CN102854714A - Heat dissipation device of zoom camera - Google Patents
Heat dissipation device of zoom camera Download PDFInfo
- Publication number
- CN102854714A CN102854714A CN201210293074XA CN201210293074A CN102854714A CN 102854714 A CN102854714 A CN 102854714A CN 201210293074X A CN201210293074X A CN 201210293074XA CN 201210293074 A CN201210293074 A CN 201210293074A CN 102854714 A CN102854714 A CN 102854714A
- Authority
- CN
- China
- Prior art keywords
- sensor plate
- conducting film
- heat conducting
- camera
- chip
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Images
Landscapes
- Studio Devices (AREA)
- Camera Bodies And Camera Details Or Accessories (AREA)
Abstract
The invention provides a heat dissipation device of a zoom camera. The heat dissipation device comprises a casing, a Sensor board, a heat conduction film and a sensing chip, wherein the Sensor board is movably installed in the camera and can be driven by a transmission device to move in the camera to be far away from or close to a lens of the camera, the sensing chip is installed on the front surface of the Sensor board, the heat conduction film comprises an upper part, a bending part and a lower part, the upper part is adhered on the Sensor board, and the lower part is adhered on other heat dissipation elements in the casing or camera. According to the heat dissipation device provided by the invention, the heat conduction film is ingeniously utilized as a heat dissipation intermediation to be adapted to the moving of the Sensor board in the camera, so that the heat dissipation effect of the whole Sensor board cannot be reduced due to the moving of the Sensor board.
Description
Technical field
The present invention relates to the image acquisition field, relate in particular to the good Zoom camera heat abstractor of a kind of radiating effect.
Background technology
Gunlock has another name called rifle formula video camera, its zooming range can from several times to decades of times, and lens changing convenience very, so range of application is very broad.Gunlock heat radiation thin spot is CMOS or the CCD chip (being referred to as sensing chip) on the Sensor plate.If this image chip can not efficiently radiates heat under high-temperature condition, then can cause picture quality degradation even damage.
In the gunlock video camera, back focal length is also referred to as back of the body focal length, refers to when installing standard lens, can make the imaging of subject just on the target surface of Sensor imageing sensor.High-definition camera generally can carry out manually or burnt adjust (ABF) automatically.When carrying out back focal length when adjusting, the Sensor plate just need to move forward and backward, so the sensing chip on the Sensor plate just can not touch camera housing with the heat dissipation metal piece and dispels the heat.The contact of heat dissipation metal piece discord housing, so the thermal resistance between sensing chip and the external environment is very large, radiating effect is relatively poor, can not effectively solve the heat radiation of sensing chip.
Summary of the invention
In view of this, the invention provides a kind of Zoom camera heat abstractor, comprise casing, Sensor plate, heat conducting film and sensing chip, wherein said Sensor plate is installed in video camera inside actively, and can under the drive of gearing, in video camera, move with away from or near the camera lens of video camera; Described sensing chip is installed in the front of Sensor plate; Described heat conducting film comprises top, kink and bottom.Wherein said top sticks on the Sensor plate, and described bottom sticks on casing or inner other heat dissipation elements of video camera.
Preferably, when the top of heat conducting film sticked on Sensor plate positive, if sensing chip is the CCD chip, then the top of heat conducting film extended to the below of CCD chip.
Preferably, when the top of heat conducting film sticked on Sensor plate positive, if sensing chip is the CMOS chip, heat conducting film can stick on the Sensor plate 2 positive zones around the CMOS chip usually.
Preferably, the Sensor plate by zone that top covered for forbidding laying element area.
Preferably, described heat conducting film is that flexible material is made.
Preferably, described heat conducting film is the graphite guide hotting mask.
Preferably, when the Sensor plate seesaws with respect to camera lens, described kink is driven and deformation or displacement occurs, and the size of described kink is set to guarantee in Sensor plate motion process, the impact that can not be moved in heat conducting film top and bottom and occur to paste and come off.
