CN102849351A - Chip box used for arranging driving chip - Google Patents

Chip box used for arranging driving chip Download PDF

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Publication number
CN102849351A
CN102849351A CN2012103807066A CN201210380706A CN102849351A CN 102849351 A CN102849351 A CN 102849351A CN 2012103807066 A CN2012103807066 A CN 2012103807066A CN 201210380706 A CN201210380706 A CN 201210380706A CN 102849351 A CN102849351 A CN 102849351A
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CN
China
Prior art keywords
chip
brilliant
sulculus
putting
driving chip
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Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
CN2012103807066A
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Chinese (zh)
Inventor
卢家福
计万里
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
SINO WEALTH ELECTRONIC CO Ltd
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SINO WEALTH ELECTRONIC CO Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
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Publication date
Application filed by SINO WEALTH ELECTRONIC CO Ltd filed Critical SINO WEALTH ELECTRONIC CO Ltd
Priority to CN2012103807066A priority Critical patent/CN102849351A/en
Publication of CN102849351A publication Critical patent/CN102849351A/en
Pending legal-status Critical Current

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Abstract

The invention provides a chip box used for arranging a driving chip. One or a plurality of small crystal arranging slots are distributed on the chip box, wherein the shape of each small crystal arranging slot is adaptive to that of the driving chip, the crystal arranging slots comprise support ridges, the upper half part of each small crystal arranging slot is formed by the space from each support ridge to the surface of the chip box; in the horizontal cross section of each small crystal arranging slot, the minimum value of the width of the opening at the top of the upper half part is obtained by adding the horizontal width of the driving chip with the crystal arranging error; and in the horizontal cross section of each small crystal arranging slot, the minimum value of the width of the opening of the bottom of the upper half part is equal to the horizontal width of the driving chip, wherein the included angle between the horizontal side wall and a vertical line of small crystal arranging slot is 10 degrees-30 degrees. According to the chip box, the requirements of cutting factories and assembling factories of the chip are compatible, the bad phenomenon caused by the chip box in the production is reduced, and the production efficiency is improved.

