CN102801004B - Distributing board - Google Patents
Distributing board Download PDFInfo
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- CN102801004B CN102801004B CN201110435851.5A CN201110435851A CN102801004B CN 102801004 B CN102801004 B CN 102801004B CN 201110435851 A CN201110435851 A CN 201110435851A CN 102801004 B CN102801004 B CN 102801004B
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- splicing ear
- distributing board
- mark
- substrate
- row
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0266—Marks, test patterns or identification means
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/11—Printed elements for providing electric connections to or between printed circuits
- H05K1/117—Pads along the edge of rigid circuit boards, e.g. for pluggable connectors
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- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Combinations Of Printed Boards (AREA)
- Structure Of Printed Boards (AREA)
Abstract
The invention provides a distributing board (1) which includes a distributing board substrate (11) and a terminal row (21). The terminal row (21) is arranged on one side of the distributing board substrate (11) to be connected with a connected terminal row (51) of a connected substrate (40). The distributing board (1) is provided with a mark which indicates the position of the terminal row (21) of the distributing board (1) relative to the connected terminal row (51) of the connected substrate (40). The mark is arranged on a specific position on the distributing board (1) on the basis of a specific part (KA) of the terminal row (21). The mark of the distributing board (1) and a part of the connected substrate (40) can be observed.
Description
Technical field
The present invention relates to a kind of have for the distributing board that is connected terminal and is listed as the splicing ear row that are connected that is connected substrate.
Background technology
Current, in the case of the splicing ear row of substrate are connected with the splicing ear row of other substrate, via connector, both splicing ear row are connected.But, being accompanied by the miniaturization of electronic equipment, the requirement that the space of the coupling part of both splicing ear row is reduced uprises.Therefore,, as shown in Japanese kokai publication hei 10-41599 communique, proposed not use connector and method that both splicing ear row are connected.
According to the technology of Japanese kokai publication hei 10-41599 communique, at the formation insulating barrier around terminal row that is connected that is connected substrate being connected with the splicing ear row of distributing board, on this insulating barrier formation be connected terminal and be listed as corresponding groove.By the splicing ear row of distributing board are embedded in this groove, thereby determine that the splicing ear of distributing board is listed as and is connected the position between terminal row that is connected of substrate.
Summary of the invention
The technology of Japanese kokai publication hei 10-41599 communique can be applied to the splicing ear row that the end face from substrate is protruded and be listed as situation about being connected with the terminal that is connected that is connected substrate.But this technology cannot be applied to the splicing ear being arranged in substrate front side is listed as to situation connected to one another.
In addition, the splicing ear that is arranged at substrate front side is being listed as in situation connected to one another, due to splicing ear is listed as toward each other, so operating personnel can only observe the back side of splicing ear row.Therefore, operating personnel cannot observe splicing ear row, so be difficult to determine that splicing ear is listed as position each other.
The present invention proposes in view of above-mentioned actual conditions, and its object is, a kind of distributing board is provided, and it can easily determine that splicing ear is listed as with respect to the position that is connected terminal row that is connected substrate.
Record method and the action effect thereof for realizing above-mentioned purpose below.
(1) according to an example of the present invention, distributing board has distributing board substrate and splicing ear row, described splicing ear row are formed on a face of described distributing board substrate, be configured to the terminal row that are connected that are connected substrate and be connected, this distributing board is characterised in that, the splicing ear that described distributing board also has for determining described distributing board is listed as the mark with respect to the described position that is connected terminal row that is connected substrate, described mark is arranged on the specific location of the specific part being listed as taking described splicing ear on the described distributing board that benchmark is set, described distributing board is configured to, can observe this mark, and described in be connected the part of substrate.
In the case, owing to can observing mark, and be connected the ad-hoc location of substrate, so can make the mark of distributing board consistent with the ad-hoc location that is connected substrate.Therefore, be connected the position relationship between terminal row and ad-hoc location that is connected of substrate, in the situation identical with position relationship between mark with the splicing ear row of distributing board, by making the mark of distributing board consistent with the ad-hoc location that is connected substrate, thereby splicing ear can be listed as to the configuration location that is listed as to specify with respect to being connected terminal.In addition, owing to can observing the mark and the ad-hoc location that is connected substrate of distributing board, even so be listed as and be connected being connected terminal row of substrate in the case of observing the splicing ear of distributing board, also splicing ear can be listed as with respect to being connected terminal row location.
(2) according to other example of the present invention, also can make described splicing ear row there are multiple splicing ears, described mark is at least 1 splicing ear in described multiple splicing ear, or a part for described at least 1 splicing ear.
In the case, due to the mark as location use using splicing ear or its part, print or laser beam marking etc. forms new mark on distributing board so do not need to utilize.Therefore, the operation that forms mark can be omitted, therefore, the manufacturing process of distributing board can be simplified.In addition, owing to not needing to guarantee to form the space of mark, so can dwindle distributing board.
(3), according to other example of the present invention, also can make described distributing board have: main part, it has the multiple distributions that extend to described splicing ear row; And connecting portion, it has described splicing ear row, and described distributing board substrate has: 2 the 1st submounts, it clamps described distribution and forms described main part; And the 2nd submounts, its back side to described splicing ear row is supported and forms described connecting portion, and described the 2nd submounts is configured to, and can be had an X-rayed described in observing and is connected substrate by the 2nd submounts.
In the case, because the 2nd submounts is transparent, so splicing ear can be used as the mark for locating.Because the splicing ear that can work to serve as a mark is observed the terminal that is connected that is connected substrate as benchmark, so by make splicing ear be connected substrate to be connected terminal consistent, position thereby the splicing ear of distributing board can be listed as with respect to the terminal row that are connected that are connected substrate.
(4) according to other example of the present invention, also can make described distributing board substrate structure become, can have an X-rayed described in observing and be connected substrate by this distributing board substrate.
In the case, because the substrate of distributing board is transparent, thus can regard mark as benchmark, and can observe the ad-hoc location that is connected substrate.Thus, can make this mark of distributing board consistent with the ad-hoc location that is connected substrate, the splicing ear of distributing board is listed as with respect to the terminal row that are connected that are connected substrate and is positioned.
(5), according to other example of the present invention, described mark can be also the through hole that runs through described distributing board substrate.
In the case, owing to being labeled as through hole, so can observe the ad-hoc location that is connected substrate by this through hole.Thus, can make this mark of distributing board consistent with the ad-hoc location that is connected substrate, the splicing ear of distributing board is listed as with respect to the terminal row that are connected that are connected substrate and is positioned.
(6), according to other example of the present invention, described mark also can be arranged on the otch on the end of described distributing board substrate.
In the case, owing to being labeled as otch, so can observe the ad-hoc location that is connected substrate by this otch.Thus, can make this mark of distributing board consistent with the ad-hoc location that is connected substrate, the splicing ear of distributing board is listed as with respect to the terminal row that are connected that are connected substrate and is positioned.
(7) according to other example of the present invention, also can make described mark be configured to, determine this mark and described in be connected the permissible range of the alternate position spike between the ad-hoc location of substrate.