The present invention utilizes heat conducting film to adapt to the movement of the inner Sensor plate of video camera as the heat radiation intermediary dexterously, so that the problem that the radiating effect of whole Sensor plate can not descend because of the motion of Sensor plate.
Description of drawings
Fig. 1 is Sensor plate and the heat conducting film scheme of installation of a kind of Zoom camera of the present invention when opening.
Fig. 2 is that heat conducting film is installed in stereographic map on the Sensor plate in one embodiment of the present invention.
Fig. 3 is that heat conducting film is installed in side view on the Sensor plate in one embodiment of the present invention.
Embodiment
Please refer to Fig. 1 and Fig. 2, the invention provides a kind of Zoom camera heat abstractor, it comprises casing 1, Sensor plate 2, heat conducting film 4 and sensing chip 3.In a kind of typical embodiment, described video camera is rifle formula video camera.Sensing chip 3 can be CCD chip or CMOS chip.Heat conducting film 4 is flexible graphite guide hotting masks.
Described Sensor plate 2 be shaped as rectangle, it comprises some mounting holes; Some mounting holes mainly are in order to assist Sensor plate 2 to be installed to more expediently video camera inside.Sensor plate 2 can be installed in video camera inside usually actively, and can move in video camera under the drive of gearing (not shown, such as electro-motor), with away from or near the camera lens of video camera.
Described sensing chip 3 is installed in the front of Sensor plate 2, and usually is installed in middle position.Described heat conducting film 4 comprises top 41, kink 42 and bottom 43.Wherein said top 41 sticks on front or the back side of Sensor plate 2, and described bottom 43 sticks on the casing 1.In preferred embodiment, heat conducting film 4 can carry viscous layer, because heat conducting film 4 itself is more frivolous, so viscous layer is usually very thin, so the Heat Transfer Influence between heat conducting film 4 and casing 1 and heat conducting film 4 and the Sensor plate 2 can be ignored.In other embodiments, also can realize with thinner double faced adhesive tape the paste operation of top 41 and the bottom 42 of heat conducting film 4, the principle of choosing double faced adhesive tape is the impact that reduces as small as possible heat-conducting effect, should be able to guarantee long adhesion effect simultaneously.
When the top 41 of heat conducting film 4 sticks on Sensor plate positive, if sensing chip 3 is the CCD chip, then the top 41 of heat conducting film 4 extends to the bottom (the namely zone of the Sensor plate 2 that covers of CCD chip) of CCD chip, because the CCD chip adopts the plug-in mounting mode to be welded on the Sensor plate 2 usually, therefore have certain gap between CCD chip and the Sensor plate 2, this gap allows heat conducting film 4 to extend to the zone of CCD chip below.When the top 41 of heat conducting film 4 sticks on Sensor plate positive; if sensing chip 3 is the CMOS chip; because the CMOS chip normally is welded on the Sensor plate 2 by the paster mode; therefore the top 41 of heat conducting film 4 can't extend to the below of CMOS chip, and heat conducting film 4 can stick on other zones in Sensor plate 2 fronts around the CMOS chip usually.
In preferred embodiment, no matter top 41 sticks on front or the back side of Sensor plate 2, the zone that Sensor plate 2 is covered by top 41 is for forbidding laying element area, can guarantee like this to have more fully between top 41 and the Sensor plate and contact, obtaining better heat-transfer effect, if laid a lot of devices might affect heat conducting film 4 and Sensor plate 2 between heat-transfer effect.
