CN102840567A - Heat sink and manufacture method thereof - Google Patents
Heat sink and manufacture method thereof Download PDFInfo
- Publication number
- CN102840567A CN102840567A CN2011101685356A CN201110168535A CN102840567A CN 102840567 A CN102840567 A CN 102840567A CN 2011101685356 A CN2011101685356 A CN 2011101685356A CN 201110168535 A CN201110168535 A CN 201110168535A CN 102840567 A CN102840567 A CN 102840567A
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- CN
- China
- Prior art keywords
- heat
- fin
- radiator structure
- heat abstractor
- conducting
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Classifications
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
- F21V29/00—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
- F21V29/50—Cooling arrangements
- F21V29/70—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks
- F21V29/71—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks using a combination of separate elements interconnected by heat-conducting means, e.g. with heat pipes or thermally conductive bars between separate heat-sink elements
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
- F21V29/00—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
- F21V29/50—Cooling arrangements
- F21V29/70—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks
- F21V29/74—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks with fins or blades
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
- F21V29/00—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
- F21V29/50—Cooling arrangements
- F21V29/70—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks
- F21V29/74—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks with fins or blades
- F21V29/77—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks with fins or blades with essentially identical diverging planar fins or blades, e.g. with fan-like or star-like cross-section
- F21V29/773—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks with fins or blades with essentially identical diverging planar fins or blades, e.g. with fan-like or star-like cross-section the planes containing the fins or blades having the direction of the light emitting axis
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
- F21V29/00—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
- F21V29/50—Cooling arrangements
- F21V29/70—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks
- F21V29/74—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks with fins or blades
- F21V29/78—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks with fins or blades with helically or spirally arranged fins or blades
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21Y—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO THE FORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THE LIGHT EMITTED
- F21Y2115/00—Light-generating elements of semiconductor light sources
- F21Y2115/10—Light-emitting diodes [LED]
Landscapes
- Engineering & Computer Science (AREA)
- General Engineering & Computer Science (AREA)
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
- Cooling Or The Like Of Electrical Apparatus (AREA)
Abstract
The invention relates to a heat sink, which comprises a first heat radiation structure (A) and a second heat radiation structure (B) which contact with an object to be radiated in a heat conducting way, wherein the first heat radiation structure (A) comprises a plurality of first radiating fins (1); the second heat radiation structure (B) comprises a plurality of second radiating fins (2); and the first radiating fins (1) are inserted into cavities (3) formed in the second radiating fins (2). In addition, the invention further relates to a manufacture method of the heat sink.
Description
Technical field
The present invention relates to a kind of heat abstractor.In addition, the invention still further relates to a kind of manufacturing approach of heat abstractor of the above-mentioned type.
Background technology
In the current illuminator, obtained increasing application as the illuminator of light source with led module.Led module has very high requirement to heat radiation, because heat radiation directly influences the performance and the life-span of led module.For this reason, used the heat abstractor of various material and shape in the prior art, the heat abstractor of aluminum for example, it has good performance of heat dissipation, but its weight is relatively large.Therefore the heat abstractor processed by heat-conducting plastic of present increasing use.In order to improve the heat dispersion of such heat abstractor; Usually the circumference of heat abstractor is provided with a plurality of equally distributed each other fin; And on the contact-making surface of the printed circuit board (PCB) of heat abstractor and led module, be furnished with the metal insert of metallic plate or tubular, the metal insert of this metallic plate or tubular just has been molded into heat abstractor usually in the process of making heat abstractor heat-conducting plastic body has suffered.Yet for the heat dispersion of heat abstractor, what play a decisive role is the heat-sinking capability of each fin of heat abstractor.The plastics heat abstractor of existing type can not improve the heat dispersion of entire heat dissipation device in essence.