In the case, can observe the mark of distributing board and be connected alternate position spike between substrate whether in permissible range.That thus, can easily judge the splicing ear row of distributing board and be connected substrate is connected the whether position relationship in regulation of terminal row.
In addition, in the situation that splicing ear is served as a mark, preferably this splicing ear and be connected the size that terminal is same degree that is connected of substrate, but also can one be made as more bigger than another.At splicing ear than being connected terminal little in the situation that, when being connected being connected of substrate and configuring this splicing ear on terminal, can observation place alignment scope.On the contrary, in the case of this splicing ear than be connected substrate be connected terminal large, when being connected being connected of substrate and configuring this splicing ear on terminal, be blocked if be connected the entirety that is connected terminal of substrate, be judged to be distributing board and be connected alternate position spike between substrate in permissible range.
(8), according to other example of the present invention, also can make described splicing ear row have: multiple splicing ears; Conduction articulamentum, it is configured on the upper surface of described each splicing ear, and is formed by the electroconductive resin that comprises conductive particle; And insulating barrier, it is configured in described splicing ear between at least 1 pair, and splicing ear is insulated from each other, and described insulating barrier is formed by insulating adhesive.
In the case, by the splicing ear row of distributing board when being connected being connected terminal row and being connected of substrate, insulating barrier and be connected substrate to be connected the part of terminal between being listed as bonding.That is, the splicing ear of distributing board row and the terminal that is connected that is connected substrate be listed ass via the electrical connection of conduction articulamentum, and distributing board and be connected substrate to pass through insulating adhesive bonding.Therefore, with distributing board be connected substrate and do not compare by the bonding situation of insulating adhesive, can increase distributing board and be connected the intensity of the coupling part between substrate.
(9) according to other example of the present invention, also can make described distributing board there is stiffener, this stiffener is arranged on the connecting portion with described splicing ear row, and this connecting portion is strengthened, and is provided with described mark on described stiffener.
In the case, utilize stiffener to strengthen splicing ear row.In addition, owing to being formed with mark on this stiffener, so can improve the positional precision of mark with respect to the reference position of splicing ear row.
(10), according to other example of the present invention, also can make described stiffener be listed as and on corresponding position, there is heating and use hole with described splicing ear.
In the case, because stiffener has heating with hole, so in the time that splicing ear row are heated, can not heat the part that is provided with splicing ear row via stiffener.Therefore, be reinforced with the part that is provided with splicing ear row the situation that plate covers compared with, splicing ear row promptly can be heated to set point of temperature.
(11), according to other example of the present invention, also described being marked at taking the specific part of described splicing ear row can be arranged to 2 on the diverse location that benchmark is set.
In the case, by making 2 marks consistent with the corresponding ad-hoc location that is connected substrate respectively, thereby the terminal board column direction that can make the splicing ear of distributing board be listed as is consistent with the terminal board column direction that is connected terminal row that is connected substrate, and both are positioned.
Brief description of the drawings
Fig. 1 is the distributing board for embodiments of the present invention, and the oblique view of a part for connecting portion is shown.
Fig. 2 is the vertical view that represents the back side of the distributing board of embodiments of the present invention.
Fig. 3 is the schematic diagram that represents the distributing board of embodiments of the present invention and be connected the method for attachment between substrate.
Fig. 4 is the vertical view that represents the distributing board to embodiments of the present invention and be connected position between substrate to carry out definite situation.
Fig. 5 is the schematic diagram that represents the distributing board of embodiments of the present invention and be connected the adhering method between substrate.
Fig. 6 is the 1st variation for embodiments of the present invention, illustrates this distributing board and is connected position between substrate and carries out the vertical view of definite situation.
Fig. 7 is the 2nd variation for embodiments of the present invention, illustrates this distributing board and is connected position between substrate and carries out the vertical view of definite situation.
Fig. 8 is the 3rd variation for embodiments of the present invention, illustrates this distributing board and is connected position between substrate and carries out the vertical view of definite situation.
Fig. 9 is the 4th variation for embodiments of the present invention, and the oblique view of a part for connecting portion is shown.
Figure 10 is the distributing board for the 4th variation, and the figure of the product in manufacture process is shown.
Figure 11 is the distributing board for the 4th variation, and the figure of the product in manufacture process is shown.
Figure 12 is the oblique view that represents a variation of embodiments of the present invention.
Embodiment
With reference to Fig. 1～Fig. 5, the execution mode that distributing board of the present invention is specialized is described.
As shown in Figures 1 and 2, distributing board 1 comprises main part 10 and is arranged on the connecting portion 20 of the leading section of main part 10.Connecting portion 20 is connected with the portion that is connected 50 that is connected substrate 40.
Main part 10 has: Wiring pattern 12, and it is formed by electric conducting material; Distributing board substrate 11, it sandwiches Wiring pattern 12; And bond layer 13, it is coated between distributing board substrate 11 and Wiring pattern 12, by bonding to distributing board substrate 11 and Wiring pattern 12.Wiring pattern 12 illustrates the pattern after many conductor arrangement.
Distributing board substrate 11 is transparent.Specifically, the transparency of distributing board substrate 11 is, can have an X-rayed and observe to be connected substrate 40.In addition, the bonding agent of formation bond layer 13 is transparent after sclerosis.Specifically, the transparency of bonding agent is, can have an X-rayed and observe to be connected substrate 40 after adhesive hardens.That is, owing to having transparent distributing board substrate 11 and transparent bond layer 13, so distributing board 1 is transparent, and then distributing board 1 has in the time observing from one side side, can have an X-rayed and observe the structure of the parts that are disposed at another side side.
As distributing board substrate 11, for example can enumerate thickness is the insulative resin thin plate of the polyethylene terephthalate of 12 μ m.The polyesters bonding agent that bond layer 13 applies the thickness of 30 μ m on distributing board substrate 11 forms.As Wiring pattern 12, for example can enumerate thickness is the Copper Foil line of 35 μ m.
Connecting portion 20 comprises: the 20A of basic courses department; Splicing ear 22, it is configured in the upper surface of the 20A of basic courses department; Conduction articulamentum 23, it is formed on the upper surface of each splicing ear 22; Insulating barrier 24, it is configured between adjacent splicing ear 22; And stiffener 26, it is strengthened this connecting portion 20.The distributing board substrate 11 that the 20A of basic courses department comprises by making main part 10 extends the part forming and extends by the bond layer 13 that makes main part 10 part forming.The length direction of splicing ear 22 is denoted as to distribution direction YA below.By orthogonal with distribution direction YA and be denoted as terminal board column direction XA along the direction of the face of distributing board 1.
Splicing ear 22 forms by Wiring pattern 12 is extended.Splicing ear 22 is parallel to each other and arrange formation splicing ear row 21 with equal intervals.The interval D A of the center line of adjacent splicing ear 22 is 0.5mm or 0.3～1.0mm.Distance (hereinafter referred to as " terminal pitch is from DB ") between the side of adjacent splicing ear 22 is 0.2mm or 0.15～0.3mm.In addition, each splicing ear 22 is configured on the bond layer 13 being laminated on distributing board substrate 11.The bottom of splicing ear 22 is imbedded in bond layer 13.