Please refer to Fig. 3, when Sensor plate 2 side-to-side movements among Fig. 3 (being to seesaw for camera lens), kink 42 can be driven and certain deformation or displacement occur, because heat conducting film 4 itself is flexible material, when the size of kink 42 arranges when reasonable, can guarantee at Sensor plate 2 in motion process the impact that can not be moved in heat conducting film top 41 and bottom 42 and occur to paste and come off.In most of situation, 2 side-to-side movements of Sensor plate all have position, left and right sides boundary, and this performance with zoom is relevant, and the zoom performance is normally fixed, so position, left and right sides boundary is also fixed.Therefore, the size of kink 42 can be set according to the distance of the side-to-side movement of Sensor plate when exploitation.Usually the size of kink 42 has larger surplus in design, can guarantee like this in the process of whole Sensor plate 2 motions, top 41 and bottom 42 can be subject to the effect of any power hardly, in the situation that so can guarantee repeatedly to move, the sticking effect of top 41 and bottom 42 can not change substantially.
In other embodiment, bottom 42 can also stick on other heat dissipation elements, on the heat radiating metal piece except sticking on the such heat dissipation element of casing 1.Above-mentioned preferred embodiment in, the present invention also can dispense heat radiating metal piece commonly used, the heat that distributes of sensing chip passes through heat conducting film, soft graphite heat conducting film such as high-termal conductivity is delivered on the casing, and is simple in structure, radiating effect is remarkable, does not have obvious heat insulation factor.
The present invention utilizes heat conducting film to adapt to the movement of the inner Sensor plate of video camera as the heat radiation intermediary dexterously, so that the problem that the radiating effect of whole Sensor plate can not descend because of the motion of Sensor plate.
The above only is preferred embodiment of the present invention, and is in order to limit the present invention, within the spirit and principles in the present invention not all, any modification of making, is equal to replacement, improvement etc., all should be included within the scope of protection of the invention.
Claims (7)
1. Zoom camera heat abstractor, comprise casing, Sensor plate, heat conducting film and sensing chip, it is characterized in that, described Sensor plate is installed in video camera inside actively, and can under the drive of gearing, in video camera, move with away from or near the camera lens of video camera; Described sensing chip is installed in the front of Sensor plate; Described heat conducting film comprises top, kink and bottom.Wherein said top sticks on the Sensor plate, and described bottom sticks on casing or inner other heat dissipation elements of video camera.
2. device as claimed in claim 1 is characterized in that, when the top of heat conducting film sticked on Sensor plate positive, if sensing chip is the CCD chip, then the top of heat conducting film extended to the below of CCD chip.
3. device as claimed in claim 1 is characterized in that, when the top of heat conducting film sticked on Sensor plate positive, if sensing chip is the CMOS chip, heat conducting film can stick on the positive zone of Sensor plate around the CMOS chip usually.
4. device as claimed in claim 1 is characterized in that, the Sensor plate by zone that top covered for forbidding laying element area.
5. device as claimed in claim 1 is characterized in that, described heat conducting film is that flexible material is made.
6. device as claimed in claim 1 is characterized in that, described heat conducting film is the graphite guide hotting mask.
