CN102829368A - High-power LED (Light-Emitting Diode) finger-shaped module capable of replacing halogen lamp - Google Patents

High-power LED (Light-Emitting Diode) finger-shaped module capable of replacing halogen lamp Download PDF

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Publication number
CN102829368A
CN102829368A CN2012103631726A CN201210363172A CN102829368A CN 102829368 A CN102829368 A CN 102829368A CN 2012103631726 A CN2012103631726 A CN 2012103631726A CN 201210363172 A CN201210363172 A CN 201210363172A CN 102829368 A CN102829368 A CN 102829368A
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finger
heat
conducting
light source
circuit
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CN102829368B (en
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姚兵
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Abstract

The invention provides a high-power LED (Light-Emitting Diode) finger-shaped module capable of replacing a halogen lamp. The high-power LED finger-shaped module comprises a lamp base and a finger-shaped bulb, wherein the lamp base comprises a hollow insulating heat conduction shell; a heat conduction joint with an annular inner conical surface is formed at the top end of the hollow insulating heat conduction shell; an anti-releasing buckle groove is arranged on the outer edge of the cylindrical face of the insulating heat conduction shell; a driving assembly is arranged in the hollow insulating heat conduction shell and comprises a driver, an elastic input power supply wire joint and an elastic outlet power supply wire joint; the elastic outlet joint is connected with a finger-shaped bulb inserting pin; the finger-shaped bulb comprises a heat conductor substrate assembly and an inserting pin with an elastic contact; an outer conical face heat conduction joint is arranged at the bottom end of the heat conductor substrate assembly; the elastic contact sheet at one end of the inserting pin is communicated with a circuit of the heat conductor substrate assembly; the other end of the inserting pin is inserted into the driving assembly of the lamp base to be matched with a circuit; and a transmitting cover is sleeved on a heat conduction substrate group, and is buckled with an appearance structure reference traditional lamp base on the finger-shaped module lamp base through a buckle, so that the outer surface space of the finger-shaped module lamp is sufficiently used for heat dissipation.

Description

A kind of great power LED finger-type module of instead Halogen lamp LED
Technical field
The invention belongs to electronic technology field, relate to a kind of electric energy-saving product, especially long with the life-span, power consumption is little, the great power LED finger-type module of instead Halogen lamp LED with effects of energy conservation and environmental protection is relevant.
Background technology
The LED bulb of the models such as G4/G9 of the alternative Halogen lamp LED on the world, the domestic market is because the volume restriction of relevant criterion at present; Heat-dissipating space and driving space wretched insufficiency; Cause to improve the brightness requirement that power reaches user's needs, make this type bulb effect in the practical application of light fixture not ideal enough.For this reason, lamps & lanterns factory hopes the commercial city to obtain both approximate with traditional Halogen lamp LED build size and brightness, does not change the novel light bulb of conventional lamp mounting means again, to satisfy the practical application of light fixture.
Summary of the invention
The object of the invention is to solve above problem, provide a kind of life-span long, power consumption is little, the great power LED finger-type module of instead Halogen lamp LED.
For reaching above-mentioned purpose, the present invention adopts following technical scheme:
A kind of great power LED finger-type module of instead Halogen lamp LED comprises cooperatively interacting:
Finger-type module lamp socket 2: comprise the insulating heat-conductive shell 21 of hollow, its top is provided with internal conical surface heat conducting interface 211, and the face of cylinder, insulating heat-conductive shell 21 top outer rim is provided with anticreep catching groove 212, cooperates with the buckle 33-1 of diffuser 33 to prevent the slippage of finger-type bubble; Driven unit 22 is arranged in the insulating heat-conductive shell 21 of hollow; Actuator assembly comprises: driver 221; Can realize the elasticity input power cord interface 222 and elasticity out-put supply line interface 223 of parallel connection, elasticity output interface 223 and the 32 grafting conductings of finger-type bubble contact pin; Insulated power supplies access flap 23 is fastened in the counterbore of insulating heat-conductive shell 21 bottoms of hollow;
Finger-type bubble 3: comprise heat carrier board unit 31, its bottom is provided with outer conical surface heat conducting interface 31-11; The elastic contact blade of contact pin 32, one ends of band elastic contact blade and the circuit communication of heat carrier board unit 31, the other end inserts the driven unit mating circuit conducting of lamp socket; Diffuser 33 is linked on the heat-conducting substrate group 31, is fastened on the finger-type module lamp socket 2 by buckle 33-1.
