D, exposure aligning: after above-mentioned heavy copper facing, before carrying out circuit successively, chemical cleaning, circuit paste dry film, then carry out circuit exposure; Wherein, be use cover PIN contraposition to realize the contraposition of exposure circuit egative film during circuit exposure.Because 2 welding fingers of this flexible PCB are realized by egative film exposure when circuit is formed; Applicant finds: if adopt conventional manual alignment, 2 different benchmark will be caused like this to carry out each artoregistration, thus causes part to weld finger dislocation bad phenomenon; And use cover PIN contraposition, then tolerance can be reduced to minimum.In addition, make at the circuit exterior domain of film egative film and detect by dislocation mark, for step F, among line inspection.The figure of dislocation mark to be the film egative film in front and the film egative film of reverse side the be relation of corresponding to each other.Such as preferred, the film egative film in front makes solid circles, the film egative film of reverse side makes hollow ring, the solid circles on the film egative film in front can corresponding be inserted in the hollow ring on the film egative film of reverse side.Preferred again, assuming that the circuit of the positive and negative of this flexible PCB allows maximum dislocation value to be ± 0.1mm, the overall diameter of the solid circles on the film egative film in then front is 0.8mm, the inner ring diameter of the hollow ring on the film egative film of reverse side is 1.0mm, as long as then the wrong error of positive and negative is in ± 0.1mm, solid circles must fall in hollow ring and there will not be overlap.Or, also can make other and similar meet positive and negative and to correspond to each other other figures of relation.Such as, the employing positive and negative be similar in new edition RMB are the counterfeit protection measures of en circle diagram shape respectively, if during dislocation, 2 en circle diagram shapes may be separated or overlap.And for example, the dislocation mark in front is circle, and the dislocation mark of reverse side is spider, and spider is corresponding in circle; Etc. multiple positive and negative correspond to each other relation other figures dislocation mark;
E, circuit is formed: specifically comprise: circuit development, circuit etching, circuit stripping.This flow process E adopts common process to realize, and therefore launches explanation no longer in detail.Needs illustrate, different from routine, detect by the mark that misplaces owing to making on film egative film in step D, therefore when the circuit of step e is formed, and the inevitable layers of copper forming the mark figure that misplaces on the positive and negative of flexible circuit board substrate;
F, line is examined: this step is except inspection conventional project, and also the dislocation detected on flexible PCB identifies whether contraposition.Because 2 of this FPC welding fingers are realized by the exposure of film egative film when circuit is formed, and 2 film egative films in common process do not make dislocation mark, thus cause judging whether 2 welding fingers occur dislocation bad phenomenon in processing procedure.Consult shown in Fig. 4, and the present invention is in step D, during exposure aligning, film egative film makes and detects by dislocation mark, and in step F, during line inspection, except inspection conventional project, also the dislocation detected on flexible PCB identifies whether contraposition, and whether just can misplace have by dislocation label detection 2 welding finger exceeds required tolerance value.Be described with the dislocation mark figure of solid circles and hollow ring.Due to when step D, the film egative film of positive and negative makes respectively the dislocation mark of solid circles and the hollow ring detected, therefore the circuit exterior domain when the circuit of step e is formed just on the positive and negative of the flexible circuit board substrate of printing opacity forms the layers of copper of solid circles and hollow ring figure respectively, auxiliary or the direct visual perception by illumination transmission, can find whether solid circles falls within the scope of hollow ring, the dislocation detecting on flexible PCB identifies whether contraposition, thus judges whether whole circuit layers of copper misplaces;
G surface treatment and electric performance test: this road flow process is also adopt common process to realize, and specifically comprises: primary chemical cleaning, top/end coverlay location, pressing, baking, punching, secondary chemical cleaning, front text printout, secondary baking, the inspection of conventional line, nog plate washing are dried, plated the steps such as soft gold, QC, itemize, breaking process wire, electrical measurement;
H, profile measurement: this is Conventional process steps, launches explanation no longer in detail;
I, test package: carry out FQC, FQA inspection and packaging warehouse-in.This is Conventional process steps also, launches explanation no longer in detail.
Although specifically show in conjunction with preferred embodiment and describe the present invention; but those skilled in the art should be understood that; not departing from the spirit and scope of the present invention that appended claims limits; can make a variety of changes the present invention in the form and details, be protection scope of the present invention.
Claims (3)
1. containing the flexible PCB manufacture craft modification method of welding finger, wherein should comprise containing the flexible PCB manufacturing process of welding finger: A, sawing sheet → B, boring → C, heavy copper facing → D, exposure aligning → E, circuit formation → F, line inspection → G, surface treatment and electric performance test → H, profile measurement → I, test package; It is characterized in that:
B, boring: it is all together by getting out that the semi arch of finger pad climbs tin hole, full-round hole and mould location hole;
D, exposure aligning: film egative film makes at circuit exterior domain and detects by dislocation mark, use cover PIN contraposition to realize exposing the film egative film contraposition of circuit;
F, line is examined: except inspection conventional project, and also the dislocation detected on flexible PCB identifies whether contraposition.