7. device as claimed in claim 1, it is characterized in that, when the Sensor plate seesaws with respect to camera lens, described kink is driven and deformation or displacement occurs, the size of described kink is set to guarantee in Sensor plate motion process, the impact that can not be moved in heat conducting film top and bottom and occur to paste and come off.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201210293074XA CN102854714A (en) | 2012-08-16 | 2012-08-16 | Heat dissipation device of zoom camera |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201210293074XA CN102854714A (en) | 2012-08-16 | 2012-08-16 | Heat dissipation device of zoom camera |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN102854714A true CN102854714A (en) | 2013-01-02 |
Family
ID=47401421
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201210293074XA Pending CN102854714A (en) | 2012-08-16 | 2012-08-16 | Heat dissipation device of zoom camera |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN102854714A (en) |
Cited By (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106922105A (en) * | 2015-12-25 | 2017-07-04 | 小米科技有限责任公司 | Fin and electronic equipment |
| CN109076722A (en) * | 2017-12-21 | 2018-12-21 | 深圳市大疆创新科技有限公司 | Camera, photographic device and unmanned plane |
| CN110602360A (en) * | 2019-09-03 | 2019-12-20 | Oppo广东移动通信有限公司 | Camera module, camera device and electronic equipment |
| US10692906B2 (en) | 2017-10-10 | 2020-06-23 | Axis Ab | Camera |
| CN112399060A (en) * | 2020-11-18 | 2021-02-23 | 杭州海康威视数字技术股份有限公司 | Video camera |
| WO2021103529A1 (en) * | 2019-11-27 | 2021-06-03 | 杭州海康威视数字技术股份有限公司 | Camera |
| CN113315893A (en) * | 2021-05-17 | 2021-08-27 | 杭州海康威视数字技术股份有限公司 | Camera and video equipment |
Citations (13)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2003143451A (en) * | 2001-11-02 | 2003-05-16 | Canon Inc | Solid-state image pickup device |
| JP2004333545A (en) * | 2003-04-30 | 2004-11-25 | Cis:Kk | Imaging apparatus |
| JP2005094731A (en) * | 2003-09-12 | 2005-04-07 | Robert Bosch Gmbh | Camera apparatus and method of manufacturing the same |
| JP2006010983A (en) * | 2004-06-24 | 2006-01-12 | Ricoh Co Ltd | Digital camera |
| JP2006243163A (en) * | 2005-03-01 | 2006-09-14 | Toa Corp | Back focus adjustment mechanism |
| JP2006319124A (en) * | 2005-05-12 | 2006-11-24 | Fuji Photo Film Co Ltd | Solid state imaging apparatus |
| JP2006340299A (en) * | 2005-06-06 | 2006-12-14 | Fujifilm Holdings Corp | Image sensor package, lens unit, and digital camera |
| US20080055420A1 (en) * | 2006-09-05 | 2008-03-06 | Sony Corporation | Camera shake correction mechanism and image capture apparatus |
| JP2009284414A (en) * | 2008-05-26 | 2009-12-03 | Olympus Imaging Corp | Imaging unit and imaging apparatus |
| CN101639606A (en) * | 2008-07-30 | 2010-02-03 | 索尼株式会社 | Optical focusing device |
| JP2010205916A (en) * | 2009-03-03 | 2010-09-16 | Olympus Corp | Semiconductor unit, and electronic imaging apparatus |
| CN102375296A (en) * | 2010-08-24 | 2012-03-14 | 佳能株式会社 | Image pickup apparatus |
| JP2012128138A (en) * | 2010-12-15 | 2012-07-05 | Canon Inc | Image pickup apparatus and control method of image pickup apparatus |
-
2012
- 2012-08-16 CN CN201210293074XA patent/CN102854714A/en active Pending
Patent Citations (13)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2003143451A (en) * | 2001-11-02 | 2003-05-16 | Canon Inc | Solid-state image pickup device |
| JP2004333545A (en) * | 2003-04-30 | 2004-11-25 | Cis:Kk | Imaging apparatus |
| JP2005094731A (en) * | 2003-09-12 | 2005-04-07 | Robert Bosch Gmbh | Camera apparatus and method of manufacturing the same |
| JP2006010983A (en) * | 2004-06-24 | 2006-01-12 | Ricoh Co Ltd | Digital camera |
| JP2006243163A (en) * | 2005-03-01 | 2006-09-14 | Toa Corp | Back focus adjustment mechanism |
| JP2006319124A (en) * | 2005-05-12 | 2006-11-24 | Fuji Photo Film Co Ltd | Solid state imaging apparatus |