In the described finger-type bubble, heat-conducting substrate assembly 31 comprises: heat conductive insulating dish 31-1, and its bottom is provided with outer conical surface heat conducting interface 31-11, and the centre position, top is provided with double inclined plane slot 31-12, and the both sides, top are provided with pin holes 31-13; Two-sided heat conductive insulating substrate 31-2, its bottom is provided with double inclined plane contact-making surface 31-21 and cooperates location and heat conduction with double inclined plane slot 31-12, the high pressure light source 31-22 of both sides, top applying configuration, connecting line 31-24 connects the both sides conducting; Contact pin 32 ends of band elastic contact blade have elastic contact blade 32-1, and the contact pin 32 of band elastic contact blade is plugged in the pin holes 31-13, and the elastic contact blade 32-1 of end is fitted in two-sided heat conductive insulating substrate 31-2 and circuit is connected; Diffuser 33 is linked on the heat conductive insulating dish 31-1, is fastened on the finger-type module lamp socket 2 by buckle 33-1.
In the described finger-type bubble; Heat-conducting substrate assembly 31 comprises: the insulation disjunctor light source substrate 31-3 and the heat conducting disk 31-4 of integrated band metallic layer circuit; Heat conducting disk 31-4 bottom is provided with outer conical surface heat conducting interface 31-41; The both sides, top are provided with pin holes 31-42, fit and dispose high pressure light source 31-31 in the both sides, insulation disjunctor light source substrate 31-3 top of band metallic layer circuit, and connecting line 31-33 connects the both sides conducting; Contact pin 32 ends of band elastic contact blade have elastic contact blade 32-1, and the contact pin 32 of band elastic contact blade is plugged in the pin holes 31-13, and the elastic contact blade 32-1 of end is fitted in the insulation disjunctor light source substrate 31-3 and the circuit of band metallic layer circuit and connects; Diffuser 33 is linked on the heat conductive insulating dish 31-1, is fastened on the finger-type module lamp socket 2 by buckle 33-1.
In the described finger-type bubble; Heat-conducting substrate assembly 31 comprises: the disjunctor light source substrate 31-5 of integrated band metallic layer circuit and heat conducting disk 31-6; The disjunctor light source substrate 31-5 both sides of band metallic layer circuit directly encapsulate high pressure light source 31-51; Heat conducting disk 31-6 bottom is provided with outer conical surface heat conducting interface 31-61, and the both sides, top are provided with conducting jack 31-62, and the conducting Socket walls has metal level and circuit communication; Inverted plug type contact pin 32 is placed for inverted plug type, and the end has tongue piece 32-2, and inverted plug type contact pin 32 is plugged in the conducting jack 31-62, and end tongue piece 32-2 equalizes the back welding and connects with circuit; Diffuser 33 is linked on the light source heat conducting disk 31-6, is fastened on the finger-type module lamp socket 2 by buckle 33-1.
Cooperate the high pressure light source to be provided with current-limiting resistance 31-23 on the described two-sided heat conductive insulating substrate.
The insulation disjunctor light source substrate 31-3 of described band metallic layer circuit goes up and cooperates high pressure light source 31-31 to be provided with current-limiting resistance 31-32.
Finger-type module lamp socket 2: comprise the insulating heat-conductive shell 21 of hollow, its top is provided with internal conical surface heat conducting interface 211, and the face of cylinder, insulating heat-conductive shell 21 top is provided with anticreep catching groove 212 and cooperates with the buckle 33-1 of diffuser 33 and prevent the slippage of finger-type bubble; Driven unit 22 is arranged in the insulating heat-conductive shell 21 of hollow, comprising: resistance-capacitance depressurization driver 221, which is provided with elasticity input power cord interface 222 and elasticity output interface 223, and described elasticity output interface 223 cooperates turning circuit with contact pin 32; Insulated power supplies access flap 23 is fastened on the insulating heat-conductive shell 21 of hollow, by the fixing riveted of the soft rivet of semi-hollow or tubular rivet 24.