Summary of the invention
Therefore, the objective of the invention is to propose a kind of heat abstractor with heat dispersion of improvement.This heat abstractor has good performance of heat dissipation, and weight is lighter relatively simultaneously, and cheaper with respect to traditional all-metal heat abstractor price.Another object of the present invention is the manufacturing approach that proposes a kind of heat abstractor of the above-mentioned type.
First purpose of the present invention realizes through a kind of heat abstractor thus; Promptly this heat abstractor has: first radiator structure and second radiator structure that contact with the object heat conduction of waiting to dispel the heat; Wherein, First radiator structure comprises that a plurality of first fin and second radiator structure comprise a plurality of second fin, and wherein, first fin is inserted in the cavity that is formed in second fin.Usually be applied in the illuminator according to heat abstractor of the present invention, especially be applied in the LED illuminator.The heat that produces as the chip of the led module of light source passes to first and second radiator structures of heat abstractor through the printed circuit board (PCB) that carries led chip.Can reduce the led chip junction temperature apace according to heat abstractor of the present invention, thereby improve the luminous efficiency of led chip significantly, prolong the service life of led module.
Propose according to the present invention, first fin has the heat conductivility higher than second fin.In design of the present invention, first fin is processed by simple metal such as copper, aluminium usually, can certainly be processed by other metals with high heat conductivility.And second fin is processed by heat-conducting plastic.Because first fin has been inserted in the cavity of second fin; And first fin has higher heat conductivility; This has improved the heat-sinking capability of second fin significantly; And then improved the heat-sinking capability of entire heat dissipation device, and accelerated the speed of heat rejection and removal from the led chip, reach the purpose of quick reduction led chip junction temperature.
According to a preferred design of the present invention, first radiator structure also has bearing assembly, this bearing assembly carry be typically designed to led module wait to dispel the heat object and be connected with each first heat sink conducts heat.Through using this bearing assembly, the heat from led module is delivered on each first fin more equably, shed thereby heat arranged equably.
Preferably, second radiator structure also has matrix, and this matrix has the accommodation section that holds bearing assembly.Bearing assembly firmly is contained in the matrix, and then the object that dispels the heat waited as led module is also remained in the matrix, thus, as much as possible led module is surrounded through heat abstractor, and this helps led module is dispelled the heat more.
Preferably, bearing assembly comprises heat-conducting plate and the installing plate that stacks together, and wherein first fin is embedded into respectively in heat-conducting plate and the installing plate, and installing plate connects each first fin in aggregates.Face of heat-conducting plate closely contacts with the object of waiting to dispel the heat, and another surface bearing is on installing plate, and installing plate then is resisted against on the corresponding bottom surface of matrix accommodation section.Each first fin is embedded into respectively on the side of heat-conducting plate and installing plate again.Through using this structure, each first fin can remain on the installing plate well, and can the heat from heat-conducting plate be conducted equably again.
Further preferably, offer a plurality of notches on heat-conducting plate and the installing plate respectively, first fin is inserted in the notch respectively, thereby guarantees that heat-conducting plate is connected with the heat conduction of first fin, and being fixedly connected of installing plate and first fin.
Propose according to the present invention, second fin and matrix are made into integration by the heat-conducting plastic of thermal conductivity factor between 1-4W/mk.In preferred design of the present invention, Heat Conduction Material can be materials such as PP, PPS, PA or ABS.This material has reduced the weight of entire heat dissipation device significantly, and has simplified manufacturing process.
Preferably, the same with first fin, heat-conducting plate is also processed greater than the metal material of 4W/mk by thermal conductivity factor.In preferred design of the present invention, the heat-conducting plate and first fin can be processed by copper base or aluminium based metal material, can certainly be processed by other metals with high heat conductivility.Heat from led chip can pass to first fin apace through this heat-conducting plate.
Another object of the present invention is to propose a kind of manufacturing approach of heat abstractor, this method may further comprise the steps: first radiator structure with a plurality of first fin a) is provided; B) second radiator structure of being processed by heat-conducting plastic is provided, second radiator structure comprises matrix and second fin that on the outer surface of matrix, extends radially outwardly, and wherein, in second fin, is formed with cavity; C) first fin is inserted in the cavity of second fin; D) utilizing heat-conducting plastic that first fin and second fin are carried out injection moulding seals.Heat abstractor through the method manufacturing has good performance of heat dissipation, and weight is lighter relatively simultaneously, and cheaper with respect to traditional all-metal heat abstractor price.
Preferably, in step a), also comprise through installing plate a plurality of first fin are connected into holistic process.Through this installing plate each first fin is firmly linked together, thus simpler in the process that first fin is inserted in the cavity of second fin.
Further preferably, in said step a), further be included in the heat-conducting plate that carries the object of waiting to dispel the heat, the process that heat-conducting plate is connected with each first heat sink conducts heat are set on the installing plate.Through heat-conducting plate is set, can be delivered to more well on each first fin from the heat of the object of waiting to dispel the heat.
Description of drawings
Accompanying drawing constitutes the part of this specification, is used to help further understand the present invention.These accompanying drawing diagrams embodiments of the invention, and be used for explaining principle of the present invention with specification.Identical in the accompanying drawings parts are represented with identical label.Shown in the figure:
Fig. 1 is the decomposition diagram according to heat abstractor of the present invention;
Fig. 2 is the decomposition diagram according to first radiator structure of heat abstractor of the present invention;
Fig. 3 a-Fig. 3 e is the assembly flow charts of manufacturing method according to the invention.
The specific embodiment
Fig. 1 shows the decomposition diagram according to heat abstractor of the present invention.Visible from Fig. 1, heat abstractor comprises the first radiator structure A and the second radiator structure B, and wherein the first radiator structure A has a plurality of independently first fin 1, and these first fin 1 are made of metal, and are especially processed by copper or aluminium.In addition, the first radiator structure A also has bearing assembly C, and this bearing assembly C carries object unshowned to be dispelled the heat, and led module just, and bearing assembly C is connected with each first fin, 1 heat conduction.In a specific embodiment of the present invention, bearing assembly C is designed to a disk, and each first fin 1 is plugged on the circumference of discoid bearing assembly C equably.
From Fig. 1, also can see; Also comprise the second radiator structure B according to heat abstractor of the present invention; This second radiator structure B has matrix 4, is designed to columniformly at this matrix 4, and on the outer surface of matrix 4, is formed with a plurality of second fin 2 that are made into integration with matrix 4.In addition, in matrix 4, also be formed with accommodation section 5.In design of the present invention, the matrix 4 and second fin 2 spray Shooting Technique by the heat-conducting plastic utilization and are made into integration.Visible from figure, first fin 1 that all is formed with a cavity 3, the first radiator structure A on each second fin 2 is inserted in this cavity 3, thereby forms complete heat abstractor.For first fin 1 is contacted with second fin 2 better, after assembling is accomplished, can be filled in the space between first fin 1 and second fin 2 through the heat-conducting plastic that melts, and be cured.In the heat abstractor that assembling is accomplished, first fin 1 is inserted completely in the cavity 3 of second fin, and bearing assembly C is contained in the accommodation section 5.
Fig. 2 shows the decomposition diagram according to the first radiator structure A of heat abstractor of the present invention.Visible from figure, heat-conducting plate 6 and installing plate 7 that this first radiator structure A comprises a plurality of first fin 1 and constitutes bearing assembly C.In design of the present invention, heat-conducting plate 6 is processed by copper or aluminium, and installing plate 7 is processed by heat-conducting plastic.On the circumference of heat-conducting plate 6 and installing plate 7, offer a plurality of notches 8 equably.First fin 1 is inserted into respectively in each notch 8, thereby a plurality of first fin 1 are firmly remained on the installing plate 7, so that assemble.Under final confined state, installing plate 7 is resisted against on the bottom surface of accommodation section 5 of matrix 4, and a face of heat-conducting plate 6 is resisted against on the installing plate, and another side is resisted against on the object of waiting to dispel the heat, just on the led module.Simultaneously, heat-conducting plate 6 also contacts with first fin 1, thereby the heat of led module is delivered on the second radiator structure B.
Fig. 3 a-Fig. 3 e shows the assembly flow charts of manufacturing method according to the invention.The first radiator structure A at first is provided in step a); In this step, at first provide a plurality of first fin 1, heat-conducting plate 6 and installing plate 7 (referring to Fig. 3 a), however these first fin 1 are inserted into respectively in the corresponding notch 8 of installing plate 7; Form firm overall structure (referring to figure b); The last heat-conducting plate 6 of above installing plate 7, placing, this each first fin 1 also snaps onto respectively in the notch 8 of heat-conducting plate 6, is connected (referring to Fig. 3 c) thereby form good heat conduction with heat-conducting plate.The second radiator structure B that is processed by heat-conducting plastic is provided in step b), and second radiator structure comprises matrix 4 and second fin 2 that on the outer surface of matrix, extends radially outwardly, and wherein, in second fin 2, is formed with cavity 3 (referring to Fig. 3 d).In step c), first fin 1 is inserted in the cavity 3 of second fin 2; D) utilize heat-conducting plastic that first fin 1 and second fin 2 are carried out injection moulding and seal, form thus according to heat abstractor of the present invention (referring to Fig. 3 e).
More than be merely the preferred embodiments of the present invention, be not limited to the present invention, for a person skilled in the art, the present invention can have various changes and variation.All any modifications of within spirit of the present invention and principle, being done, be equal to replacement, improvement etc., all should be included within protection scope of the present invention.
Reference number
1 first fin
2 second fin
3 cavitys
4 matrixes
5 accommodation sections
6 heat-conducting plates
7 installing plates
8 notches
A first radiator structure
B second radiator structure
The C bearing assembly
Claims (13)
1. heat abstractor; Be characterised in that; Said heat abstractor has: with first radiator structure (A) and second radiator structure (B) that the object heat conduction of waiting to dispel the heat contacts, wherein, said first radiator structure (A) comprises that a plurality of first fin (1) and said second radiator structure (B) comprise a plurality of second fin (2); Wherein, first fin (1) is inserted in the cavity (3) that is formed in second fin (2).
2. heat abstractor according to claim 1 is characterized in that, said first fin (1) has than the high heat conductivility of said second fin (2).
3. heat abstractor according to claim 1 is characterized in that, said first radiator structure (A) also has bearing assembly (C), and said bearing assembly (C) carries the said object and be connected with each said first fin (1) heat conduction of waiting to dispel the heat.
4. heat abstractor according to claim 3 is characterized in that, said second radiator structure (B) also has matrix (4), and said matrix (4) has the accommodation section (5) that holds said bearing assembly (C).
5. heat abstractor according to claim 4; It is characterized in that; Said bearing assembly (C) comprises heat-conducting plate (6) and the installing plate (7) that stacks together; Wherein said first fin (1) is embedded into respectively in said heat-conducting plate (6) and the said installing plate (7), and said installing plate (7) connects each said first fin (1) in aggregates.
6. heat abstractor according to claim 5 is characterized in that, offers a plurality of notches (8) respectively on said heat-conducting plate (6) and the said installing plate (7), and said first fin (1) is inserted into respectively in the said notch (8).
7. heat abstractor according to claim 4 is characterized in that, said second fin (2) and said matrix (4) are made into integration by the heat-conducting plastic of thermal conductivity factor between 1-4W/mk.
8. heat abstractor according to claim 7 is characterized in that, said heat-conducting plastic is PP, PPS, PA or ABS material.
9. heat abstractor according to claim 5 is characterized in that, said first fin (1) and said heat-conducting plate (6) are processed greater than the metal material of 4W/mk by thermal conductivity factor.