Conduction articulamentum 23 is formed on the upper surface of each splicing ear 22.Conduction articulamentum 23 is for example formed as the thickness of 15 μ m by thermoplastic silver paste.As silver paste, preferably use that to comprise average grain diameter be the flakey silver powder of 0.5～5 μ m and organic substance is carried out to the silver paste that average grain diameter after metallic cover is less than or equal to the spherical silver powder of 20nm.Be less than or equal to the spherical silver powder of 20nm owing to containing average grain diameter in silver paste, become level and smooth so can make to conduct electricity the surface of articulamentum 23.Utilize level and smooth surface, can increase the contact area between terminal 52 that is connected of conducting electricity the partly surperficial of articulamentum 23 and being connected substrate 40.
Insulating barrier 24 is configured on bond layer 13.The height of the upper surface of insulating barrier 24, taking the upper surface of distributing board substrate 11 as datum level 25, is arranged on than the Geng Gao position, position of the upper surface of conduction articulamentum 23.Step HA between insulating barrier 24 and conduction articulamentum 23 arranges highlyer than the height that is connected terminal 52 that is connected substrate 40.In addition, the end face distance WA between insulating barrier 24 adjacent one another are is set to, identical or larger than this length with the length of the Width that is connected terminal 52 that is connected substrate 40.
As the insulating adhesive that forms insulating barrier 24, can enumerate for example polyesters hot-melt adhesive.The melt temperature of insulating barrier 24 is for example preferably 120 DEG C～150 DEG C.Lower than 120 DEG C, may make distributing board 1 and the adhesive strength that is connected between substrate 40 reduces in the melt temperature of insulating barrier 24.Be greater than 150 DEG C in the melt temperature of insulating barrier 24, may make distributing board substrate 11 be out of shape, or the bonding force between distributing board substrate 11 and bond layer 13 is reduced.
Stiffener 26 is configured in the back side of connecting portion 20, on the face relative with the face that is formed with splicing ear 22.Stiffener 26 is transparent, and then, in the time that stiffener 26 is disposed on connecting portion 20, can has an X-rayed and observe connecting portion 20.As stiffener 26, for example, can enumerate polyethylene terephthalate substrate, polyimide substrate etc.In addition, stiffener 26 has the heat resisting temperature higher than the melt temperature of insulating adhesive.
In addition, as shown in figure 12, distributing board 1 also can not have main part and only have connecting portion 20.Arranged spaced Wiring pattern 12 to specify on distributing board substrate 11, and utilize bond layer 13 bonding.In the case, Wiring pattern 12 is only made up of splicing ear 22.With the mode shown in Fig. 1 in the same manner, insulating barrier 24 is configured on bond layer 13, by conduction articulamentum 23 be formed on the upper surface of splicing ear 22.Also can, at the upper configuration of the lower surface of distributing board substrate 11 (face contrary with the face that disposes Wiring pattern 12) stiffener 26, in addition, also can not be configured.In the case, as shown in figure 12, distributing board 1 can be connected as the flat cable 440 that is connected multiple conducting wires 452 that terminal works and is convex shape.
In addition, as shown in Figure 2, on the position corresponding with splicing ear row 21 of stiffener 26, be formed with heating and use hole 30.Heating is general square shape with hole 30.Heating with the upper limb 31 in hole 30 and lower edge 32 along extending with the orthogonal direction of the length direction of splicing ear 22.Heating is configured in the left side of splicing ear row 21 with the left border 33 in hole 30, extend along distribution direction YA.Heating is configured in the right side of splicing ear row 21 with the right border 34 in hole 30, extend along distribution direction YA.
In addition, be provided with the 1st mark 27 and the 2nd mark 28 at right-hand member and the left end of connecting portion 20.The 1st mark 27 and the 2nd mark 28 by the splicing ear row 21 of distributing board 1 when being connected being connected terminal row 51 and being connected of substrate 40, as for making splicing ear 22 and being connected the benchmark of the aligned in position between terminal row 51 and using.The 1st mark 27 and the 2nd mark 28 arrange by laser-marking device or ink jet printing, punching press printing, punch mark shaping etc.
In Fig. 3, by the intersection point being configured between the right side ora terminalis of rightmost splicing ear 22 and the front-end edge of distributing board 1, be denoted as initial point (reference position) KA of the position for specifying the 1st mark 27 below.In addition, the axis extending by this initial point KA and along terminal board column direction X is denoted as to X-axis, the axis extending by initial point KA and along distribution direction Y is denoted as to Y-axis.To be configured in rightmost splicing ear 22 and be denoted as reference terminal 22K.
In Fig. 2, the 1st mark 27 is arranged on and is arranged in splicing ear row 21 and is configured in rightmost splicing ear 22 right sides and has in the part of stiffener 26.The 1st mark 27 is cross.The central point of the 1st mark 27 is configured on coordinate (X1, Y1).
In Fig. 2, the 2nd mark 28 is arranged on and is arranged in splicing ear row 21 and is configured in leftmost splicing ear 22 left sides and has in the part of stiffener 26.The 2nd mark 28 is cross.The central point of the 2nd mark 28 is configured on coordinate (X2, Y1).
With reference to Fig. 3, the substrate 40 that is connected being connected with distributing board 1 is described.
Being connected substrate 40 comprises: base plate 41, and it is manufactured by glass epoxy resin; And being connected portion 50, it is configured on a face of base plate 41.
Be connected portion 50 have by multiple be connected that terminal 52 forms be connected terminal row 51.The adjacent interval that is connected terminal 52 is identical with the interval of adjacent splicing ear 22.The length direction that is connected terminal 52 is denoted as to distribution direction YB below.In addition, by orthogonal with distribution direction YB and be denoted as terminal board column direction XB along the direction of the face of base plate 41.
Be provided with the 3rd mark 53 and the 4th mark 54 at the right-hand member and the left end that are connected portion 50.The 3rd mark 53 and the 4th mark 54 are when being connected being connected terminal row 51 and being connected with the splicing ear row 21 of distributing board 1 of substrate 40, as using for making to be connected the benchmark of the aligned in position between terminal row 51 and splicing ear 22.
In Fig. 3, by the summit, upper right that is connected terminal (hereinafter referred to as " benchmark is connected terminal 52K ") being connected with reference terminal 22K, be denoted as initial point (reference position) KB of the position for specifying the 3rd mark 53.In addition, the axis extending by this initial point KB and along terminal board column direction XB is denoted as to X-axis, the axis extending by initial point KB and along distribution direction YB is denoted as to Y-axis.
In Fig. 3, the 3rd mark 53 is arranged on to be connected and in terminal row 51, is disposed at rightmost the right that is connected terminal 52.The 3rd mark 53 is cross.The central point of the 3rd mark 53 is configured on coordinate (X1, Y1).