2. the flexible PCB manufacture craft modification method containing welding finger according to claim 1, is characterized in that: dislocation mark is solid circles and hollow ring respectively.
3. the flexible PCB manufacture craft modification method containing welding finger according to claim 2, is characterized in that: the overall diameter of solid circles is 0.8mm, and the inner ring diameter of hollow ring is 1.0mm.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201210394016.6A CN102883557B (en) | 2012-10-17 | 2012-10-17 | Production process improvement method of flexible printed circuit board containing welding finger |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201210394016.6A CN102883557B (en) | 2012-10-17 | 2012-10-17 | Production process improvement method of flexible printed circuit board containing welding finger |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN102883557A CN102883557A (en) | 2013-01-16 |
| CN102883557B true CN102883557B (en) | 2015-06-03 |
Family
ID=47484633
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201210394016.6A Active CN102883557B (en) | 2012-10-17 | 2012-10-17 | Production process improvement method of flexible printed circuit board containing welding finger |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN102883557B (en) |
Families Citing this family (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103582317B (en) * | 2013-10-16 | 2016-07-06 | 镇江华印电路板有限公司 | Flexible printed wiring board leakage stannum semicircle orifice manufacture method |
| CN103687315B (en) * | 2013-12-12 | 2017-02-15 | 广州兴森快捷电路科技有限公司 | Designing method of punching alignment target |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101772268A (en) * | 2009-12-22 | 2010-07-07 | 深圳市集锦线路板科技有限公司 | Technology for aligning circuit board by PIN nail |
| CN101951736A (en) * | 2010-09-17 | 2011-01-19 | 深圳市集锦线路板科技有限公司 | Process for producing circuit board metallized semi-holes |
| CN202145703U (en) * | 2011-07-29 | 2012-02-15 | 索尔思光电（成都）有限公司 | Flexible circuit board |
-
2012
- 2012-10-17 CN CN201210394016.6A patent/CN102883557B/en active Active
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101772268A (en) * | 2009-12-22 | 2010-07-07 | 深圳市集锦线路板科技有限公司 | Technology for aligning circuit board by PIN nail |
| CN101951736A (en) * | 2010-09-17 | 2011-01-19 | 深圳市集锦线路板科技有限公司 | Process for producing circuit board metallized semi-holes |
| CN202145703U (en) * | 2011-07-29 | 2012-02-15 | 索尔思光电（成都）有限公司 | Flexible circuit board |
Also Published As
| Publication number | Publication date |
|---|---|
| CN102883557A (en) | 2013-01-16 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| JP4757083B2 (en) | Wiring circuit board assembly sheet | |
| CN103379749B (en) | Multilayer circuit board and preparation method thereof | |
| CN108990318A (en) | A kind of method for manufacturing circuit board of loophole lamination mistake proofing | |
| CN110099523A (en) | A kind of manufacture craft of multilayer circuit board | |
| CN103179790A (en) | Mixed-compressing printed circuit board and manufacture method thereof | |
| CN102883557B (en) | Production process improvement method of flexible printed circuit board containing welding finger | |
| CN103096646B (en) | The manufacture method of the multilager base plate of embedded element | |
| CN103796415B (en) | Multilayer circuit board and method for manufacturing same | |
| CN104684277A (en) | Method for manufacturing gold fingers of printed circuit board | |
| CN107645855A (en) | Non-conductor electroplating circuit board and preparation method thereof | |
| CN105517373B (en) | A kind of production method of PCB backboards outer-layer circuit figure | |
| US20140110152A1 (en) | Printed circuit board and method for manufacturing same | |
| CN106525114A (en) | Method for testing production line hole making capability in positive process | |
| CN103857204A (en) | Bearing plate and manufacture method for the same | |
| TWI462660B (en) | Printed circuit board and method for manufacturing same | |
| CN217693821U (en) | 3D interconnection high density PCB board | |
| US20230199945A1 (en) | Method for manufacturing flexible printed circuit board | |
| CN105633054A (en) | Package substrate and method for fabricating the same | |
| CN108366492A (en) | It is a kind of pre- big without lead electro-plating method based on finger connection position | |
| CN114430609B (en) | Battery protection plate, processing method and electronic equipment | |
| CN207625877U (en) | A kind of inclined inspection structure of golden finger erosion control | |
| CN112601388A (en) | Inner core board anti-stacking PCB and monitoring method | |
| CN106102352B (en) | A method of solving non-symmetrical line slab warping | |
| JP2007027341A (en) | Printed wiring board and electronic-components mounting structure | |
| JP2014192259A (en) | Double-sided wiring flexible substrate and inspection method thereof |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C06 | Publication | ||
| PB01 | Publication | ||
| C10 | Entry into substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant |