CN102848952A - Temperature regulating device - Google Patents
Temperature regulating device Download PDFInfo
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- CN102848952A CN102848952A CN2012103554005A CN201210355400A CN102848952A CN 102848952 A CN102848952 A CN 102848952A CN 2012103554005 A CN2012103554005 A CN 2012103554005A CN 201210355400 A CN201210355400 A CN 201210355400A CN 102848952 A CN102848952 A CN 102848952A
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Abstract
The invention relates to a temperature regulating device which comprises a casing, a temperature regulating assembly and an air supplying device, wherein the temperature regulating assembly and the air supplying device are installed in the casing. The temperature regulating assembly comprises a semiconductor refrigeration/heating sheet, a first radiating fin and a second radiating fin, a first air channel and a second air channel are isolated and formed on two sides of the semiconductor refrigeration/heating sheet, the semiconductor refrigeration/heating sheet is provided with a refrigeration surface and a heating surface, the first radiating fin and the second radiating fin are respectively installed on the working surfaces, the first radiating fin is located in the first air channel, and the second radiating fin is located in the second air channel. After being conveyed to the temperature regulating assembly by the air supplying device, air flow is shunted and heated or refrigerated in the first air channel and the second air channel and then is discharged out of the casing. The temperature regulating device utilizes the semiconductor refrigeration/heating sheet to regulate temperature of a seat, no vehicle-mounted air conditioning needs to be led in, and load of the vehicle-mounted air conditioning and automobile energy consumption cannot be increased.
Description
Technical field
The present invention relates to the temperature adjustment field, particularly relate to a kind of register for automotive seat or mattress.
Background technology
Present seat, mattress be automotive seat particularly, have the poor problem of permeability to air, can not in time the moisture on the seat be distributed.In summer, under the direct projection of the sun, vehicle interior temperature is too high, and air-conditioning is regulated needs the regular hour, makes the occupant have the human discomfort of a very long time.Present register mainly is divided into two kinds of forms: built-in seat register and external seat register.Built-in seat register refers to that at the inner register of installing of seat, the while finishes the adjustment of gas and gas sent into the overall process of seat in seat inside.External seat register refers to, finishes the adjustment of gas in the seat outside and gas pushed the device of seat inside by input channel.
At present, a kind of built-in seat register takes two tube axial fans to superpose up and down, and middle mode of placing thermounit is carried out temperature adjustment, and its thickness is too thick and heavy, puts into seat inside and acquires a certain degree of difficulty; Another kind of built-in seat register is taked to put into water tank in seat inside, utilizes the mode of perfusion cold water that seat is lowered the temperature, and this device need to often be poured water and be changed water, and realizability is relatively poor.
External seat register then needs to be installed in the seat outside, and is attractive in appearance not, and because volume is larger, both taken interior space, has again certain potential safety hazard.The external seat register that has utilizes automobile self air-conditioning, hot-water heating to input the temperature adjustment form of seat inside by pipeline, this form is brought larger burden to air conditioning for automobiles undoubtedly, gas flow enters seat inside, and be input to seat surface and need larger pressure, this has strengthened the power consumption of automobile virtually, and the damage rate of on-board air conditioner also significantly promotes.
Summary of the invention
Based on this, be necessary to provide a kind of register that can not increase the on-board air conditioner burden.
A kind of register, it comprises: housing, inside are provided with air channel and air stream outlet chamber, and the wall of described housing is provided with the ventilation inlet that communicates with the air channel; Temperature-controlled package, be placed on enclosure interior and between air channel and air stream outlet chamber, described temperature-controlled package comprises semiconductor refrigerating/heat sheet, the first radiating gill and the second radiating gill, the both sides of described semiconductor refrigerating/heat sheet form the first air flue and the second air flue that is isolated from each other, described semiconductor refrigerating/heat sheet has chill surface and heats two driving surfaces of face, described the first radiating gill and the second radiating gill are installed in respectively on the driving surface, and described the first radiating gill is arranged in described the first air flue, and described the second radiating gill is arranged in described the second air flue; Air-supply arrangement is placed in the described air channel in order to described temperature-controlled package delivery air; And heat spacer, be installed in the described air stream outlet chamber and described air stream outlet chamber be divided into the first cavity and the second cavity that is isolated from each other, described the first air flue is communicated with described air channel and described the first cavity, described the second air flue is communicated with described air channel and described the second cavity, offer the first air stream outlet on the wall of described the first cavity, offer the second air stream outlet on the wall of described the second cavity.
Among embodiment, described housing has upper wall and the lower wall that is oppositely arranged therein, and described the first air flue shaped is formed in upper wall and semiconductor refrigerating/heat between the sheet, and described the second air flue shaped is formed in lower wall and semiconductor refrigerating/heat between the sheet.
Among embodiment, described upper wall and lower wall are set parallel to each other therein.
Among embodiment, described upper wall is step-like structure therein, and described lower wall is smooth platy structure.
Therein among embodiment, described housing comprises air supplying part and the temperature adjustment section that axially is arranged in order, described ventilation inlet is opened on the described air supplying part, and described air-supply arrangement is installed in the air supplying part, and described temperature-controlled package and heat spacer are installed in the described temperature adjustment section.
Therein among embodiment, there is height fall in the top of the top of described air supplying part and described temperature adjustment section, and described ventilation inlet is opened in the top of described air supplying part, and described air-supply arrangement is the tube axial fan that is installed in the ventilation inlet place.
Therein among embodiment, the top of described air supplying part is concordant with the top of described temperature adjustment section, and described ventilation inlet is opened in the top of described air supplying part, and described air-supply arrangement is the centrifugal fan that is installed in the ventilation inlet place.
Therein among embodiment, described air supplying part is obliquely installed with respect to described temperature adjustment section.
Among embodiment, also comprise temperature sensor therein, described temperature sensor and described the first radiating gill are installed on the same driving surface.
Among embodiment, also be provided with guide vane between described air-supply arrangement and the described temperature-controlled package therein.
Above-mentioned register utilizes that semiconductor refrigerating/heating sheet carries out temperature adjustment to seat, need not to introduce on-board air conditioner, can not increase the burden of on-board air conditioner, and putting into as built-in register not to increase the automobile power consumption yet when seat is inner to be used.
Description of drawings
Fig. 1 is the cross-sectional view of the register of embodiment one;
Fig. 2 is the birds-eye view of the register of embodiment one;
Fig. 3 is the cross-sectional view of the register of embodiment two;
Fig. 4 is the birds-eye view of the register of embodiment two;
Fig. 5 is the cross-sectional view of the register of embodiment three;
Fig. 6 is the birds-eye view of the register of embodiment three.
The specific embodiment
The design of the register of following embodiment is: utilize that semiconductor refrigerating/heating sheet carries out temperature adjustment to seat or mattress, can not increase the burden of on-board air conditioner and increase the automobile power consumption.
Please refer to Fig. 1 and Fig. 2, the register 100 of embodiment one comprises housing 110, is installed in the temperature-controlled package 120 of housing 110 inside, temperature sensor 130, heat spacer 140 and air-supply arrangement 150.
Temperature-controlled package 120 is placed in the temperature adjustment section 112, between air channel 113 and air stream outlet chamber.The semiconductor refrigerating of temperature-controlled package 120 in the middle of comprising/heat the first radiating gill 124 and second radiating gill 126 of sheet 122 and both sides.Semiconductor refrigerating/heat sheet 122 has two relative driving surfaces, and one is chill surface, and another is for heating face.The first radiating gill 124 and the second heat radiation 126 are installed in respectively on the driving surface.Semiconductor refrigerating/heat the chill surface of sheet 122 and heat face and can arbitrarily change as required only need to make polarity exchange when received current.In the present embodiment, temperature sensor 130 and the first radiating gill 124 are installed on the same driving surface.
Form respectively the first air flue 116 and the second air flue 117 that is isolated from each other between two driving surfaces of semiconductor refrigerating/heat sheet 122 and upper wall and the lower wall.The first air flue 116 and the second air flue 117 all are communicated with air channel 113.The first radiating gill 124 is arranged in the first air flue 116 and allows air-flow to pass through, and the first radiating gill 126 is arranged in the second air flue 117 and allows air-flow to pass through.Semiconductor refrigerating/heat sheet 122 objectively plays the effect that air-flow that air-supply arrangement 150 is carried is shunted, two driving surfaces heating or refrigeration, and then gas-heated or the refrigeration of radiating gill to flowing through by correspondence.
In the present embodiment, in temperature adjustment section 112, housing 110 also is provided with the antetheca 118 that connects upper wall, lower wall.The air stream outlet chamber is formed between temperature-controlled package 120 and the antetheca 118.Heat spacer 140 is installed in the air stream outlet chamber, and the air stream outlet chamber is divided into upper and lower setting and the first cavity 1142 that is isolated from each other and the second cavity 1144.The first cavity 1142 communicates with aforesaid the first air flue 116.The second cavity 1144 communicates with aforesaid the second air flue 117.The first cavity 1142 is provided with the first air stream outlet 1142a in the antetheca 118 of housing 110.The first cavity 119 offers the second air stream outlet 1144a on the lower wall of housing 110.
Air-supply arrangement 150 is installed in air supplying part 111 inside, in order to temperature-controlled package 120 delivery airs.In the present embodiment, air-supply arrangement 150 is for being installed in the tube axial fan at ventilation inlet place.
During air-supply arrangement 150 work, the 113 interior delivery airs to the air channel, air-flow is split into two strands when arriving temperature-controlled package 120, one is by the first air flue 116 and entered the first cavity 1142 after 124 heating of the first radiating gill or the refrigeration, and another strand is by the second air flue 117 and entered the second cavity 1144 after 126 heating of the second radiating gill or the refrigeration.Whether the temperature that temperature sensor 130 can detect the air-flow that flows into the first cavity 1142 is design temperature, and then by feedback to wind speed and semiconductor refrigerating/heat sheet 122 to regulate, the air-flow of final preference temperature flows out and to flow into the chair/bed pad inner from the first air stream outlet 1142a.The air-flow that flows into the second cavity 1144 is then got rid of from the second air stream outlet 1144a as waste gas.Preamble is stated, and the air-flow that flows out from the first air stream outlet 1142a can be hot gas, also can be cold air, arranges as required.When the air-flow of the first air stream outlet 1142a outflow was hot gas, the air-flow that flows out from the second air stream outlet 1144a then was cold air, otherwise then just opposite.
Please refer to Fig. 3 and Fig. 4, be the register 200 of embodiment two.Register 200 comprises housing 210, is installed in the temperature-controlled package 220 of housing 210 inside, temperature sensor 230, heat spacer 240, air-supply arrangement 250 and guide vane 260.
During use, the air-flow that air-supply arrangement 250 is carried is split into two strands when arriving temperature-controlled package 220, one is by the first air flue and entered the first cavity 2142 after 224 heating of the first radiating gill or the refrigeration, another strand is by the second air flue and entered the second cavity 2144 after the heating of the second radiating gill 226 or the refrigeration, and then the air stream outlet by separately ejects.
The register 200 of embodiment two is identical with the temperature adjustment principle of register 100.Register 200 is with the difference of register 100: 1) air supplying part 211 is concordant with the top of temperature adjustment section 212, making housing 210 upper walls is flat structures, in other words, the cavity of housing 210 is different from the cavity geometry of housing 110, and each element also is axial array in the housing 210, so be beneficial to the reduction of height; 2) cavity geometry with housing 210 adapts to, and air-supply arrangement 250 adopts centrifugal fan but not tube axial fan; 3) compared to register 100, set up guide vane 260, this guide vane 260 is arranged between air-supply arrangement 250 and the temperature-controlled package 220, so that it is more even to arrive the air-flow of temperature-controlled package 220, thereby improves the air-flow degree of utilization.
Please refer to Fig. 5 and Fig. 6, the register 300 of embodiment three comprises housing 310, is installed in the temperature-controlled package 320 of housing 310 inside, temperature sensor 330, heat spacer 340, air-supply arrangement 350 and guide vane 360.
During use, the air-flow that air-supply arrangement 350 is carried is split into two strands when arriving temperature-controlled package 320, one is by the first air flue and entered the first cavity 3142 after 324 heating of the first radiating gill or the refrigeration, another strand is by the second air flue and entered the second cavity 3144 after the heating of the second radiating gill 326 or the refrigeration, and then the air stream outlet by separately ejects.
The register 300 of embodiment three is identical with the register of embodiment 2 200 temperature adjustment implementations, also be to adopt centrifugal fan, and the two housing structure is also very similar, difference only is: air supplying part 311 is obliquely installed with respect to temperature adjustment section 312, connection at an angle between the two.So, when air-supply arrangement 350(centrifugal fan) when being installed in the air supplying part 311, compare with the air-supply arrangement 250 of embodiment two, the speed of the air-flow that air-supply arrangement 350 is carried and the flow direction distribute change have occured, and satisfy thus different operatings needs.It may be noted that the speed of air-flow and flow to the change that distributes and also can realize by the angle of adjusting the centrifugal fan flabellum.
The register of above-mentioned embodiment utilizes the heating of semiconductor refrigerating/heat sheet or cooling flow, utilizes the air-flow after heating or the refrigeration that seat is carried out temperature adjustment, does not need to introduce on-board air conditioner, can not increase the burden of on-board air conditioner and increase the automobile power consumption.In addition, the register of above-mentioned embodiment, air-supply arrangement, temperature-controlled package etc. are arranged vertically, and temperature-controlled package uses quartz conductor/heat sheet and radiating gill, these component thickness are less, whole device thickness also is minimized, and is suitable as built-in register and puts into the inner use of seat.In addition, the register of above-mentioned embodiment itself has been finished the adjusting to gas flow temperature, can certainly be used as the external register, is placed on the outside use of seat, by pipeline air-flow is transported to seat inside.
The above embodiment has only expressed several embodiment of the present invention, and it describes comparatively concrete and detailed, but can not therefore be interpreted as the restriction to claim of the present invention.Should be pointed out that for the person of ordinary skill of the art without departing from the inventive concept of the premise, can also make some distortion and improvement, these all belong to protection scope of the present invention.Therefore, the protection domain of patent of the present invention should be as the criterion with claims.
Claims (10)
1. a register is characterized in that, comprising:
Housing, inside are provided with air channel and air stream outlet chamber, and the wall of described housing is provided with the ventilation inlet that communicates with the air channel;
Temperature-controlled package, be placed on enclosure interior and between air channel and air stream outlet chamber, described temperature-controlled package comprises semiconductor refrigerating/heat sheet, the first radiating gill and the second radiating gill, the both sides of described semiconductor refrigerating/heat sheet form the first air flue and the second air flue that is isolated from each other, described semiconductor refrigerating/heat sheet has chill surface and heats two driving surfaces of face, described the first radiating gill and the second radiating gill are installed in respectively on the driving surface, and described the first radiating gill is arranged in described the first air flue, and described the second radiating gill is arranged in described the second air flue;
Air-supply arrangement is placed in the described air channel in order to described temperature-controlled package delivery air; And
Heat spacer, be installed in the described air stream outlet chamber and described air stream outlet chamber be divided into the first cavity and the second cavity that is isolated from each other, described the first air flue is communicated with described air channel and described the first cavity, described the second air flue is communicated with described air channel and described the second cavity, offer the first air stream outlet on the wall of described the first cavity, offer the second air stream outlet on the wall of described the second cavity.
2. register according to claim 1, it is characterized in that, described housing has upper wall and the lower wall that is oppositely arranged, and described the first air flue shaped is formed in upper wall and semiconductor refrigerating/heat between the sheet, and described the second air flue shaped is formed in lower wall and semiconductor refrigerating/heat between the sheet.
3. register according to claim 2 is characterized in that, described upper wall and lower wall are set parallel to each other.
4. register according to claim 2 is characterized in that, described upper wall is step-like structure, and described lower wall is smooth platy structure.
5. register according to claim 1, it is characterized in that, described housing comprises air supplying part and the temperature adjustment section that axially is arranged in order, described ventilation inlet is opened on the described air supplying part, described air-supply arrangement is installed in the air supplying part, and described temperature-controlled package and heat spacer are installed in the described temperature adjustment section.
6. register according to claim 5, it is characterized in that, there is height fall in the top of the top of described air supplying part and described temperature adjustment section, and described ventilation inlet is opened in the top of described air supplying part, and described air-supply arrangement is the tube axial fan that is installed in the ventilation inlet place.
7. register according to claim 5 is characterized in that, the top of described air supplying part is concordant with the top of described temperature adjustment section, and described ventilation inlet is opened in the top of described air supplying part, and described air-supply arrangement is the centrifugal fan that is installed in the ventilation inlet place.
8. register according to claim 7 is characterized in that, described air supplying part is obliquely installed with respect to described temperature adjustment section.
9. the described register of arbitrary claim in 8 according to claim 1 is characterized in that also comprise temperature sensor, described temperature sensor and described the first radiating gill are installed on the same driving surface.
10. the described register of arbitrary claim in 8 according to claim 1 is characterized in that, also is provided with guide vane between described air-supply arrangement and the described temperature-controlled package.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2012103554005A CN102848952A (en) | 2012-09-21 | 2012-09-21 | Temperature regulating device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2012103554005A CN102848952A (en) | 2012-09-21 | 2012-09-21 | Temperature regulating device |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN102848952A true CN102848952A (en) | 2013-01-02 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN2012103554005A Pending CN102848952A (en) | 2012-09-21 | 2012-09-21 | Temperature regulating device |
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| CN (1) | CN102848952A (en) |
Cited By (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106740342A (en) * | 2017-03-20 | 2017-05-31 | 上海安闻汽车电子有限公司 | A kind of temperature-adjusting device and system |
| CN108357399A (en) * | 2018-03-15 | 2018-08-03 | 上海盟栎汽配有限公司 | A kind of air-conditioned seat air inlet and outlet device |
| CN110455009A (en) * | 2019-09-12 | 2019-11-15 | 赵进洲 | A kind of weather adjustment device and air-conditioning |
| CN110959095A (en) * | 2017-07-28 | 2020-04-03 | Lg伊诺特有限公司 | Cooling/heating device |
| CN112319325A (en) * | 2020-10-30 | 2021-02-05 | 广州塔祈巴那电器有限公司 | Blower with cooling and heating functions |
| CN113488341A (en) * | 2021-07-13 | 2021-10-08 | 郑州航空工业管理学院 | Installation device for super capacitor |
| CN115240528A (en) * | 2022-08-18 | 2022-10-25 | 浙江赛格教仪科技有限公司 | Intelligent cabin human-computer interaction simulation platform |
| WO2023062488A1 (en) * | 2021-10-13 | 2023-04-20 | Gentherm Gmbh | Footwell heating module |
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Cited By (10)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106740342A (en) * | 2017-03-20 | 2017-05-31 | 上海安闻汽车电子有限公司 | A kind of temperature-adjusting device and system |
| CN110959095A (en) * | 2017-07-28 | 2020-04-03 | Lg伊诺特有限公司 | Cooling/heating device |
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| CN108357399A (en) * | 2018-03-15 | 2018-08-03 | 上海盟栎汽配有限公司 | A kind of air-conditioned seat air inlet and outlet device |
| CN110455009A (en) * | 2019-09-12 | 2019-11-15 | 赵进洲 | A kind of weather adjustment device and air-conditioning |
| CN112319325A (en) * | 2020-10-30 | 2021-02-05 | 广州塔祈巴那电器有限公司 | Blower with cooling and heating functions |
| CN113488341A (en) * | 2021-07-13 | 2021-10-08 | 郑州航空工业管理学院 | Installation device for super capacitor |
| WO2023062488A1 (en) * | 2021-10-13 | 2023-04-20 | Gentherm Gmbh | Footwell heating module |
| CN115240528A (en) * | 2022-08-18 | 2022-10-25 | 浙江赛格教仪科技有限公司 | Intelligent cabin human-computer interaction simulation platform |
| CN115240528B (en) * | 2022-08-18 | 2024-03-08 | 浙江赛格教仪科技有限公司 | Intelligent cabin man-machine interaction simulation platform |
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