CN102848285A - Chamfering method of LTCC chip component and grinding material formula - Google Patents
Chamfering method of LTCC chip component and grinding material formula Download PDFInfo
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- CN102848285A CN102848285A CN2012103324573A CN201210332457A CN102848285A CN 102848285 A CN102848285 A CN 102848285A CN 2012103324573 A CN2012103324573 A CN 2012103324573A CN 201210332457 A CN201210332457 A CN 201210332457A CN 102848285 A CN102848285 A CN 102848285A
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Abstract
The invention relates to a chamfering method of an LTCC (low temperature co-fired ceramic) chip component and a grinding material formula. The grinding material formula for chamfering is designed according to material characteristics of the LTCC chip component. A grinding material is prepared by a silicon carbide grinding material and a zirconia spherical grinding material in the mass ratio of 1:10-1:2. The grinding material is fed to a ball mill (or a chamfering machine), and the LTCC chip component is subjected to wet chamfering by taking water as a medium. The machining face of the chamfering is clean and smooth, after the machining is finished, the subsequent machining can be conducted without special cleaning treatment; the chamfering efficiency of the LTCC chip component is improved, and the machining efficiency of the wet chamfering with the ball mill (or the chamfering machine) is improved by more than one time compared with the machining efficiency using the grinding material for the chamfering of the traditional chip component.
Description
Technical field
The invention belongs to the LTCC(LTCC) the slice component processing technique field, relate to a kind of LTCC slice component chamfering method and abrasive material prescription.
Background technology
Traditional slice component is mainly with the MLCC(chip multilayer ceramic capacitor) the technology manufacturing, characteristic for the MLCC ceramic material has its specific chamfering abrasive material, and the LTCC chip device is because existing the difference of material behavior with traditional slice component, therefore use the chamfering abrasive material of traditional MLCC slice component to carry out chamfer machining and can not arrive expected effect, and need more than 24 hours process time, and efficient is very low.
Summary of the invention
The present invention is intended to solve the traditional slice component chamfering method of use and abrasive material carries out the low defective of chamfering efficiency to the LTCC slice component.
Realize that technical solution of the present invention is: use ball mill or beveler to add the abrasive material that is applicable to LTCC slice component chamfering, the LTCC slice component is carried out wet method chamfering take water as medium.
Described wet method chamfering is drop into abrasive material and LTCC slice component in ball mill or beveler after, and injected water in ball mill or the beveler carries out the ball milling chamfering take water as medium again.
LTCC slice component chamfering method comprises following steps:
A. prepare abrasive material:
B. load abrasive material: the abrasive material for preparing is packed in ball mill or the beveler;
C. load element: the element that will treat chamfer machining is packed in ball mill or the beveler;
D. water filling: water is injected ball mill or beveler;
E. ball milling chamfering: open ball mill or beveler and carry out the element chamfering;
F. sieve element: element is sieved out from abrasive material;
H. wash element: the element that will finish chamfer machining washes in water, removes surperficial abrasive dust;
I. dry: the element after will cleaning is dry in baking oven, removes surface moisture.
Described abrasive material is to use silicon carbide abrasive and the preparation of zirconia ball abrasive material.
Described silicon carbide abrasive and zirconia ball abrasive material be 1:10～1:2 preparation in mass ratio.
Also comprise following steps in the step of described f screening element:
Screening silicon carbide abrasive: use sieve aperture in water, to sieve and wash abrasive material, element mixture less than the slice component size and greater than the sieve of silicon-carbide particle size, silicon carbide abrasive is separated;
Screening element: use sieve aperture in water, to sieve and wash zirconia ball, element mixture less than the sieve of zirconia ball sphere diameter size, element is separated with zirconia ball.
A kind of abrasive material prescription for LTCC slice component chamfering is characterized in that: the spherical abrasive material of use silicon carbide abrasive and zirconia in mass ratio 1:10～1:2 is mixed with abrasive material.
Described carborundum is the following carborundum of 100 orders.
The sphere diameter of described zirconia ball abrasive material is 3mm～10mm.
The present invention compared with prior art, its remarkable advantage is:
A. can form cleaning, smooth chamfer machining surface: the LTCC slice component of the wet method chamfer machining take water as medium, chamfer machining face cleaning, smooth does not need Special cleaning agent can carry out follow-up processing after finishing processing.
B. can improve the chamfer machining efficient of LTCC slice component: the time that the chamfering abrasive material of preparing according to LTCC slice component material behavior can carry out chamfer machining with the traditional slice component chamfering abrasive material of use has been improved working (machining) efficiency greatly by foreshortening to more than 24 hours in 10 hours.
The specific embodiment
Below the invention will be further described.Following examples only are used for technical scheme of the present invention more clearly is described, and can not limit protection scope of the present invention with this.
Processing process of the present invention mainly comprises following a few part:
Preparation abrasive material → filling abrasive material → filling element → water filling → ball milling chamfering → screening silicon carbide abrasive → screening element → flushing element → drying.