In Fig. 3, the 4th mark 54 is arranged on to be connected and in terminal row 51, is disposed at the leftmost left side that is connected terminal 52.The 4th mark 54 is cross.The central point of the 4th mark 54 is configured on coordinate (X2, Y1).
With reference to Fig. 3 and Fig. 4, distributing board 1 and the localization method that is connected between substrate 40 are described.
First, by be connected having of substrate 40 be connected terminal 52 facing to top, will be connected substrate 40 and be fixed on base 61.Be connected substrate 40 with by distributing board 1 be connected substrate 40 and be connected after, the state that can easily dismantle from base 61 is fixed.For example, utilize splicing tape by base 61 and to be connected substrate 40 temporary fixed.Or also can be using ferromagnetism bodies such as iron as base 61, use magnet will be connected substrate 40 and be fixed on base 61.
Then, by distributing board 1 have splicing ear 22 facing to below, determine distributing board 1 with respect to be connected substrate 40 position.Specifically, first, the connecting portion of distributing board 1 20 is overlapped with the portion that is connected 50 that is connected substrate 40.Then, make the 1st mark 27 center consistent with the 3rd mark 53 center, and make the 2nd mark 28 center consistent with the 4th mark 54 center, thereby determine that distributing board 1 is with respect to the position that is connected substrate 40.Preferred orientation operation is used microscope to carry out, so that the alternate position spike between the alternate position spike between the 1st mark 27 center and the 3rd mark 53 center and the 2nd mark 28 center and the 4th mark 54 center is in prescribed limit (hereinafter referred to as " permissible range ").For example, in the situation that terminal pitch is 0.2mm from DB, be set as ± 0.05mm of the permissible range of alternate position spike.
The 1st mark 27 and the 2nd mark 28 are arranged on ad-hoc location taking reference terminal 22K on the position of the regulation coordinate of initial point KA.The 3rd mark 53 and the 4th mark 54 are arranged on the ad-hoc location that is connected terminal 52K taking benchmark on the position of the regulation coordinate of initial point KB.In addition, the coordinate of the 1st mark 27 is identical with the coordinate of the 3rd mark 53, and the coordinate of the 2nd mark 28 is identical with the coordinate of the 4th mark 54.Utilize this relation, the splicing ear row of distributing board 1 21 and the terminal row 51 that are connected that are connected substrate 40 are accurately located each other.
At distributing board 1 with when being connected substrate 40 and overlapping, the conduction articulamentum 23 of splicing ear 22 and the be connected terminal row 51 corresponding with this splicing ear 22 contact with each other, and insulating barrier 24 embeds and is connected between terminal 52.
With reference to Fig. 5, distributing board 1 and the adhering method that is connected between substrate 40 are described.
At distributing board 1 be connected after the location positioning between substrate 40, the heating part of heater 70 71 is pressed in the heating of stiffener 26 with in part corresponding to hole 30, the splicing ear row 21 of distributing board 1 are heated.Now, by making a part of melting of insulating barrier 24, thereby by the insulating barrier of distributing board 1 24 with to be positioned at the part being connected between terminal 52 bonding.
According to present embodiment, there is following effect.
(1) in the present embodiment, in the preferred coordinates that benchmark is set, be provided with the 1st mark 27 at the ad-hoc location taking reference terminal 22K (initial point KA).The 1st mark 27 is for determining that the splicing ear row 21 of distributing board 1 are with respect to the position that is connected terminal row 51 that is connected substrate 40.Be arranged on the 3rd mark 53 on the ad-hoc location that is connected substrate 40, can see through distributing board substrate 11 and be observed together with the 1st mark 27.
According to this structure, owing to regarding the 1st mark as benchmark, and can see through distributing board substrate 11 and observe the 3rd mark 53 that is connected substrate 40, so can be so that the 1st mark 27 of distributing board 1 and be connected the mode of the position consistency of the 3rd mark 53 of substrate 40, configuration distributing board 1 and be connected substrate 40.
In addition, in this structure, the 3rd mark 53 is with respect to the position relationship that is connected terminal row 51 that is connected substrate 40, identical with respect to the position relationship of the splicing ear row 21 of distributing board 1 with the 1st mark 27.Therefore, by making the 1st mark 27 of distributing board 1 and being connected the position consistency of the 3rd mark 53 of substrate 40, thereby configuration that can be is according to the rules determined splicing ear row 21 with respect to the position that is connected terminal row 51.
In addition, owing to can observing the 1st mark 27 and the 3rd mark 53 that is connected substrate 40 of distributing board 1, even if so in the case of observing the splicing ear row 21 of distributing board 1 and be connected being connected terminal row 51 of substrate 40, also can determine splicing ear row 21 with respect to the position that is connected terminal row 51.
(2) in the present embodiment, distributing board substrate 11 is transparent, can have an X-rayed and observes the 1st mark 27 and be connected substrate 40.According to this structure, can see through the substrate 11 of distributing board 1, be labeled as benchmark with the 1st, observe the 3rd mark 53 that is connected substrate 40.Thus, can make the 1st mark 27 of distributing board 1 and be connected the position consistency of the 3rd mark 53 of substrate 40, thereby the splicing ear row 21 of determining distributing board 1 are with respect to the position that is connected terminal row 51.
(3) in the present embodiment,, on the upper surface of each splicing ear 22 that forms splicing ear row 21, be provided with the conduction articulamentum 23 being formed by the silver paste that contains silver powder.In addition, between splicing ear 22, be provided with insulating barrier insulated from each other splicing ear 22 24.Insulating barrier 24 is formed by hot-melt adhesive.
According to this structure, by the splicing ear row 21 of distributing board 1 when being connected being connected terminal row 51 and being connected of substrate 40, insulating barrier 24 and be connected substrate 40 be connected terminal row 51 to be connected part between terminal 52 bonding., the splicing ear row 21 of distributing board 1 are electrically connected via conduction articulamentum 23 with the terminal row 51 that are connected that are connected substrate 40.In addition, distributing board 1 and be connected substrate 40 and utilize hot-melt adhesive bonding.By utilizing hot-melt adhesive by distributing board 1 and to be connected substrate 40 bonding, thereby can increase distributing board 1 and be connected the intensity of the connecting portion between substrate 40.
(4) in the present embodiment,, on the connecting portion 20 with splicing ear row 21, be provided with the stiffener 26 that connecting portion 20 is strengthened.In addition, on connecting portion 20, be provided with the 1st mark 27.
According to this structure, utilize stiffener 26 to strengthen splicing ear row 21.In addition, owing to being provided with the 1st mark 27 on this stiffener 26, so can improve the positional precision of the 1st mark 27 with respect to the reference position (initial point KA) of splicing ear row 21.
(5) in the present embodiment, be provided with heating at the part place corresponding with splicing ear row 21 of stiffener 26 and use hole 30.According to this structure, in the time that splicing ear row 21 are heated, can not heat the part with splicing ear row 21 via stiffener 26.Therefore, be reinforced with the part with splicing ear row 21 situation that plate 26 covers compared with, splicing ear row 21 can be heated to rapidly to set point of temperature.