Adopt technique scheme, the present invention has broken through the bottleneck that substitutes the LED bulb heat radiation insufficient space of Halogen lamp LED at present on the market, and finger-type module lamp socket is used heat conduction and insulating properties excellent material instead; Contour structures is with reference to prior lamp holder; The finger-type bubble transfers heat to finger-type module lamp socket through the circular cone hot interface, lets finger-type module lamp socket carry out auxiliary heat dissipation, increases the integral heat sink ability greatly; Created radiating condition for increasing power, also found suitable space simultaneously for built-in resistance-capacitance depressurization drives.Because hollow shell and heat conducting disk assembly material good insulation performance performance have also been created the condition of using safely for using high pressure light source and resistance-capacitance depressurization to drive.
The setting of the great power LED finger-type module of instead Halogen lamp LED is to help the lamp socket outer surface to bear main heat radiation; Finger-type bulb insulating heat-conductive dish and outer cover of lamp holder material are insulating properties and heat conductivility excellent material; Hot interface between lamp socket and bulb adopts the taper seat of suitable tapering to realize conducting heat; Belong to no gap and cooperate, faying face need not add any heat filling.Appropriate cone angle has certain self-locking performance, can not come off easily, also is unlikely to when dismounting, to produce excessive pulling capacity.Even the conical surface has no technical difficulty like the needs secondary operations, adopt conventional cutting process to get final product, as long as strict control coning angle gets final product outside diameter control in allowed band.There is not any technology difficulty.By it is the luminous intensity distribution setting that breaks through the LED bubble limit of the existing G4/G9 of substituting, is that the LED bulb of popular in the market alternative G4/G9 can't be compared.Can cooperate to meet the traditional standard insulating support or jockey connects with light fixture, can make troubles for light fixture manufacturer because of needs change fitting structure.Finger-type module lamp socket and finger-type bubble all can be changed behind corrupted; Meeting international module standard formulation fully organizes non-alternative, replaceable, the Connection Block of zhaga regulation to separate with photo engine; The principle that mounting interface, power interface, heat radiation interface, optical interface are arranged can be carried out wide model and promoted.
Description of drawings
Fig. 1 is the explosive view of embodiment one;
Fig. 2 is the constitutional diagram of embodiment one;
Fig. 3 is the lamp socket explosive view of embodiment one;
Fig. 4 is the lamp socket constitutional diagram of embodiment one;
Fig. 5 is the driven unit explosive view of embodiment one;
Fig. 6 is the constitutional diagram of the driven unit of embodiment one;
Fig. 7 is the first scheme explosive view of the finger-type bubble of embodiment one;
Fig. 8 is the first scheme heat-conducting substrate assembled figure of the finger-type bubble of embodiment one;
Fig. 9 is the first scheme constitutional diagram of the finger-type bubble of embodiment one;
Figure 10 is the alternative plan explosive view of the finger-type bubble of embodiment one;
Figure 11 is the alternative plan heat-conducting substrate assembled figure of the finger-type bubble of embodiment one;
Figure 12 is the alternative plan constitutional diagram of the finger-type bubble of embodiment one;
Figure 13 is third party's case explosive view of the finger-type bubble of embodiment one;
Figure 14 is third party's case heat-conducting substrate assembled figure of the finger-type bubble of embodiment one;
Figure 15 is third party's case constitutional diagram of the finger-type bubble of embodiment one;
Figure 16 is the circuit diagram of embodiment one;
Figure 17 is the explosive view of embodiment two;
Figure 18 is the constitutional diagram of embodiment two;
Figure 19 is the lamp socket explosive view of embodiment two;
Figure 20 is the lamp socket constitutional diagram of embodiment two;
Figure 21 is the driven unit explosive view of embodiment two;
Figure 22 is the first scheme explosive view of the finger-type bubble of embodiment two;
Figure 23 is the first scheme constitutional diagram of the finger-type bubble of embodiment two;
Figure 24 is the alternative plan explosive view of the finger-type bubble of embodiment two;
Figure 25 is the alternative plan constitutional diagram of the finger-type bubble of embodiment two;
Figure 26 is third party's case explosive view of the finger-type bubble of embodiment two;
Figure 27 is third party's case constitutional diagram of the finger-type bubble of embodiment two;
Figure 28 is that third party's case contact pin of the finger-type bubble of embodiment two inserts the welding sketch map;
Figure 29 is the circuit diagram of embodiment two.
The specific embodiment
Below in conjunction with accompanying drawing and embodiment the present invention is detailed.