Description

Be used for placing the chip cartridges that drives chip
Technical field
The present invention relates to chip placement technique field, specifically, the present invention relates to a kind of for placing the chip cartridges that drives chip.
Background technology
Current, the driving chip (driver IC) that is used for the screen of electronic device demonstration generally presents narrow elongate in shape.Fig. 1-a is a schematic top plan view that is used for placing the chip cartridges that drives chip of the prior art; Fig. 1-b is the cross-sectional view along the A-A line of Fig. 1-a illustrated embodiment; Fig. 1-c is the cross-sectional view along the B-B line of Fig. 1-a illustrated embodiment; And Fig. 1-d is the structure for amplifying schematic diagram of the circled in Fig. 1-c illustrated embodiment.
Shown in Fig. 1-a, be used for to place drive in the prior art be distributed with on the chip cartridges (Tray) 100 of chip (not shown) that a lot of of lining up array and driving chip form adapt be the brilliant sulculus 101 of putting of thin-and-long.Shown in Fig. 1-b, each puts brilliant sulculus 101 longitudinal cross-section overall lengths is X, and its bottom has left and right two steps 102,103, also is provided with a support ridge 104 between this left and right step 102,103.So, this the first half of putting brilliant sulculus 101 is used for placing the driving chip of thin-and-long, the left and right two ends of this driving chip are shelved on respectively on this left and right step 102,103, and interlude can be shelved on the support ridge 104, make the driving chip keep straight at length direction, prevent that its interlude is affected by gravity and is bent downwardly.As for this latter half of putting brilliant sulculus 101 in left and right two steps 102,103 and support ridge 104 between two little deep trouths 105 staying respectively, its be for temporarily be accommodated in pick and place drive chip process from driving fallen a little chip on chip or the vacuum WAND, avoid defective chip.
Under request in person in conjunction with shown in Fig. 1-c and Fig. 1-d, this bottom width of putting brilliant sulculus 101 the first half (namely from support ridge 105 to its upper surface) is Y, highly is Z.This lateral cross section of putting brilliant sulculus 101 sees it is to keep the right angle basically from the bottom, namely the angle between the sidewall of its lateral cross section and the vertical curve is almost 0 °.
Fig. 2 is one of the prior art and is putting into vacuum WAND or picking drives the schematic perspective view of the chip cartridges of chip; Fig. 3 is that of embodiment shown in Fig. 2 puts brilliant sulculus and the schematic top plan view that drives the chip position relation.Please in conjunction with Fig. 2, shown in Figure 3, in chip cutting factory (for example COG factory), with vacuum WAND 203 drive chips 202 from blue film choose on the wafer cassette 200 put 201 li of brilliant sulculuses the time, need putting brilliant sulculus 201 and driving the opening that gap X1, X2, Y1 and the Y2(between the border around the chip 202 namely puts brilliant sulculus 201 on the wafer cassette 200) large as much as possible.If it is enough large to put the opening of brilliant sulculus 201, just relatively easy when vacuum WAND 203 puts in driving chip 202.And because equipment board aligning has individual error limit, so need that between the two certain interval is arranged (for example Y1+Y2 among Fig. 3>150 μ m).
And in chip assembling plant (for example module factory), when driving chip 202 is drawn to the pressing of glass module by vacuum WAND 203 from wafer cassette 200 when, need again the brilliant sulculus 201 of putting of wafer cassette 200 and drive gap between chip 202 borders as much as possible little (in transportation, prevent chip rolling dynamic friction, also need this spacing as far as possible little).This be because, the chip assembling plant draw with vacuum WAND 203 drive chips 202 in, its suction nozzle is aimed at also an error limit.If excessive clearance, suction nozzle mouth might exceed the border that drives chip 202, so that suction nozzle vacuumizes and occurs badly, causes chip pick-up bad or come off midway.For the driving chip that is elongated shape, the most easily occur unusually at its minor face; Minor face is narrower, more easily occurs to draw bad.Therefore, as if Y1, Y2 distance has become conflict among choose reasonable Fig. 3.
Summary of the invention
Technical matters to be solved by this invention provides a kind of chip cartridges for place driving chip, can take into account simultaneously the demand of chip cutting factory and assembling plant, eliminates simultaneously by chip cartridges caused badly, enhances productivity.
For solving the problems of the technologies described above, the invention provides a kind of chip cartridges for place driving chip, be distributed with the brilliant sulculus of putting that one or more and described driving chip form adapts on it;
Describedly put brilliant sulculus and comprise support ridge, the space from described support ridge to described chip cartridges surface consists of described the first half of putting brilliant sulculus;
In described lateral cross section of putting brilliant sulculus, the minimum value of the open top width of described the first half is that the transverse width of described driving chip adds that one puts brilliant error;
In described lateral cross section of putting brilliant sulculus, the minimum value of the bottom opening width of described the first half is the transverse width of described driving chip;
Wherein, described lateral sidewalls and the angle between the vertical curve of putting brilliant sulculus is 10 ° ~ 30 °.
Alternatively, described put brilliant error be one greater than the numerical value of 100 μ m.
Alternatively, the described thickness of putting the first half of brilliant sulculus is described driving chip thickness adds a specification surplus.
Alternatively, described specification surplus be one greater than the numerical value of 100 μ m.
Alternatively, described driving chip is glass top chip.
Compared with prior art, the present invention has the following advantages:
The present invention puts the horizontal open-topped width of the first half of brilliant sulculus by increase, so that chip cutting factory is easier in the driving chip is placed into, relevant device accuracy requirement appropriateness is reduced.And reduce to put the width of transverse bottom opening of the first half of brilliant sulculus, then again so that the relative position that drives chip can be fixed in chip cartridges, contraposition was more accurate when chip assembling plant picking drove chip.
Thus, chip cartridges of the present invention can be taken into account the demand of chip cutting factory and assembling plant simultaneously, and caused bad by chip cartridges in the minimizing production, enhances productivity.
Description of drawings
The above and other features of the present invention, character and advantage will become more obvious by the description below in conjunction with drawings and Examples, wherein:
Fig. 1-a is a schematic top plan view that is used for placing the chip cartridges that drives chip of the prior art;
Fig. 1-b is the cross-sectional view along the A-A line of Fig. 1-a illustrated embodiment;
Fig. 1-c is the cross-sectional view along the B-B line of Fig. 1-a illustrated embodiment;
Fig. 1-d is the structure for amplifying schematic diagram of the circled in Fig. 1-c illustrated embodiment;
Fig. 2 is one of the prior art and is putting into vacuum WAND or picking drives the schematic perspective view of the chip cartridges of chip;
Fig. 3 is that of embodiment shown in Fig. 2 puts brilliant sulculus and the schematic top plan view that drives the chip position relation;
Fig. 4 is the transverse sectional view of putting brilliant sulculus of a chip cartridges of the prior art;
Fig. 5 is the transverse sectional view of putting brilliant sulculus that is used for placing the chip cartridges that drives chip of one embodiment of the invention.
The specific embodiment
The invention will be further described below in conjunction with specific embodiments and the drawings; set forth in the following description more details so that fully understand the present invention; but the present invention obviously can implement with the multiple alternate manner that is different from this description; those skilled in the art can be in the situation that do similar popularization, deduction without prejudice to intension of the present invention according to practical situations, therefore should be with content constraints protection scope of the present invention of this specific embodiment.
Fig. 4 is the transverse sectional view of putting brilliant sulculus of a chip cartridges of the prior art; Fig. 5 is the transverse sectional view of putting brilliant sulculus (comparing with Fig. 4) that is used for placing the chip cartridges that drives chip of one embodiment of the invention.It should be noted that above-mentioned accompanying drawing only as example, it is not to be to draw according to the condition of equal proportion, and should not be construed as limiting as the protection domain to actual requirement of the present invention with this.
Please in conjunction with Fig. 4 and shown in Figure 5, two chip cartridges are respectively the chip cartridges that drives chip 402 and 502 such as glass top chip (COG) etc. be used to placing, respectively be distributed with on it one or more respectively with drive that chip 402,502 shapes adapt put brilliant sulculus 401,501.Put brilliant sulculus 401,501 and include support ridge 404,504, consist of respectively from support ridge 404,504 spaces to the chip cartridges surface and put brilliant sulculus 401, the first half of 501.
Both are difference, the present invention among Fig. 5 is in the lateral cross section of putting brilliant sulculus 501, the minimum value of the open top width Y ' of the first half is put brilliant error for the transverse width that drives chip 502 adds one of chip cutting factory, this puts brilliant error can be the numerical value greater than 100 μ m at present, and namely the open top width Y ' of Y ' prior art in Fig. 4 _ old increases to some extent.And the present invention among Fig. 5 is in the lateral cross section of putting brilliant sulculus 501, the minimum value of the bottom opening width Y of the first half is to drive the transverse width of chip 502 (for the fixed position, Y is as far as possible little), namely Y bottom opening width Y_old of prior art in Fig. 4 increases to some extent.Thus, put the lateral sidewalls of brilliant sulculus 501 and the slanted angle θ between the vertical curve by increasing to 10 ° ~ 30 ° close to 0 ° among Fig. 4.The calculating formula of this angle theta is θ=arctan ((Y '-Y)/2)/Z.
In addition, the thickness Z of putting the first half of brilliant sulculus 501 can remain unchanged, and is specially and drives chip 402,502 thickness adds chip cutting factory to a specification surplus of thickness Z, and this specification surplus can be the numerical value greater than 100 μ m at present.
The present invention puts the horizontal open-topped width of the first half of brilliant sulculus by increase, so that chip cutting factory is easier in the driving chip is placed into, relevant device accuracy requirement appropriateness is reduced.And reduce to put the width of transverse bottom opening of the first half of brilliant sulculus, then again so that the relative position that drives chip can be fixed in chip cartridges, contraposition was more accurate when chip assembling plant picking drove chip.
Thus, chip cartridges of the present invention can be taken into account the demand of chip cutting factory and assembling plant simultaneously, and caused bad by chip cartridges in the minimizing production, enhances productivity.
Although the present invention with preferred embodiment openly as above, it is not to limit the present invention, and any those skilled in the art can make possible change and modification without departing from the spirit and scope of the present invention.Therefore, every content that does not break away from technical solution of the present invention, all falls within the protection domain that claim of the present invention defines any modification, equivalent variations and modification that above embodiment does according to technical spirit of the present invention.