Concrete technology is as follows:
A. prepare abrasive material: use silicon carbide abrasive and zirconia ball abrasive material in mass ratio 1:5 are formulated as the chamfering abrasive material;
B. load abrasive material: the chamfering abrasive material for preparing is packed in the ball mill;
C. load element: the element that will treat chamfer machining is packed in the ball mill;
D. water filling: water is injected ball mill;
E. ball milling chamfering: open ball mill and carry out the element chamfering;
F. sieve silicon carbide abrasive: use sieve aperture in water, to sieve and wash abrasive material, element mixture less than the slice component size and greater than the sieve of silicon-carbide particle size, silicon carbide abrasive is separated;
G. sieve element: use sieve aperture in water, to sieve and wash zirconia ball, element mixture less than the sieve of zirconia ball sphere diameter size, element is separated with zirconia ball;
H. wash element: the element that will finish chamfer machining washes in water, removes surperficial abrasive dust;
I. dry: the element after will cleaning is dry in baking oven, removes surface moisture.
The prescription of chamfering abrasive material is:
The chamfering abrasive material is prepared in mass ratio by silicon carbide abrasive and zirconia ball abrasive material, and mass ratio is: 1:10～1:2.
The above only is preferred embodiment of the present invention; should be pointed out that for those skilled in the art, under the prerequisite that does not break away from the technology of the present invention principle; can also make some improvement and distortion, these improvement and distortion also should be considered as protection scope of the present invention.
Claims (9)
1. LTCC slice component chamfering method is characterized in that: add the abrasive material that chamfering is used in ball mill or beveler, the LTCC slice component is carried out wet method chamfering take water as medium.
2. LTCC slice component chamfering method according to claim 1, it is characterized in that: described wet method chamfering is drop into abrasive material and LTCC slice component in ball mill or beveler after, injected water in ball mill or the beveler carries out the ball milling chamfering take water as medium again.
3. LTCC slice component chamfering method according to claim 1 is characterized in that: comprise following steps:
A. prepare abrasive material:
B. load abrasive material: the abrasive material for preparing is packed in ball mill or the beveler;
C. load element: the element that will treat chamfer machining is packed in ball mill or the beveler;
D. water filling: water is injected ball mill or beveler;
E. ball milling chamfering: open ball mill or beveler and carry out the element chamfering;
F. sieve element: element is sieved out from abrasive material;
H. wash element: the element that will finish chamfer machining washes in water, removes surperficial abrasive dust;
I. dry: the element after will cleaning is dry in baking oven, removes surface moisture.
4. LTCC slice component chamfering method according to claim 3 is characterized in that: described abrasive material is to use silicon carbide abrasive and zirconia ball abrasive material to prepare.
5. LTCC slice component chamfering method according to claim 4 is characterized in that: described silicon carbide abrasive and zirconia ball abrasive material be 1:10～1:2 preparation in mass ratio.
6. LTCC slice component chamfering method according to claim 4 is characterized in that: also comprise following steps in the step of described f screening element:
Screening silicon carbide abrasive: use sieve aperture in water, to sieve and wash abrasive material, element mixture less than the slice component size and greater than the sieve of silicon-carbide particle size, silicon carbide abrasive is separated;
Screening element: use sieve aperture in water, to sieve and wash zirconia ball, element mixture less than the sieve of zirconia ball sphere diameter size, element is separated with zirconia ball.
7. abrasive material prescription that is used for LTCC slice component chamfering is characterized in that: use silicon carbide abrasive and zirconia sphere abrasive material in mass ratio 1:10～1:2 be mixed with abrasive material.
8. the abrasive material prescription for LTCC slice component chamfering according to claim 7 is characterized in that: described carborundum is the following carborundum of 100 orders.
9. the abrasive material prescription for LTCC slice component chamfering according to claim 7, it is characterized in that: the sphere diameter of described zirconia ball abrasive material is 3mm～10mm.
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| CN201210332457.3A CN102848285B (en) | 2012-09-11 | 2012-09-11 | A kind of LTCC slice component chamfering method and abrasive material formula |
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| CN102848285B CN102848285B (en) | 2016-04-13 |
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Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN109333168A (en) * | 2018-10-19 | 2019-02-15 | 海鹰企业集团有限责任公司 | A kind of chamfering method of piezo ceramic element |
| CN111823126A (en) * | 2020-06-10 | 2020-10-27 | 广东风华高新科技股份有限公司 | Ceramic chip type component chamfering process |
| CN113579861A (en) * | 2021-07-05 | 2021-11-02 | 广东风华高新科技股份有限公司 | Chamfering method of LTCC chip type ceramic filter |
| CN114377957A (en) * | 2021-12-24 | 2022-04-22 | 湖南艾迪奥电子科技有限公司 | Method and device for continuously and automatically cleaning MLCC (multi-layer ceramic capacitor) after chamfering |
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Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN109333168A (en) * | 2018-10-19 | 2019-02-15 | 海鹰企业集团有限责任公司 | A kind of chamfering method of piezo ceramic element |
| CN111823126A (en) * | 2020-06-10 | 2020-10-27 | 广东风华高新科技股份有限公司 | Ceramic chip type component chamfering process |
| CN113579861A (en) * | 2021-07-05 | 2021-11-02 | 广东风华高新科技股份有限公司 | Chamfering method of LTCC chip type ceramic filter |
| CN114377957A (en) * | 2021-12-24 | 2022-04-22 | 湖南艾迪奥电子科技有限公司 | Method and device for continuously and automatically cleaning MLCC (multi-layer ceramic capacitor) after chamfering |
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| CN102848285B (en) | 2016-04-13 |
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Effective date of registration: 20180813 Address after: 233030 2016 Tang He road, Bengbu, Anhui Patentee after: Huadong Photoelectric Integrated Device Research Institute Address before: 215163 No. 89 Longshan Road, hi tech Zone, Suzhou, Jiangsu Patentee before: China North Industries Group Corporation No.214 Research Institute Suzhou R&D Center |
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