(6) in the present embodiment, the 1st mark 27 and the 2nd mark 28, taking the specific part of splicing ear row 21 as benchmark, are arranged on different positions.According to this structure, by making the 1st mark 27 consistent with the 3rd mark 53 that is connected substrate 40, and make the 2nd mark 28 consistent with the 4th mark 54 that is connected substrate 40, thereby can, with the terminal board column direction XA of the splicing ear row 21 of distributing board 1 and the consistent mode of terminal board column direction XB that is connected terminal row 51, determine splicing ear row 21 and be connected the position between terminal row 51.
< the 1st variation >
With reference to Fig. 6, distributing board 1 is described with respect to the variation of the locating structure that is connected substrate 40.
The distributing board 1 of the 1st variation is different from the structure of above-mentioned execution mode in the following areas., in the above-described embodiment, so that the 1st mark 27 center is consistent with the 3rd mark 53 center, the 2nd mark 28 center and the 4th consistent mode in mark 54 center, determine distributing board 1 and the position that is connected substrate 40.On the other hand, in the 1st variation, the 1st mark 127 has the shape that makes the 3rd mark 153 enter its inner side.The relation of the 2nd mark and the 4th mark is identical with the relation of the 1st mark 127 and the 3rd mark 153.The detailed change of the structure with respect to above-mentioned execution mode in the 1st variation is described below.For with the general structure of above-mentioned execution mode, mark identical label, the description thereof will be omitted.
In Fig. 6, the 1st mark 127 of distributing board 1 is formed on splicing ear 22 right sides of the right-hand member that is positioned at splicing ear row 21 and has in the part of stiffener 26.The 1st mark 127 is for having the ring-type of regulation internal diameter.
On the other hand, the 3rd mark 153 is circular, and this circular diameter is less than the internal diameter of the 1st mark 127.For example, the difference between the internal diameter of the 1st mark 127 and the diameter of the 3rd mark 153 is set as to 0.1mm.,, in the time of the interior existence of the 1st mark 127 the 3rd mark 153, the alternate position spike between the 1st mark 127 center and the 3rd mark 153 center is in ± 0.05mm.
Determine the splicing ear row 21 of distributing board 1 and be connected substrate 40 be connected the position between terminal row 51 time so that the mode that the 3rd mark 153 enters the inner side of the 1st mark 127, and determine distributing board 1 and be connected the position between substrate 40.Thus, can easily observe alternate position spike between the 1st mark 127 and the 3rd mark 153 whether in permissible range.
According to the 1st variation, except the effect of above-mentioned (1)～(6), can realize following effects effect.
(7) in the 1st variation, the 1st mark 127 is configured to, and determines the 1st mark 127 of distributing board 1 and is connected the permissible range of the alternate position spike between the 3rd mark 153 of substrate 40.According to this structure, can observe the 1st mark 127 of distributing board 1 and be connected alternate position spike between the 3rd mark 153 of substrate 40 whether in permissible range.Thus, can be easily splicing ear row 21 to distributing board 1 and the position relationship whether terminal row 51 have regulation that is connected that is connected substrate 40 judge.
< the 2nd variation >
With reference to Fig. 7, distributing board 1 is described with respect to the variation of be connected substrate 40 locating structure.
The distributing board 1 of the 2nd variation is different from the structure of above-mentioned execution mode in the following areas., in the above-described embodiment, so that the 1st mark 27 center is consistent with the 3rd mark 53 center and the 2nd mark 28 center and the 4th consistent mode in mark 54 center, determine distributing board 1 and the position that is connected substrate 40.On the other hand, in the 2nd variation, the 1st mark 227 has the shape that makes the 3rd mark 253 enter its inner side.The relation of the 2nd mark and the 4th mark is identical with the relation of the 1st mark 227 and the 3rd mark 253.The detailed change of the structure with respect to above-mentioned execution mode in the 2nd variation is described below.For with the general structure of above-mentioned execution mode, mark identical label, the description thereof will be omitted.
In Fig. 7, the 1st mark 227 of distributing board 1 is formed on splicing ear 22 right sides of the right-hand member that is positioned at splicing ear row 21 and has in the part of stiffener 26.The 1st mark 227 is for having the through hole of regulation internal diameter.
On the other hand, the 3rd mark 253 is circular, and this circular diameter is less than the internal diameter of the 1st mark 227.For example, the difference between the diameter of the 1st mark 227 and the diameter of the 3rd mark 253 is set as to 0.1mm.,, in the time of the interior existence of the 1st mark 227 the 3rd mark 253, the alternate position spike between the 1st mark 227 center and the 3rd mark 253 center is in ± 0.05mm.
Determine distributing board 1 splicing ear row 21 and be connected substrate 40 be connected the position between terminal row 51 time, with the 1st variation in the same manner, so that the mode that the 3rd mark 253 enters the inner side of the 1st mark 227 is determined distributing board 1 and is connected the position between substrate 40.Thus, can easily observe alternate position spike between the 1st mark 227 and the 3rd mark 253 whether in permissible range.
According to the 2nd variation, the 1st mark 227 forms as through hole.Therefore, do not need to make distributing board substrate 11 and bond layer 13 for transparent.Therefore, distributing board substrate 11 and bond layer 13 can be manufactured by coloured material.
According to the 2nd variation, except the effect of above-mentioned (1)～(7), can realize following effects effect.
(8), in the 2nd variation, the 1st mark 227 forms as running through the through hole of distributing board substrate 11.According to this structure, can observe the 3rd mark 253 that is connected substrate 40 by through hole.Thus, can make the 1st mark 227 of distributing board 1 and be connected the position consistency of the 3rd mark 253 of substrate 40, thereby the splicing ear row 21 of determining distributing board 1 are with respect to the position that is connected terminal row 51 that is connected substrate 40.
< the 3rd variation >
With reference to Fig. 8, distributing board 1 is described with respect to the variation of be connected substrate 40 locating structure.
The distributing board 1 of the 3rd variation is different from the structure of the 2nd variation in the following areas.,, in the 2nd variation, the 1st mark 227 forms as through hole.On the other hand, in the 3rd variation, the 1st mark 327 forms as otch.The relation of the 2nd mark and the 4th mark is identical with the relation of the 1st mark 327 and the 3rd mark 353.The detailed change of the structure with respect to above-mentioned execution mode in the 3rd variation is described below.For with the general structure of above-mentioned execution mode, mark identical label, the description thereof will be omitted.
In Fig. 8, the 1st mark 327 of distributing board 1 is by a part for the right-hand member of connecting portion 20 is cut and formed.The 1st mark 327 be shaped as rectangle.Otch as the 1st mark 327 utilizes diel and forms.