| JP2006340299A (en) * | 2005-06-06 | 2006-12-14 | Fujifilm Holdings Corp | Image sensor package, lens unit, and digital camera |
| US20080055420A1 (en) * | 2006-09-05 | 2008-03-06 | Sony Corporation | Camera shake correction mechanism and image capture apparatus |
| JP2009284414A (en) * | 2008-05-26 | 2009-12-03 | Olympus Imaging Corp | Imaging unit and imaging apparatus |
| CN101639606A (en) * | 2008-07-30 | 2010-02-03 | 索尼株式会社 | Optical focusing device |
| JP2010205916A (en) * | 2009-03-03 | 2010-09-16 | Olympus Corp | Semiconductor unit, and electronic imaging apparatus |
| CN102375296A (en) * | 2010-08-24 | 2012-03-14 | 佳能株式会社 | Image pickup apparatus |
| JP2012128138A (en) * | 2010-12-15 | 2012-07-05 | Canon Inc | Image pickup apparatus and control method of image pickup apparatus |
Cited By (10)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106922105A (en) * | 2015-12-25 | 2017-07-04 | 小米科技有限责任公司 | Fin and electronic equipment |
| CN106922105B (en) * | 2015-12-25 | 2019-02-19 | 小米科技有限责任公司 | Cooling fin and electronic equipment |
| US10692906B2 (en) | 2017-10-10 | 2020-06-23 | Axis Ab | Camera |
| CN109076722A (en) * | 2017-12-21 | 2018-12-21 | 深圳市大疆创新科技有限公司 | Camera, photographic device and unmanned plane |
| CN110602360A (en) * | 2019-09-03 | 2019-12-20 | Oppo广东移动通信有限公司 | Camera module, camera device and electronic equipment |
| WO2021103529A1 (en) * | 2019-11-27 | 2021-06-03 | 杭州海康威视数字技术股份有限公司 | Camera |
| CN112965325A (en) * | 2019-11-27 | 2021-06-15 | 杭州海康威视数字技术股份有限公司 | Video camera |
| CN112965325B (en) * | 2019-11-27 | 2022-03-11 | 杭州海康威视数字技术股份有限公司 | Video camera |
| CN112399060A (en) * | 2020-11-18 | 2021-02-23 | 杭州海康威视数字技术股份有限公司 | Video camera |
| CN113315893A (en) * | 2021-05-17 | 2021-08-27 | 杭州海康威视数字技术股份有限公司 | Camera and video equipment |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN102854714A (en) | Heat dissipation device of zoom camera | |
| KR102071925B1 (en) | Camera module | |
| CN204089956U (en) | There is camera module and the mobile phone of refrigerating function | |
| US7334951B2 (en) | Camera head | |
| CN104580852B (en) | Cell-phone camera device and mobile phone | |
| US20150070565A1 (en) | Camera module and camera apparatus | |
| US8432486B2 (en) | Heat dissipating structure for an imaging unit | |
| CN202307857U (en) | Heat radiation fin of CCD image sensor | |
| CN106534626A (en) | Thermally conductive camera enclosure | |
| CN107896467B (en) | Electronic equipment | |
| JP2016502371A (en) | Video shooting device | |
| CN101650521A (en) | Portable communication device | |
| CN106131383A (en) | A kind of camera module and electronic equipment | |
| CN102868851B (en) | Camera heat-radiating device | |
| CN112788222B (en) | Camera module and electronic equipment | |
| WO2021185363A1 (en) | Electronic device and camera module that can be used independently | |
| CN109451217A (en) | Mobile terminal | |
| CN109361845B (en) | CCD camera structure capable of continuously shooting high-definition pictures | |
| WO2020088316A1 (en) | Fill light module and terminal device | |
| CN206363017U (en) | Wear display device | |
| CN105785546A (en) | Closed loop single camera automatic focusing driving device of novel dustproof structure | |
| JP2014081504A (en) | Imaging unit and electronic apparatus | |
| JP2009060459A (en) | Heating suppressing method of imaging device, cooling method of imaging device, and electronic camera | |
| CN110291444A (en) | Camera model and Optical devices including liquid lens | |
| JP2007180706A (en) | Imaging apparatus |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C06 | Publication | ||
| PB01 | Publication | ||
| C10 | Entry into substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| WD01 | Invention patent application deemed withdrawn after publication |
Application publication date: 20130102 |
|
| WD01 | Invention patent application deemed withdrawn after publication |