Like Fig. 1-Figure 16 embodiment one is the sketch map of the finger-type module of more high-power (5-6W ≈ 500-600lm), and Figure 17-Figure 29 embodiment two is common high-power (3-4W Finger-type module sketch map 300-400lm), two kinds of embodiment structures are basic identical, and just watt level is different; Size is different; Drive circuit is different, and therefore, the finger-type module describes during only with embodiment one more high-power; A kind of great power LED finger-type module of instead Halogen lamp LED comprises cooperatively interacting:
Finger-type module lamp socket 2: comprise the insulating heat-conductive shell 21 of hollow, its top internal conical surface heat conducting interface 211, the face of cylinder, insulating heat-conductive shell 21 top outer rim is provided with anticreep catching groove 212, cooperates with the buckle 33-1 of diffuser 33 to prevent the slippage of finger-type bubble; Driven unit 22 is arranged in the insulating heat-conductive shell 21 of hollow; Actuator assembly comprises: driver 221; Can realize the elasticity input power cord interface 222 and elasticity out-put supply line interface 223 of parallel connection, elasticity output interface 223 and the 32 grafting conductings of finger-type bubble contact pin; Insulated power supplies access flap 23 is fastened in the counterbore of insulating heat-conductive shell 21 bottoms of hollow;
Finger-type bubble 3: comprise heat carrier board unit 31, its bottom is provided with outer conical surface heat conducting interface 31-11; The elastic contact blade of contact pin 32, one ends of band elastic contact blade and the circuit communication of heat carrier board unit 31, the other end inserts the driven unit mating circuit conducting of lamp socket; Diffuser 33 is linked in heat-conducting substrate group 31 and is fastened on the finger-type module lamp socket 2.
But matching standard lamp socket 1 uses.
In the described finger-type bubble, heat-conducting substrate assembly 31 comprises: heat conductive insulating dish 31-1, and its bottom is provided with outer conical surface heat conducting interface 31-11, and the centre position, top is provided with double inclined plane slot 31-12, and the both sides, top are provided with pin holes 31-13; Two-sided heat conductive insulating substrate 31-2, its bottom is provided with double inclined plane contact-making surface 31-21 and cooperates location and heat conduction with double inclined plane slot 31-12, the high pressure light source 31-22 and the current-limiting resistance 31-23 of the applying configuration of both sides, top, connecting line 31-24 connects the both sides conducting; Contact pin 32 ends of band elastic contact blade have elastic contact blade 32-1, and the contact pin 32 of band elastic contact blade is plugged in the pin holes 31-13, and the elastic contact blade 32-1 of end is fitted in two-sided heat conductive insulating substrate 31-2 and circuit is connected; Diffuser 33 is linked on the heat conductive insulating dish 31-1.
In the described finger-type bubble; Heat-conducting substrate assembly 31 comprises: the insulation disjunctor light source substrate 31-3 and the heat conducting disk 31-4 of integrated band metallic layer circuit; Heat conducting disk 31-4 bottom is provided with outer conical surface heat conducting interface 31-41; The both sides, top are provided with pin holes 31-42, fit and dispose high pressure light source 31-31 and current-limiting resistance 31-32 in the both sides, insulation disjunctor light source substrate 31-3 top of band metallic layer circuit, and connecting line 31-33 connects the both sides conducting; Contact pin 32 ends of band elastic contact blade have elastic contact blade 32-1, and the contact pin 32 of band elastic contact blade is plugged in the pin holes 31-13, and the elastic contact blade 32-1 of end is fitted in the insulation disjunctor light source substrate 31-3 and the circuit of band metallic layer circuit and connects; Diffuser 33 is linked on the heat conductive insulating dish 31-1.
In the described finger-type bubble; Heat-conducting substrate assembly 31 comprises: the disjunctor light source substrate 31-5 of integrated band metallic layer circuit and heat conducting disk 31-6; The disjunctor light source substrate 31-5 both sides of band metallic layer circuit directly encapsulate high pressure light source 31-51; Heat conducting disk 31-6 bottom is provided with outer conical surface heat conducting interface 31-61, and the both sides, top are provided with conducting jack 31-62, and the conducting Socket walls has metal level and circuit communication; Inverted plug type contact pin 32 is placed for inverted plug type, and the end has tongue piece 32-2, and inverted plug type contact pin 32 is plugged in the conducting jack 31-62, and end tongue piece 32-2 equalizes the back welding and connects with circuit; Diffuser 33 is linked on the light source heat conducting disk 31-6.
