CN102802360A - 一种pcb加工中孤立激光孔防击穿爆孔方法 - Google Patents
一种pcb加工中孤立激光孔防击穿爆孔方法 Download PDFInfo
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- CN102802360A CN102802360A CN2012102954867A CN201210295486A CN102802360A CN 102802360 A CN102802360 A CN 102802360A CN 2012102954867 A CN2012102954867 A CN 2012102954867A CN 201210295486 A CN201210295486 A CN 201210295486A CN 102802360 A CN102802360 A CN 102802360A
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- laser
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- laser hole
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- 238000012545 processing Methods 0.000 title claims abstract description 54
- 238000000034 method Methods 0.000 title claims abstract description 50
- 238000005422 blasting Methods 0.000 title abstract 5
- 238000005553 drilling Methods 0.000 claims abstract description 16
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims abstract description 10
- 239000011889 copper foil Substances 0.000 claims abstract description 6
- 238000005530 etching Methods 0.000 claims abstract description 4
- 238000005516 engineering process Methods 0.000 claims description 10
- 238000011161 development Methods 0.000 claims description 6
- 125000004122 cyclic group Chemical group 0.000 claims description 5
- 238000003825 pressing Methods 0.000 claims description 5
- 238000003475 lamination Methods 0.000 claims description 3
- 238000007747 plating Methods 0.000 claims description 3
- 238000004519 manufacturing process Methods 0.000 abstract description 5
- 230000002035 prolonged effect Effects 0.000 abstract description 3
- 230000015556 catabolic process Effects 0.000 abstract description 2
- 238000010030 laminating Methods 0.000 abstract 2
- JEIPFZHSYJVQDO-UHFFFAOYSA-N ferric oxide Chemical compound O=[Fe]O[Fe]=O JEIPFZHSYJVQDO-UHFFFAOYSA-N 0.000 description 5
- 229910052802 copper Inorganic materials 0.000 description 4
- 239000010949 copper Substances 0.000 description 4
- 230000000694 effects Effects 0.000 description 4
- 238000001354 calcination Methods 0.000 description 3
- 230000005855 radiation Effects 0.000 description 3
- 238000003754 machining Methods 0.000 description 2
- 239000000463 material Substances 0.000 description 2
- 238000012795 verification Methods 0.000 description 2
- 238000002679 ablation Methods 0.000 description 1
- 230000001351 cycling effect Effects 0.000 description 1
- 238000013461 design Methods 0.000 description 1
- 238000009713 electroplating Methods 0.000 description 1
- 239000004744 fabric Substances 0.000 description 1
- 238000001914 filtration Methods 0.000 description 1
- 238000002309 gasification Methods 0.000 description 1
- 239000011491 glass wool Substances 0.000 description 1
- 230000017525 heat dissipation Effects 0.000 description 1
- 230000003252 repetitive effect Effects 0.000 description 1
- 239000011347 resin Substances 0.000 description 1
- 229920005989 resin Polymers 0.000 description 1
- 238000007493 shaping process Methods 0.000 description 1
- 238000004381 surface treatment Methods 0.000 description 1
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Abstract
Description
AP | 外周直径 | 加工模式 | 脉冲周期 | 脉冲宽度 | 脉冲数 |
0 | 0.12mm | I | 500us | 14us | 6 |
Claims (2)
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CN201210295486.7A CN102802360B (zh) | 2012-08-17 | 2012-08-17 | 一种pcb加工中孤立激光孔防击穿爆孔方法 |
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CN201210295486.7A CN102802360B (zh) | 2012-08-17 | 2012-08-17 | 一种pcb加工中孤立激光孔防击穿爆孔方法 |
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CN102802360A true CN102802360A (zh) | 2012-11-28 |
CN102802360B CN102802360B (zh) | 2014-10-01 |
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Cited By (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN103596368A (zh) * | 2013-10-14 | 2014-02-19 | 大连太平洋电子有限公司 | 一种改进的激光直接钻孔加工方法 |
CN105728949A (zh) * | 2016-04-18 | 2016-07-06 | 江苏博敏电子有限公司 | 一种镭射切割方法 |