On the other hand, the 3rd mark 353 is rectangle, less than the 1st mark 327.For example, the difference along between the length of terminal board column direction XB of the length along terminal board column direction XA of the 1st mark 327 and the 3rd mark 353 is 0.1mm.In addition, the difference along between the length of distribution direction YB of the length along distribution direction YA of the 1st mark 327 and the 3rd mark 353 is 0.1mm.,, in the time of the interior existence of the 1st mark 327 the 3rd mark 353, the alternate position spike between the 1st mark 327 center (cornerwise intersection point) and the 3rd mark 353 center is in ± 0.05mm.
Determine distributing board 1 splicing ear row 21 and be connected substrate 40 be connected the position between terminal row 51 time, with the 1st variation in the same manner, so that the mode that the 3rd mark 353 enters the inner side of the 1st mark 327 is determined distributing board 1 and is connected the position between substrate 40.Thus, can easily observe alternate position spike between the 1st mark 327 and the 3rd mark 353 whether in permissible range.
According to the 3rd variation, the 1st mark 327 forms as otch.Therefore, do not need to make distributing board substrate 11 and bond layer 13 for transparent.Therefore, distributing board substrate 11 and bond layer 13 can be manufactured by coloured material.
According to the 3rd variation, except the effect of above-mentioned (1)～(7), can realize following effects effect.
(9) in the 3rd variation, the 1st mark 327 as be arranged on distributing board substrate 11 end otch and form.According to this structure, can observe the 3rd mark 353 that is connected substrate 40 by otch.Thus, can make the 1st mark 327 of distributing board 1 and be connected the position consistency of the 3rd mark 353 of substrate 40, thereby the splicing ear row 21 of determining distributing board 1 are with respect to the position that is connected terminal row 51 that is connected substrate 40.
< the 4th variation >
With reference to Fig. 9, distributing board 1 is described with respect to the variation of be connected substrate 40 locating structure.
In the distributing board 1 of the execution mode shown in Fig. 3, on connecting portion 20, be formed with the 1st mark 27 and the 2nd mark 28.On the other hand, in the 4th variation shown in Fig. 9, using 2 splicing ears 22 as the 1st mark and the 2nd mark and using.In the case, as the 3rd mark being consistent with the 1st mark, be connected the mark in the portion that is connected 50 of substrate 40, use be connected with the splicing ear 22 as the 1st mark be connected terminal 52.In the same manner, as the 4th mark being consistent with the 2nd mark, be connected the mark of the portion that is connected 50 sides of substrate 40, use be connected with the splicing ear 22 as the 2nd mark be connected terminal 52.The detailed change of the structure with respect to above-mentioned execution mode in the 4th variation is described below.For with the general structure of above-mentioned execution mode, mark identical label, the description thereof will be omitted.
Main part 10 has: Wiring pattern 12, and it is formed by electric conducting material; The 1st submounts 111, it sandwiches Wiring pattern 12; Bond layer 112, it is coated between the 1st submounts 111 and Wiring pattern 12, by bonding to the 1st submounts 111 and Wiring pattern 12; And the 2nd submounts 120, it supports splicing ear row.Wiring pattern 12 is Wiring patterns identical with the execution mode of enumerating at first, and the Copper Foil line that is for example 35 μ m by thickness forms.
As the 1st submounts 111, can enumerate the insulative resin thin plate that for example thickness is the polyethylene terephthalate of 12 μ m.In the above-mentioned execution mode of enumerating at first, use transparent distributing board substrate 11, but in this variation, can use opaque substrate as the 1st submounts 111.
The polyesters bonding agent that bond layer 112 applies 20～100 μ m thickness on distributing board substrate 11 forms.Bond layer 112, in the above-mentioned execution mode of enumerating at first, is transparent after sclerosis, but in this 4th variation, can be transparent after sclerosis, can be also opaque.
The 1st submounts 111 covers the end on the extending direction of Wiring pattern 12, the part that forms the part of connecting portion 20.The 2nd submounts 120 directly sticks on connecting portion 20.
The 2nd submounts 120 has: the 2nd submounts main body 121, and it has rigidity; And bond layer 122, it is bonded on splicing ear 22.Bond layer 122 is coated on a face of the 2nd submounts main body 121.Bond layer 122 is transparent, even and if heated also maintain transparent state.The 2nd submounts main body 121 is also transparent, is formed by the insulative resin thin plate of polyethylene terephthalate of the thickness with 50～150 μ m.
The 2nd submounts 120 is bonded on splicing ear row 21 via bond layer 122.The stiffener that the 2nd submounts 120 is out of shape as inhibition splicing ear 22 works.The 1st submounts 111 is equivalent to the distributing board substrate 11 of above-mentioned execution mode.The 2nd submounts 120 is equivalent to the stiffener 26 of above-mentioned execution mode.
Not circumscribed of the shape of the 2nd submounts 120.In the 4th variation, make the front end of splicing ear 22 consistent with the ora terminalis of the 2nd submounts 120.Also can replace, so that the ora terminalis of the 2nd submounts 120 is positioned at the mode on the extended line of front end of splicing ear 22, form the 2nd submounts 120.
The structure of connecting portion 20 is identical with the structure of the connecting portion 20 of initial execution mode., on the upper surface of splicing ear 22, be formed with conduction articulamentum 23.Between adjacent splicing ear 22, be formed with insulating barrier 24.
The splicing ear row 21 of distributing board 1 are determined in the following manner with the position that is connected terminal row 51 that is connected substrate 40.
The splicing ear 22 at the two ends of splicing ear row 21 is respectively as the 1st mark and the 2nd mark and use.Splicing ear 22 as the 1st mark and the terminal 52 (the 3rd mark) that is connected of the one end that is connected substrate 40 are confirmed, make this splicing ear 22 and the position consistency that is connected terminal 52, and the splicing ear 22 as the 2nd mark and the terminal 52 (the 4th mark) that is connected of the other end that is connected substrate 40 are confirmed, made this splicing ear 22 and the position consistency that is connected terminal 52.Now, also can be from distributing board 1 to being connected substrate 40 light irradiations, be clear that be connected substrate 40 be connected terminal row 51.
In addition, in the time making splicing ear 22 and be connected the position consistency of terminal 52, also can be using the ora terminalis of splicing ear 22 as benchmark as shown in following.About this location, describe with reference to Fig. 3.Although the distributing board 1 shown in Fig. 3 is different from the distributing board 1 of this 4th variation, the array structure of the splicing ear 22 of the distributing board 1 of the array structure of splicing ear 22 and the 4th variation is identical.Therefore,, in the explanation of the location in the time making splicing ear 22 and be connected terminal 52 position consistency, use Fig. 3.
Splicing ear row 21 and the position that is connected terminal row 51 are alignd, making from the ora terminalis 22A (with reference to Fig. 3) of the splicing ear 22 as the 1st mark to the distance till the ora terminalis 52A (with reference to Fig. 3) that is connected terminal 52 of the 3rd mark, extremely equate as the distance till the ora terminalis 52B that is connected terminal 52 of the 4th mark with the ora terminalis 22B of the splicing ear 22 from as the 2nd mark.Also can replace, in the case, as the mark for aligned in position, replace the ora terminalis of splicing ear 22 and use the bight of splicing ear 22.