Finger-type module lamp socket 2: comprise the insulating heat-conductive shell 21 of hollow, its top is provided with internal conical surface heat conducting interface 211, and the face of cylinder, insulating heat-conductive shell 21 top is provided with anticreep catching groove 212 and cooperates with the buckle 33-1 of diffuser 33 and prevent the slippage of finger-type bubble; Driven unit 22 is arranged in the insulating heat-conductive shell 21 of hollow, comprising: resistance-capacitance depressurization driver 221, which is provided with elasticity input power cord interface 222 and elasticity output interface 223, and described elasticity output interface 223 cooperates turning circuit with contact pin 32; Insulated power supplies access flap 23 is fastened on the insulating heat-conductive shell 21 of hollow, by the fixing riveted of the soft rivet 24 of semi-hollow when high-power (general use tubular rivet).
Described driven unit power at 5-6W (500-600lm) circuit structure is: the resistance- capacitance depressurization 2 and 2 of band bridge rectifier is scurried paster light source or chip circuit, is furnished with the multilayer holding circuit of the multilayer holding circuit of current-limiting resistance, piezo-resistance.
Described driven unit power at 3-4W (300-400lm) circuit structure is: the resistance-capacitance depressurization 2 of band bridge rectifier is scurried paster light source or chip circuit, is furnished with the multilayer holding circuit of the multilayer holding circuit of current-limiting resistance, piezo-resistance.
Adopt technique scheme; Design idea of the present invention, structure and operation principle further specify as follows: great power LED finger-type module is to meet the novel illumination product that conventional lamp is used fully; Light efficiency can be configured to approximate G4/G9 incandescent lamp bulb requirement, is the New LED illuminating product that can replace traditional G4/G9 incandescent lamp bulb.Maximum characteristics of the present invention are to be set to 300-600lm according to the different capacity needs, in case of necessity in addition can be provided with bigger.By it is the luminous intensity distribution setting that breaks through the LED bubble limit of the existing G4/G9 of substituting, is that the LED bulb of popular in the market alternative G4/G9 can't be compared.The high-power finger-type module of LED is the assembly of lamp socket and finger-type bubble; Lamp socket is mainly with reference to traditional G 9 Ceramic lamp base structures; Adopt traditional approach to cooperate the different support jockey to be connected with light fixture; Light fixture needn't be done any change when using the high-power finger-type module of LED, can make troubles for light fixture manufacturer because of the different change fitting structure of connected mode.Electrical interface has changed former G9 mode, for cooperating hot interface and being communicated with built-in driven unit output, it is arranged to the contact pin mode is connected conducting with driven unit output interface for the petal type structure.Lamp socket and finger-type bubble all can be changed behind corrupted; Meeting international module standard formulation fully organizes non-alternative, replaceable, the Connection Block of zhaga regulation to separate with photo engine; The principle that mounting interface, power interface, heat radiation interface, optical interface are arranged can be carried out wide model and promoted.
In order to solve since the power that increases great power LED finger-type bubble to making the heat-dissipating space wretched insufficiency; The setting of great power LED finger-type module is to bear main heat radiation task by the lamp socket outer surface, and bulb insulating heat-conductive dish and outer cover of lamp holder material are insulating properties and heat conductivility excellent material; Hot interface between lamp socket and bulb adopts the taper seat of suitable tapering to realize conducting heat, and belongs to no gap and cooperates, and faying face need not add any heat filling.Appropriate cone angle has certain self-locking performance and can not come off easily, also is unlikely to when dismounting, to produce excessive pulling capacity.Need secondary operations not have technical difficulty like the conical surface, adopt conventional cutting process to get final product, the size aspect is as long as strict control coning angle gets final product outside diameter control in allowed band.The internal cavities of lamp socket is power supply and output interface and drives the space that driving is that simple and economic bridge rectifier adds two holding circuits.Because lamp socket and bulb are taked all insulation setting, use ac high-voltage light source can not produce potential safety hazard, uses very safely, the most important thing is and can reduce cost significantly.