Claims (5)

1. chip cartridges that be used for to place drives chip (502), what be distributed with on it that one or more and described driving chip (502) shape adapts puts brilliant sulculus (501);
The described brilliant sulculus (501) of putting comprises support ridge (504), and the space from described support ridge (504) to described chip cartridges surface consists of described the first half of putting brilliant sulculus (501);
In described lateral cross section of putting brilliant sulculus (501), the minimum value of the open top width of described the first half (Y ') is that the transverse width of described driving chip (502) adds that one puts brilliant error;
In described lateral cross section of putting brilliant sulculus (501), the minimum value of the bottom opening width (Y) of described the first half is the transverse width of described driving chip (502);
Wherein, described lateral sidewalls and the angle between the vertical curve of putting brilliant sulculus (501) is 10 ° ~ 30 °.
2. chip cartridges according to claim 1 is characterized in that, described put brilliant error be one greater than the numerical value of 100 μ m.
3. chip cartridges according to claim 1 is characterized in that, the thickness that the described thickness of putting the first half of brilliant sulculus (501) is described driving chip (502) adds a specification surplus.
4. chip cartridges according to claim 3 is characterized in that, described specification surplus be one greater than the numerical value of 100 μ m.
5. chip cartridges according to claim 1 is characterized in that, described driving chip (502) is glass top chip.
CN2012103807066A 2012-10-09 2012-10-09 Chip box used for arranging driving chip Pending CN102849351A (en)

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Application Number Priority Date Filing Date Title
CN2012103807066A CN102849351A (en) 2012-10-09 2012-10-09 Chip box used for arranging driving chip

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Application Number Priority Date Filing Date Title
CN2012103807066A CN102849351A (en) 2012-10-09 2012-10-09 Chip box used for arranging driving chip

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CN102849351A true CN102849351A (en) 2013-01-02

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Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2016000279A1 (en) * 2014-07-04 2016-01-07 深圳市华星光电技术有限公司 Packing box device for liquid crystal panels
US9643772B2 (en) 2014-07-04 2017-05-09 Shenzhen China Star Optoelectronics Technology Co., Ltd. Package box device for liquid crystal panels

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20050202597A1 (en) * 2004-03-12 2005-09-15 Noriyuki Takahashi Manufacturing method of a tray, a socket for inspection, and a semiconductor device
CN102502073A (en) * 2011-10-09 2012-06-20 常熟市华海电子有限公司 Chip packaging tray

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20050202597A1 (en) * 2004-03-12 2005-09-15 Noriyuki Takahashi Manufacturing method of a tray, a socket for inspection, and a semiconductor device
CN102502073A (en) * 2011-10-09 2012-06-20 常熟市华海电子有限公司 Chip packaging tray

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2016000279A1 (en) * 2014-07-04 2016-01-07 深圳市华星光电技术有限公司 Packing box device for liquid crystal panels
US9643772B2 (en) 2014-07-04 2017-05-09 Shenzhen China Star Optoelectronics Technology Co., Ltd. Package box device for liquid crystal panels

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Application publication date: 20130102