CN102856396B - 光传感器装置 - Google Patents
光传感器装置 Download PDFInfo
- Publication number
- CN102856396B CN102856396B CN201210224283.9A CN201210224283A CN102856396B CN 102856396 B CN102856396 B CN 102856396B CN 201210224283 A CN201210224283 A CN 201210224283A CN 102856396 B CN102856396 B CN 102856396B
- Authority
- CN
- China
- Prior art keywords
- glass
- optical sensor
- substrate
- sensor arrangement
- light sensor
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
- 239000011521 glass Substances 0.000 claims abstract description 151
- 239000000758 substrate Substances 0.000 claims abstract description 91
- 230000003287 optical effect Effects 0.000 claims abstract description 75
- 238000001465 metallisation Methods 0.000 claims description 6
- 229910044991 metal oxide Inorganic materials 0.000 claims description 5
- 150000004706 metal oxides Chemical class 0.000 claims description 5
- 230000000903 blocking effect Effects 0.000 claims description 2
- 238000004806 packaging method and process Methods 0.000 abstract description 17
- 229920005989 resin Polymers 0.000 description 30
- 239000011347 resin Substances 0.000 description 30
- 239000000463 material Substances 0.000 description 15
- 238000010521 absorption reaction Methods 0.000 description 14
- 238000009413 insulation Methods 0.000 description 9
- 239000000203 mixture Substances 0.000 description 9
- 239000003822 epoxy resin Substances 0.000 description 6
- 229920000647 polyepoxide Polymers 0.000 description 6
- 230000000694 effects Effects 0.000 description 4
- 239000002184 metal Substances 0.000 description 4
- 238000002844 melting Methods 0.000 description 3
- 238000007789 sealing Methods 0.000 description 3
- 239000000853 adhesive Substances 0.000 description 2
- 230000001070 adhesive effect Effects 0.000 description 2
- 229910010293 ceramic material Inorganic materials 0.000 description 2
- 239000012530 fluid Substances 0.000 description 2
- 238000004519 manufacturing process Methods 0.000 description 2
- 238000000465 moulding Methods 0.000 description 2
- 239000000049 pigment Substances 0.000 description 2
- 239000004065 semiconductor Substances 0.000 description 2
- 239000004593 Epoxy Substances 0.000 description 1
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical compound [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 description 1
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 1
- 230000006978 adaptation Effects 0.000 description 1
- 230000005540 biological transmission Effects 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- 239000000919 ceramic Substances 0.000 description 1
- 230000001351 cycling effect Effects 0.000 description 1
- 238000000354 decomposition reaction Methods 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 230000007613 environmental effect Effects 0.000 description 1
- 238000001914 filtration Methods 0.000 description 1
- 239000000156 glass melt Substances 0.000 description 1
- 238000005286 illumination Methods 0.000 description 1
- 238000009434 installation Methods 0.000 description 1
- 239000007788 liquid Substances 0.000 description 1
- 238000000034 method Methods 0.000 description 1
- 238000007639 printing Methods 0.000 description 1
- 230000000630 rising effect Effects 0.000 description 1
- 230000035945 sensitivity Effects 0.000 description 1
- 229910052710 silicon Inorganic materials 0.000 description 1
- 239000010703 silicon Substances 0.000 description 1
- 239000002356 single layer Substances 0.000 description 1
- 239000005361 soda-lime glass Substances 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L31/00—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L31/02—Details
- H01L31/0203—Containers; Encapsulations, e.g. encapsulation of photodiodes
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L31/00—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L31/02—Details
- H01L31/0216—Coatings
- H01L31/02161—Coatings for devices characterised by at least one potential jump barrier or surface barrier