Lamp socket is to be formed placing driven unit in the cavity of insulating heat-conductive shell and insulating lid riveted by two tubular rivets or soft semitubular rivet; Driven unit is the sub-assembly that on resistance-capacitance depressurization driver pcb board, welds elasticity electrical interface and elasticity output electrical interface, can reduce the assembling link and enhance productivity.The configuration of lamp socket profile is basic identical with traditional external screw thread G9 lamp socket; It itself is exactly a kind of traditional fixed form that screw thread is provided with; Can also help heat radiation through increasing external surface area, also can conduct the heat to light fixture, help outside module, carrying out to greatest extent heat transmission through the coupling part.Support connects configuration and meets the requirement that prior lamp holder must be fit to two or more mounting means fully, and the scope of application is maximization as far as possible.Electric source line interface is with the quick straight cutting mode that adopts, and power line connects very convenient.The lower end of lamp socket is recessed taper seat heat conducting interface, and two holes are arranged at conical surface bottom, supplies bulb contact pin and driver to patch connection circuit.
Great power LED finger-type bubble has three kinds of configurations, in order that adapt to different processes and production equipment, further reduces thermal resistance and improves heat sinking function and light efficiency.
First kind is that the insulating heat-conductive dish adopts the double inclined plane rectangular opening dock with the double inclined plane of vertical double-sided copper base bottom independently to realize heat to conduct the use paster LED light source on vertical double-sided copper base two sides.Carry out embedding behind the hole, garden with contact contact pin insertion insulating heat-conductive dish and fix, with the vertical double-sided copper base insertion double inclined plane rectangular opening of the led light source behind the paster, the conical surface of exerting pressure is a little just combined closely.At this moment, because the elastic force of contact contact pin shell fragment part makes shell fragment and copper base circuit communication, do like this and can reduce the welding link; Confirming that can buckle diffuser after circuit is connected accomplishes assembling.
Second kind is configured to insulating heat-conductive dribbling disjunctor heat conduction disjunctor double-sided metallic circuit substrate, and such being provided with can reduce working link, and technology is simple, can enhance productivity.Equally also be to use the paster LED light source on disjunctor heat conductive insulating double-sided substrate two sides, carry out embedding behind the type hole with contact contact pin insertion insulating heat-conductive dish then and fix.At this moment, because the elastic force of contact contact pin shell fragment part makes shell fragment and copper base circuit communication, do like this and can reduce the welding link; Confirming that can buckle diffuser after circuit is connected accomplishes assembling.
The third configuration is directly on the heat conduction dribbling disjunctor double-sided substrate of thermal conductive ceramic material, to use stereo circuit metallic layer circuit (metallic layer circuit technology is described by other patent), in the enterprising line light source encapsulation of metallized stereo circuit.The contact pin hole wall has metal layer to be connected with circuit with end face, and contact pin contacts with the metal layer of hole wall pouring into the hole surfaces externally and internally, and the microtia of pin head is played the part of flat back and the welding of metal layer circuit, not only connection circuit but also fixed contact pin; Confirming that can buckle diffuser after circuit is connected accomplishes assembling.。
In order to guarantee that great power LED finger-type bubble is unlikely to come off, be provided with the fastener that carries on the mouth edge of diffuser, prevent to come off with the dual fail-safe mode; The positioning table on the mouth edge of diffuser is convenient a kind of fool proof measure when lamp socket inserts great power LED finger-type bubble.
For being fit to the great power LED finger-type bubble of different configurations, the versatility of lamp socket is necessary.In addition, be to adapt to the power requirement of high pressure 50V light source, the output current of resistance-capacitance depressurization circuit is set to about 100mA, employing be that the bridge rectifier of stable performance adds two holding circuits.Great power LED finger-type bubble can be arranged to two-way or multiple series series circuit, only is to use electric current to be different from smaller power LED finger-type bubble.Because the output current of capacitance-resistance reduction voltage circuit is constant in the lamp socket, electric current is set to satisfy the electric current of great power LED finger-type bubble need of load.The LED finger-type of smaller power bubble only need in its circuit, increase a current-limiting resistance reduces output current; Problem just can obtain fine solution like this, can not produce because the hidden danger of the excessive generation damage of electric current because of using super-high-current because of the LED finger-type bubble of smaller power.
The present invention breaks through the bottleneck that substitutes the LED bulb heat radiation insufficient space of Halogen lamp LED at present on the market; Finger-type module lamp socket is used heat conduction and insulating properties excellent material instead; Contour structures is with reference to prior lamp holder, dispels the heat in the outer surface space that makes full use of finger-type module lamp socket.The finger-type bubble transfers heat to finger-type module lamp socket through the circular cone hot interface; Let finger-type module lamp socket carry out auxiliary heat dissipation; Increase the integral heat sink ability greatly, created radiating condition, also found suitable space simultaneously for built-in resistance-capacitance depressurization drives for increasing power.Because hollow shell and heat conducting disk assembly material good insulation performance performance have also been created the condition of using safely for using high pressure light source and resistance-capacitance depressurization to drive.