With reference to Figure 10 and Figure 11, the manufacture method of above-mentioned distributing board 1 is described.
As shown in figure 10, by many Copper Foil lines are arranged side by side, form thus Wiring pattern 12.Bonding the 1st thin plate 200 on a face of above-mentioned Wiring pattern 12, then, in the mode of aliging with the 1st thin plate 200, from bonding the 2nd thin plate 200 of another face.
The 1st thin plate 200 is by forming with the mother metal thin plate of the 1st submounts 111 same materials.On a face of this mother metal thin plate, be coated with the bonding agent that forms bond layer 112 by heating.
The 1st thin plate 200 is thin plates of growing along a direction, has the window 201 of rectangle, and this window 201 has the length of regulation along extending direction.Be about 2 times of length of connecting portion 20 along the length of the window 201 of extending direction.The width of window 201 is larger than the width of splicing ear row 21.The distance along between the adjacent window 201 of extending direction of the 1st thin plate 200 is consistent with the length of distributing board 1., window 201 is formed in the part corresponding with splicing ear row 21.And in the time that thin plate 200 is sticked on Wiring pattern 12, the window 201 of 2 thin plates is roughly consistent, does not cover connecting portion 20.
As shown in Figure 10 and Figure 11 (a), cut off line CC thin plate is cut off along the 1st cut-out line CA, the 2nd cut-out line CB and the 3rd.Thus, cut out distributing board 1.Then, as shown in Figure 11 (b), at bonding the 2nd submounts 120 in the both ends of distributing board 1.A part for the 2nd submounts 120 and thin plate 200 (, the 1st submounts 111) are overlapping.
Then, prepare transfer printing thin plate 130, it for forming conduction articulamentum 23 and insulating barrier 24 on connecting portion 20.
As shown in Figure 11 (c), transfer printing thin plate 130 is to peel off on thin plate 131, alternately the coating electric conducting material 133 corresponding with conduction articulamentum 23 and the formation with insulating material 132 corresponding to insulating barrier 24.
On the surface of peeling off thin plate 131, be for example formed with layer of silicone.This way be for, after electric conducting material 133 and insulating material 132 are sticked on connecting portion 20, will peel off thin plate 131 and peel off time, prevent from thin plate 131, adhering to electric conducting material 133 and insulating material 132 peeling off.
Electric conducting material 133 is for example formed by thermoplastic silver paste.
By utilizing silk screen printing to the regulation region of peeling off thin plate 131, the region coating silver paste corresponding with splicing ear 22, is then dried and hardens, thereby forming electric conducting material 133.
Insulating material 132 is for example formed by polyesters hot-melt adhesive.Utilize silk screen printing to the regulation region of peeling off thin plate 131, i.e. the coating of region between adjacent splicing ear 22 hot-melt adhesive, and make hot-melt adhesive dry.Form according to the method described above transfer printing thin plate 130.
As shown in Figure 11 (d), transfer printing thin plate 130 is sticked on the connecting portion 20 of distributing board 1, and utilize pressing plate etc. that electric conducting material 133 is pressed to splicing ear 22, insulating material 132 is pressed to the 2nd submounts 120.In the time utilizing pressing plate etc. to press to the 2nd submounts 120 electric conducting material 133 and insulating material 132, heat with 120～200 DEG C.Then, remove and peel off thin plate 131.Form distributing board 1 by above operation.
In Figure 10 and Figure 11, after thin plate cutting is distributing board 1, bonding the 2nd submounts 120, has carried out transfer printing to electric conducting material 133 and insulating material 132.Also can replace, in the part to corresponding with connecting portion 20, after bonding the 2nd submounts 120, thin plate be cut off.In addition, also can be in the part corresponding with connecting portion 20 bonding the 2nd submounts 120, and with respect to the 2nd submounts 120, electric conducting material 133 and insulating material 132 are carried out, after transfer printing, thin plate being cut off.
According to the 4th variation, except the effect of above-mentioned (1)～(6), realize following effect.
(10) in the 4th variation, for determine splicing ear row 21 with respect to the position that is connected substrate 40, and using splicing ear 22 as the 1st mark and the 2nd mark use.Thus, can regard the splicing ear 22 as the 1st mark as benchmark, and observe be connected substrate 40 conduct the 3rd mark be connected terminal 52.In addition, can observe as the splicing ear 22 of the 2nd mark and be connected substrate 40 conduct the 4th mark be connected terminal 52.Thus, can make splicing ear 22 and the position consistency that is connected terminal 52 that is connected substrate 40, thereby the splicing ear row 21 of determining distributing board 1 are with respect to the position that is connected terminal row 51 that is connected substrate 40.
(other execution modes)
Example of the present invention is not limited to the form shown in above-mentioned execution mode and variation.For example, example of the present invention also can change and implement as shown in following.In addition, following each variation is not only applicable to the various embodiments described above, also combination with one another between different variation can be implemented.
In the above-described embodiment, in order positioning with respect to being connected substrate 40, and on distributing board 1, to be provided with 2 marks, but 1 mark also can be set.In the case, make distributing board 1 and rotate with respect to being connected substrate 40, so that the 1st mark 27 of distributing board 1 and be connected the position consistency of the 3rd mark 53 of substrate 40, thereby make the terminal board column direction XA of splicing ear row 21 consistent with the terminal board column direction XB that is connected terminal row 51.
In the above-described embodiment, use one deck stiffener 26, but also can use the stiffener 26 that is more than or equal to 2 layers.In the case, also can form heating use hole 30 to run through the mode of 2 layers.In addition, also can only on 1 layer of outside, form heating and use hole 30.
In the above-described embodiment, the stiffener 26 of distributing board 1 has heating with hole 30, uses hole 30 but also can not have heating.In the case, via stiffener 26, connecting portion 20 is heated.
In the above-described embodiment, the stiffener 26 of distributing board 1 surrounds the periphery of connecting portion 20, but stiffener 26 is not limited to which.For example, stiffener 26 also can only cover the leading section of distributing board 1.In addition, stiffener 26 also can cover leading section and the both ends of distributing board 1.
In the above-described embodiment, on stiffener 26, be formed with the 1st mark 27 and the 2nd mark 28, but on position the part that mark 27,28 can be formed on except having stiffener 26.
In the above-described embodiment, the back side of distributing board 1 has stiffener 26, but also can not have stiffener 26.
In the above-described embodiment, insulating barrier 24 forms 2 layers, but the structure of insulating barrier 24 is not limited thereto.For example, insulating barrier 24 can form 1 layer.In addition, insulating barrier 24 can form and be more than or equal to 3 layers.In addition, conduction articulamentum 23 is formed with 1 layer, but also can be formed with and be more than or equal to 2 layers.
In the above-described embodiment, conduction articulamentum 23 is formed by silver paste, but can replace, and is formed by anisotropy resin.In the case, in the operation after coating anisotropy resin, by the compression of anisotropy resin, form conduction articulamentum 23.