10. heat abstractor according to claim 9 is characterized in that, said first fin (1) and said heat-conducting plate (6) are processed by copper base or aluminium based metal material.
11. the manufacturing approach of a heat abstractor is characterized in that following steps:
A) first radiator structure (A) with a plurality of first fin (1) is provided;
B) second radiator structure of being processed by heat-conducting plastic (B) is provided; Second fin (1) that said second radiator structure (B) comprises matrix (4) and on the outer surface of said matrix (4), extends radially outwardly; Wherein, in said second fin (2), be formed with cavity (3);
C) said first fin (1) is inserted in the said cavity of said second fin (2) (3);
D) utilizing heat-conducting plastic that said first fin (1) and said second fin (2) are carried out injection moulding seals.
12. manufacturing approach according to claim 11 is characterized in that, in said step a), also comprises through installing plate (7) a plurality of said first fin (1) are connected into holistic process.
13. manufacturing approach according to claim 12; It is characterized in that; In said step a), further be included in the heat-conducting plate (6) that carries the object of waiting to dispel the heat, the process that said first fin of said heat-conducting plate (6) and each (1) heat conduction is connected are set on the said installing plate (7).
Priority Applications (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2011101685356A CN102840567A (en) | 2011-06-21 | 2011-06-21 | Heat sink and manufacture method thereof |
| PCT/EP2012/059427 WO2012175263A1 (en) | 2011-06-21 | 2012-05-22 | Heat-sink device and manufacturing method thereof |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2011101685356A CN102840567A (en) | 2011-06-21 | 2011-06-21 | Heat sink and manufacture method thereof |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN102840567A true CN102840567A (en) | 2012-12-26 |
Family
ID=46208459
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN2011101685356A Pending CN102840567A (en) | 2011-06-21 | 2011-06-21 | Heat sink and manufacture method thereof |
Country Status (2)
| Country | Link |
|---|---|
| CN (1) | CN102840567A (en) |
| WO (1) | WO2012175263A1 (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103307573A (en) * | 2012-03-13 | 2013-09-18 | 欧司朗股份有限公司 | Radiator and illuminating device provided with same |
Families Citing this family (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103604055B (en) * | 2013-11-21 | 2015-07-29 | 王丽娜 | A kind of LED module |
| JP2017162788A (en) * | 2016-03-04 | 2017-09-14 | 三菱電機株式会社 | Lighting device and illuminating device |
| US10386058B1 (en) | 2016-03-17 | 2019-08-20 | Shat-R-Shield, Inc. | LED luminaire |
| US10767849B2 (en) * | 2016-04-25 | 2020-09-08 | Shat-R-Shield, Inc. | LED luminaire |
| EP3403937B1 (en) * | 2017-05-19 | 2021-01-13 | Goodrich Lighting Systems GmbH | Exterior aircraft light unit |
Family Cites Families (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TW200934362A (en) * | 2008-01-16 | 2009-08-01 | Neng Tyi Prec Ind Co Ltd | Method of manufacturing heat dissipaters having heat sinks and structure thereof |
| US20100044009A1 (en) * | 2008-08-20 | 2010-02-25 | Shyh-Ming Chen | Annular heat dissipating device |
-
2011
- 2011-06-21 CN CN2011101685356A patent/CN102840567A/en active Pending
-
2012
- 2012-05-22 WO PCT/EP2012/059427 patent/WO2012175263A1/en active Application Filing
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103307573A (en) * | 2012-03-13 | 2013-09-18 | 欧司朗股份有限公司 | Radiator and illuminating device provided with same |
| CN103307573B (en) * | 2012-03-13 | 2018-07-24 | 欧司朗股份有限公司 | Radiator and lighting device with the radiator |
Also Published As
| Publication number | Publication date |
|---|---|
| WO2012175263A1 (en) | 2012-12-27 |
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Application publication date: 20121226 |