- H01L31/02162—Coatings for devices characterised by at least one potential jump barrier or surface barrier for filtering or shielding light, e.g. multicolour filters for photodetectors
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/10—Bump connectors; Manufacturing methods related thereto
- H01L2224/15—Structure, shape, material or disposition of the bump connectors after the connecting process
- H01L2224/16—Structure, shape, material or disposition of the bump connectors after the connecting process of an individual bump connector
- H01L2224/161—Disposition
- H01L2224/16151—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/16221—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/16225—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/151—Die mounting substrate
- H01L2924/1515—Shape
- H01L2924/15151—Shape the die mounting substrate comprising an aperture, e.g. for underfilling, outgassing, window type wire connections
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Electromagnetism (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Power Engineering (AREA)
- Photometry And Measurement Of Optical Pulse Characteristics (AREA)
- Light Receiving Elements (AREA)
Abstract
Description
Claims (12)
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2011-145893 | 2011-06-30 | ||
JP2011145893A JP5736253B2 (ja) | 2011-06-30 | 2011-06-30 | 光センサ装置 |
Publications (2)
Publication Number | Publication Date |
---|---|
CN102856396A CN102856396A (zh) | 2013-01-02 |
CN102856396B true CN102856396B (zh) | 2016-11-23 |
Family
ID=47389596
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CN201210224283.9A Expired - Fee Related CN102856396B (zh) | 2011-06-30 | 2012-07-02 | 光传感器装置 |
Country Status (4)
Country | Link |
---|---|
US (1) | US8946664B2 (zh) |
JP (1) | JP5736253B2 (zh) |
CN (1) | CN102856396B (zh) |
TW (1) | TWI542021B (zh) |
Families Citing this family (15)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP5855917B2 (ja) * | 2011-11-17 | 2016-02-09 | セイコーインスツル株式会社 | 光センサ装置 |
US8987658B2 (en) * | 2012-11-28 | 2015-03-24 | Intersil Americas LLC | Packaged light detector semiconductor devices with non-imaging optical concentrators for ambient light and/or optical proxmity sensing, methods for manufacturing the same, and systems including the same |
JP6288499B2 (ja) | 2013-10-03 | 2018-03-07 | 日本電気硝子株式会社 | 強化ガラス板及びこれを用いた携帯端末 |
JP6415309B2 (ja) * | 2014-02-18 | 2018-10-31 | エイブリック株式会社 | 光センサ装置 |
US9825078B2 (en) | 2014-11-13 | 2017-11-21 | Visera Technologies Company Limited | Camera device having an image sensor comprising a conductive layer and a reflection layer stacked together to form a light pipe structure accommodating a filter unit |
KR101639741B1 (ko) * | 2015-03-26 | 2016-07-14 | (주)파트론 | 수광 센서 패키지 |
TWI615985B (zh) * | 2015-12-25 | 2018-02-21 | 財團法人工業技術研究院 | 光感測元件及其製造方法 |
DE102016209840A1 (de) | 2016-06-03 | 2017-12-07 | Continental Teves Ag & Co. Ohg | Sensor, Verfahren und Sensoranordnung |
US10649156B2 (en) * | 2016-12-23 | 2020-05-12 | Avago Technologies International Sales Pte. Limited | Optical sensing device having integrated optics and methods of manufacturing the same |
US10919473B2 (en) | 2017-09-13 | 2021-02-16 | Corning Incorporated | Sensing system and glass material for vehicles |
KR20200042541A (ko) * | 2017-09-13 | 2020-04-23 | 코닝 인코포레이티드 | 차량용 감지 시스템 및 유리 재료 |
TWI645321B (zh) * | 2017-10-17 | 2018-12-21 | 友達光電股份有限公司 | 觸控板 |
CN108217579A (zh) * | 2017-12-29 | 2018-06-29 | 中国科学院半导体研究所 | 基于硅玻璃阳极键合的圆片级高真空无引线封装方法 |
US10712197B2 (en) | 2018-01-11 | 2020-07-14 | Analog Devices Global Unlimited Company | Optical sensor package |
CN110751047B (zh) * | 2019-09-20 | 2021-08-31 | 维沃移动通信有限公司 | 一种指纹识别模组及电子设备 |
Citations (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN1471172A (zh) * | 2002-06-24 | 2004-01-28 | ��ʿ��Ƭ��ʽ���� | 固体摄像装置及其制造方法 |
CN1606158A (zh) * | 2003-06-11 | 2005-04-13 | 三星电子株式会社 | 互补金属氧化物半导体器件型图像传感器模块 |