In the above-described embodiment, form than the high insulating barrier 24 in position of the upper surface of conduction articulamentum 23.As forming the method for this insulating barrier 24, exist: utilize silk screen printing to form the method for 2 layer insulatings 24, the method for after insulating barrier 24 and conduction articulamentum 23 are formed with equal height, conduction articulamentum 23 being compressed etc.
In the above-described embodiment, also can make to conduct electricity the upper surface of articulamentum 23 and the upper surface of insulating barrier 24 is roughly the same height.
In the above-described embodiment, also can make to conduct electricity the upper surface of articulamentum 23 higher than the upper surface of insulating barrier 24.
In the above-described embodiment, for conduction articulamentum 23 and insulating barrier 24, also can replace transfer printing and directly print.
In the above-described embodiment, insulating barrier 24 is formed between each splicing ear 22.Also can replace, only in splicing ear row 21, the outside of splicing ear 22 of one end and the outside of the splicing ear of the other end 22 form insulating barrier 24.In addition, any 1 place that also can be between each splicing ear 22 or be more than or equal to 2 places and form insulating barriers 24.
In above-mentioned the 4th variation, as shown in Figure 9, on a face of splicing ear row 21, directly paste the 2nd submounts 120.Also can replace, make the 1st submounts 111 of at least one side for transparent, make this 1st transparent submounts 111 extend to connecting portion 20, on the 1st submounts 111, paste the 2nd submounts 120.The 1st submounts 111 and the 2nd submounts 120 have the transparency of following degree, that is, pasting after the 1st submounts 111 and the 2nd submounts 120, can have an X-rayed and observe and be connected substrate 40.; according to this structure; because the composite plate forming after the 1st submounts 111 and the 2nd submounts 120 stickups is transparent; so with the 4th variation in the same manner; can make splicing ear 22 and the position consistency that is connected terminal 52 that is connected substrate 40, determine that the splicing ear row 21 of distributing board 1 are with respect to the position that is connected terminal row 51 that is connected substrate 40.
Claims (2)
1. a distributing board, it has distributing board substrate and splicing ear row, and described splicing ear is listed as at least a portion on a face that is formed on described distributing board substrate, and be configured to the terminal row that are connected that are connected substrate and be connected,
This distributing board is characterised in that,
Described splicing ear row have: multiple splicing ears; Conduction articulamentum, it is configured on the upper surface of described each splicing ear, and is formed by the electroconductive resin that comprises conductive particle; And insulating barrier, it is configured in described splicing ear between at least 1 pair, and splicing ear is insulated from each other, and described insulating barrier is formed by insulating adhesive,
At least a portion of described distributing board substrate is transparent, described splicing ear row are by transparent bond layer and described distributing board substrate bonding, via described distributing board substrate can observe described splicing ear row and described in be connected terminal row, a part at least 1 splicing ear in described multiple splicing ears is used as to benchmark, described splicing ear can be listed as with respect to the described terminal row that are connected and position
Described distributing board has: main part, and it has multiple distributions of the splicing ear that extends to described splicing ear row; And connecting portion, it has described splicing ear row,
Described distributing board substrate has: 2 the 1st submounts, and it clamps described distribution and forms described main part; And the 2nd transparent submounts, it is bonded in the back side of described splicing ear row and is formed described connecting portion by described transparent bond layer, described splicing ear is listed as from described the 1st submounts and protrudes, and is bonded on described the 2nd submounts by described transparent bond layer.
2. a distributing board, it has distributing board substrate and splicing ear row, and described splicing ear is listed as at least a portion on a face that is formed on described distributing board substrate, and be configured to the terminal row that are connected that are connected substrate and be connected,
In this distributing board,
Described splicing ear row have: multiple splicing ears, and it extends along distribution direction; Conduction articulamentum, it is configured on the upper surface of described each splicing ear, and is formed by the electroconductive resin that comprises conductive particle; And insulating barrier, it is configured in described splicing ear between at least 1 pair, and splicing ear is insulated from each other, in the length range of described of the described distributing board substrate of described each splicing ear in described distribution direction, extends, described insulating barrier is formed by insulating adhesive
Described distributing board substrate entirety is transparent, described splicing ear row are by transparent bond layer and described distributing board substrate bonding, via described distributing board substrate can observe described splicing ear row and described in be connected terminal row, a part at least 1 splicing ear in described multiple splicing ears is used as to benchmark, described splicing ear can be listed as with respect to the described terminal row that are connected and position
The described terminal row that are connected are from multiple wires of flat cable protrusion, are connected with described flat cable.
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2011115033A JP5760687B2 (en) | 2010-06-23 | 2011-05-23 | Wiring board |
| JP2011-115033 | 2011-05-23 |
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| Publication Number | Publication Date |
|---|---|
| CN102801004A CN102801004A (en) | 2012-11-28 |
| CN102801004B true CN102801004B (en) | 2014-10-01 |
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| CN201110435851.5A Active CN102801004B (en) | 2011-05-23 | 2011-12-22 | Distributing board |
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| KR (2) | KR101297904B1 (en) |
| CN (1) | CN102801004B (en) |
| TW (1) | TWI426835B (en) |
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| JP6985211B2 (en) * | 2018-05-31 | 2021-12-22 | 日東電工株式会社 | Wiring circuit board |
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| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH05304348A (en) * | 1992-04-27 | 1993-11-16 | Fujitsu Ltd | Installation structure of flexible printed board |
| JP3176201B2 (en) * | 1993-12-20 | 2001-06-11 | シャープ株式会社 | Wiring board connection method |
| JPH11121894A (en) * | 1997-08-12 | 1999-04-30 | Optrex Corp | Connection structure of circuit board |
| JP3833425B2 (en) * | 1999-10-27 | 2006-10-11 | 富士通株式会社 | Method for connecting printed wiring boards and printed circuit board |
| JP2011077125A (en) * | 2009-09-29 | 2011-04-14 | Sumitomo Electric Ind Ltd | Wiring board, manufacturing method of wiring board, connection structure of wiring board, and connection method of wiring board |
| TWM401950U (en) * | 2010-10-18 | 2011-04-11 | Ko Ja (Cayman) Co Ltd Taiwan Branch | Transparent films type of printed circuit board |
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2011
- 2011-12-19 KR KR1020110137434A patent/KR101297904B1/en active IP Right Grant
- 2011-12-19 TW TW100147019A patent/TWI426835B/en active
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Non-Patent Citations (4)
| Title |
|---|
| JP特开2011-77125A 2011.04.14 |
| JP特开平11-121894A 1994.04.30 |
| JP特开平5-304348A 1993.11.16 |
| JP特开平7-176838A 1995.07.14 |
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| KR101396668B1 (en) | 2014-05-16 |
| CN102801004A (en) | 2012-11-28 |
| KR101297904B1 (en) | 2013-08-22 |
| TWI426835B (en) | 2014-02-11 |
| KR20130059375A (en) | 2013-06-05 |
| TW201249269A (en) | 2012-12-01 |
| KR20120130679A (en) | 2012-12-03 |
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