CN107592741A (zh) * | 2017-09-20 | 2018-01-16 | 四川海英电子科技有限公司 | 制作高密度互连电路板的二阶盲孔的方法 |
CN108260302A (zh) * | 2016-12-28 | 2018-07-06 | 中国科学院苏州纳米技术与纳米仿生研究所 | 多层柔性电路板及其制备方法 |
CN108788498A (zh) * | 2018-08-28 | 2018-11-13 | 济南邦德激光股份有限公司 | 激光切割机穿孔方法、装置和电子设备 |
CN109514110A (zh) * | 2018-12-29 | 2019-03-26 | 江门职业技术学院 | 一种激光雕刻印花工艺及实施该工艺的设备 |
CN114650651A (zh) * | 2022-03-18 | 2022-06-21 | 深圳市牧泰莱电路技术有限公司 | 一种激光台阶hdi的pcb |
CN116249288A (zh) * | 2023-05-09 | 2023-06-09 | 江苏博敏电子有限公司 | 一种用于嵌入芯片结构的多层PCB板Cavity制作方法 |
Families Citing this family (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN108500485A (zh) * | 2017-02-27 | 2018-09-07 | 无锡深南电路有限公司 | 一种ic载板激光微孔的制作方法 |
Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US6479788B1 (en) * | 1997-11-10 | 2002-11-12 | Hitachi Via Mechanics, Ltd. | Method and apparatus of making a hole in a printed circuit board |
CN101222817A (zh) * | 2007-01-13 | 2008-07-16 | 大连太平洋电子有限公司 | 一种盲孔板及其加工方法 |
CN101745744A (zh) * | 2008-12-18 | 2010-06-23 | 北大方正集团有限公司 | 一种直接镭射成孔方法 |
JP4780881B2 (ja) * | 2001-09-28 | 2011-09-28 | 京セラ株式会社 | プリプレグシートのレーザによる穿孔方法 |
-
2012
- 2012-08-17 CN CN201210295486.7A patent/CN102802360B/zh active Active
Patent Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US6479788B1 (en) * | 1997-11-10 | 2002-11-12 | Hitachi Via Mechanics, Ltd. | Method and apparatus of making a hole in a printed circuit board |
JP4780881B2 (ja) * | 2001-09-28 | 2011-09-28 | 京セラ株式会社 | プリプレグシートのレーザによる穿孔方法 |
CN101222817A (zh) * | 2007-01-13 | 2008-07-16 | 大连太平洋电子有限公司 | 一种盲孔板及其加工方法 |
CN101745744A (zh) * | 2008-12-18 | 2010-06-23 | 北大方正集团有限公司 | 一种直接镭射成孔方法 |
Cited By (10)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN103596368A (zh) * | 2013-10-14 | 2014-02-19 | 大连太平洋电子有限公司 | 一种改进的激光直接钻孔加工方法 |
CN105728949A (zh) * | 2016-04-18 | 2016-07-06 | 江苏博敏电子有限公司 | 一种镭射切割方法 |
CN108260302A (zh) * | 2016-12-28 | 2018-07-06 | 中国科学院苏州纳米技术与纳米仿生研究所 | 多层柔性电路板及其制备方法 |
CN107592741A (zh) * | 2017-09-20 | 2018-01-16 | 四川海英电子科技有限公司 | 制作高密度互连电路板的二阶盲孔的方法 |
CN108788498A (zh) * | 2018-08-28 | 2018-11-13 | 济南邦德激光股份有限公司 | 激光切割机穿孔方法、装置和电子设备 |
CN109514110A (zh) * | 2018-12-29 | 2019-03-26 | 江门职业技术学院 | 一种激光雕刻印花工艺及实施该工艺的设备 |
CN109514110B (zh) * | 2018-12-29 | 2023-10-20 | 江门职业技术学院 | 一种激光雕刻印花工艺及实施该工艺的设备 |
CN114650651A (zh) * | 2022-03-18 | 2022-06-21 | 深圳市牧泰莱电路技术有限公司 | 一种激光台阶hdi的pcb |
CN114650651B (zh) * | 2022-03-18 | 2024-05-28 | 深圳市牧泰莱电路技术有限公司 | 一种激光台阶hdi的pcb |
CN116249288A (zh) * | 2023-05-09 | 2023-06-09 | 江苏博敏电子有限公司 | 一种用于嵌入芯片结构的多层PCB板Cavity制作方法 |
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CN102802360B (zh) | 2014-10-01 |
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Effective date of registration: 20160225 Address after: 116600 West Tieshan Road, Dalian Development Zone, Liaoning, China, Patentee after: Dalian new loop Electronics Co.,Ltd. Address before: 116600 No. 127 West Liaohe Road, Jinzhou New District, Liaoning, Dalian Patentee before: DALIAN PACIFIC ELECTRONICS Co.,Ltd. |
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Denomination of invention: A method for preventing breakdown and blasting of isolated laser holes in PCB processing Effective date of registration: 20220830 Granted publication date: 20141001 Pledgee: Bohai Bank Co.,Ltd. Dalian Branch Pledgor: DALIAN ASIA PACIFIC ELECTRONICS CO.,LTD. Registration number: Y2022980014042 |
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Date of cancellation: 20230908 Granted publication date: 20141001 Pledgee: Bohai Bank Co.,Ltd. Dalian Branch Pledgor: DALIAN ASIA PACIFIC ELECTRONICS CO.,LTD. Registration number: Y2022980014042 |
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Denomination of invention: A method for preventing breakdown and explosion of isolated laser holes in PCB processing Effective date of registration: 20230914 Granted publication date: 20141001 Pledgee: Bohai Bank Co.,Ltd. Dalian Branch Pledgor: DALIAN ASIA PACIFIC ELECTRONICS CO.,LTD. Registration number: Y2023980056968 |