Claims (7)

1. the great power LED finger-type module of an instead Halogen lamp LED is characterized in that: comprise cooperatively interacting:
Finger-type module lamp socket (2): the insulating heat-conductive shell (21) that comprises hollow; Its top is provided with internal conical surface heat conducting interface (211); Insulating heat-conductive shell (21) face of cylinder, top outer rim is provided with anticreep catching groove (212), cooperates with the buckle (33-1) of diffuser (33) to prevent the slippage of finger-type bubble; Driven unit (22) is arranged in the insulating heat-conductive shell (21) of hollow; Actuator assembly comprises: driver (221); Can realize the elasticity input power cord interface (222) and elasticity out-put supply line interface (223) of parallel connection, elasticity output interface (223) and the grafting conducting of finger-type bubble contact pin (32); Insulated power supplies access flap (23) is fastened in the counterbore of insulating heat-conductive shell (21) bottom of hollow;
Finger-type bubble (3): comprise heat carrier board unit (31), its bottom is provided with outer conical surface heat conducting interface (31-11); The contact pin (32) of band elastic contact blade, the circuit communication of the elastic contact blade of an end and heat carrier board unit (31), the other end inserts the driven unit mating circuit conducting of lamp socket; The heat-conducting substrate group (31) that is linked in diffuser (33) goes up and is fastened on the finger-type module lamp socket (2) by buckle (33-1).
2. the great power LED finger-type module of a kind of instead Halogen lamp LED as claimed in claim 1; It is characterized in that: in the described finger-type bubble; Heat-conducting substrate assembly (31) comprising: heat conductive insulating dish (31-1); Its bottom is provided with outer conical surface heat conducting interface (31-11), and the centre position, top is provided with double inclined plane slot (31-12), and the both sides, top are provided with pin holes (31-13); Two-sided heat conductive insulating substrate (31-2); Its bottom is provided with double inclined plane contact-making surface (31-21) and cooperates location and heat conduction with double inclined plane slot (31-12); The high pressure light source of fitting and dispose in the both sides, top (31-22), connecting line (31-24) is connected the both sides conducting; Contact pin (32) end of band elastic contact blade has elastic contact blade (32-1), and the contact pin (32) of band elastic contact blade is plugged in the pin holes (31-13), and the elastic contact blade of end (32-1) is fitted in two-sided heat conductive insulating substrate (31-2) and connects with circuit; Diffuser (33) is linked on the heat conductive insulating dish (31-1), is fastened on the finger-type module lamp socket (2) by buckle (33-1).
3. the great power LED finger-type module of a kind of instead Halogen lamp LED as claimed in claim 1; It is characterized in that: in the described finger-type bubble; Heat-conducting substrate assembly (31) comprising: the insulation disjunctor light source substrate (31-3) of integrated band metallic layer circuit and heat conducting disk (31-4); Heat conducting disk (31-4) bottom is provided with outer conical surface heat conducting interface (31-41); The both sides, top are provided with pin holes (31-42), fit and dispose high pressure light source (31-31) in insulation disjunctor light source substrate (31-3) both sides, top of band metallic layer circuit, and connecting line (31-33) is connected the both sides conducting; Contact pin (32) end of band elastic contact blade has elastic contact blade (32-1); The contact pin (32) of band elastic contact blade is plugged in the pin holes (31-13), and the elastic contact blade of end (32-1) is fitted in the insulation disjunctor light source substrate (31-3) of band metallic layer circuit and connects with circuit; Diffuser (33) is linked on the heat conductive insulating dish (31-1), is fastened on the finger-type module lamp socket (2) by buckle (33-1).