CN1883056A (zh) * | 2003-11-14 | 2006-12-20 | 夏普株式会社 | 光收发元件用的子座 |
CN101044631A (zh) * | 2004-11-30 | 2007-09-26 | 国际商业机器公司 | 镶嵌铜布线图像传感器 |
EP2063629A1 (en) * | 2006-10-05 | 2009-05-27 | Panasonic Corporation | Imaging device, method for manufacturing the imaging device and cellular phone |
CN101558495A (zh) * | 2006-11-28 | 2009-10-14 | 凸版印刷株式会社 | 固体摄像装置及其制造方法 |
CN201845786U (zh) * | 2010-07-22 | 2011-05-25 | 原相科技股份有限公司 | 感测装置及其影像感测模块 |
Family Cites Families (9)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP3738824B2 (ja) * | 2000-12-26 | 2006-01-25 | セイコーエプソン株式会社 | 光学装置及びその製造方法並びに電子機器 |
US6885107B2 (en) * | 2002-08-29 | 2005-04-26 | Micron Technology, Inc. | Flip-chip image sensor packages and methods of fabrication |
JP2005038956A (ja) * | 2003-07-17 | 2005-02-10 | Matsushita Electric Ind Co Ltd | 光部品とその製造方法 |
DE102004031315A1 (de) * | 2004-06-29 | 2006-01-19 | Robert Bosch Gmbh | Mikrostrukturierter Infrarot-Sensor |
JP4296147B2 (ja) * | 2004-11-19 | 2009-07-15 | シャープ株式会社 | 光半導体装置および光半導体装置の製造方法 |
JP2007299929A (ja) * | 2006-04-28 | 2007-11-15 | Matsushita Electric Ind Co Ltd | 光学デバイス装置とそれを用いた光学デバイスモジュール |
US8525323B2 (en) * | 2008-07-25 | 2013-09-03 | Nec Corporation | Encapsulating package, printed circuit board, electronic device and method for manufacturing encapsulating package |
US8659105B2 (en) * | 2009-11-26 | 2014-02-25 | Kyocera Corporation | Wiring substrate, imaging device and imaging device module |
JP2012134397A (ja) * | 2010-12-22 | 2012-07-12 | Seiko Instruments Inc | 光学デバイスモジュール |
-
2011
- 2011-06-30 JP JP2011145893A patent/JP5736253B2/ja not_active Expired - Fee Related
-
2012
- 2012-04-16 TW TW101113500A patent/TWI542021B/zh not_active IP Right Cessation
- 2012-05-15 US US13/471,602 patent/US8946664B2/en not_active Expired - Fee Related
- 2012-07-02 CN CN201210224283.9A patent/CN102856396B/zh not_active Expired - Fee Related
Patent Citations (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN1471172A (zh) * | 2002-06-24 | 2004-01-28 | ��ʿ��Ƭ��ʽ���� | 固体摄像装置及其制造方法 |
CN1606158A (zh) * | 2003-06-11 | 2005-04-13 | 三星电子株式会社 | 互补金属氧化物半导体器件型图像传感器模块 |
CN1883056A (zh) * | 2003-11-14 | 2006-12-20 | 夏普株式会社 | 光收发元件用的子座 |
CN101044631A (zh) * | 2004-11-30 | 2007-09-26 | 国际商业机器公司 | 镶嵌铜布线图像传感器 |
EP2063629A1 (en) * | 2006-10-05 | 2009-05-27 | Panasonic Corporation | Imaging device, method for manufacturing the imaging device and cellular phone |
CN101558495A (zh) * | 2006-11-28 | 2009-10-14 | 凸版印刷株式会社 | 固体摄像装置及其制造方法 |
CN201845786U (zh) * | 2010-07-22 | 2011-05-25 | 原相科技股份有限公司 | 感测装置及其影像感测模块 |
Also Published As
Publication number | Publication date |
---|---|
JP2013011568A (ja) | 2013-01-17 |
CN102856396A (zh) | 2013-01-02 |
TWI542021B (zh) | 2016-07-11 |
US20130001409A1 (en) | 2013-01-03 |
US8946664B2 (en) | 2015-02-03 |
TW201308615A (zh) | 2013-02-16 |
JP5736253B2 (ja) | 2015-06-17 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
C06 | Publication | ||
PB01 | Publication | ||
SE01 | Entry into force of request for substantive examination | ||
SE01 | Entry into force of request for substantive examination | ||
C41 | Transfer of patent application or patent right or utility model | ||
TA01 | Transfer of patent application right |
Effective date of registration: 20160304 Address after: Chiba County, Japan Applicant after: SEIKO INSTR INC Address before: Chiba, Chiba, Japan Applicant before: Seiko Instruments Inc. |
|
C14 | Grant of patent or utility model | ||
GR01 | Patent grant | ||
CP01 | Change in the name or title of a patent holder |
Address after: Chiba County, Japan Patentee after: EPPs Lingke Co. Ltd. Address before: Chiba County, Japan Patentee before: SEIKO INSTR INC |
|
CP01 | Change in the name or title of a patent holder | ||
CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20161123 Termination date: 20210702 |
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CF01 | Termination of patent right due to non-payment of annual fee |