4. the great power LED finger-type module of a kind of instead Halogen lamp LED as claimed in claim 1; It is characterized in that: in the described finger-type bubble; Heat-conducting substrate assembly (31) comprising: the disjunctor light source substrate (31-5) of integrated band metallic layer circuit and heat conducting disk (31-6); Disjunctor light source substrate (31-5) both sides of band metallic layer circuit directly encapsulate high pressure light source (31-51); Heat conducting disk (31-6) bottom is provided with outer conical surface heat conducting interface (31-61), and the both sides, top are provided with conducting jack (31-62), and the conducting Socket walls has metal level and circuit communication; Inverted plug type contact pin (32) is placed for inverted plug type, and the end has tongue piece (32-2), and inverted plug type contact pin (32) is plugged in the conducting jack (31-62), and end tongue piece (32-2) is equalized the back welding and connected with circuit; Diffuser (33) is linked on the light source heat conducting disk (31-6), is fastened on the finger-type module lamp socket (2) by buckle (33-1).
5. the great power LED finger-type module of a kind of instead Halogen lamp LED as claimed in claim 2 is characterized in that: cooperate the high pressure light source to be provided with current-limiting resistance (31-23) on the described two-sided heat conductive insulating substrate.
6. the great power LED finger-type module of a kind of instead Halogen lamp LED as claimed in claim 3 is characterized in that: the insulation disjunctor light source substrate (31-3) of described band metallic layer circuit is gone up and is cooperated high pressure light source (31-31) to be provided with current-limiting resistance (31-32).
7. like the great power LED finger-type module of claim 1,2,3,4,5 or 6 each described a kind of instead Halogen lamp LEDs, it is characterized in that:
Finger-type module lamp socket (2): the insulating heat-conductive shell (21) that comprises hollow; Its top is provided with internal conical surface heat conducting interface (211), and insulating heat-conductive shell (21) face of cylinder, top is provided with anticreep catching groove (212) and cooperates with the buckle (33-1) of diffuser (33) and prevent the slippage of finger-type bubble; Driven unit (22) is arranged in the insulating heat-conductive shell (21) of hollow; Comprise: resistance-capacitance depressurization driver (221); Which is provided with elasticity input power cord interface (222) and elasticity output interface (223), described elasticity output interface (223) cooperates turning circuit with contact pin (32); Insulated power supplies access flap (23) is fastened on the insulating heat-conductive shell (21) of hollow, by the fixing riveted of the soft rivet of semi-hollow or tubular rivet (24).
CN201210363172.6A 2012-09-26 2012-09-26 High-power LED (Light-Emitting Diode) finger-shaped module capable of replacing halogen lamp Expired - Fee Related CN102829368B (en)

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Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN104180232A (en) * 2014-09-12 2014-12-03 东莞市闻誉实业有限公司 Efficient LED heat dissipation lamp
CN104819413A (en) * 2015-04-24 2015-08-05 广州供电局有限公司 Substation indicator lamp
CN105449404A (en) * 2015-09-11 2016-03-30 利威光源零件(厦门)有限公司 Bayonet base

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Publication number Priority date Publication date Assignee Title
CN101968177A (en) * 2010-11-10 2011-02-09 厦门立明光电有限公司 Novel light-emitting diode lamp capable of replacing halogen lamp
CN102454889A (en) * 2010-10-22 2012-05-16 苏州盟泰励宝光电有限公司 LED lighting lamp
CN102570116A (en) * 2010-10-01 2012-07-11 泰科电子公司 Interface contact for an electrical connector
CN202884555U (en) * 2012-09-26 2013-04-17 姚兵 High-power light-emitting diode (LED) finger-shaped module capable of replacing halogen lamp

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Publication number Priority date Publication date Assignee Title
CN102570116A (en) * 2010-10-01 2012-07-11 泰科电子公司 Interface contact for an electrical connector
CN102454889A (en) * 2010-10-22 2012-05-16 苏州盟泰励宝光电有限公司 LED lighting lamp
CN101968177A (en) * 2010-11-10 2011-02-09 厦门立明光电有限公司 Novel light-emitting diode lamp capable of replacing halogen lamp
CN202884555U (en) * 2012-09-26 2013-04-17 姚兵 High-power light-emitting diode (LED) finger-shaped module capable of replacing halogen lamp

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN104180232A (en) * 2014-09-12 2014-12-03 东莞市闻誉实业有限公司 Efficient LED heat dissipation lamp
CN104180232B (en) * 2014-09-12 2016-08-17 东莞市闻誉实业有限公司 Efficient LED radiating lamp
CN104819413A (en) * 2015-04-24 2015-08-05 广州供电局有限公司 Substation indicator lamp
CN105449404A (en) * 2015-09-11 2016-03-30 利威光源零件(厦门)有限公司 Bayonet base

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